(1,00 mm) .0394"
CLM, MLE SERIES
CLM –111– 02 –L –D
CLM–126–02–F–D
MLE–150–01–G–DV MLE–120–01–G–DV
WWW.SAMTEC.COM
(0,28)
.011
(1,00)
.03937
(2,54)
.100
(1,00)
.03937 100 02
01
No. of positions x (1,00) .03937
+ (0,318) .0125
(2,12)
.084
(2,26)
.089
(3,81)
.150
(2,41)
.095
(5,72)
.225
x
(3,57)
.140
(3,00)
.118
(8,26) .325
by A
(0,89) .035
DIA
(1,36)
.054
(7,00)
.275
NO. PINS
PER ROW OPTIONS
102 PLATING
OPTION D
Mates with:
FTM, FTMH, MW
–P
CLM
A
PIN/ROW
04-15 (3,56)
.140
(7,11)
.280
16-50
F-213
–F
= Gold fl ash on
contact,
Matte Tin on tail
–L
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
02 thru 50 –BE
= Bottom Entry
(Required for bottom entry)
–K
= (3,50 mm) .138" DIA
Polyimide fi lm Pick & Place Pad
(7 positions minimum)
–P
= Pick & Place Pad
(7 positions minimum)
–PA
= Pick & Place Pad with
integral Alignment Pin
–TR
= Tape & Reel Packaging
NO. PINS
PER ROW OPTIONS
101 PLATING
OPTION DV
Mates with:
FTM, FTMH, MW
MLE
–G
= 10µ"
(0,25 µm)
Gold
02 thru 50 –A
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
discretion.
–K
= (4,00 mm) .1575" DIA
Polyimide fi lm Pick & Place Pad
(5 positions minimum)
–P
= Metal Pick & Place Pad
(5 positions minimum)
–TR
= Tape & Reel Packaging
(3,30)
.130
(4,32)
.170
(3,50)
.138
(6,35)
.250
x
(3,18)
.125
(0,71)
.028
(0,64)
.025
DIA
No. of positions
x (1,00) .03937 + (0,20) .008
(0,30)
.012
(1,00)
.03937
(3,07)
.121
(1,00)
.03937 100 02
01
(3,12)
.123
–P
–A
Note: Some
lengths, styles
and options are
non-standard,
non-returnable.
For complete specifi cations and
rec om mend ed PCB layouts
see www.samtec.com?CLM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au, Sn or SnPb
over 50µ" (1,27 µm) Ni
Current Rating:
3A per contact
@ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
15 mΩ
Insertion Depth:
Top Entry = (1,40 mm) .055"
min., Bottom Entry = (2,41 mm)
.095" min. (Add board
thickness for correct post OAL)
Insertion Force:
1.5 oz (0,42 N) average
Normal Force:
40 grams (0,39 N) average
Withdrawal Force:
.75 oz (0,21 N) average
Max Cycles:
100 with 10µ" (0,25 µm) Au
RoHS Compliant:
Ye s
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
For complete specifi cations and
rec om mend ed PCB layouts
see www.samtec.com?MLE
Insulator Material:
Black LCP
Contact Material:
BeCu
Operating Temp Range:
-55°C to +125°C
Plating:
Au over 10µ" (0,25 µm) Ni
Insertion Depth:
(1,63 mm) .064" to (3,18 mm)
.125" with (0,38 mm) .015"
wipe, pass-through, or
(2,44 mm) .096" minimum
for bottom entry
Insertion Force:
2.70 oz (0,75 N) average
Withdrawal Force:
0.50 oz (0,14 N) average
RoHS Compliant: Ye s
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–PA
SPECIFICATIONS
SPECIFICATIONS
RUGGED RELIABLE MICRO SOCKETS
APPLICATION
Pass-Thru
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30µ" Gold
TM
Call Samtec for maximum cycles
• Alignment Pin available.
• Other Gold plating options available.
Call Samtec.
APPLICATION
SPECIFIC OPTION