© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 7 1Publication Order Number:
SMS05T1/D
SMS05T1 Series
SC−74 Quad Transient
Voltage Suppressor
for ESD Protection
This quad monolithic silicon voltage suppressor is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems and
other applications. This quad device provides superior surge
protection over current quad Zener MMQA series by providing up to
350 watts peak power.
Features
•SC-74 Package Allows Four Separate Unidirectional Configurations
•Peak Power − 350 W, 8 x 20 mS
•ESD Rating of Class N (Exceeding 25 kV) per
the Human Body Model
•ESD Rating:
IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact)
IEC 61000−4−4 (EFT) 40 A (5/50 ns)
IEC 61000−4−5 (lightning) 23 A (8/20 ms)
•UL Flammability Rating of 94 V−0
•Pb−Free Packages are Available
Typical Applications
•Hand Held Portable Applications such as Cell Phones, Pagers,
Notebooks and Notebook Computers
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation
8 x 20 mS @ TA = 25°C (Note 1) Ppk 350 W
Total Power Dissipation on FR−5 Board
@ TA = 25°C (Note 2)
Derate Above 25°C
PD225
1.8
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient RqJA 556 °C/W
Junction and Storage
Temperature Range TJ, Tstg −55 to +150 °C
Lead Solder Temperature
Maximum 10 Seconds Duration TL260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform
2. FR−5 = 1.0 x 0.75 x 0.62 in.
SC−74 QUAD TRANSIENT
VOLTAGE SUPPRESSOR
350 WATTS PEAK POWER
5 VOLTS
SC−74
CASE 318F
STYLE 1
1
2
3
6
5
4
MARKING DIAGRAM
PIN ASSIGNMENT
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 o
f
this data sheet.
DEVICE MARKING INFORMATION
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1
6
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
1
xxx M G
G
xxx = Specific Device Code
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
SMS05T1 Series
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2
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol Parameter
IPP Maximum Reverse Peak Pulse Current
VCClamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
ITTest Current
QVBR Maximum Temperature Coefficient of VBR
IFForward Current
VFForward Voltage @ IF
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK
Uni−Directional
IPP
IF
V
I
IR
IT
VRWM
VCVBR VF
ELECTRICAL CHARACTERISTICS − UNIDIRECTIONAL
Device Device
Marking
Breakdown
Voltage
Max
Reverse
Leakage
Current
Max Reverse Voltage
(Clamping Voltage)
At Specified Reverse
Surge Current (IRSM)
Max Reverse Voltage
(Clamping Voltage)
At Specified Reverse
Surge Current (IRSM)
Capacitance
@ 0 Volt Bias,
1 MHz
VBR(V) ITIRVR
IRSM
(8x20 ms) VRSM
(8x20 ms) IRSM
(8x20 ms) VRSM
(8x20 ms) (pF)
Min Nom Max (mA) (mA) (V) (A) (V) (A) (V) Min Max
SMS05T1 5V0 6.0 − 7.2 1.0 20 5.0 5.0 9.8 23 15.5 250 400
SMS12T1 12V 13.3 − 15 1.0 1.0 12 5.0 19.0 15 23.0 80 150
SMS15T1 15V 16.7 − 18.5 1.0 1.0 15 5.0 24.0 12 29.0 60 125
SMS24T1 24V 26.7 − 32 1.0 1.0 24 5.0 40.0 8 44.0 40 75
ORDERING INFORMATION
Device Package Shipping†
SMS05T1 SC−74 3000 / Tape & Reel
SMS05T1G SC−74
(Pb−Free)
SMS12T1 SC−74 3000 / Tape & Reel
SMS12T1G SC−74
(Pb−Free)
SMS15T1 SC−74 3000 / Tape & Reel
SMS15T1G SC−74
(Pb−Free)
SMS24T1 SC−74 3000 / Tape & Reel
SMS24T1G SC−74
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
SMS05T1 Series
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3
SMS15
SMS12
Figure 1. Non−Repetitive Peak Pulse Power
versus Pulse Time Figure 2. Power Derating Curve
Figure 3. Pulse Waveform
t, TIME (ms)
30151050
Figure 4. Clamping Voltage versus
Peak Pulse Current
IPP, PEAK PULSE CURRENT (A)
2
5
20151050
15
10
5
0
25
PERCENT OF I
PP
VC, CLAMPING VOLTAGE (V)
Figure 5. 8 x 20 ms VF
IF, FORWARD CURRENT (A)
5
3
1
1050
Figure 6. Typical Capacitance (SMS05 Series)
VR, REVERSE VOLTAGE (V)
2
5
20151050
150
100
50
00
200
250
V
F
, FORWARD VOLTAGE (V)
C, CAPACITANCE (pF)
2520
90
80
70
60
50
40
30
20
10
0
100
110 WAVEFORM
PARAMETERS
tr = 8 ms
td = 20 ms
td = IPP/2
4
2015
PULSE
WAVEFORM
tr = 8 ms
td = 20 ms
WAVEFORM
PARAMETERS
tr = 8 ms
td = 20 ms
20
SMS24
2
300
TJ = 25°C
c−t
8 X 20 ms SURGE
SMS05
SMS12
SMS05
tp, PULSE DURATION (ms)
10
1
0.1
10001001010.1
TA, AMBIENT TEMPERATURE (°C)
15
0
1251007550250
90
80
70
60
50
40
30
20
10
0
0.01
100
110
P
PP
, PEAK PULSE POWER (kW)
% OF RATED POWER OR IPP
SMS15 SMS24
40
35
30
50
45
SMS05T1 Series
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4
PACKAGE DIMENSIONS
SC−74 (SC−59ML)
CASE 318F−05
ISSUE M
STYLE 1:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
23
456
D
1
eb
E
A1
A
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. 318F−01, −02, −03, −04 OBSOLETE. NEW
STANDARD 318F−05.
C
L
HE
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.90 1.00 1.10 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.25 0.37 0.50 0.010
c0.10 0.18 0.26 0.004
D2.90 3.00 3.10 0.114
E1.30 1.50 1.70 0.051
e0.85 0.95 1.05 0.034
0.20 0.40 0.60 0.008
0.039 0.043
0.002 0.004
0.015 0.020
0.007 0.010
0.118 0.122
0.059 0.067
0.037 0.041
0.016 0.024
NOM MAX
2.50 2.75 3.00 0.099 0.108 0.118
HE− −
L
0°10°0°10°
q
q
0.7
0.028
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.95
0.037
ǒmm
inchesǓ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its of ficers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
SMS05T1/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
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