ALLIANCE SEMICONDUCTOR
High Performance
256K×4
CMOS SRAM
AS7C1028
AS7C1028L
®
256K×4 CMOS SRAM
Features
Organization: 262,144 words × 4 bits
High speed
- 12/15/20/25/35 ns address access time
- 4/4/5/6/8 ns output enable access time
Low power consumption
- Active: 660 mW max (15 ns cycle)
- Standby:27.5 mW max, CMOS I/O
5.5 mW max, CMOS I/O, L version
- Very low DC component in active power
2.0V data retention (L version)
Equal access and cycle times
Easy memory expansion with CE and OE inputs
TTL-compatible, three-state I/O
28-pin JEDEC standard packages
- 300 mil PDIP and SOJ
- 400 mil PDIP and SOJ
ESD protection > 2000 volts
Latch-up current > 200 mA
Logic block diagram
A
10
A
9
512×512×4
Array
(1,048,576)
Input buffer
A0
A1
A2
A3
A4
A5
A6
A7
A
11 A
12 A
13 A
14 A
15 A
16 A
17
I/O0
I/O3
Vcc
GND
OE
CE
WE
Column decoder
Row decoder
Control
circuit
A8
I/O2
I/O1
Sense amp
Pin arrangement
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
CE
OE
GND
DIP, SOJ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
A17
A16
A15
A14
A13
A12
A11
NC
I/O0
I/O1
I/O2
I/O3
WE
AS7C1028
16
15
Selection guide
Shaded areas contain advance information.
7C1028-12 7C1028-15 7C1028-20 7C1028-25 7C1028-35 Unit
Maximum address access time 12 15 20 25 35 ns
Maximum output enable access time 44568ns
Maximum operating current 130 120 110 100 80 mA
Maximum CMOS standby current 5.0 5.0 5.0 5.0 5.0 mA
L1.0 1.0 1.0 1.0 1.0 mA
AS7C1028
AS7C1028L
2
Functional description
The AS7C1028 is a high performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) organized as 262,144 words × 4 bits. It
is designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 12/15/20/25/35 ns with output enable access times (tOE) of 4/4/5/6/8 ns are ideal
for high performance applications. A chip enable (CE) input permits easy memory expansion with multiple-bank memory organizations.
When CE is HIGH the device enters standby mode. The standard AS7C1028 is guaranteed not to exceed 27.5 mW power consumption in
standby mode; the L version is guaranteed not to exceed 5.5 mW, and typically requires only 800 µW. The L version also offers 2.0V data
retention, with maximum power consumption in this mode of 600 µW.
A write cycle is accomplished by asserting chip enable (CE) and write enable (WE) LOW. Data on the input pins I/O0-I/O3 is written on
the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins only after
outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting chip enable (CE) and output enable (OE) LOW, with write enable (WE) HIGH. The chip drives
I/O pins with the data word referenced by the input address. When chip enable or output enable is HIGH, or write enable is LOW, output
drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible, and operation is from a single 5V supply. The AS7C1028 is packaged in high volume
industry standard packages.
Absolute maximum ratings
Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute max-
imum rating conditions for extended periods may affect reliability.
Truth table
Key: X = Don’t Care, L = LOW, H = HIGH
Recommended operating conditions (Ta = 0°C to +70°C)
VIL min = –3.0V for pulse width less than tRC/2
Parameter Symbol Min Max Unit
Voltage on any pin relative to GND Vt–0.5 +7.0 V
Power dissipation PD–1.0W
Storage temperature (plastic) Tstg –55 +150 oC
Temperature under bias Tbias 10 +85 oC
DC output current Iout –20mA
CE WE OE Data Mode
H X X High Z Standby (ISB, ISB1)
L H H High Z Output Disable
LHLD
out Read
LLXD
in Write
Parameter Symbol Min Typ Max Unit
Supply voltage VCC 4.5 5.0 5.5 V
GND 0.0 0.0 0.0 V
Input voltage VIH 2.2 VCC+1 V
VIL –0.5–0.8V
AS7C1028
AS7C1028L
3
DC operating characteristics1(VCC = 5V±10%, GND = 0V, Ta = 0°C to +70°C)
Capacitance2(f = 1 MHz, Ta = Room Temperature, VCC = 5V)
Key to switching waveforms
Read cycle3,9 (VCC = 5V±10%, GND = 0V, Ta = 0°C to +70°C)
Parameter Symbol Test Conditions
-12 -15 -20 -25 -35
Unit
Min Max Min Max Min Max Min Max Min Max
Input leakage
current | ILI | VCC = Max,
Vin = GND to VCC 1–1–1–1–1µA
Output
leakage current | ILO | CE = VIH, VCC = Max,
Vout = GND to VCC 1–1–1–1–1µA
Operating
power supply
current
ICC CE = VIL, f = fmax,
Iout = 0 mA
130 120 110 100 80 mA
L 125 115 105 95 75 mA
Standby
power supply
current
ISB CE = VIH, f = fmax
50 40 40 35 30 mA
L 45 35 35 30 25 mA
ISB1
CE > VCC–0.2V, f = 0,
Vin 0.2V or
Vin VCC–0.2V
5.0 5.0 5.0 5.0 5.0 mA
L 1.0 1.0 1.0 1.0 1.0 mA
Output voltage VOL IOL = 8 mA, VCC = Min 0.4 0.4 0.4 0.4 0.4 V
VOH IOH = –4 mA, VCC = Min 2.4 –2.4–2.4–2.4–2.4– V
Parameter Symbol Signals Test Conditions Max Unit
Input capacitance CIN A, CE, WE, OE Vin = 0V 5 pF
I/O capacitance CI/O I/O Vin = Vout = 0V 7 pF
Parameter Symbol
-12 -15 -20 -25 -35
Unit Notes
Min Max Min Max Min Max Min Max Min Max
Read cycle time tRC 12 –15–20–25–35–ns
Address access time tAA 12 15 20 25 35 ns 3
Chip enable (CE) access time tACE 12 15 20 25 35 ns 3
Output enable (OE) access time tOE 3–45–68ns
Output hold From address change tOH 3–3–3–3–3ns5
Chip enable to output in Low Z tCLZ 3–3–3–3–3ns4, 5
Chip disable to output in High Z tCHZ 3–4–5–68ns4, 5
Output enable to output in Low Z tOLZ 0–0–0–0–0ns4, 5
Output disable to output in High Z tOHZ 3–4–5–6–8ns4, 5
Chip enable to power up time tPU 0–0–0–0–0–ns4, 5
Chip Disable to power down time tPD 12 15 20 25 35 ns 4, 5
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A
Undefined output/don’t care
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Falling input
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Rising input
AS7C1028
AS7C1028L
4
Read waveform 13,6,7,9 Address controlled
Read waveform 23,6,8,9 CE controlled
Write cycle11 (VCC = 5V±10%, GND = 0V, Ta = 0°C to +70°C)
Parameter Symbol
-12 -15 -20 -25 -35
Unit Notes
Min Max Min Max Min Max Min Max Min Max
Write cycle time tWC 12 –15–20–20–30–ns
Chip enable to write end tCW 10 –10–12–15–20–ns
Address setup to write end tAW 10 –10–12–15–20–ns
Address setup time tAS 0–0–0–0–0–ns
Write pulse width tWP 8 9 –12–15–17ns
Address hold from end of write tAH 0–0–0–0–0ns
Data valid to write end tDW 8 9 –10–10–15–ns
Data hold time tDH 0–0–0–0–0–ns4, 5
Write enable to output in High Z tWZ 5–5–5–5–5ns4, 5
Output active from write end tOW 3–3–3–3–3–ns4, 5
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Address
Dout Data Valid
tOH
tAA
tRC
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Supply
current
CE
OE
Dout
tRC1
tOE
tOLZ
tACE tCHZ
tCLZ
tPU
tPD ICC
ISB
50% 50%
tOHZ
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Dat a Vali d
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A
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A
AS7C1028
AS7C1028L
5
Write waveform 110,11 WE controlled
Write waveform 210,11 CE controlled
Data retention characteristics L version only
Data retention waveform L version only
Parameter Symbol Test Conditions Min Max Unit
VCC for data retention VDR VCC = 2.0V
CEVCC–0.2V
VinVCC–0.2V or
Vin0.2V
2.0 V
Data retention current ICCDR –300µA
Chip deselect to data retention time tCDR 0–ns
Operation recovery time tRtRC –ns
Input leakage current | ILI | –1µA
t
AW tAH
tWC
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Address
WE
Din
Dout
tDH
tOW
tDW
tWZ
tWP
tAS
Data Valid
tAW
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Address
CE
WE
Din
Dout
Data Valid
tCW
tWP
tDW tDH
tAH
tWZ
tWC
tAS
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VCC
CE
tR
tCDR
Data retention mode
4.5V 4.5V
VDR2.0V
VIH VIH
VDR
AS7C1028
AS7C1028L
6
AC test conditions
Notes
1 During VCC power-up, a pull-up resistor to VCC on CE is required to meet ISB specification.
2 This parameter is sampled and not 100% tested.
3 For test conditions, see AC Test Conditions, Figures A, B, C.
4t
CLZ and tCHZ are specified with CL = 5pF as in Figure C. Transition is measured ±500mV from steady-state voltage.
5 This parameter is guaranteed but not tested.
6WE
is HIGH for read cycle.
7CE
and OE are LOW for read cycle.
8 Address valid prior to or coincident with CE transition LOW.
9 All read cycle timings are referenced from the last valid address to the first transitioning address.
10 CE or WE must be HIGH during address transitions.
11 All write cycle timings are referenced from the last valid address to the first transitioning address.
255
Output load: see Figure B,
except for tCLZ and tCHZ see Figure C.
Input pulse level: GND to 3.0V. See Figure A.
Input rise and fall times: 5 ns. See Figure A.
Input and output timing reference levels: 1.5V.
5 pF*
480
Dout
GND
+5V
168
Thevenin E q uivalent:
Dout +1.728V
Figure C: Output Load for tCLZ, tCHZ
25530 pF*
480
Dout
GND
+5V
Figure B: Outpu t Load
*including sco pe
10%
90%
10%
90%
GND
+3.0V
Figure A: Input Waveform
and jig capacitance
AS7C1028
AS7C1028L
7
Typical DC and AC characteristics
Supply voltage (V)
4.0 5.5 6.0
5.04.5
0.0
0.2
0.6
0.8
0.4
1.0
1.2
1.4
Normalized ICC, ISB
Normalized supply current ICC, ISB
Am bi ent temper at ure (°C)
–55 80 125
35–10
0.0
0.2
0.6
0.8
0.4
1.0
1.2
1.4
Normalized ICC, ISB
Normalized supply curr ent ICC, ISB
vs. ambient temperature Ta
vs. supply voltage VCC
ICC
ISB
ICC
ISB
Ambient temperature (°C)
-55 80 125
35-10
0.2
1
0.04
5
25
625
Normalized ISB1 (log scale)
Normalized supply current ISB1
vs. ambi ent t empe rat ure Ta
VCC = 5.0V
Supply voltage (V)
4.0 5.5 6.0
5.04.5
0.8
0.9
1.1
1.2
1.0
1.3
1.4
1.5
Nor malized acces s time
Normalized access time tAA
Ambient temperature (°C)
–55 80 125
35–10
0.8
0.9
1.1
1.2
1.0
1.3
1.4
1.5
Nor malized acces s time
Normalized access time tAA
Cycle frequency (MHz)
060
80
4020
0.0
0.2
0.6
0.8
0.4
1.0
1.2
1.4
No rm al ized ICC
Normalize d supply current ICC
vs. ambient te mper atur e Tavs. cycle fre quency 1/tRC, 1/tWC
vs. supply voltage VCC
VCC = 5.0V
Ta = 25°C
VCC = 5.0VTa = 25°C
Output voltage (V)
0.0 3.75 5.0
2.51.25
0
20
60
80
40
100
120
140
Output source current (mA)
Output sourc e current IOH
Output voltage (V)
0.0 3.75 5.0
2.51.25
Out put sink current (mA)
Output sink current IOL
vs. output voltage VOL
vs. o utput volt age VOH
0
20
60
80
40
100
120
140
VCC = 5.0V
Ta = 25°C VCC = 5.0V
Ta = 25°C
Capacitance (pF)
0750
1000
500250
0
5
15
20
10
25
30
35
Chang e in tAA (ns )
Typical access time change tAA
vs. output capacitive loading
VCC = 4.5V
AS7C1028
AS7C1028L
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Printed in U.S.A. Copyright © 1996 All rights reserved. June 1996
Alliance Semiconductor reserves the right to make changes in this data sheet at any time to improve design and supply the best product possible. Publication of advance information does not constitute a
committment to produce or supply the product described. The company cannot assume responsibility for circuits shown or represent that they are free from patent infringement. Alliance products are not
authorized for use as critical components in life support devices or systems without the express written approval of the president of Alliance. ProMotion® and the Alliance logo are registered trademarks
of Alliance Semiconductor Corporation. All other trademarks are property of their respective holders.
Ordering codes
Shaded areas contain advance information.
Part numbering system
Package \ Access Time 12 ns 15 ns 20 ns 25 ns 35 ns
Plastic DIP, 300 mil AS7C1028-12TPC
AS7C1028L-12TPC
AS7C1028-15TPC
AS7C1028L-15TPC
AS7C1028-20TPC
AS7C1028L-20TPC
AS7C1028-25TPC
AS7C1028L-25TPC
AS7C1028-35TPC
AS7C1028L-35TPC
Plastic DIP, 400 mil AS7C1028-12PC
AS7C1028L-12PC
AS7C1028-15PC
AS7C1028L-15PC
AS7C1028-20PC
AS7C1028L-20PC
AS7C1028-25PC
AS7C1028L-25PC
AS7C1028-35PC
AS7C1028L-35PC
Plastic SOJ, 300 mil AS7C1028-12TJC
AS7C1028L-12TJC
AS7C1028-15TJC
AS7C1028L-15TJC
AS7C1028-20TJC
AS7C1028L-20TJC
AS7C1028-25TJC
AS7C1028L-25TJC
AS7C1028-35TJC
AS7C1028L-35TJC
Plastic SOJ, 400 mil AS7C1028-12JC
AS7C1028L-12JC
AS7C1028-15JC
AS7C1028L-15JC
AS7C1028-20JC
AS7C1028L-20JC
AS7C1028-25JC
AS7C1028L-25JC
AS7C1028-35JC
AS7C1028L-35JC
AS7C 1028 X –XX X C
SRAM prefix Device number Blank = Standard power
L = Low power Access time
Package: TP = PDIP 300 mil
P = PDIP 400 mil
TJ = SOJ 300 mil
J = SOJ 400 mil
Commercial temperature range,
0°C to 70 °C