Preliminary Data Sheet No. PD60192-E IR2171/IR2172 (S) LINEAR CURRENT SENSING IC Features * * * * * * * * Product Summary Floating channel up to +600V Monolithic integration Linear current feedback through shunt resistor Direct digital PWM output for easy interface Low IQBS allows the boot strap power supply Independent fast overcurrent trip signal High common mode noise immunity Input overvoltage protection for IGBT short circuit condition VOFFSET 600Vmax IQBS Vin 1mA Gain temp.drift +/-260mVmax 20ppm/oC (typ.) fo 40kHz (typ.) * Open Drain outputs Overcurrent trip signal delay (IR2172) 1.5usec (typ) Description Overcurrent trip level +/-260mV (typ.) IR2171/IR2172 are monolithic current sensing IC designed for motor drive applications. It senses the motor phase current through an external shunt resistor, converts from analog to digital signal, and transfers the signal to the low side. IR's proprietary high voltage isolation technology is implemented to enable the high bandwidth signal processing. The output format is discrete PWM to eliminate need for the A/D input interface for the IR2172. The dedicated overcurrent trip (OC) signal facilitates IGBT short circuit protection. The opendrain outputs make easy for any interface from 3.3V to 15V. Block Diagram 15V PWM Output GND Overcurrent VCC Packages 8-Lead SOIC 8-Lead PDIP Up to 600V V+ IR2171/ VIR2172 VB COM PO NC (OC 2172) VS To Motor Phase (Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout. IR2171/IR2172 Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units VS High side offset voltage -0.3 600 VBS High side floating supply voltage -0.3 25 VCC Low side and logic fixed supply voltage -0.3 25 VIN Maximum input voltage between VIN+ and VIN- -5 5 VPO Digital PWM output voltage COM -0.3 VCC +0.3 VOC Overcurrent output voltage (IR2172) COM -0.3 VCC +0.3 VIN- VIN- input voltage (note 1) VS -5 VB+ 0.3 dV/dt Allowable offset voltage slew rate -- 50 8 lead SOIC -- .625 8 lead PDIP -- 1.0 PD RthJA Package power dissipation @ TA +25C Thermal resistance, junction to ambient 8 lead SOIC -- 200 8 lead PDIP -- 125 TJ Junction temperature -- 150 TS Storage temperature -55 150 TL Lead temperature (soldering, 10 seconds) -- 300 V V/ns W C/W C Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins. Recommended Operating Conditions The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. Symbol 2 Definition VB High side floating supply voltage VS High side floating supply offset voltage Min. Max. VS +13.0 VS +20 0.3 600 Units VPO Digital PWM output voltage COM VCC VOC Overcurrent output voltage COM VCC V CC Low side and logic fixed supply voltage 9.5 20 VIN Input voltage between VIN+ and VIN- -260 +260 mV TA Ambient temperature -40 125 C V www.irf.com IR2171/IR2172 DC Electrical Characteristics o VCC = VBS = 15V, and T A = 25 C unless otherwise specified. Symbol Definition VIN Nominal input voltage range before saturation Min. Typ. Max. Units Test Conditions -260 -- 260 -- -- -- 10 |VIN+ _ VIN-| Overcurrent trip positive input voltage VOC+ VOC- Overcurrent trip negative input voltage -- 260 -260 VOS Input offset voltage -10 0 VOS/ T A Input offset voltage temperature drift Gain (duty cycle % per VIN) G mV VIN = 0V (Note 1) -- 25 -- V/ C 157 162 167 %/V o max gain error=5% (Note 2) G/ T A Gain temperature drift o -- 20 -- ppm/ C ILK Offset supply leakage current -- -- 50 A IQBS Quiescent VBS supply current Quiescent VCC supply current -- 1 2 -- -- 0.5 Linearity (duty cycle deviation from ideal linearity -- 0.5 1 % Linearity temperature drift -- .005 -- %/oC Digital PWM output sink current 20 -- -- VO = 1V 2 -- -- 10 -- -- VO = 0.1V VO = 1V 1 -- -- VO = 0.1V I QCC LIN mA VB = VS = 600V VS = 0V curve) VLIN/ TA IOPO OC output sink current (IR2172) I OCC mA Note 1: 10mV offset represents 1.5% duty cycle fluctuation Note 2: Gain = (full range of duty cycle in %) / (full input voltage range). AC Electrical Characteristics VCC = VBS = 15V, and T A = 25oC unless otherwise specified. Symbol Definition Propagation delay characteristics fo Min. Typ. Max. Units Test Conditions Carrier frequency output 35 41 47 kHz Temperature drift of carrier frequency -- 500 -- ppm/oC figure 1 VIN = 0 & 5V Dmin Minimum duty -- 7 -- % VIN+=-260mV,VIN-=0V Dmax Maximum duty -- 93 -- f/TA % VIN+=+260mV,VIN-=0V BW fo bandwidth 15 kHz VIN+ = 100mVpk -pk sine wave, gain=-3dB PHS Phase shift at 1kHz -10 o VIN+ =100mVpk-pk sine wave tdoc Propagation delay time of OC (IR2172) 1 1.5 -- twoc Low true pulse width of OC (IR2172) -- 1 -- www.irf.com sec 3 IR2171/IR2172 Timing Waveforms Duty=7% Vin+= -260mV Vin- = 0V PO Duty=93% Vin+= +260mV Vin- = 0V PO Carrier Frequency = 40kHz Figure 1 Output waveform +260mV Vin -260mV OC twoc tdoc Figure 2. OC Waveform (2172 only) Application Hint: Temperature drift of the output carrier frequency can be cancelled by measuring both a PWM period and the on-time of PWM (Duty) at the same time. Since both periods vary in the same direction, computing the ratio between these values at each PWM period gives consistent measurement of the current feedback over the temperature drift. 4 www.irf.com IR2171/IR2172 Lead Definitions Symbol Description VCC Low side and logic supply voltage COM Low side logic ground VIN+ Positive sense input VIN- Negative sense input VB High side supply VS High side return PO Digital PWM output OC N.C. Overcurrent output (negative logic) (IR2172 only) No connection Lead Assignment 1 VCC 2 PO 8 lead SOIC VIN+ 8 1 VCC VIN- 7 2 PO IR2171S 8 VIN- 7 IR2171 3 COM VB 6 3 COM VB 6 4 NC VS 5 4 NC VS 5 1 VCC VIN+ 8 1 VCC VIN+ 8 2 PO VIN- 7 2 PO VIN- 7 8 lead SOIC 8 lead PDIP IR2172S www.irf.com 8 lead PDIP VIN+ IR2172 3 COM VB 6 3 COM VB 6 4 OC VS 5 4 OC VS 5 5 IR2171/IR2172 Case outlines 01-6014 01-3003 01 (MS-001AB) 8 Lead PDIP D DIM B 5 A FOOTPRINT 6 8 7 6 5 H E 1 2 3 0.25 [.010] 4 A 6.46 [.255] MIN .0532 .0688 1.35 1.75 A1 .0040 3X 1.27 [.050] e1 .0098 0.10 0.25 .013 .020 0.33 0.51 c .0075 .0098 0.19 0.25 D .189 .1968 4.80 5.00 E .1497 .1574 3.80 4.00 e .050 BASIC 0.25 [.010] A1 1.27 BASIC .025 BASIC 0.635 BASIC H .2284 .2440 5.80 6.20 K .0099 .0196 0.25 0.50 L .016 .050 0.40 1.27 y 0 8 0 8 K x 45 A C 8X b 8X 1.78 [.070] MAX b e1 6X e MILLIMETERS MAX A 8X 0.72 [.028] INCHES MIN y 0.10 [.004] 8X L 8X c 7 C A B NOTES: 1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 8 Lead SOIC 5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 01-6027 01-0021 11 (MS-012AA) 1/7/2003 6 www.irf.com