(1,00 mm) .0394"
CLM, MLE SERIES
CLM –111 02 L D
CLM–126–02–F–D
MLE150–01–G–DV MLE–120–01–G–DV
WWW.SAMTEC.COM
(0,28)
.011
(1,00)
.03937
(2,54)
.100
(1,00)
.03937 100 02
01
No. of positions x (1,00) .03937
+ (0,318) .0125
(2,12)
.084
(2,26)
.089
(3,81)
.150
(2,41)
.095
(5,72)
.225
x
(3,57)
.140
(3,00)
.118
(8,26) .325
by A
(0,89) .035
DIA
(1,36)
.054
(7,00)
.275
NO. PINS
PER ROW OPTIONS
102 PLATING
OPTION D
Mates with:
FTM, FTMH, MW
–P
CLM
A
PIN/ROW
04-15 (3,56)
.140
(7,11)
.280
16-50
F-213
–F
= Gold fl ash on
contact,
Matte Tin on tail
–L
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
02 thru 50 –BE
= Bottom Entry
(Required for bottom entry)
–K
= (3,50 mm) .138" DIA
Polyimide fi lm Pick & Place Pad
(7 positions minimum)
–P
= Pick & Place Pad
(7 positions minimum)
–PA
= Pick & Place Pad with
integral Alignment Pin
–TR
= Tape & Reel Packaging
NO. PINS
PER ROW OPTIONS
101 PLATING
OPTION DV
Mates with:
FTM, FTMH, MW
MLE
–G
= 10µ"
(0,25 µm)
Gold
02 thru 50 –A
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
discretion.
–K
= (4,00 mm) .1575" DIA
Polyimide fi lm Pick & Place Pad
(5 positions minimum)
–P
= Metal Pick & Place Pad
(5 positions minimum)
–TR
= Tape & Reel Packaging
(3,30)
.130
(4,32)
.170
(3,50)
.138
(6,35)
.250
x
(3,18)
.125
(0,71)
.028
(0,64)
.025
DIA
No. of positions
x (1,00) .03937 + (0,20) .008
(0,30)
.012
(1,00)
.03937
(3,07)
.121
(1,00)
.03937 100 02
01
(3,12)
.123
–P
–A
Note: Some
lengths, styles
and options are
non-standard,
non-returnable.
For complete specifi cations and
rec om mend ed PCB layouts
see www.samtec.com?CLM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au, Sn or SnPb
over 50µ" (1,27 µm) Ni
Current Rating:
3A per contact
@ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
15 mΩ
Insertion Depth:
Top Entry = (1,40 mm) .055"
min., Bottom Entry = (2,41 mm)
.095" min. (Add board
thickness for correct post OAL)
Insertion Force:
1.5 oz (0,42 N) average
Normal Force:
40 grams (0,39 N) average
Withdrawal Force:
.75 oz (0,21 N) average
Max Cycles:
100 with 10µ" (0,25 µm) Au
RoHS Compliant:
Ye s
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
For complete specifi cations and
rec om mend ed PCB layouts
see www.samtec.com?MLE
Insulator Material:
Black LCP
Contact Material:
BeCu
Operating Temp Range:
-55°C to +125°C
Plating:
Au over 10µ" (0,25 µm) Ni
Insertion Depth:
(1,63 mm) .064" to (3,18 mm)
.125" with (0,38 mm) .015"
wipe, pass-through, or
(2,44 mm) .096" minimum
for bottom entry
Insertion Force:
2.70 oz (0,75 N) average
Withdrawal Force:
0.50 oz (0,14 N) average
RoHS Compliant: Ye s
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–PA
SPECIFICATIONS
SPECIFICATIONS
RUGGED RELIABLE MICRO SOCKETS
APPLICATION
Pass-Thru
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30µ" Gold
TM
Call Samtec for maximum cycles
Alignment Pin available.
Other Gold plating options available.
Call Samtec.
APPLICATION
SPECIFIC OPTION