HTSC423.xxx - 0201 High Temperature Silicon Capacitor Rev 3.1 Key features Key applications High stability up to 200C: All applications up to 200C, such as military, aerospace and automotive industries Voltage <0.1 %/V High reliability applications Negligible capacitance loss through aging Replacement of X7R and C0G dielectrics Decoupling / Filtering / Charge pump (i.e.: motor management, temperature sensors) Downsizing Temperature <1% (-55 C to +200 C) Unique high capacitance in EIA/0201 package size, up to 10nF High reliability (FIT <0.017 parts / billion hours) Low leakage current down to 100 pA Low ESL and Low ESR Suitable for lead free reflow-soldering *Please refer to our assembly Application Note for further recommendations Thanks to the unique IPDiA Silicon capacitor The IPDiA technology offers industry leading technology, most of the problems encountered in performances relative to failure rate with a demanding applications can be solved. FIT<0.017. High Temperature Silicon Capacitors are This technology also offers high reliability, up to dedicated to applications where reliability up to 10 200C is the main parameter. technologies, such as Tantalum or MLCC, and This technology features a capacitor integration capability (up to 250nF/mm ) which times better than alternative capacitor eliminates cracking phenomena. offers This Silicon based technology is RoHS compliant capacitance value similar to X7R dielectric, but and compatible with lead free reflow soldering with better electrical performances than C0G/NP0 process. dielectrics, up to 200C. HTSC provides the highest capacitor stability over the full -55C/+200C temperature range in the market with a Temperature Coefficient lower than 1%. HTSC423.xxx Electrical specification Capacitance value 10 Contact IPDIA Sales Contact 10 pF IPDIA Sales Contact 0.1 nF IPDIA Sales 10nF: 935.132.423.510 1 nF 935.132.723.510 22 33 47 68 Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Contact IPDIA Sales Parameters Capacitance range Capacitance tolerances Operating temperature range Storage temperatures Temperature coefficient Breakdown voltage (BV) Capacitance variation versus RVDC Equivalent Serial Inductor (ESL) Equivalent Serial Resistor (ESR) (*) Thinner thickness (as low as 100 m thick) available, see Low Profile Silicon Capacitor product: LPSC Value 10 nF(***) 15 %(***) -55 C to 200 C (**) - 70 C to 215 C <1 %, from -55 C to +200 C 11 VDC, 30VDC 0.1 % /V (from 0 V to RVDC) Max 100 pH Max 400m (***) 50G min @ 3V,25C 20G min @ 3V,200C Negligible, < 0.001 % / 1000h FIT<0.017 parts / billion hours, Max 400 m (*) Insulation resistance (**) Extended temperature range (up to +250 C) available, see Xtreme Temperature Silicon Capacitor product: XTSC Ageing Reliability Capacitor height (***) Other values on request. DC Voltage stability MLCC capacitors vs. PICS ESL (nH) @25C 0402 C0G(NPO) vs. PICS 1,1 10 PICS 1 0 -10 C0G 0,9 C0G 0,8 -20 0,7 -30 X7R ESL(nH) Capacitance change (%) Unit 1 pF 15 -40 -50 0,6 0,5 0,4 -60 0,3 -70 -80 0,2 Y5V PICS 0,1 -90 0 -100 0 1 2 3 4 5 6 0 7 50 100 150 200 Fig.1 Capacitance change versus temperature variation compared with alternative dielectrics 250 300 350 400 450 500 550 600 650 700 750 800 Capacitance (pF) Bias voltage (V) Fig.3 ESL versus capacitance value compared with alternative dielectrics Fig.2 Capacitance change versus voltage variation compared with alternative dielectrics Part Number 935.132. i.e.: 10 nF/0201 case (HTSC type) 935.132.423.510 B.2 S. Breakdown Voltage 4 = 11V 7 = 30V U Size 3 = 0201 xx Unit 0 = 10 f 1 = 0.1 p 2=1p 3 = 10 p 4 = 0.1 n Value 10 15 22 33 47 68 5=1n 6 = 10 n 7 = 0.1 8=1 9 = 10 Termination and Outline Termination Lead-free nickel/solder coating compatible with automatic soldering technologies: reflow and manual. Package outline Typical dimensions, all dimensions in mm. L Typ. 0201 W Comp. size L 0.80.03 W 0.600.03 Land pattern IPD component Solder Resist (0201 PCB footprint) Packaging Tape and reel, tray, waffle pack or wafer delivery. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. For more information, please visit: http://www.ipdia.com To contact us, email to: sales@ipdia.com Date of release 28th February 2014 Document identifier: CL431 111 615 133 850 900 950 1000