PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers--from ultra-mobile notebooks to powerful servers--and in a wide range of handheld devices such as smartphones and tablets. Samsung also delivers the industry's widest line of storage products from the consumer to the enterprise level. These include optical disk drives as well as flash storage, such as Solid State Drives, and a range of embedded and removable flash storage products. Markets DRAM Mobile/Wireless SSD FLASH ASIC LOGIC TFT/LCD N/A Notebook PCs/ Ultrabooks Desktop PCs/ Workstations Servers Networking/ Communications Consumer Electronics samsung.com/us/oem-solutions N/A N/A ODD DRAM Pages 4-12 * * * * DDR3 SDRAM DDR2 SDRAM DDR SDRAM SDRAM * Mobile DRAM * Graphics DDR SDRAM * DRAM Ordering Information FLASH - SSD Pages 13-15 samsung.com/flash * * * * SLC Flash MLC Flash SD and microSD Cards eMMC * Solid State Drive * Flash Ordering Information MULTI-CHIP PACKAGE Pages 16-17 samsung.com/mcp * NAND + MDDR * eMMC + LPDDR2 * eMMC + MDDR storage Pages 18-19 samsung.com/greenmemory * Solid State Drive samsungodd.com * Optical Disc Drive Displays Pages 20-22 samsungdisplay.com * Exclusive Digital Information Display (E-DID) * Performance Digital Information Display (P-DID) * Basic Digital Information Display (B-DID) * Tablets * Notebooks/PCs * Monitors CONTACTs Page 23 samsung.com/us/oemsolutions * Sales Representatives and Distributors samsung.com/dram 2H 2012 3 DRAM samsung.com/dram DDR3 SDRAM REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance 1GB M393B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M393B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now 2GB 4GB 1.5V 1.5V 1.5V 128Mx72 256Mx72 512Mx72 1.5V 1Gx72 16GB 1.5V 2Gx72 8GB 1.5V 1Gx72 M393B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M393B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M393B5170GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now M393B5273CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M393B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M393B1K73CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K73DH0-C(F8/H9)(08/09) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K70CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now M393B1K70DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2K70CM0-C(F8/H9)(04/05) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2K70DM0-C(F8/H9)(08/09) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2G70AH0-C(F8/H9)(04/05) 16GB 1.5V 2Gx72 32GB 1.5V 4Gx72 2GB 1.35V 256Mx72 4GB 8GB 1.35V 1.35V 512Mx72 1Gx72 16GB 1.35V 2Gx72 8GB 1.35V 1Gx72 16GB 1.35V 2Gx72 4Gx72 Ranks Production M393B5773CH0-C(F8/H9)(04/05) M393B5270CH0-C(F8/H9)(04/05) 8GB Speed (Mbps) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now M393B2G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2G73AH0-C(F8/H9)(04/05) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2G73BH0-C(F8/H9)(08/09) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70AM0-C(F8/H9)(04/05) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70BM0-C(F8/H9)(08/09) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B5773CH0-Y(F8/H9)(04/05) 2Gb (256M x4) * 9 Lead Free & Halogen Free 1066/1333 1 Now M393B5773DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x4) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now M393B5173GB0-Y(F8/H9)(08/09) 1Gb (128M x8) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333 4 Now M393B5170GB0-Y(F8/H9/K0)(08/09) 1Gb (256M x4) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333/1600 2 Now M393B5273CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M393B5273DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B5270CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B5270DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M393B1K73CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K73DH0-Y(F8/H9)(08/09) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K70CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now M393B1K70DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2K70CM0-Y(F8/H9)(04/05) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2K70DM0-Y(F8/H9)(08/09) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M393B1G73BH0-Y(F8/H9/K0)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2G70AH0-Y(F8/H9)(04/05) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2G73AH0-Y(F8/H9)(04/05) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2G73BH0-Y(F8/H9)(08/09) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70AM0-Y(F8/H9)(04/05) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70BM0-Y(F8/H9)(08/09) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now 32GB 1.35V Notes: 04 = IDT B0 register F8 = DDR3-1066 (7-7-7) 05 = Inphi C0 register 09 = Inphi UV GS02 MA = DDR3-1866 (13-13-13) * K0 (1600Mbps) available in ES only H9 = DDR3-1333 (9-9-9) 08 = IDT A1 K0 = DDR3-1600 (11-11-11) DDR3 SDRAM Load Reduced REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 16GB 1.35V 2Gx72 M386B2K70DM0-YH90 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1333 4 Now 32GB 1.35V 4Gx72 M386B4G70BM0-YH90 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1333 4 Now Notes: 4 0 = Inphi iMB GS02A DDR3 SDRAM 2H 2012 samsung.com/dram samsung.com/dram Density Voltage Organization Part Number Composition Compliance 1GB 1.5V M392B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M392B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now M392B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M392B5773CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M392B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B5273CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B5270CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M392B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B1K73CM0-C(F8/H9)(04/05) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K73DM0-C(F8/H9)(08/09) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K70CM0-C(F8/H9)(04/05) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B1K70DM0-C(F8/H9/K0/MA)(08/09) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B2G70AM0-C(F8/H9)(04/05) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B2G70BM0-C(F8/H9/K0/MA)(08/09) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B2G73AM0-C(F8/H9)(04/05) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B2G73BM0-C(F8/H9)(08/09) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B5773CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M392B5773DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B5273CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B5273DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B5270CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M392B5270DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B1K73CM0-Y(F8/H9)(04/05) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now 2GB 4GB 8GB 16GB 2GB 4GB 8GB 1.5V 1.5V 1.5V 1.5V 1.35V 1.35V 1.35V 128Mx72 256Mx72 512Mx72 1Gx72 2Gx72 256Mx72 512Mx72 1Gx72 Ranks Production M392B1K73DM0-Y(F8/H9)(08/09) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K70CM0-Y(F8/H9)(04/05) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B1K70DM0-Y(F8/H9/K0)(08/09) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B1G73BH0-Y(F8/H9/K0)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B1G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B2G70AM0-Y(F8/H9)(04/05) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B2G70BM0-Y(F8/H9/K0)(08/09) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B2G70AM0-Y(F8/H9)(04/05) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now 16GB 1.35V 2Gx72 32GB 1.35V 4Gx72 Notes: 04 = IDT B0 register F8 = DDR3-1066 (7-7-7) 05 = Inphi C0 register H9 = DDR3-1333 (9-9-9) M392B2G70BM0-Y(F8/H9)(08/09) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B4G70BE0-Y(F8/H9)(08) 4Gb QDP (4G x4) * 18 Lead Free & Halogen Free 1066/1333 4 Now 08 = IDT A1 K0 = DDR3-1600 (11-11-11) 09 = Inphi UV GS02 MA = DDR3-1866 (13-13-13) samsung.com/dram Speed (Mbps) 2H 2012 DDR3 SDRAM 5 DRAM DDR3 SDRAM VLP REGISTERED MODULES DDR3 SDRAM UNBUFFERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 1GB 1.5V 128Mx64 2GB 1.5V 256Mx64 4GB 1.5V 512Mx64 8GB 1.5V 1024Mx64 M378B2873GB0-C(F8/H9/K0/MA) M378B5673GB0-C(F8/H9/K0/MA) M378B5773CH0-C(F8/H9) M378B5773DH0-C(F8/H9/K0/MA) M378B5273CH0-C(F8/H9) M378B5273DH0-C(F8/H9/K0/MA) M378B1G73AH0-C(F8/H9) M378B1G73BH0-C(F8/H9/K0/MA) 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 8 2Gb (256M x8) * 16 2Gb (256M x8) * 16 4Gb (512M x8) * 16 4Gb (512M x8) * 16 Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1 2 1 1 2 2 2 2 Now Now Now Now Now Now Now Now DDR3 SDRAM UNBUFFERED MODULES (ECC) Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 1GB 1.5V 128Mx72 2GB 1.5V 256Mx72 4GB 1.5V 512Mx72 8GB 1.5V 1024Mx72 1GB 1.35V 128Mx72 2GB 1.35V 256Mx72 4GB 1.35V 512Mx72 8GB 1.35V 1024Mx72 M391B2873GB0-C(F8/H9/K0/MA) M391B5673GB0-C(F8/H9/K0/MA) M391B5773CH0-C(F8/H9) M391B5773DH0-C(F8/H9/K0/MA) M391B5273CH0-C(F8/H9) M391B5273DH0-C(F8/H9/K0/MA) M391B1G73AH0-C(F8/H9) M391B1G73BH0-C(F8/H9/K0/MA) M391B2873GB0-Y(F8/H9/K0) M391B5673GB0-Y(F8/H9/K0) M391B5773CH0-Y(F8/H9) M391B5773DH0-Y(F8/H9/K0) M391B5273CH0-Y(F8/H9) M391B5273DH0-Y(F8/H9/K0) M391B1G73AH0-Y(F8/H9) M391B1G73BH0-Y(F8/H9/K0) 1Gb (128M x8) * 9 1Gb (128M x8) * 18 2Gb (256M x8) * 9 2Gb (256M x8) * 9 2Gb (256M x8) * 18 2Gb (256M x8) * 18 4Gb (512M x8) * 18 4Gb (512M x8) * 18 1Gb (128M x8) * 9 1Gb (128M x8) * 18 2Gb (256M x8) * 9 2Gb (256M x8) * 9 2Gb (256M x8) * 18 2Gb (256M x8) * 18 4Gb (512M x8) * 18 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free,Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free,Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333/1600 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600 1 2 1 1 2 2 2 2 1 2 1 1 2 2 2 2 Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now NOTES: 6 F8 = DDR3-1066 (7-7-7) DDR3 SDRAM H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) 2H 2012 samsung.com/dram Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 1GB 1.5V 128Mx64 2GB 1.5V 256Mx64 4GB 1.5V 512Mx64 8GB 1.5V 1024Mx64 1GB 1.35V 128Mx64 2GB 1.35V 256Mx64 4GB 1.35V 512Mx64 8GB 1.35V 1024Mx64 M471B2873GB0-C(F8/H9/K0/MA) M471B5673GB0-C(F8/H9/K0/MA) M471B5773CHS-C(F8/H9) M471B5773DH0-C(F8/H9/K0/MA) M471B5273CH0-C(F8/H9) M471B5273DH0-C(F8/H9/K0/MA) M471B5173BH0-C(F8/H9/K0/MA) M471B1G73AH0-C(F8/H9/K0) M471B1G73BH0-C(F8/H9/K0/MA) M471B2873GB0-Y(F8/H9/K0) M471B5673GB0-Y(F8/H9/K0) M471B5773CHS-Y(F8/H9) M471B5773DH0-Y(F8/H9/K0) M471B5273CH0-Y(F8/H9) M471B5273DH0-Y(F8/H9/K0) M471B5173BH0-Y(F8/H9/K0) M471B1G73AH0-Y(F8/H9) M471B1G73BH0-Y(F8/H9/K0) 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 8 2Gb (256M x8) * 16 2Gb (256M x8) * 16 4Gb (512M x8) * 8 4Gb (512M x8) * 16 4Gb (512M x8) * 16 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 8 2Gb (256M x8) * 16 2Gb (256M x8) * 16 4Gb (512M x8) * 8 4Gb (512M x8) * 16 4Gb (512M x8) * 16 Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333/1600 1066/1333 1066/1333/1600 1 2 1 1 2 2 1 2 2 1 2 1 1 2 2 1 2 2 Notes: F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now MA = DDR3-1866 (13-13-13) DDR2 SDRAM UNBUFFERED MODULES (ECC) Density Organization Part Number Composition Compliance Speed (Mbps) Rank Production 1GB 128Mx72 M391T2863FB3-C(E6/F7) (128Mx8)*9 Lead free 667/800 1 Now 2GB 256Mx64 M391T5663FB3-C(E6/F7) (128Mx8)*18 Lead free 667/800 2 Now Notes: E6 = PC2-5300 (DDR2-667 @ CL=5) F7 = PC2-6400 (DDR2-800 @ CL=6) E7 = PC2-6400 (DDR2-800 @ CL=5) Voltage = 1.8V DDR2 SDRAM SODIMM MODULES Density Organization Part Number Composition Compliance Speed (Mbps) Rank Production 1GB 128Mx64 M470T2863FB3-C(E6/F7/E7) (64Mx16)*8 Lead free 667/800 2 Now 2GB 256Mx64 M470T5663FB3-C(E6/F7/E7) (128M x8)*8 Lead free 667/800 2 Now Notes: E6 = PC2-5300 (DDR2-667 @ CL=5) F7 = PC2-6400 (DDR2-800 @ CL=6) samsung.com/dram E7 = PC2-6400 (DDR2-800 @ CL=5) Voltage = 1.8V 2H 2012 DDR3 & DDR2 SDRAM 7 DRAM DDR3 SDRAM SODIMM MODULES DDR2 SDRAM COMPONENTS Density 256Mb 512Mb 1Gb Organization Part Number # Pins-Package Dimensions Package Speed (Mbps) Production 16Mx16 K4T56163QN-HC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now 128M x4 K4T51043QJ-HC(E6/F7/E7) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800 Now 64M x8 K4T51083QJ-HC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800/1066 Now 32M x16 K4T51163QJ-HC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now 256M x4 K4T1G044QF-BC(E6/F7/E7) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800 Now 128M x8 K4T1G084QF-BC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800/1066 Now 64M x16 K4T1G164QF-BC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now DDR SDRAM COMPONENTS Density Organization 128Mx4 512Mb 256Mb 64Mx8 Part Number # Pins - Package Speed (Mbps) K4H510438J-LCB3/B0 66-TSOP 266/333 K4H510438J-BCCC/B3 60-FBGA 333/400 K4H510838J-LCCC/B3 66-TSOP 333/400 K4H510838J-BCCC/B3 60-FBGA 333/400 32Mx16 K4H511638J-LCCC/B3 66-TSOP 333/400 64Mx4 K4H560438N-LCB3/B0 66-TSOP 266/333 32Mx8 K4H560838N-LCCC/B3 66-TSOP 333/400 16Mx16 K4H561638N-LCCC/B3 66-TSOP 333/400 128Mb 8Mx16 K4H281638O-LCCC 66-TSOP 400 Notes: B0 = DDR266 (133MHz @ CL=2.5) A2 = DDR266 (133MHz @ Cl=2) B3 = DDR333 (166MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3) 8 DDR2, DDR & SDRAM COMPONENTS 2H 2012 samsung.com/dram Density Type 512Mb 1Gb MDDR 2Gb Organization Part Number Package Power Production 32Mx16 K4X51163PK-FGD8 60-FBGA, 800MHz 1.8V Now 16Mx32 K4X51323PK-8GD8 90-FBGA, 800MHz 1.8V Now 32Mx32 K4X1G323PF-8GD8 90-FBGA, 800MHz 1.8V Now 64Mx32 K4X2G323PD-8GD8 90-FBGA, 800MHz 1.8V Now 4Gb x32 (2CS, 2CKE) K4X4G303PD-AGD8 168-FBGA, 12x12 PoP, DDP . 800MHz 1.8V Now 2Gb 1CH x32 K4P2G324ED-AG(1) 168-FBGA, 12x12 PoP, MONO, 1.2V Now 1CH x32 K4P4G324EB-AG(1,2) 168-FBGA, 12x12 PoP, MONO, 128Mx32 1.2V Now 4Gb 8Gb LPDDR2 16Gb 4Gb 8Gb LPDDR3 16Gb 1CH x32 K4P4G324EC-AG(2) 168-FBGA, 12x12 PoP, MONO, 128Mx32 1.2V ES 2CH x32/ch K3PE4E400P-XG(2) 216FBGA,12x12 PoP, DDP, 64Mx32*2 1.2V Now 2CH x32/ch K3PE4E400D-XGC(2) 220FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V CS 2CH x32/ch K3PE4E400K-XG(2) 240-FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V Now 1CH x32 K4P8G304EB-FG(1,2) 134-FBGA, 11x11.5 , DDP, 128x16*4 1.2V Now 1CH x32 K4P8G304EB-AG(1) 168-FBGA, 12x12 PoP, DDP, 128x16*4 1.2V Now 1CH x32 K4P8G304EB-GG(2) 216FBGA, 12x12 PoP, DDP, 128x16*4 1.2V CS 1CH x32 K4P8G304EC-FG(2) 134-FBGA, 11x11.5 , DDP, 128x16*4 1.2V ES 1CH x32 K4P8G304EC-AG(2) 168-FBGA, 12x12 PoP, DDP, 128x16*4 1.2V ES 2CH x32/ch K3PE7E700M-XG(2) 216-FBGA, 12x12 PoP, DDP, 128Mx32*2 1.2V Now 2CH x32/ch K3PE7E700D-XG(2) 220-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V Now 2CH x32/ch K3PE7E700A-XG(2) 240-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V Now 2CH x32/ch K3PE7E700P-XG(2) 220-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V CS 2CH x32/ch K3PE7E700L-XG(2) 216-FBGA, 12x12 PoP, DDP, 128Mx32*2 1.2V CS 2CH x32/ch K3PE7E700N-XG(2) 240-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V ES 1CH x32 K4PAG304EB-FG(2) 134-FBGA, 11x11.5 , QDP 1.2V Now 1CH x32 K4PAG304EC-FG(2) 134-FBGA, 11x11.5 , QDP 1.2V ES 2CH x32/ch K3PE0E000M-XG(2) 216-FBGA, 12x12 PoP, QDP, 128Mx32*4 1.2V Now 2CH x32/ch K3PE0E000A-XG(2) 220-FBGA, 14x14 PoP, QDP, 128Mx32*4 1.2V Now 2CH x32/ch K3PE0E000B-XG(2) 240-FBGA, 14x14 PoP, QDP, 128Mx32*4 1.2V Now 2CH x32/ch K3PE0E000E-XG(2) 220-FBGA, 14x14 PoP, QDP, 128Mx32*4 1.2V ES 2CH x32/ch K3PE0E000C-XG(2) 216-FBGA, 12x12 PoP, QDP, 128Mx32*4 1.2V ES 2CH x32/ch K3PE0E000D-XG(2) 240-FBGA, 14x14 PoP, QDP, 128Mx32*4 1.2V ES 1CH x32 K4E4E324EB-EGCE 178-FBGA, 11x11.5 , MONO , 1066 MHz 1.2V ES 1CH x32 K4E8E304EB-EGCE 178-FBGA, 11x11.5 , DDP, 1066 MHz 1.2V ES 2CH x32/ch K3QF1F100B-PGCE 253-FBGA, 11x11.5 , DDP, 1066 MHz 1.2V ES 2CH x32/ch K3QF1F100G-XGCE 216-FBGA, 15x15 PoP , DDP, 1066 MHz 1.2V ES 1CH x32 K4E6E304EB-EGCE 178-FBGA, 11x11.5 , QDP, 1066 MHz 1.2V ES 2CH x32/ch K3QF2F200A-XGCE 253-FBGA, 11x11.5 , QDP, 1066 MHz 1.2V ES 2CH x32/ch K3QF2F200B-XGCE 216-FBGA, 15x15 PoP , QDP, 1066 MHz 1.2V ES Notes: (1,2) Speed: Mobile LPDDR2 (1) C1: 800MHz DRAM MOBILE DRAM COMPONENTS (2) C2: 1066MHz GRAPHICS DRAM COMPONENTS Type Density 2Gb Organization 64Mx32 GDDR5 1Gb GDDR3 gDDR3 Notes: 32Mx32 Part Number Package VDD/VDDQ Speed Bin (MHz) Production K4G20325FD-FC(04/03/28) 170-FBGA 1.5V/1.5V 1250/1500/1750 Now K4G20325FD-FC(04/03) 170-FBGA 1.35V/1.35V 1000/1250 Now K4G10325FG-HC03 170-FBGA 1.6V/1.6V 1500 Now K4G10325FG-HC(05/04) 170-FBGA 1.5V/1.5V 1000/1250 Now K4G10325FG-HC(04/03) 170-FBGA 1.35V/1.35V 900/1050 Now 1Gb 32Mx32 K4J10324KG-HC(14/1A) 136-FBGA 1.8V/1.8V 700/1000 Now 4Gb 256Mx16 K4W4G1646B-HC(12/11/1A) 96-FBGA 1.5V/1.5V 800/933/1066 Now 2Gb 128Mx16 K4W2G1646E-BC(15/12/11/1A) 96-FBGA 1.5V/1.5V 667/800/933/1066 Now 1Gb 64Mx16 K4W1G1646G-BC(15/12/11/1A) 96-FBGA 1.5V/1.5V 667/800/933/1066 Now Package (1) Speeds (clock cycle - speed bin) H: FBGA (Halogen Free & Lead Free) B: FBGA (Halogen Free & Lead Free) 03: 0.3ns (3000MHz) 04: 0.4ns (2500MHz) 05: 0.5ns (2000MHz) 5C: 0.555 (1800MHz) samsung.com/dram 2H 2012 08: 0.83ns (1200MHz) 1A: 1ns (1000MHz GDDR3) 1A: 1ns (1066MHz gDDR3) 11: 1.1ns (933MHz) 12: 1.25ns (800MHz) 14: 1.429ns (700MHz) 20: 2.0ns (500MHz) 25: 2.5ns (400MHz) Mobile & Graphics DRAM Components 9 COMPONENT DRAM ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) Number of Internal Banks SAMSUNG Memory DRAM DRAM Type Density Bit Organization 1. Memory (K) 2. DRAM: 4 3. DRAM Type B: DDR3 SDRAM D: GDDR SDRAM G: GDDR5 SDRAM H: DDR SDRAM J: GDDR3 SDRAM M: Mobile SDRAM N: SDDR2 SDRAM S: SDRAM T: DDR SDRAM U: GDDR4 SDRAM V: Mobile DDR SDRAM Power Efficient Address W: SDDR3 SDRAM X: Mobile DDR SDRAM Y: XDR DRAM Z: Value Added DRAM 4. Density 10: 1G, 8K/32ms 16: 16M, 4K/64ms 26: 128M, 4K/32ms 28: 128M, 4K/64ms 32: 32M, 2K/32ms 50: 512M, 32K/16ms 51: 512M, 8K/64ms 52: 512M, 8K/32ms 54: 256M, 16K/16ms 55: 256M, 4K/32ms 56: 256M, 8K/64ms 62: 64M, 2K/16ms 64: 64M, 4K/64ms 68: 768M, 8K/64ms 1G: 1G, 8K/64ms 2G: 2G, 8K/64ms 4G: 4G, 8K/64ms 5. Bit Organization 02: x2 04: x4 06: x4 Stack (Flexframe) 07: x8 Stack (Flexframe) 10 DRAM Ordering Information 08: x8 15: x16 (2CS) 16: x16 26: x4 Stack (JEDEC Standard) 27: x8 Stack (JEDEC Standard) 30: x32 (2CS, 2CKE) 31: x32 (2CS) 32: x32 6. # of Internal Banks 2: 2 Banks 3: 4 Banks 4: 8 Banks 5: 16 Banks 7. Interface ( VDD, VDDQ) 2: LVTTL, 3.3V, 3.3V 4: LVTTL, 2.5V, 2.5V 5: SSTL-2 1.8V, 1.8V 6: SSTL-15 1.5V, 1.5V 8: SSTL-2, 2.5V, 2.5V A: SSTL, 2.5V, 1.8V F: POD-15 (1.5V,1.5V) H: SSTL_2 DLL, 3.3V, 2.5V M: LVTTL, 1.8V, 1.5V N: LVTTL, 1.5V, 1.5V P: LVTTL, 1.8V, 1.8V Q: SSTL-2 1.8V, 1.8V R: SSTL-2, 2.8V, 2.8V U: DRSL, 1.8V, 1.2V 8. Revision A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation E: 6th Generation F: 7th Generation G: 8th Generation H: 9th Generation I: 10th Generation J: 11th Generation K: 12th Generation M: 1st Generation N: 14th Generation Q: 17th Generation 2H 2012 9. Package Type DDR2 DRAM L: TSOP II (Lead-free & Halogen-free) H: FBGA (Lead-free & Halogen-free) F: FBGA for 64Mb DDR (Lead-free & Halogen-free) 6: sTSOP II (Lead-free & Halogen-free) T: TSOP II N: sTSOP II G: FBGA U: TSOP II (Lead-free) V: sTSOP II (Lead-free) Z: FBGA (Lead-free) DDR2 SDRAM Z: FBGA (Lead-free) J: FBGA DDP (Lead-free) Q: FBGA QDP (Lead-free) H: FBGA (Lead-free & Halogen-free) M: FBGA DDP (Lead-free & Halogen-free) E: FBGA QDP (Lead-free & Halogen-free) T: FBGA DSP (Lead-free & Halogen-free, Thin) DDR3 SDRAM Z: FBGA (Lead-free) H: FBGA (Halogen-free & Lead-free) Graphics Memory Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 FBGA (Lead Free) Z: 84 FBGA (Lead Free) T: TSOP L: TSOP (Lead Free) A: 136 FBGA B: 136 FBGA (Lead Free) H: FBGA (Hologen Free & Lead Free) E: 100 FBGA (Hologen Free & Lead Free) SDRAM L TSOP II (Lead-free & Halogen-free) N: STSOP II T: TSOP II U: TSOP II (Lead-free) V: sTSOP II (Lead-free) samsung.com/dram 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) Number of Internal Banks SAMSUNG Memory DRAM DRAM Type Density Bit Organization XDR DRAM J: BOC(LF) P: BOC Mobile DRAM Leaded/Lead Free G/A: 52balls FBGA Mono R/B: 54balls FBGA Mono X/Z: 54balls BOC Mono J/V: 60(72)balls FBGA Mono 0.5pitch L /F: 60balls FBGA Mono 0.8pitch S/D: 90balls FBGA Monolithic (11mm x 13mm) F/H: Smaller 90balls FBGA Mono Y/P: 54balls CSP DDP M/E: 90balls FBGA DDP 10. Temp & Power - COMMON (Temp, Power) C: Commercial, Normal (0'C - 95'C) & Normal Power C: (Mobile Only) Commercial (-25 ~ 70'C), Normal Power J: Commercial, Medium L: Commercial, Low (0'C - 95'C) & Low Power L: (Mobile Only) Commercial, Low, i-TCSR F: Commercial, Low, i-TCSR & PASR & DS E: Extended (-25~85'C), Normal N: Extended, Low, i-TCSR G: Extended, Low, i-TCSR & PASR & DS I: Industrial, Normal (-40'C - 85'C) & Normal Power P: Industrial, Low (-40'C - 85'C) & Low Power H: Industrial, Low, i-TCSR & PASR & DS 11. Speed (Wafer/Chip Biz/BGD: 00) DDR SDRAM CC: DDR400 (200MHz @ CL=3, tRCD=3, tRP=3) B3: DDR333 (166MHz @ CL=2.5, tRCD=3, tRP=3) *1 A2: DDR266 (133MHz @ CL=2 , tRCD=3, tRP=3) B0: DDR266 (133MHz @ CL=2.5, tRCD=3, tRP=3) Note 1: "B3" has compatibility with "A2" and "B0" samsung.com/dram DRAM COMPONENT DRAM ORDERING INFORMATION DDR2 SDRAM CC: DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) D5: DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) E6: DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) F7: DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) E7: DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) DDR3 SDRAM F7: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6) F8: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7) G8: DDR3-1066 (533MHz @ CL=8, tRCD=8, tRP=8) H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9) K0: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11) MA: DDR3-1866 (933MHz @ CL=13, tRCD=13, tRP=13) NB: DDR3-2133 (1067MHz @ CL=14, tRCD=14, tRP=14) Graphics Memory 18: 1.8ns (550MHz) 04: 0.4ns (2500MHz) 20: 2.0ns (500MHz) 05: 0.5ns (2000MHz) 22: 2.2ns (450MHz) 5C: 0.56ns (1800MHz) 25: 2.5ns (400MHz) 06: 0.62ns (1600MHz) 2C: 2.66ns (375MHz) 6A: 0.66ns (1500MHz) 2A: 2.86ns (350MHz) 07: 0.71ns (1400MHz) 33: 3.3ns (300MHz) 7A: 0.77ns (1300MHz) 36: 3.6ns (275MHz) 08: 0.8ns (1200MHz) 40: 4.0ns (250MHz) 2H 2012 09: 0.9ns (1100MHz) 45: 4.5ns (222MHz) 1 : 1.0ns (1000MHz) 50/5A: 5.0ns (200MHz) 1 : 1.1ns (900MHz) 55: 5.5ns (183MHz) 12: 1.25ns (800MHz) 60: 6.0ns (166MHz) 14: 1.4ns (700MHz) 16: 1.6ns (600MHz) SDRAM (Default CL=3) 50: 5.0ns (200MHz CL=3) 60: 6.0ns (166MHz CL=3) 67: 6.7ns 75: 7.5ns PC133 (133MHz CL=3) XDR DRAM A2: 2.4Gbps, 36ns, 16Cycles B3: 3.2Gbps, 35ns, 20Cycles C3: 3.2Gbps, 35ns, 24Cycles C4: 4.0Gbps, 28ns, 24Cycles DS: Daisychain Sample Mobile-SDRAM 60: 166MHz, CL 3 75: 133MHz, CL 3 80: 125MHz, CL 3 1H: 105MHz, CL 2 1L: 105MHz, CL 3 15: 66MHz, CL 2 & 3 Mobile-DDR C3: 133MHz, CL 3 C2: 100MHz, CL 3 C0: 66MHz, CL 3 Note: All of Lead-free or Halogen-free product are in compliance with RoHS DRAM Ordering Information 11 Module DRAM Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 13 M X XX T XX X X X X X X XX X AMB Vendor Speed Temp & Power PCB Revision Package Component Revision SAMSUNG Memory DIMM Data bits DRAM Component Type Depth Number of Banks Bit Organization 1. Memory Module: M 2. DIMM Type 3: DIMM 4: SODIMM 3. Data bits 12: x72 184pin Low Profile Registered DIMM 63: x63 PC100/PC133 SODIMM with SPD for 144pin 64: x64 PC100/PC133 SODIMM with SPD for 144pin (Intel/JEDEC) 66: x64 Unbuffered DIMM with SPD for 144pin/168pin (Intel/JEDEC) 68: x64 184pin Unbuffered DIMM 70: x64 200pin Unbuffered SODIMM 71: x64 204pin Unbuffered SODIMM 74: x72/ECC Unbuffered DIMM with SPD for 168pin (Intel/JEDEC) 77: x72/ECC PLL + Register DIMM with SPD for 168pin (Intel PC100) 78: x64 240pin Unbuffered DIMM 81: x72 184pin ECC unbuffered DIMM 83: x72 184pin Registered DIMM 90: x72/ECC PLL + Register DIMM 91: x72 240pin ECC unbuffered DIMM 92: x72 240pin VLP Registered DIMM 93: x72 240pin Registered DIMM 95: x72 240pin Fully Buffered DIMM with SPD for 168pin (JEDEC PC133) 4. DRAM Component Type B: DDR3 SDRAM (1.5V VDD) L: DDR SDRAM (2.5V VDD) S: SDRAM T: DDR2 SDRAM (1.8V VDD) 5. Depth 9. Package 09: 8M (for 128Mb/512Mb) 17: 16M (for 128Mb/512Mb) 16: 16M 28: 128M 29: 128M (for 128Mb/512Mb) 32: 32M 33: 32M (for 128Mb/512Mb) 51: 512M 52: 512M (for 512Mb/2Gb) 56: 256M 57: 256M (for 512Mb/2Gb) 59: 256M (for 128Mb/512Mb) 64: 64M 65: 64M (for 128Mb/512Mb) 1G: 1G 1K: 1G (for 2Gb) 6. # of Banks in Comp. & Interface 1: 4K/64mxRef., 4Banks & SSTL-2 2 : 8K/64ms Ref., 4Banks & SSTL-2 2: 4K/64ms Ref., 4Banks & LVTTL (SDR Only) 5: 8K/64ms Ref., 4Banks & LVTTL (SDR Only) 5: 4Banks & SSTL-1.8V 6: 8Banks & SSTL-1.8V 7. Bit Organization 0: x 4 3: x 8 4: x16 6: x 4 Stack (JEDEC Standard) 7: x 8 Stack (JEDEC Standard) 8: x 4 Stack 9: x 8 Stack 8. Component Revision A: 2nd Gen. B: 3rd Gen. C: 4th Gen. D: 5th Gen. E: 6th Gen. F: 7th Gen. G: 8th Gen. M: 1st Gen. Q: 17th Gen. 12 DRAM Ordering Information E: FBGA QDP (Lead-free & Halogen-free) G: FBGA H: FBGA (Lead-free & Halogen-free) J: FBGA DDP (Lead-free) M: FBGA DDP (Lead-free & Halogen-free) N: sTSOP Q: FBGA QDP (Lead-free) T: TSOP II (400mil) U: TSOP II (Lead-Free) V: sTSOP II (Lead-Free) Z: FBGA (Lead-free) 10. PCB Revision 0: Mother PCB 1: 1st Rev 2: 2nd Rev. 3: 3rd Rev. 4: 4th Rev. A: Parity DIMM S: Reduced PCB U: Low Profile DIMM 11. Temp & Power C: Commercial Temp. (0C ~ 95C) & Normal Power L: Commercial Temp. (0C ~ 95C) & Low Power 12. Speed CC: (200MHz @ CL=3, tRCD=3, tRP=3) D5: (266MHz @ CL=4, tRCD=4, tRP=4) E6: (333MHz @ CL=5, tRCD=5, tRP=5) F7: (400MHz @ CL=6, tRCD=6, tRP=6) E7: (400MHz @ CL=5, tRCD=5, tRP=5) F8: (533MHz @ CL=7, tRCD=7, tRP=7) G8: (533MHz @ CL=8, tRCD=8, tRP=8) H9: (667MHz @ CL=9, tRCD=9, tRP=9) K0: (800MHz @ CL=10, tRCD=10, tRP=10) 7A: (133MHz CL=3/PC100 CL2) 13. AMB Vendor for FBDIMM 0, 5: Intel 1, 6, 8: IDT 9: Montage Note: All of Lead-free or Halogen-free product are in compliance with RoHS 2H 2012 samsung.com/dram SLC Flash Technology Part Number Package Type Org. Vol(V) Status 512Gb HDP 21nm DDR K9WDGY8S5M-CCK* 316FBGA x8 3.3/1.8 CS Q2 2012 256Gb ODP 21nm DDR K9QFGY8S7M-CCK* 316FBGA x8 3.3/1.8 CS Q2 2012 128Gb QDP 21nm DDR K9VHGY8SCM-CCK* 316FBGA x8 3.3/1.8 CS Q2 2012 16Gb QDP 42nm SDR 8Gb DDP 42nm SDR 4Gb 42nm SDR 2Gb 42nm SDR 1Gb 42nm SDR K9WAG08U1D-SCB0* TSOP1 x8 3.3 MP K9WAG08U1D-SIB0* TSOP1 x8 3.3 MP K9K8G08U0D-SCB0* TSOP-LF/HF x8 3.3 MP K9K8G08U0D-SIB0* TSOP-LF/HF, i-temp x8 3.3 MP K9F4G08U0D-SCB0* TSOP1 HF & LF x8 3.3 MP K9F4G08U0D-SIB0* TSOP1 HF & LF, i-temp x8 3.3 MP K9F2G08U0C-SCB0* TSOP-LF/HF x8 3.3 MP K9F2G08U0C-SIB0* TSOP-LF/HF, i-temp x8 3.3 MP K9F1G08U0D-SCB0* TSOP-LF/HF x8 3.3 MP K9F1G08U0D-SIB0* TSOP-LF/HF, i-temp x8 3.3 MP Please contact your local Samsung sales representative for latest product offerings. F L A SH - SSD Density Note: All parts are lead free MLC Flash Type Density Technology Part Number Package Type Org. Vol(V) Status 512Gb ODP 21nm DDR K9PHGY8S5A-HCK0000 132BGA x8 3.3/1.8 MP 256Gb QDP 21nm DDR K9HFGY8S5A-HCK0000 132BGA x8 3.3/1.8 MP 27nm DDR K9HDG08U1A-SCB0000 48TSOP x8 3.3 MP 21nm DDR K9HDGY8U5B-HCK0000 132BGA x8 3.3 MP 21nm DDR K9HDGY8U5B-HCK0000 132BGA x8 3.3 MP 21nm DDR K9LDGY8S1A-HCK0000 132BGA x8 3.3/1.8 MP 21nm DDR K9LCG08U0B-SCB0000 48TSOP x8 3.3 MP 21nm SDR K9LCGY8U1B-HCK0000 132BGA x8 3.3 MP 21nm DDR K9GCGY8S0A-HCK0000 132BGA x8 3.3 MP 21nm SDR K9GBG08U0A-SCB0000 48TSOP x8 3.3 MP 21nm DDR K9GBGY8U0B-HCK0000 60LGA x9 3.3/1.8 MP 27nm SDR K9GAG08U0F-SCB0000 48TSOP x8 3.3 MP 27nm DDR K9GAGD8U0F-MCB0000 60LGA x8 3.3 MP 256Gb QDP 21nm DDR K9CFGD8U1A-SCB0000 TSOP x8 3.3 MP 128Gb DDP 21nm DDR K9BDGD8U0A-SCB0000 TSOP x8 3.3 MP 64Gb mono 21nm DDR K9ACGD8U0A-SCB0000 TSOP x8 3.3 MP 32Gb mono 21nm DDR K9ABGD8U0C-SCB0000 TSOP x8 3.3 MP 128Gb QDP 128Gb DDP 2bit 64Gb DDP 64Gb mono 32Gb mono 16Gb mono 3bit Please contact your local Samsung sales representative for latest product offerings. samsung.com/flash 2H 2012 Note: All parts are lead-free & halogen-free SLC & MLC FLASH 13 SD and MicroSD FLASH CARDS Application SD Cards uSD Cards Density Part Number 2GB MMAGF02GWFCA-2MN00 4GB MMBTF04GWBCA-QME00 8GB MMBTF08GWBCA-RME00 16GB MMBTF16GWBCA-RME00 2GB MMAUR02G3ACA-QMP00 4GB MMBTR04GUBCA-2ME00 8GB MMBTR08GUBCA-2ME00 16GB MMBTR16GUBCA-2ME00 32GB MMBTR32GUBCA-2AB00 Please contact your local Samsung sales representative for part numbers and latest product offerings. eMMC Density Flash 4GB 8GB 16GB 32GB 64GB Part Number Class (Random W IOPS) mmC Version Package Type Org. Vol (V) Status 32Gb*1 KLM4G1FE3B-B001xxx 50 v4.41 11.5x13 BGA x8 1.8/3.3 MP 32Gb*1 KLM4G1YE4C-B001xxx 100 v4.41 11.5x13 BGA x8 1.8/3.3 MP 32Gb*1 KLM4G1FE3B-B001xxx 50 v4.41 11.5x13 BGA x8 1.8/3.3 MP 32Gb*1 KLM4G1YE4C-B001xxx 100 v4.41 11.5x13 BGA x8 1.8/3.3 MP 64Gb*2 KLMAG2WE4A-A001xxx 250 v4.41 12x16 BGA x8 1.8/3.3 MP 64Gb*2 KLMAG2GE4A-A001xxx 400 v4.41 12x16 BGA x8 1.8/3.3 MP 64Gb*2 KLMAG2GE2A-A001xxx 1500 v4.5 12x16 BGA x8 1.8/3.3 MP 64Gb*4 KLMBG4WE4A-A001xxx 400 v4.41 12x16 BGA x8 1.8/3.3 MP 64Gb*4 KLMBG4GE2A-A001xxx 1500 v4.5 12x16 BGA x8 1.8/3.3 MP 64Gb*8 KLMCG8GE4A-A001xxx 400 v4.41 12x16 BGA x8 1.8/3.3 MP 64Gb*8 KLMCG8GE2A-A001xxx 1500 v4.5 12x16 BGA x8 1.8/3.3 MP Please contact your local Samsung sales representative for part numbers and latest product offerings. SOLID STATE DRIVES (SSD) Interface Size 2.5" 7mmT Connector Thin SATA Controller PM830 Component 27nm 32Gb MLC SATA III - 6Gb/s mSATA SATA II - 3Gb/s 2.5" 15mmT PCIe Thin SATA PM830 SM825 21nm 32Gb MLC 32nm 32Gb E-MLC Density Part Number Comments 64GB MZ7PC064HADR-00000 Mass production 128GB MZ7PC128HAFU-00000 Mass production 256GB MZ7PC256HAFU-00000 Mass production 512GB MZ7PC512HAGH-00000 Mass production 32GB MZMPC032HBCD-00000 Mass production 64GB MZMPC064HBDR-00000 Mass production 128GB MZMPC128HBFU-00000 Mass production 256GB MZMPC256HBGJ-00000 Mass production 100GB MZ5EA100HMDR-00003 Mass production 200GB MZ5EA200HMDR-00003 Mass production 400GB MZ5EA400HMFP-00003 Mass production Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead free 14 SD/MicroSD Flash, eMMC & SSD 2H 2012 samsung.com/flash 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 K 9 X X X X X X X X - X X X X Pre-Program Version Customer Bad Block Temp Package --Generation Mode SAMSUNG Memory NAND Flash Small Classification Density Density Organization Organization Vcc 1. Memory (K) 2. NAND Flash : 9 3. Small Classification (SLC : Single Level Cell, MLC : Multi Level Cell) 7 : SLC eMMC 8 : MLC eMMC F : SLC Normal G : MLC Normal H : MLC QDP K : SLC DDP L : MLC DDP M : MLC DSP N : SLC DSP P : MLC 8 Die Stack Q : SLC 8 Die Stack S : SLC Single SM T : SLC SINGLE (S/B) U : 2 Stack MSP W : SLC 4 Die Stack 4~5. Density 12 : 512M 56 : 256M 1G : 1G 2G : 2G 4G : 4G 8G : 8G AG: 16G BG: 32G CG: 64G DG : 128G EG : 256G LG : 24G NG : 96G ZG : 48G 00 : NONE 6~7. Organization 00 : NONE 08 : x8 16 : x16 samsung.com/flash 8. Vcc A : 1.65V~3.6V B : 2.7V (2.5V~2.9V) C : 5.0V (4.5V~5.5V) D : 2.65V (2.4V~2.9V) E : 2.3V~3.6V R : 1.8V (1.65V~1.95V) Q : 1.8V (1.7V~1.95V) T : 2.4V~3.0V U : 2.7V~3.6V V : 3.3V (3.0V~3.6V) W : 2.7V~5.5V, 3.0V~5.5V 0 : NONE 9. Mode 0 : Normal 1 : Dual nCE & Dual R/nB 3 : Tri/CE & Tri R/B 4 : Quad nCE & Single R/nB 5 : Quad nCE & Quad R/nB 9 : 1st block OTP A : Mask Option 1 L : Low grade 13. Temp C : Commercial I : Industrial 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 14. Customer Bad Block B : Include Bad Block D : Daisychain Sample L : 1~5 Bad Block N : ini. 0 blk, add. 10 blk S : All Good Block 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 15. Pre-Program Version 0 : None Serial (1~9, A~Z) 10. Generation M : 1st Generation A : 2nd Generation B : 3rd Generation C : 4th Generation D : 5th Generation 11. ---12. Package A : COB B : FBGA (Halogen-Free, Lead-Free) C : CHIP BIZ D : 63-TBGA F : WSOP (Lead-Free) G : FBGA H : TBGA (Lead-Free) I : ULGA (Lead-Free) (12*17) J : FBGA (Lead-Free) L : ULGA (Lead-Free) (14*18) M : TLGA N : TLGA2 P : TSOP1 (Lead-Free) Q : TSOP2 (Lead-Free) S : TSOP1 (Halogen-Free, Lead-Free) T : TSOP2 U : COB (MMC) V : WSOP W : Wafer Y : TSOP1 Z : WELP (Lead-Free) 2H 2012 15 F L A SH - SSD FLASH Product Ordering Information Samsung has a vast portfolio of MCP products for a variety of solutions, such as mobile phones, PMPs, and tablet computers. The following illustration shows Samsung's lineup of MCP memory solutions, which can be deployed in almost any application. Samsung MCP products' suite with different values and types of RAM and ROM ROM eMCP=eMMC+LPDDR1 or LPDDR2 64GB 32GB 16GB 8GB 4GB 2GB NAND + LPDDR1 8G 4G 2G 1G 32 M 64M 128M 256M 512M 1G 2G 4G 6G 8G RAM mSDR LPDDR1 LPDDR2 16 Multi-Chip Packages 2H 2012 samsung.com/mcp MCP: NAND + MDDR Memory NAND Density DRAM Density/Organization Voltage (NAND-DRAM) Package 256Mb (x16) 1.8V - 1.8V 130FBGA 512Mb (x16) 1.8V - 1.8V 130FBGA 2Gb (x8) 1Gb (x32) 1.8V - 1.8V 130FBGA 2Gb (x16) 1Gb (x16) 1.8V - 1.8V 130FBGA 2Gb (x32) 1.8V - 1.8V 137FBGA 2Gb*2 (x32, 2CS/2CKE) 1.8V - 1.8V 137FBGA DRAM Density/Organization Voltage (eMMC-DRAM) Package 4Gb 3.3V/1.8V - 1.8V/1.2V 162FBGA 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 1Gb (x16) NAND & MDRAM 4Gb (x16) Memory eMMC Density 4GB eMMC & MDRAM 8GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 162FBGA 16GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 186FBGA 32GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 186FBGA 64GB 4Gb*2 (x32, 1ch, 2CS) 3.3V/1.8V - 1.8V/1.2V 186FBGA eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package 4GB 2Gb*2 (x32, 2CS/CKE) 3.3V/1.8V - 1.8V 153FBGA 8GB 512Mb (x16) 3.3V/1.8V - 1.8V 169FBGA 16GB 512Mb (x16) 3.3V/1.8V - 1.8V 169FBGA 32GB 512Mb (x16) 3.3V/1.8V - 1.8V 169FBGA 64GB 512Mb (x16) 3.3V/1.8V - 1.8V 169FBGA MCP eMCP: eMMC + LPDDR2 eMCP: eMMC + MDDR Memory eMMC & MDRAM samsung.com/mcp 2H 2012 Multi-Chip Packages 17 Samsung Solid State Drives Data Center EDITION High-Write Environments Client/Mobile EDITION High-Read Environments Samsung SM825 Samsung PM830 2.5 inches 2.5 inches mSATA Capacity (GB) 100, 200, 400 64, 128, 256, 512 32, 64, 128, 256 Host Interface SATA Gen 2.0 - 3Gb/s SATA Gen 3.0 - 6Gb/s E-MLC 30nm-class MLC 20nm-class AES-256 AES-256 2mm hours 1.5 mm hours 1 in 1017 1 in 1015 Active: 1.8W Idle: 1.3W Active: 0.127W Idle: 0.078W Up to 7,000TBW Up to 60-1250TBW Yes No Sequential R/W (MB/s) 250/220 500/400 500/400 Random R/W (IOPs) 43K/11K 80K/36K 50K/29K 100 x 69.85 x 15mm 100 x 69.85 x 7mm 50.95 x 30 x 3.8mm 140 -146g 61g - 62.5g 9 - 10g Form Factor Flash Encryption MTBF Uncorrectable Bit Error Rate (UBER) Power Consumption Write Endurance (Terabytes Written) Cache Power Protection Physical Dimensions Weight 1 mm hours Up to 30-60TBW Which SSD is right for you? For more information, email: SSD@ssi.samsung.com 18 SSDs 2H 2012 samsung.com/flash-ssd SOLID STATE DRIVES (SSD) Interface Size 2.5" 7mmT Connector Thin SATA Controller PM830 Component 27nm 32Gb MLC SATA III - 6Gb/s mSATA SATA II - 3Gb/s 2.5" 15mmT PCIe Thin SATA PM830 SM825 21nm 32Gb MLC 32nm 32Gb E-MLC Density Part Number Comments 64GB MZ7PC064HADR-00000 Mass production 128GB MZ7PC128HAFU-00000 Mass production 256GB MZ7PC256HAFU-00000 Mass production 512GB MZ7PC512HAGH-00000 Mass production 32GB MZMPC032HBCD-00000 Mass production 64GB MZMPC064HBDR-00000 Mass production 128GB MZMPC128HBFU-00000 Mass production 256GB MZMPC256HBGJ-00000 Mass production 100GB MZ5EA100HMDR-00003 Mass production 200GB MZ5EA200HMDR-00003 Mass production 400GB MZ5EA400HMFP-00003 Mass production Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead free Optical SmartHub Interface Speed Type Loading Lightscribe Model Wi-Fi DVD Write 8X Slim Tray X SE-208BW Blu-ray Slim Interface SATA Speed Type Loading Lightscribe Model BD Combo 6X Slim Tray X SN-406AB BD Writer 6X Slim Tray X SN-506BB Model Interface Speed Type Loading Lightscribe USB 2.0 BD Writer 6X Slim Tray X Interface Speed Type Loading Lightscribe Model SATA DVD Write 24X H/H Tray X SH-224BB Model STOR AG E Blu-ray writer Slim external SE-506AB SE-506BB DVD-W H/H DVD-W SLIM Interface Speed Type Loading Lightscribe SATA DVD Write 8X Slim Tray X SN-208BB SN-208DB DVD-W Slim External Interface USB 2.0 Speed DVD Write 8X samsungodd.com Type Loading Lightscribe Model Ultra Slim Tray X SE-218BB Slim Tray X SE-208DB 2H 2012 OPTICAL SMARTHUB & DVD 19 DID Product Classification E-DID: Exclusive DID Outdoor: High Luminance Super Narrow 1500 - 2000nit Wall-mounted Narrow P-DID: Performance DID Thin/Light (Edge LED) Narrow Black Bezel B-DID: Basic DID Large Format Display 70"/82" Landscape/Portrait convertible Why DID Instead of TV? Commercial (DID) Consumer (TV) Warranty 18 months to 2 years 90 days to 1 year Reliability Designed for continuous use in different environments Turned on for 20 hours + Variety of temperatures & location Designed for in-home use in controlled environment Turned on for 6-8 hours In-home living room Picture Quality Designed for PC signals LCD backlight covers a wider color spectrum necessary for PC source integration giving better picture quality Designed for TV signals Location Can be oriented in either portrait or landscape mode Can only be oriented in landscape mode Product Segmentation HEAVY USE E-DID: Exclusive All features of P-DID plus Specialty: SNB, High Brightness Robust design P-DID: Performance All features of B-DID plus Narrow & Black Bezel Typ. Brightness: 700 (cd/m2) B-DID: Basic Landscape/Portrait High reliability Pol. (Haze 44%) Long lifetime: more than 2 years Professional Outdoor Events Billboard * Control Room * Simulation * Scoreboard * Sports Broadcasting * Billboard Entertainment Transportation Communication Rental * Casino * Theatre * Poster * Menu * Airport * Train/Bus Station * Conference Room * Rental * Staging Commercial Education * Kiosk * Mart Board * E-Board LIGHT USE Product Segmentation Type Abbr Warranty Bezel Suggested Run Time Brightness Usage Applications Pricing E-DID Exclusive 2 years Narrow and Super Narrow 20 hours + 450 to 2000 nits Heavy Outdoor, Video Walls High-price range P-DID Performance 2 years Narrow 20 hours + 600/700 nits Medium Semi-Outdoor Mid-price range B-DID Basic 18 months Normal 12 hours 450 nits Light Indoor, e-Board Low-price range; comparable to consumer panels 20 DID PRODUCT CLASSIFICATION 2H 2012 samsungdisplay.com Samsung Digital Information Display (DID) Panel Lineup Current Model Size Model resolution Bezel Backlight Brightness (typical) Contrast Ratio Response Time Frequency MP* LTI216XM01 21.6" 960x960 Super narrow D-LED 450 nits 4000:1 8ms 60Hz Aug. 2012 LTI460HN03 46" FHD Narrow + Black CCFL 1500 nits 3,000:1 8ms 60Hz LTI460HN01 46" FHD Super narrow D-LED 700 nits 3,000:1 8ms LTI460HN07 46" FHD Super narrow D-LED 450 nits 3,000:1 LTI460AA05 46" HD Super narrow CCFL 450 nits LTI550HN01 55" FHD Super narrow D-LED LTI550HN04 55" FHD Super narrow LTI700HD02 70" FHD E-DID P-DID B-DID Comment High Tni 85C Now High Bright, Hi Temp LC, 1/4 Pol. Yes 60Hz Now 5.7mm Active to Active Yes 8ms 60Hz Q3, 2012 4,000:1 8ms 60Hz Ltd Avail. 7.3mm Active to Active 700 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active D-LED 450 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active Normal D-LED 2000 nits 2,500:1 8ms 60Hz Now High Bright Yes LTI400HA02 40" FHD Narrow CCFL 700 nits 3,000:1 8ms 60Hz Now LTI400HA08 40" FHD Narrow CCFL 700 nits 3,000:1 8ms 60Hz Now Yes LTI400HA08 40" FHD Narrow + Black CCFL 700 nits 3,000:1 8ms 60Hz Now Yes LTI400HA10 40" FHD Narrow E-LED 700 nits 3500:1 8ms 60Hz Oct. 2012 LTI460HN05 46" FHD Narrow + Black CCFL 700 nits 3,500:1 8ms 60Hz Now Yes LTI550HN03 55" FHD Narrow CCFL 700 nits 4,000:1 8ms 60Hz Now Yes LTI700HD01 70" FHD Normal CCFL 600 nits 2,000:1 8ms 60Hz Now LTI820HT-L01 82" FHD Normal CCFL 600 nits 2,000:1 8ms 60Hz Now LTI320AP02 32" HD Normal CCFL 450 nits 3,500:1 8ms 60Hz Now LTI400HA07 40" FHD Normal CCFL 450 nits 4,000:1 8ms 60Hz Now Yes LTI460HN04 46" FHD Normal CCFL 450 nits 3,000:1 8ms 60Hz Now Yes LTI550HN02 55" FHD Normal CCFL 450 nits 3,500:1 8ms 60Hz Now Yes LTI700HA01 70" FHD Normal CCFL 450 nits 2,000:1 8ms 60Hz Now E-Board; Landscape mode only LTI700HA02 70" FHD Normal E-LED 400 nits 4,000:1 8ms 60Hz Now E-Board; Landscape mode only LTI820HD03 82" FHD Normal CCFL 450 nits 2,000:1 8ms 60Hz Now E-Board; Landscape mode only LTI460AP01 46" HD Narrow Transparent/ No BLU 4,500:1 8ms 60Hz Now LTI220MT02 46" WSXGA+ Narrow Transparent/ No BLU 500:1 5ms 60Hz Now Transparent samsungdisplay.com 2H 2012 DI S PL AYS Type LVDS Input DID PANEL LINEUP 21 Tablets Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness (nits) MP 7" LTN070AL01 PLS WXGA 1280 800 16:10 216 400 Now 10.1" LTL101AL02 PLS WXGA 1280 800 16:10 149 400 Now MONITORs Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness (nits) MP 19" LTM190BT07 TN WXGA+ 1440 900 16:9 96 250 Ltd Avail. LTM200KT03 TN HD+ 1600 900 16:09 92 250 Ltd Avail. 20" 21.5" 22" 23" 24" 27" 22 LTM200KT10 TN HD+ 1600 900 16:09 92 250 Now LTM215HT04 TN FHD 1920 1080 16:9 103 250 Ltd Avail. LTM220MT05 TN WSXGA+ 1680 1050 16:10 90 250 Ltd Avail. LTM220MT09 TN WSXGA+ 1680 1050 16:10 90 250 Now LTM230HT10 TN FHD 1920 1080 16:9 96 300 Now LTM230HL01 PLS FHD 1920 1080 16:9 96 300 Now LTM240CT06 TN WUXGA 1920 1200 16:10 94 250 Now LTM240CL01 PLS WUXGA 1920 1200 16:10 94 300 Now LTM270HT03 TN FHD 1920 1080 16:9 82 300 Now LTM270DL02 PLS QHD 2560 1440 16:9 109 300 Now TABLETS, NOTEBOOKS & MONITORS 2H 2012 samsungdisplay.com CONTACTS Feel free to contact your local distributor or sales representative with any Samsung sales inquiries. Representatives Name Location Phone Name Location Phone Adelsa Ciudad Juarez 52-656-613-3517 Infinity Sales Los Angeles 818-880-6480 Adelsa Monterrey 52-818-214-0011 Infinity Sales Orange County 714-669-8520 Adelsa Mexico City (HQ) 52-555-560-5002 InTELaTECH Calgary 905-629-0082 Adelsa Guadalajara 52-333-122-3054 InTELaTECH Montreal 905-629-0082 ATMI Washington 425-869-7636 InTELaTECH Ottawa 905-629-0082 ATMI Oregon 503-643-8307 InTELaTECH Toronto 905-629-0082 Bear/VAI Ohio 440-526-1991 I-Squared San Jose 408-988-3400 Bear/VAI Western PA 440-526-1991 I-Squared Petaluma 707-773-3108 Bear/VAI Indiana/Kentucky 440-832-7637 Neptune Electr. (NECCO) NY, PA, MD 631-234-2525 Bear/VAI Michigan 440-526-1991 New Elpis (LCD) Ontario 905-275-3516 Massachusetts 781-229-8888 Bestronics San Diego 858-673-4300 New Tech Solutions Core Illinois 847-843-8888 New Tech Solutions CT/NY 585-204-2183 Core Wisconsin 414-791-1666 Rep One Associates Alabama 256-539-7371 Crestone Colorado 303-280-7202 Rep One Associates Charlotte, NC 704-846-5744 Crestone Utah 303-280-7202 Rep One Associates Georgia 770-209-9242 Customer 1st Iowa 319-393-1351 Rep One Associates Raleigh, NC 919-424-3804 Customer 1st Kansas 913-390-9119 Rep One Associates Florida 256-539-7371 Customer 1st Minnesota 952-851-7909 Summit Sales Phoenix/El Paso 480-998-4850 Digit-Tech Sales Sao Paulo, Brazil 5511-3165-2218 West Associates Dallas 972-680-2800 Digit-Tech Sales Puerto Rico 787-892-4260 West Associates Austin 512-343-1199 Digit-Tech Sales Miami (export) 305-591-2400 West Associates Houston 512-538-2810 Distributors Location Contact Edge Electronics, Inc. Headquarters 75 Orville Dr., Unit 2 Bohemia, NY 11716 Phone: 800.647.EDGE (3343) Fax: 631.471.3405 www.edgeelectronics.com Email: edge@edgeelectronics.com Avnet, Inc. Phoenix, Arizona Headquarters 2211 South 47th Street Phoenix, AZ 85034 www.avnet.com For sales inquiries: (800) 332-8638 www.avnetexpress.com WPG Americas Inc. Corporate Office 5285 Hellyer Avenue Suite 150 San Jose, CA 95138 Tel 408-392-8100 Tel 888-WPG-8881 Fax 408-436-9551 www.wpgamericas.com For sales inquiries: inquiry@wpgamericas.com Arrow Electronics, Inc. Corporate Headquarters Corporate Headquarters 7459 S. Lima Street Englewood, CO 80112-5816 Phone: (303) 824-4000 www.arrow.com For sales inquiries: www.arrownac.com/onlinesales@arrow.com/(800) 833-3557 For all product information please visit: samsung.com/us/oem-solutions C ONTA CTS Company Name samsung.com/us/oem-solutions 2H 2012 CONTACTS 23 Memory DRAM Flash SRAM MCP System LSI ASICs APs Display Drivers Imaging ICs Foundry Storage Solid State Drives Hard Drives Optical Disc Drives LCD Panels Displays Monitors Smartphones Tablets TVs Samsung Semiconductor, Inc. 3655 North First Street San Jose, CA 95134-1713 samsung.com/us/oem-solutions Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products or product specifications with the intent to improve function or design at any time and without notice and is not required to update this documentation to reflect such changes. This publication does not convey to a purchaser of semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages. Copyright 2012. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co., Ltd. All other names and brands may be claimed as the property of others. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. BR-12-ALL-001 | Printed 08/12