Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Red, Green and Blue
5 mm Standard Oval LEDs
Data Sheet
Description
These Precision Optical Performance Oval LEDs are
speci cally designed for full color/video and passenger
information signs. The oval shaped radiation pattern
and high luminous intensity ensure that these devices
are excellent for wide  eld of view outdoor applications
where a wide viewing angle and readability in sunlight
are essential. The package epoxy contains UV inhibitor to
reduce the e ects of long term exposure to direct sunlight.
Applications
• Full Color Signs
Package Dimensions
Package Drawing A
Features
• Well de ned spatial radiation pattern
• High brightness material
• Available in red, green and blue color
– Red AlInGaP 626 nm
– Green InGaN 530 nm
– Blue InGaN 470 nm
• Superior resistance to moisture
• Stando and non-stando Package
• Tinted and di used
• Typical viewing angle 40° x100°
Package Drawing B
5.20
0.204
1.02
0.040 MAX.
0.70
0.028 MAX.
7.00
0.275
25.00
0.984 MIN.
SQ. TYP.
0.020 ±0.004
0.50 ±0.10
1.00
0.039 MIN. 2.54
0.10
3.80
0.150
MEASURED AT BASE OF LENS.
CATHODE LEAD
MEASURED AT BASE OF LENS.
5.20 ± 0.20
0.205 ± 0.008
10.80 ± 0.50
0.425 ± 0.020
7.00 ± 0.20
0.276 ± 0.008
1.30 ± 0.20
0.051 ± 0.008
1.02
0.040 MAX.
1.00
0.039 MIN.
24.00
0.945 MIN.
SQ TYP.
0.50 ± 0.10
0.020 ± 0.004
0.70
0.028 MAX. Refer to Note 1
3.80 ± 0.20
0.150 ± 0.008
2.54 ± 0.30
0.10 ± 0.012
Note 1. This dimension does not apply to Red LED
CATHODE LEAD
2
Device Selection Guide
Part Number
Color and Dominant
Wavelength λd (nm)
Typ [3]
Luminous Intensity Iv (mcd)
at 20 mA [1,2,5]
Stando
Typical
Viewing
Angle (°) [4]
Package Draw-
ing
Min Max
HLMP-HG74-XY0DD Red 626 1660 2400 No 40 x 100 A
HLMP-HG75-XY0DD Red 626 1660 2400 Yes B
HLMP-HM74-34BDD Green 530 4200 6050 No A
HLMP-HM75-34BDD Green 530 4200 6050 Yes B
HLMP-HM74-34CDD Green 530 4200 6050 No A
HLMP-HM75-34CDD Green 530 4200 6050 Yes B
HLMP-HB74-UVBDD Blue 470 960 1380 No A
HLMP-HB75-UVBDD Blue 470 960 1380 Yes B
HLMP-HB74-UVCDD Blue 470 960 1380 No A
HLMP-HB75-UVCDD Blue 470 960 1380 Yes B
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the o -axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%.
Part Numbering System
Packaging Option
DD: Ammopack
Color Bin Selection
0 : Full Distribution
B : Color Bin 2 & 3
C : Color Bin 3 & 4
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Stando/Non Stando
74: Non Stando
75: Stando
Color
G : Red
M : Green
B : Blue
Package
H: 5 mm Standard Oval 40° x 100°
HLMP – H x xx – x x x xx
3
Absolute Maximum Ratings
TJ = 25° C
Parameter Red Green/ Blue Unit
DC Forward Current [1] 50 30 mA
Peak Forward Current 100 [2] 100 [3] mA
Power Dissipation 120 114 mW
LED Junction Temperature 130 110 °C
Operating Temperature Range -40 to +100 -40 to +85 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figures 4 and 8.
2. Duty Factor 30%, frequency 1 KHz.
2. Duty Factor 10%, frequency 1 KHz.
Electrical / Optical Characteristics
TJ = 25° C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Red
Green
Blue
VF
1.8
2.8
2.8
2.1
3.2
3.2
2.4
3.8
3.8
VI
F = 20 mA
Reverse Voltage [3]
Red
Green and Blue
VR
5
5
V
IR = 100 μA
IR = 10 μA
Dominant Wavelength [1]
Red
Green
Blue
λd
618
523
464
626
530
470
630
535
476
nm IF = 20 mA
Peak Wavelength
Red
Green
Blue
λPEAK
634
521
464
nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Pin
Luminous E cacy [2]
Red
Green
Blue
ηV
218
538
65
lm/W Emitted Luminous Power/
Emitted Radiant Power
Notes:
1. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is
the luminous e cacy in lumens/watt.
3. Indicates product  nal testing condition. Long term reverse bias is not recommended.
4
0
10
20
30
40
50
60
0 20406080100
TA - AMBIENT TEMPERATURE - °C
IF MAX - MAXIMUM FORWARD CURRENT - mA
0
0.2
0.4
0.6
0.8
1
550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
0
20
40
60
80
100
0123
FORWARD VOLTAGE - V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 20406080100
DC FORWARD CURRENT-mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
FORWARD CURRENT - mA
AlInGaP Red
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
5
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630
WAVELENGTH - nm
RELATIVE INTENSITY
GREEN
BLUE
0
20
40
60
80
100
012345
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
020406080100 120
FORWARD CURRENT-mA
RELATIVE INTENSITY
(NORMALIZED AT 20mA)
-8
-6
-4
-2
0
2
4
6
020406080100 120
FORWARD CURRENT-mA
RELATIVE DOMINANT WAVELENGTH-nm
Green
Blue
Blue
Green
0
5
10
15
20
25
30
35
020406080100
TA - AMBIENT TEMPERATURE - °C
IF - MAXIMUM FORWARD CURRENT - mA
InGaN Green and Blue
Figure 5. Relative Intensity vs Wavelength Figure 6. Forward Current vs Forward Voltage
Figure 7. Relative Intensity vs Forward Current Figure 8. Maximum Forward Current vs Ambient Temperature
Figure 9. Relative Dominant Wavelength vs Forward Current
6
Figure 10. Radiation pattern-Major Axis Figure11. Radiation pattern-Minor Axis
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Bin
Intensity (mcd) at 20 mA
Min Max
U 960 1150
V 1150 1380
W 1380 1660
X 1660 1990
Y 1990 2400
Z 2400 2900
1 2900 3500
2 3500 4200
3 4200 5040
4 5040 6050
Tolerance for each bin limit is ±15%
Figure12. Relative Light Output vs Junction Temperature Figure13. Forward Voltage Shift vs Junction Temperature
VF Bin Table (V at 20 mA)
Bin ID Min Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Notes:
1. Tolerance for each bin limit is ±0.05 V
2. VF binning only applicable to Red color.
0.1
1
10
-40 -20 0 20 40 60 80 100 120 140
TJ -JUNCTION TEMPERATURE
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ = 25°C)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-40 -20 0 20 40 60 80 100 120 140
TJ -JUNCTION TEMPERATURE
FORWARD VOLTAGE SHIFT-V
Green
Red
Blue
Green
Red
Blue
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPALCEMENT (°)
NORMALIZED INTENSITY
Red
Green
Blue
Red
Green
Blue
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPALCEMENT (°)
NORMALIZED INTENSITY
7
Avago Color Bin on CIE 1931 Chromaticity Diagram
Blue Color Bin Table
Bin
Min
Dom
Max
Dom
2 464 468 x 0.1374 0.1766 0.1699 0.1291
y 0.0374 0.0966 0.1062 0.0495
3 468 472 x 0.1291 0.1699 0.1616 0.1187
y 0.0495 0.1062 0.1209 0.0671
4 472 476 x 0.1187 0.1616 0.1517 0.1063
y 0.0671 0.1209 0.1423 0.0945
Tolerance for each bin limit is ± 0.5 nm
Note:
1. All bin categories are established for classi cation of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
Green Color Bin Table
Bin
Min
Dom
Max
Dom
2 523 527 x 0.0979 0.1450 0.1711 0.1305
y 0.8316 0.7319 0.7218 0.8189
3 527 531 x 0.1305 0.1711 0.1967 0.1625
y 0.8189 0.7218 0.7077 0.8012
4 531 535 x 0.1625 0.1967 0.2210 0.1929
y 0.8012 0.7077 0.6920 0.7816
Tolerance for each bin limit is ± 0.5 nm
Red Color Range
Min
Dom
Max
Dom
618.0 630.0 x 0.6872 0.3126 0.6890 0.2943
y 0.6690 0.3149 0.7080 0.2920
Tolerance for each bin limit is ± 0.5 nm
0.000
0.200
0.400
0.600
0.800
1.000
0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800
Y
X
Green
Red
Blue
2
2
3
3
4
4
8
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be e ectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59 mm. Soldering
the LED using soldering iron tip closer than 1.59 mm
might damage the LED.
1.59mm
AlInGaP Device
CATHODE
InGaN Device
ANODE
Note:
1. PCB with di erent size and design (component density) will have
di erent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
pro le again before loading a new type of PCB.
2. Avago Technologies’ AllnGaP high brightness LED are using high
e ciency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260° C and
the solder contact time does not exceeding 5 sec. Over-stressing the
LED during soldering process might cause premature failure to the
LED due to delamination.
Avago Technologies LED con guration
• Any alignment  xture that is being applied during
wave soldering should be loosely  tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment  xture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using re ow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause di culty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105° C Max. –
Preheat time 60 sec Max –
Peak temperature 260° C Max. 260° C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
• Wave soldering parameters must be set and main-
tained according to the recommended temperature
and dwell time. Customer is advised to perform daily
check on the soldering pro le to ensure that it is always
conforming to recommended soldering conditions.
9
Ammo Packs Drawing
Note: All dimensions in millimeters (inches)
Example of Wave Soldering Temperature Pro le for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255° C ± 5° C
(maximum peak temperature = 260° C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5 sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60 sec Max
TIME (sec)
260° C Max
105° C Max
TEMPERATURE (° C)
CATHODE
VIEW A-A
AA
6.35 ±1.30
0.25 ±0.0512
12.70 ±1.00
0.50 ±0.0394
9.125 ±0.625
0.3593 ±0.0246
18.00 ±0.50
0.7087 ±0.0197
12.70 ±0.30
0.50 ±0.0118
0.70 ±0.20
0.0276 ±0.0079
4.00 ±0.20
0.1575 ±0.008
TYPØ
20.50 ±1.00
0.8071 ±0.0394
10
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
LABEL ON THIS
SIDE OF BOX
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
ANODE LEAD LEAVES
THE BOX FIRST.
+
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-2725EN - April 24, 2012
DISCLAIMER: Avago’s products and software are not speci cally designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
Acronyms and De nition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
(ii) Avago Baby Label (Only available on bulk packaging)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
260C
Lam
p
s Bab
y
Label