74LCX16244MTDX_NL - FAIRCHILD SEMICONDUCTOR

October, 2012 − Rev. 11

1Publication Order Number:

MC74LCX16244/D

MC74LCX16244

Low-Voltage CMOS

16-Bit Buffer

With 5 V−Tolerant Inputs and Outputs

(3−State, Non−Inverting)

The MC74LCX16244 is a high performance, non−inverting 16−bit

buffer operating from a 2.3 to 3.6 V supply. The device is nibble

controlled. Each nibble has separate Output Enable inputs which can

be tied together for full 16−bit operation. High impedance TTL

compatible inputs significantly reduce current loading to input drivers

while TTL compatible outputs offer improved switching noise

performance. A VI specification of 5.5 V allows MC74LCX16244

inputs to be safely driven from 5.0 V devices. The MC74LCX16244 is

suitable for memory address driving and all TTL level bus oriented

transceiver applications.

The 4.5 ns maximum propagation delays support high performance

applications. Current drive capability is 24 mA at the outputs. The

Output Enable (OEn) inputs, when HIGH, disable the outputs by

placing them in a HIGH Z condition.

The MC74LCX16244 contains sixteen non−inverting buffers with

3−state 5.0 V−tolerant outputs. The device is nibble controlled with

each nibble functioning identically, but independently. The control

pins may be tied together to obtain full 16−bit operation. The 3−state

outputs are controlled by an Output Enable (OEn) input for each

nibble. When OEn is LOW, the outputs are on. When OEn is HIGH,

the outputs are in the high impedance state.

Features

•Designed for 2.3 V to 3.6 V VCC Operation

•4.5 ns Maximum tpd

•5.0 V Tolerant − Interface Capability With 5.0 V TTL Logic

•Supports Live Insertion and Withdrawal

•IOFF Specification Guarantees High Impedance When VCC = 0 V

•LVTTL Compatible

•LVCMOS Compatible

•24 mA Balanced Output Sink and Source Capability

•Near Zero Static Supply Current in All Three Logic States (20 mA)

Substantially Reduces System Power Requirements

•Latchup Performance Exceeds 500 mA

•ESD Performance:

♦Human Body Model >2000 V

♦Machine Model >200 V

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MARKING DIAGRAM

TSSOP−48

DT SUFFIX

CASE 1201

A = Assembly Location

WL = Wafer Lot

YY = Year

WW = Work Week

G = Pb−Free Package

LCX16244G

AWLYYWW

See detailed ordering and shipping information in the package

dimensions section on page 3 of this data sheet.

ORDERING INFORMATION

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Figure 1. Pinout: 48−Lead (Top View)

481 OE2

OE1

472 D0O0

463 D1O1

454 GNDGND

445 D2

436 D3O3

427 VCC

VCC

418 D4O4

409 D5O5

3910 GNDGND

3811 D6O6

3712 D7O7

3613 D8O8

3514 D9O9

3415 GNDGND

3316 D10O10

3217 D11O11

3118 VCC

VCC

3019 D12O12

2920 D13O13

2821 GNDGND

2722 D14O14

2623 D15O15

2524 OE3

OE4

Table 1. PIN NAMES

Pins Function

OEn Output Enable Inputs

D0−D15 Inputs

O0−O15 Outputs

OE1

OE2

D0:3

D4:7

O0:3

O4:7

OE3

OE4

D8:11

D12:15

O8:11

O12:15

One of Four

Figure 2. Logic Diagram

TRUTH TABLE

OE1 D0:3 O0:3 OE2 D4:7 O4:7 OE3 D8:11 O8:11 OE4 D12:15 O12:15

L L L L L L L L L L L L

L H H L H H L H H L H H

H X Z H X Z H X Z H X Z

H = High Voltage Level

L = Low Voltage Level

Z = High Impedance State

X = High or Low Voltage Level and Transitions Are Acceptable; for ICC reasons, DO NOT FLOAT Inputs.

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ORDERING INFORMATION

Device Package Shipping†

MC74LCX16244DTG TSSOP−48

(Pb−Free)

39 Units / Rail

M74LCX16244DTR2G TSSOP−48

(Pb−Free)

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MAXIMUM RATINGS

Symbol Parameter Value Condition Units

VCC DC Supply Voltage −0.5 to +7.0 V

VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V

VODC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V

−0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V

IIK DC Input Diode Current −50 VI < GND mA

IOK DC Output Diode Current −50 VO < GND mA

+50 VO > VCC mA

IODC Output Source/Sink Current ±50 mA

ICC DC Supply Current Per Supply Pin ±100 mA

IGND DC Ground Current Per Ground Pin ±100 mA

TSTG Storage Temperature Range −65 to +150 °C

MSL Moisture Sensitivity Level 1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. IO absolute maximum rating must be observed.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Units

VCC Supply Voltage

Operating

Data Retention Only

2.0

1.5

2.5, 3.3

3.6

VIInput Voltage 0 5.5 V

VOOutput Voltage

(HIGH or LOW State)

(3−State)

VCC

5.5

IOH HIGH Level Output Current

VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

−24

−12

−8

IOL LOW Level Output Current

VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

+24

+12

TAOperating Free−Air Temperature −40 +85 °C

Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V

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DC ELECTRICAL CHARACTERISTICS

TA = −40°C to +85°C

Symbol Characteristic Condition Min Max Units

VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V

2.7 V ≤ VCC ≤ 3.6 V 2.0

VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V

2.7 V ≤ VCC ≤ 3.6 V 0.8

VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mAVCC −0.2 V

VCC = 2.3 V; IOH = −8 mA 1.8

VCC = 2.7 V; IOH = −12 mA 2.2

VCC = 3.0 V; IOH = −18 mA 2.4

VCC = 3.0 V; IOH = −24 mA 2.2

VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA0.2 V

VCC = 2.3 V; IOL = 8 mA 0.6

VCC = 2.7 V; IOL = 12 mA 0.4

VCC = 3.0 V; IOL = 16 mA 0.4

VCC = 3.0 V; IOL = 24 mA 0.55

IOZ 3−State Output Current VCC = 3.6 V, VIN = VIH or VIL,

VOUT = 0 to 5.5 V

±5mA

IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA

IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5mA

ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 mA

DICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA

2. These values of VI are used to test DC electrical characteristics only.

AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W)

Symbol Parameter Waveform

TA = −40°C to +85°C

Units

VCC = 3.3 V ± 0.3 V

CL = 50 pF

VCC = 2.7 V

CL = 50 pF

VCC = 2.5 V ± 0.2 V

CL = 30 pF

Min Max Min Max Min Max

tPLH

tPHL

Propagation Delay

Input to Output

1 1.5

1.5

4.5

1.5

5.2

1.5

5.4

tPZH

tPZL

Output Enable Time to

High and Low Level

2 1.5

1.5

5.5

1.5

6.3

1.5

7.2

tPHZ

tPLZ

Output Disable Time From

High and Low Level

2 1.5

1.5

5.4

1.5

5.7

1.5

6.5

tOSHL

tOSLH

Output−to−Output Skew

(Note 3)

1.0

3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.

The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter

guaranteed by design.

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DYNAMIC SWITCHING CHARACTERISTICS

TA = +25°C

Symbol Characteristic Condition Min Typ Max Units

VOLP Dynamic LOW Peak Voltage

(Note 4)

VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V

VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V

0.8

0.6

VOLV Dynamic LOW Valley Voltage

(Note 4)

VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V

VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V

−0.8

−0.6

4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is

measured in the LOW state.

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Units

CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF

COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF

CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 20 pF

WAVEFORM 1 − PROPAGATION DELAYS

tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns

VCC

0 V

VOH

VOL

tPLH

tPHL

WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES

tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns

0 V

OEn

tPZH tPHZ

tPZL tPLZ

Vmo

VmiVmi

Vmo Vmo

Figure 3. AC Waveforms

Vmi

VOH

VHZ

VOL

VCC

VLZ

Table 2. AC WAVEFORMS

Symbol

VCC

3.3 V ± 0.3 V 2.7 V 2.5 V ± 0.2 V

Vmi 1.5 V 1.5 V VCC / 2

Vmo 1.5 V 1.5 V VCC / 2

VHZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V

VLZ VOH − 0.3 V VOH − 0.3 V VOH − 015 V

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OPEN

PULSE

GENERATOR

DUT

VCC

6 V or VCC x 2

GND

Figure 4. Test Circuit

Table 3. TEST CIRCUIT

Test Switch

tPLH, tPHL Open

tPZL, tPLZ 6 V at VCC = 3.3 ±0.3 V

6 V at VCC = 2.5 ±0.2 V

Open Collector/Drain tPLH and tPHL 6 V

tPZH, tPHZ GND

CL= 50 pF at VCC = 3.3 ±0.3 V or equivalent (includes jig and probe capacitance)

CL= 30 pF at VCC = 2.5 ±0.2 V or equivalent (includes jig and probe capacitance)

RL= R1 = 500 W or equivalent

RT= ZOUT of pulse generator (typically 50 W)

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PACKAGE DIMENSIONS

TSSOP−48

DT SUFFIX

CASE 1201

ISSUE B

ÇÇÇ

0.12 (0.005) V S

0.254 (0.010) T

−V−

−U−

48X REF

PIN 1

IDENT.

124

2548

0.076 (0.003)

SEATING

−T−

PLANE

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A12.40 12.60 0.488 0.496

B6.00 6.20 0.236 0.244

C−−− 1.10 −−− 0.043

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.50 BSC 0.0197 BSC

H0.37 −−− 0.015 −−−

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.17 0.27 0.007 0.011

K1 0.17 0.23 0.007 0.009

L7.95 8.25 0.313 0.325

M0 8 0 8

__ __

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL

IN EXCESS OF THE K DIMENSION AT

MAXIMUM MATERIAL CONDITION.

5. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

6. DIMENSIONS A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

ÉÉÉ

−W−

DETAIL E

SECTION N−N

0.25 (0.010)

DETAIL E

8.45

48X

0.32

0.50

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT

RECOMMENDED

48X

1.00

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