INTEGRATED CIRCUITS DATA SHEET PCD3349A 8-bit microcontroller with DTMF generator Product specification Supersedes data of 1996 Dec 18 File under Integrated Circuits, IC03 1998 May 11 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING INFORMATION 5.1 5.2 Pinning Pin description 6 FREQUENCY GENERATOR 6.1 6.2 6.3 6.4 6.5 Frequency generator derivative registers Frequency registers DTMF frequencies Modem frequencies Musical scale frequencies 7 TIMING 8 RESET 9 STOP MODE 10 IDLE MODE 11 INSTRUCTION SET 12 SUMMARY OF MASK OPTIONS 13 LIMITING VALUES 14 HANDLING 15 DC CHARACTERISTICS 16 AC CHARACTERISTICS 17 PACKAGE OUTLINES 18 SOLDERING 18.1 18.2 18.3 Introduction DIP SO 19 DEFINITIONS 20 LIFE SUPPORT APPLICATIONS 1998 May 11 2 PCD3349A Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator 1 2 FEATURES * 8-bit CPU, ROM, RAM, I/O in a single 28-lead package PCD3349A GENERAL DESCRIPTION The PCD3349A provides 4 kbytes of Program Memory, 224 bytes of RAM and 20 I/O lines. * 4-kbyte ROM * 224-byte RAM The PCD3349A is a microcontroller which has been designed primarily for telecom applications. It includes an on-chip dual tone multi-frequency (DTMF) generator. * Over 100 instructions (based on MAB8048) all of 1 or 2 cycles * 20 quasi-bidirectional I/O port lines The instruction set is based on that of the MAB8048 and is software compatible with the PCD33xxA family. * 8-bit programmable Timer/event counter 1 This data sheet details the specific properties of the PCD3349A. The shared characteristics of the PCD33xxA family of microcontrollers are described in the "PCD33xxA Family" data sheet and also in "Data Handbook IC03; Section PCD33xxA Family", which should be read in conjunction with this publication. * 2 single-level vectored interrupts: - external - Timer/event counter 1 * Two test inputs, one of which also serves as the external interrupt input * DTMF tone generator * Reference for supply and temperature-independent TONE output * Filtering for low output distortion (CEPT compatible) * Power-on-reset * Stop and Idle modes * Supply voltage: 1.8 to 6 V (DTMF TONE output from 2.5 V) * Low standby voltage of 1 V * Low Stop mode current of 1 A (typical) * Clock frequency: 1 to 16 MHz (3.58 MHz for DTMF suggested) * Manufactured in silicon gate CMOS process. 3 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION PCD3349AP DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1 PCD3349AT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 1998 May 11 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 8 4 8 4 kbytes PORT 1 BUFFER PORT 2 BUFFER TONE PORT 0 BUFFER PORT 1 FLIP-FLOP PORT 2 FLIP-FLOP PORT 0 FLIP-FLOP DECODE FILTER MEMORY BANK FLIP-FLOPS SINE WAVE GENERATOR 8 8 HGF REGISTER LGF REGISTER 8 8 PCD3349A 8 4 32 T1 8 8 8 8 8 8 LOWER PROGRAM COUNTER 5 8 PROGRAM STATUS WORD 8 8 8 8 8 8 MULTIPLEXER TIMER/ EVENT COUNTER TEMPORARY REGISTER 1 INTERRUPT LOGIC RAM ADDRESS REGISTER ACCUMULATOR ARITHMETIC timer interrupt TEMPORARY REGISTER 2 INSTRUCTION REGISTER & DECODER CE / T0 LOGIC UNIT POWER-ON-RESET VPOR T1 external interrupt DECIMAL ADJUST CONDITIONAL BRANCH LOGIC D E C O D E REGISTER 0 REGISTER 1 REGISTER 2 REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 8 LEVEL STACK (VARIABLE LENGTH) OPTIONAL SECOND REGISTER BANK TIMER FLAG CARRY DATA STORE RESET STOP IDLE ACC CONTROL & TIMING CE / T0 XTAL 2 OSCILLATOR Fig.1 Block diagram. RESIDENT RAM ARRAY 224 bytes MBG098 Product specification INITIALIZE XTAL 1 ACC BIT TEST PCD3349A INTERRUPT RESET handbook, full pagewidth 4 INTERNAL CLOCK FREQUENCY 30 HIGHER PROGRAM COUNTER 8-bit microcontroller with DTMF generator BLOCK DIAGRAM P0.0 to P0.7 RESIDENT ROM Philips Semiconductors 4 1998 May 11 P1.0 to P1.7 P2.0 to P2.3 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator 5 PINNING INFORMATION 5.1 5.2 Pinning PCD3349A Pin description Table 1 SOT117-1 and SOT136-1 packages SYMBOL DESCRIPTION P0.1 1 28 P0.0 P0.0 to P0.7 28, 1 to 7 Port 0: 8 quasi-bidirectional I/O lines P0.2 2 27 P2.3 T1 8 Test 1 or count input of 8-bit Timer/event counter 1 P0.3 3 26 P2.2 XTAL1 9 P0.4 4 25 P2.1 crystal oscillator or external clock input P0.5 5 24 VDD XTAL2 10 crystal oscillator output 23 TONE RESET 11 reset input CE/T0 12 Chip Enable or Test 0 handbook, halfpage P0.6 6 P0.7 7 PCD3349A 22 VSS T1 8 21 P2.0 XTAL1 9 20 P1.7 XTAL2 10 19 P1.6 RESET 11 18 P1.5 CE/T0 12 17 P1.4 P1.0 13 16 P1.3 P1.1 14 15 P1.2 MBG087 Fig.2 Pin configuration (SOT117-1 and SOT136-1). 1998 May 11 PIN 5 P1.0 to P1.7 13 to 20 Port 1: 8 quasi-bidirectional I/O lines P2.0 to P2.3 21, 25, 26, 27 Port 2: 4 quasi-bidirectional I/O lines VSS 22 ground TONE 23 DTMF output VDD 24 positive supply voltage Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator 6 The TONE output can alternatively issue twelve modem frequencies for data rates between 300 and 1200 bits/s. FREQUENCY GENERATOR A versatile frequency generator section is provided (see Fig.3). For normal operation, use a 3.58 MHz quartz crystal or PXE resonator. The frequency generator includes precision circuitry for dual tone multifrequency (DTMF) signals, which is typically used for tone dialling telephone sets. 6.1 PCD3349A In addition to DTMF and modem frequencies, two octaves of musical scale in steps of semitones are available. Frequency generator derivative registers Table 2 gives the derivative addresses, mnemonics and access types of the frequency generator derivative registers. The addresses 03H to FFH are not used. Table 2 Addresses of the frequency generator derivative registers ADDRESS REGISTER 7 6 5 4 3 2 1 0 01H HGF(1) H7 H6 H5 H4 H3 H2 H1 H0 02H LGF(2) L7 L6 L5 L4 L3 L2 L1 L0 Notes 1. HGF = High Group Frequency; access type W. 2. LGF = Low Group Frequency; access type W. dbook, full pagewidth 8 HGF REGISTER DIGITAL SINE WAVE SYNTHESIZER DAC SWITCHEDCAPACITOR BANDGAP VOLTAGE REFERENCE 8 internal bus SWITCHEDCAPACITOR LOW-PASS FILTER RC LOW-PASS FILTER MBG099 DAC 8 LGF REGISTER DIGITAL SINE WAVE SYNTHESIZER Fig.3 Block diagram of the frequency generator section. 1998 May 11 6 TONE Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator 6.2 Table 3 Frequency registers The two frequency registers HGF and LGF define two frequencies. From these, the digital sine synthesizers together with the Digital-to-Analog Converters (DACs) construct two sine waves. Their amplitudes are precisely scaled according to the bandgap voltage reference. This ensures TONE output levels independent of supply voltage and temperature. The amplitude of the Low Group Frequency sine wave is attenuated by 2 dB compared to the amplitude of the High Group Frequency sine wave. The two sine waves are summed and then filtered by an on-chip switched capacitor and RC low-pass filters. These guarantee that all DTMF tones generated fulfil the CEPT recommendations with respect to amplitude, frequency deviation, total harmonic distortion and suppression of unwanted frequency components. FREQUENCY (Hz) The frequency limitation given by x 60 is due to the low-pass filters which would attenuate higher frequency sine waves. DTMF frequencies Assuming an oscillator frequency fxtal = 3.58 MHz, the DTMF standard frequencies can be implemented as shown in Table 3. The relationship between telephone keyboard symbols and the frequency register contents are given in Table 4. 7 DEVIATION STANDARD GENERATED (%) (Hz) DD 697 697.90 0.13 0.90 C8 770 770.46 0.06 0.46 B5 852 850.45 -0.18 -1.55 A3 941 943.23 0.24 2.23 7F 1209 1206.45 -0.21 -2.55 72 1336 1341.66 0.42 5.66 67 1477 1482.21 0.35 5.21 5D 1633 1638.24 0.32 5.24 Dialling symbols, corresponding DTMF frequency pairs and frequency registers content TELEPHONE DTMF FREQ. KEYBOARD PAIRS SYMBOLS (Hz) The frequency of the sine wave generated is dependent upon the decimal value `x' held in the frequency registers (HGF and LGF), and this may be calculated as follows: f xtal f = --------------------------------; where 60 x 255. [ 23 ( x + 2 ) ] 1998 May 11 DTMF standard frequencies and their implementation; value = LGF, HGF contents VALUE (HEX) Table 4 The value 00H in a frequency register stops the corresponding digital sine synthesizer. If both frequency registers contain 00H, the whole frequency generator is shut off, resulting in lower power consumption. 6.3 PCD3349A LGF VALUE (HEX) HGF VALUE (HEX) 0 (941, 1336) A3 72 1 (697, 1209) DD 7F 2 (697, 1336) DD 72 3 (697, 1477) DD 67 4 (770, 1209) C8 7F 5 (770, 1336) C8 72 6 (770, 1477) C8 67 7 (852, 1209) B5 7F 8 (852, 1336) B5 72 9 (852, 1477) B5 67 A (697, 1633) DD 5D B (770, 1633) C8 5D C (852, 1633) B5 5D D (941, 1633) A3 5D * (941, 1209) A3 7F # (941, 1477) A3 67 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator 6.4 Table 6 Modem frequencies Again assuming an oscillator frequency fxtal = 3.58 MHz, the standard modem frequency pairs summarized in Table 5 can be implemented. It is suggested to define the frequency by the HGF register while the LGF register contains 00H, disabling Low Group Frequency generation. Table 5 HGF VALU E (HEX) FREQUENCY (Hz) MODEM GENERATED DEVIATION (%) (Hz) 9D 980(1) 978.82 -0.12 -1.18 82 1180(1) 1179.03 -0.08 -0.97 8F 1070(2) 1073.33 79 1270(2) 80 1200(3) 45 Musical scale frequencies and their implementation HGF VALUE (HEX) STANDARD(1) GENERATED D#5 F8 622.3 622.5 E5 EA 659.3 659.5 NOTE Standard modem frequency pairs and their implementation PCD3349A FREQUENCY (Hz) F5 DD 698.5 697.9 F#5 D0 740.0 741.1 G5 C5 784.0 782.1 G#5 B9 830.6 832.3 A5 AF 880.0 879.3 A#5 A5 923.3 931.9 B5 9C 987.8 985.0 3.33 C6 93 1046.5 1044.5 1265.30 -0.37 -4.70 C#6 8A 1108.7 1111.7 1197.17 -0.24 -2.83 D6 82 1174.7 1179.0 2200(3) 2192.01 -0.36 -7.99 D#6 7B 1244.5 1245.1 76 1300(4) 1296.94 -0.24 -3.06 E6 74 1318.5 1318.9 48 2100(4) 2103.14 0.15 3.14 F6 6D 1396.9 1402.1 5C 1650(1) 1655.66 0.34 5.66 F#6 67 1480.0 1482.2 52 1850(1) 1852.77 0.15 2.77 G6 61 1568.0 1572.0 4B 2025(2) 2021.20 -0.19 -3.80 G#6 5C 1661.2 1655.7 44 2225(2) 2223.32 -0.08 -1.68 0.31 A6 56 1760.0 1768.5 Notes A#6 51 1864.7 1875.1 1. Standard is V.21. B6 4D 1975.5 1970.0 2. Standard is Bell 103. 3. Standard is Bell 202. 4. Standard is V.23. 6.5 Musical scale frequencies 48 2093.0 2103.3 44 2217.5 2223.3 D7 40 2349.3 2358.1 D#7 3D 2489.0 2470.4 Note Finally, two octaves of musical scale in steps of semitones can be realized, again assuming an oscillator frequency fxtal = 3.58 MHz (Table 6). It is suggested to define the frequency by the HGF register while the LGF contains 00H, disabling Low Group Frequency generation. 1998 May 11 C7 C#7 1. Standard scale based on A4 at 440 Hz. 8 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator 7 TIMING 10 IDLE MODE Although the PCD3349A operates over a clock frequency range from 1 to 16 MHz, fxtal = 3.58 MHz will usually be chosen to take full advantage of the frequency generator section. 8 In the Idle mode, the frequency generator remains operative. 11 INSTRUCTION SET RESTRICTIONS Since no serial I/O interface is provided, the serial I/O (Input/Output) instructions are not available. `MOV Dx, A' is the only applicable derivative instruction because the derivative registers are write-only. RESET In addition to the conditions given in the "PCD33xxA Family" data sheet, all derivative registers are cleared in the RESET state. 9 PCD3349A ROM space being restricted to 4 kbytes, SEL MB2/3 would define non-existing Program Memory banks and should therefore be avoided. STOP MODE RAM space being restricted to 224 bytes, care should be taken to avoid accesses to non-existing RAM locations. Since the oscillator is switched off, the frequency generator receives no clock. It is suggested to clear both the HGF and LGF registers before entering Stop mode. This will cut-off the biasing of the internal amplifiers, considerably reducing current requirements. 12 SUMMARY OF MASK OPTIONS Table 7 Port mask options PORT OUTPUT DRIVE(1) PORT STATE AFTER RESET(2) PORT NAME OPTION 1 OPTION 2 OPTION 3 SET RESET Port 0 (P0.0 to P0.7) X X X X X Port 1 (P1.0 to P1.7) X X X X X Port 2 (P2.0 to P2.7) X X X X X Notes 1. Port output drives: a) Option 1: standard I/O. b) Option 2: open-drain I/O. c) Option 3: push-pull output; see "PCD33xxA Family" data sheet. 2. Port state after reset: S = Set (HIGH) and R = Reset (LOW). Table 8 Mask options FEATURE DESCRIPTION ROM code: program/data Any mix of instructions and data up to ROM size of 4 kbytes. Power-on-reset voltage level: VPOR 1.2 to 3.6 V in increments of 100 mV; OFF Oscillator transconductance: gm LOW transconductance: gmL MEDIUM transconductance: gmM HIGH transconductance: gmH 1998 May 11 9 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator PCD3349A 13 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); see note 1 and 2. SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage -0.5 +7.0 VI all input voltages -0.5 VDD + 0.5 V II, IO DC input or output current -10 +10 mA Ptot total power dissipation - 125 mW PO power dissipation per output - 30 mW ISS ground supply current -50 +50 mA Tstg storage temperature -65 +150 C Tj operating junction temperature - 90 C V Notes 1. Stresses above those listed under Limiting Values may cause permanent damage to the device. 2. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. 14 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices (see "Handling MOS devices"). 15 DC CHARACTERISTICS VDD = 1.8 to 6 V; VSS = 0 V; Tamb = -25 to +70 C; all voltages with respect to VSS; fxtal = 3.58 MHz (gmL); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (see Figs 5 to 9) VDD IDD IDD(idle) IDD(stp) supply voltage operating; note 1 1.8 - 6 V RAM data retention in Stop mode 1.0 - 6 V operating supply current; note 2 supply current Idle mode; note 2 supply current Stop mode 1998 May 11 VDD = 3 V; value HGF 0 and/or LGF 0 - 0.9 1.8 mA VDD = 3 V - 0.3 0.6 mA VDD = 5 V; fxtal = 10 MHz (gmL) - 1.1 3.0 mA VDD = 5 V; fxtal = 16 MHz (gmM) - 1.7 5.0 mA VDD = 5 V; fxtal = 16 MHz (gmH) - 2.5 6.0 mA VDD = 3 V; value HGF 0 and/or LGF 0 - 0.7 1.4 mA VDD = 3 V; value HGF = LGF = 0 - 0.2 0.4 mA VDD = 5 V; fxtal = 10 MHz (gmL) - 0.8 1.6 mA VDD = 5 V; fxtal = 16 MHz (gmM) - 1.2 4.0 mA VDD = 5 V; fxtal = 16 MHz (gmH) - 1.7 5.0 mA VDD = 1.8 V; Tamb = 25 C; note 3 - 1.0 2.5 A VDD = 1.8 V; Tamb = 70 C; note 3 - - 10 A 10 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator SYMBOL PARAMETER PCD3349A CONDITIONS MIN. TYP. MAX. UNIT Inputs - VIL LOW-level input voltage 0 VIH HIGH-level input voltage 0.7VDD - VDD 0.3VDD V V IIL input leakage current VSS VI VDD -1 - +1 A Port outputs (see Figs 10 to 12) IOL LOW-level port sink current VDD = 3 V; VO = 0.4 V 0.7 3.5 - mA IOH HIGH-level port pull-up source current VO = 2.7 V; VDD = 3 V -10 -20 - A VO = 0 V; VDD = 3 V - -100 -300 A IOH HIGH-level port push-pull source current VDD = 3 V; VO = 2.6 V -0.7 -4 - mA TONE output (see Fig.4; notes 1 and 4) VHGrms HGF voltage (RMS) 158 181 205 mV VLGrms LGF voltage (RMS) 125 142 160 mV f f frequency deviation -0.6 - 0.6 % VDC DC voltage level - 0.5VDD - V ZO output impedance - 100 500 VG pre-emphasis of group 1.5 2.0 2.5 dB THD total harmonic distortion Tamb = 25 C; note 5 - 25 - dB note 6 -0.5 0 +0.5 V Power-on-reset VPOR Power-on-reset level variation around chosen VPOR Notes 1. TONE output requires VDD 2.5 V. 2. VIL = VSS; VIH = VDD; open-drain outputs connected to VSS; all other outputs open; value HGF = LGF = 0, unless otherwise specified. 3. Crystal connected between XTAL1 and XTAL2; pins T1 and CE/T0 at VSS; value HGF = LGF = 0. 4. Values are specified for DTMF frequencies only (CEPT). 5. Related to the Low Group Frequency (LGF) component (CEPT). 6. VPOR is an option chosen by the user. Depending on its value, it may restrict the supply voltage range. 1998 May 11 11 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator PCD3349A MGB826 6 handbook, halfpage IDD(stp) (A) 5 handbook, halfpage VDD 4 DEVICE TYPE NUMBER (1) 1 F TONE 3 10 k 50 pF 2 VSS MGB835 1 0 1 3 5 VDD (V) 7 (1) Device type number: PCD3349A Fig.5 Typical supply current (IDD) in Stop mode as a function of supply voltage (VDD). Fig.4 TONE output test circuit. MGB827 6 MGB828 6 handbook, halfpage handbook, halfpage IDD (mA) IDD (mA) 16 MHz 4 4 5V 3.58 MHz HGF or LGF 0 10 MHz 2 2 3.58 MHz 3V 0 0 1 3 5 VDD (V) 7 1 10 fxtal (MHz) Measured with crystal between XTAL1 and XTAL2. Measured with function generator on XTAL1. Fig.6 Fig.7 Typical operating supply current (IDD) as a function of supply voltage (VDD). 1998 May 11 12 10 2 Typical operating supply current (IDD) as a function of clock frequency (fxtal). Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator PCD3349A MGB829 6 MGB830 6 handbook, halfpage handbook, halfpage IDD(idle) (mA) IDD(idle) (mA) 4 4 16 MHz 3.58 MHz HGF or LGF 0 2 2 5V 10 MHz 3V 3.58 MHz 0 0 1 3 5 7 VDD (V) 1 10 fxtal (MHz) Measured with crystal between XTAL1 and XTAL2. Measured with function generator on XTAL1. Fig.8 Fig.9 Typical supply current (IDD) in Idle mode as a function of supply voltage (VDD). MGB831 2 Typical supply current (IDD) in Idle mode as a function of clock frequency (fxtal). MBG095 -300 12 10 handbook, halfpage handbook, halfpage IOL (mA) IOH (A) -200 8 VO = V SS -100 4 VO = 0.9VDD 0 0 1 3 5 VDD (V) 7 1 3 5 VDD (V) 7 VO = 0.4 V. Fig.11 Typical HIGH-level output pull-up source current (IOH) as a function of supply voltage (VDD). Fig.10 Typical LOW-level port output sink current (IOL) as a function of supply voltage (VDD). 1998 May 11 13 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator MGD495 MGB833 -12 PCD3349A 6 handbook, halfpage handbook, halfpage IOH1 (mA) VDD (V) -8 4 -4 2 VPOR = 2.0 V VPOR = 1.3 V 0 1 3 5 VDD (V) 0 -25 7 25 75 125 Tamb (C) 70 VO = VDD - 0.4 V. Fig.12 Typical HIGH-level push-pull output source current (IOH) as a function of supply voltage (VDD). 1998 May 11 Fig.13 Typical Power-on-reset level (VPOR) as function of temperature. 14 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator PCD3349A 16 AC CHARACTERISTICS VDD = 1.8 to 6 V; VSS = 0 V; Tamb = -25 to +70 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL PARAMETER tr rise time all outputs tf fall time all outputs fxtal clock frequency CONDITIONS MIN. VDD = 5 V; Tamb = 25 C; CL = 50 pF TYP. MAX. UNIT - 30 - ns - 30 - ns see Fig.14 1 - 16 MHz VDD = 5 V Oscillator (see Fig.15) gmL LOW transconductance 0.2 0.4 1.0 mS gmM MEDIUM transconductance 0.9 1.6 3.2 mS gmH HIGH transconductance 3.0 4.5 9.0 mS RF feedback resistor 0.3 1.0 3.0 M MLA493 18 xtal (MHz) 15 MBG097 10 handbook, halfpage f handbook, halfpage gmH gm (mS) gmM 12 1 9 guaranteed operating range 6 gmL 3 10 0 1 3 5 VDD (V) 7 Fig.14 Maximum clock frequency (fxtal) as a function of supply voltage (VDD). 1998 May 11 -1 1 3 5 VDD (V) 7 Fig.15 Typical transconductance as a function of supply voltage (VDD). 15 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator PCD3349A 17 PACKAGE OUTLINES seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH 1998 May 11 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 16 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator PCD3349A SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1998 May 11 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 17 o 8 0o Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. 18 SOLDERING 18.1 Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 18.3.2 This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). 18.2 18.2.1 * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP * The longitudinal axis of the package footprint must be parallel to the solder flow. SOLDERING BY DIPPING OR BY WAVE * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 18.3 18.3.1 18.3.3 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 May 11 WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. 18.2.2 PCD3349A 18 Philips Semiconductors Product specification 8-bit microcontroller with DTMF generator PCD3349A 19 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 20 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 May 11 19 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com (c) Philips Electronics N.V. 1998 SCA60 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 415102/1200/05/pp20 Date of release: 1998 May 11 Document order number: 9397 750 03605