July 2006 Rev 1 1/10
STPS10170C
High voltage power Schottky rectifier
Main product characteristics
Features and benefits
■High junction temperature capability
■Good trade-off between leakage current and
forward voltage drop
■Low leakage current
■Avalanche capability specified
Description
Dual centre tab Schottky rectifier designed for
high frequency switch mode power supplies.
Order codes
IF(AV) 2 x 5 A
VRRM 170 V
Tj175° C
VF (typ) 0.69 V
Part Number Marking
STPS10170CT STPS10170CT
STPS10170CG STPS10170CG
STPS10170CG-TR STPS10170CG
STPS10170CR STPS10170CR
STPS10170CB PS10170CB
STPS10170CB-TR PS10170CB
A1
A2
K
K
A1
A2
K
A1
A2
K
A1
A2
K
A1
A2
D2PAK
STPS10170CG
TO-220AB
STPS10170CT
I2PAK
STPS10170CR
DPAK
STPS10170CB
www.st.com
Characteristics STPS10170C
2/10
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.65 x IF(AV) + 0.02 x IF2(RMS)
Table 1. Absolute ratings (limiting values per diode, Tamb = 25° C unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 170 V
IF(RMS) RMS forward current 10 A
IF(AV) Average forward current, δ = 0.5 Tc = 155° C Per diode 5 A
Total package 10
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A
PARM Relative peak avalanche power Tj = 25° C tp = 1µs 3100 W
Tstg Storage temperature range -65 to + 175 °C
TjMaximum operating junction temperature(1) 175 °C
dV/dt Critical rate of rise of reverse voltage 10 000 V/µs
1. thermal runaway condition for a diode on its own heatsink
dPtot
dTj
--------------- 1
Rth j a–()
--------------------------<
Table 2. Thermal parameters
Symbol Parameter Value Unit
Rth(j-c) Junction to case Per diode 4
°C/WTo t a l 2 . 4
Rth(c) Coupling 0.7
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
IR(1) Reverse leakage current Tj = 25° C VR = VRRM
10 µA
Tj = 125° C 10 mA
VF(2) Forward voltage drop
Tj = 25° C IF = 5 A 0.92
V
Tj = 125° C 0.69 0.75
Tj = 25° C IF = 10 A 1
Tj = 125° C 0.79 0.85
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
STPS10170C Characteristics
3/10
Figure 1. Conduction losses versus average
forward current (per diode)
Figure 2. Average forward current versus
ambient temperature (δ = 0.5, per
diode)
0
1
2
3
4
5
0123456
P
F(AV)
(W)
δ=0.05
δ=0.1 δ=0.2
δ=0.5
δ=1
T
δ
=tp/T tp
I
F(AV)
(A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0 25 50 75 100 125 150 175
I
F(AV)
(A)
R
th(j-a)
=15°C/W
T
δ
=tp/T tp
R
th(j-a)
=R
th(j-c)
T
amb
(°C)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t)
P (1µs)
ARM p
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(t)
P (25°C)
ARM p
ARM
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
Figure 6. Relative variation of thermal
impedance, junction to case versus
pulse duration
0
10
20
30
40
50
60
70
80
1.E-03 1.E-02 1.E-01 1.E+00
I
M
(A)
T
C
=50°C
T
C
=75°C
T
C
=125°C
I
M
t
δ
=0.5
t(s)
0.1
1.0
1.E-03 1.E-02 1.E-01 1.E+00
Z
th(j-c)
/R
th(j-c)
Single pulse
TO-220AB
DPAK
I²PAK
D²PAK
tp(s)
Characteristics STPS10170C
4/10
Figure 7. Reverse leakage current versus
reverse voltage applied (typical
values, per diode)
Figure 8. Junction capacitance versus
reverse voltage applied (typical
values, per diode)
Figure 9. Forward voltage drop versus
forward current (per diode)
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm - DPAK)
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm - D2PAK)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
0 25 50 75 100 125 150 175
I
R
(µA)
Tj=150°C
Tj=125°C
Tj=25°C
Tj=75°C
Tj=175°C
VR(V)
10
100
1000
1 10 100 1000
C(pF)
F=1MHz
V
OSC
=30mV
RMS
T
j
=25°C
V
R
(V)
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
I
FM
(A)
Tj=25°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
Tj=125°C
(Typical values)
V
FM
(V)
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30 35 40
R
th(
j
-a)
(°C/W)
DPAK
S
CU
(cm²)
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
D²PAK
S
CU
(cm²)
R
th(j-a)
(°C/W)
STPS10170C Package dimensions
5/10
2 Package dimensions
Epoxy meets UL94, V0
Table 4. T0-220AB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
A
C
D
L7
Dia
L5
L6
L9
L4
F
H2
G
G1
L2
F2
F1
E
M
Package dimensions STPS10170C
6/10
Table 5. I2PAK dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
b1 1.14 1.70 0.044 0.067
c 0.49 0.70 0.019 0.028
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
E 10 10.40 0.394 0.409
L 13 14 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
E
L2
L1
b1
D
A1
c
c2
A
b
e
e1
L
STPS10170C Package dimensions
7/10
Figure 12. DPAK footprint (dimensions in mm)
Table 6. DPAK dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
H
L4
G
B
L2
E
B2
D
A1
R
R
C
A
C2
0.60 MIN.
V2
A2
6.7
6.7 3 3 1.6
1.6
2.3
2.3
Package dimensions STPS10170C
8/10
Figure 13. D2PAK footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 7. D2PAK dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
G
L3
L2
B
B2
E
* FLAT ZONE NO LESS THAN 2m
m
A
C2
D
R
A2
M
V2
C
A1
*
16.90
10.30
8.90 3.70
5.08
1.30
STPS10170C Ordering information
9/10
3 Ordering information
4 Revision history
Part number Marking Package Weight Base qty Delivery mode
STPS10170CT STPS10170CT TO-220AB 2.23 g 50 Tube
STPS10170CG STPS10170CG D2PAK 1.48 g 50 Tube
STPS10170CG-TR STPS10170CG D2PAK 1.48 g 1000 Tape and reel
STPS10170CB PS10170CB DPAK 0.3 g 75 Tube
STPS10170CB-TR PS10170CB DPAK 0.3 g 2500 Tape and reel
STPS10170CR STPS10170CR I2PAK 1.49 g 50 Tube
Date Revision Description of changes
13-Jul-2006 1 First issue.
STPS10170C
10/10
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