EH1125HSTS-1.544M-G - Ecliptek Corporation

RoHS

EH1125HSTS-1.544M-G

EH11 25 HS TS -1.544M - G

Series

RoHS Compliant (Pb-free) 5.0V 8 Pin DIP Metal

Thru-Hole HCMOS/TTL High Frequency Oscillator

Frequency Tolerance/Stability

±25ppm Maximum

Package

Operating Temperature Range

0°C to +70°C

Duty Cycle

50 ±10(%)

Gull Wing

Value Added Option Prefix

Nominal Frequency

1.544MHz

Pin 1 Connection

Tri-State (Disabled Output: High Impedance)

ELECTRICAL SPECIFICATIONS

Nominal Frequency 1.544MHz

Frequency Tolerance/Stability ±25ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,

Shock, and Vibration.)

Aging at 25°C ±5ppm/year Maximum

Operating Temperature Range 0°C to +70°C

Supply Voltage 5.0Vdc ±10%

Input Current 50mA Maximum (No Load)

Output Voltage Logic High (Voh) 2.4Vdc Minimum with TTL Load, Vdd-0.4Vdc Minimum with HCMOS Load (IOH = -16mA)

Output Voltage Logic Low (Vol) 0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load (IOL = +16mA)

Rise/Fall Time 6nSec Maximum (Measured at 0.8Vdc to 2.0Vdc with TTL Load; Measured at 20% to 80% of waveform

with HCMOS Load)

Duty Cycle 50 ±10(%) (Measured at 1.4Vdc with TTL Load or at 50% of waveform with HCMOS Load)

Load Drive Capability 10TTL Load or 50pF HCMOS Load Maximum

Output Logic Type CMOS

Pin 1 Connection Tri-State (Disabled Output: High Impedance)

Tri-State Input Voltage (Vih and Vil) +2.2Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to

enable output.

Absolute Clock Jitter ±250pSec Maximum, ±100pSec Typical

One Sigma Clock Period Jitter ±50pSec Maximum, ±30pSec Typical

Start Up Time 10mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test MIL-STD-883, Method 1014, Condition A

Gross Leak Test MIL-STD-883, Method 1014, Condition C

Lead Integrity MIL-STD-883, Method 2004

Mechanical Shock MIL-STD-202, Method 213, Condition C

Resistance to Soldering Heat MIL-STD-202, Method 210

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010

Vibration MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 1 of 7

EH1125HSTS-1.544M-G

MECHANICAL DIMENSIONS (all dimensions in millimeters)

7.620

±0.203

7.620 ±0.203

13.2

MAX

13.2

MAX

85DIA 0.457

±0.1 (X4)

5.08 MIN

5.6 MAX

0.8 ±0.1 (X3)

MARKING

ORIENTATION

PIN CONNECTION

1 Tri-State

4 Case/Ground

5 Output

8 Supply Voltage

LINE MARKING

1ECLIPTEK

2EH11TS

EH11=Product Series

31.544M

4XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

OUTPUT WAVEFORM & TIMING DIAGRAM

VOH

VOL

80% or 2.4VDC

50% or 1.4VDC

20% or 0.4VDC

Fall

Time

Rise

Time TW

Duty Cycle (%) = TW/T x 100

VIH

VIL

tPLZ tPZL

CLOCK OUTPUT TRI-STATE INPUT

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EH1125HSTS-1.544M-G

Supply

Voltage

(VDD)

Test Circuit for TTL Output

Output

No Connect

or Tri-State

Ground

+ +

Power

Supply Voltage

Meter

Current

Meter

0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

(Note 4)

Power

Supply

Oscilloscope Frequency

Counter

Probe

(Note 2)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.

Note 5: All diodes are MMBD7000, MMBD914, or equivalent.

Table 1: RL Resistance Value and CL Capacitance

Value Vs. Output Load Drive Capability

Output Load

Drive Capability RL Value

(Ohms) CL Value

(pF)

10TTL

5TTL

2TTL

10LSTTL

1TTL

390

780

1100

2000

2200

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EH1125HSTS-1.544M-G

Supply

Voltage

(VDD)

Test Circuit for CMOS Output

Output

No Connect

or Tri-State

Ground

+ +

Power

Supply 0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Voltage

Meter

Current

Meter

Oscilloscope Frequency

Counter

Probe

(Note 2)

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T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EH1125HSTS-1.544M-G

High Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

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T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EH1125HSTS-1.544M-G

Low Temperature Infrared/Convection 185°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)185°C Maximum

Target Peak Temperature (TP Target) 185°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 6 of 7

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EH1125HSTS-1.544M-G

Low Temperature Solder Bath (Wave Solder)

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 30 - 60 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)245°C Maximum

Target Peak Temperature (TP Target) 245°C Maximum 1 Time / 235°C Maximum 2 Times

Time within 5°C of actual peak (tp)5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

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