Integrated Circuits Package Information Latest changes to this document - 11th February 2002 Delvery packaging specification added Publication No: D/Packs/8 February 2002 1 CML Microcircuit Package Information Package Suffixes CML package styles are currently identified with the following suffixes: J, LG, LH, LS and P. To make this system more explanatory, new identifier suffixes are being introduced to all NEW CML products. For an undetermined period both current and new identifiers will be used in publications where relevant. The table below explains the old and new nomenclature: Package Information PLCC TQFP SOIC PDIP SSOP QFP CLCC Plastic Leaded Chip Carrier Thin Quad Plastic Flatpack Small Outline Integrated Circuit Plastic Dual In Line Shrunk Small Outline Package Quad Plastic Flatpack Ceramic Leaded Chip Carrier Number of Pins Material Package Type New Product Suffix 28 Plastic SOIC D1 24 Plastic SOIC D2 20 Plastic SOIC D3 16 Plastic SOIC D4 24 Plastic SSOP D5 28 Plastic SSOP D6 28 Plastic TSSOP E1 24 Plastic TSSOP E2 20 Plastic TSSOP E3 16 Plastic TSSOP E4 14 Ceramic Cerdip J1 16 Ceramic Cerdip J2 22 Ceramic Cerdip J3 24 Ceramic Cerdip J4 28 Ceramic Cerdip J5 24 Plastic PLCC L1 24 Plastic PLCC L2 28 Plastic PLCC L3 48 Plastic TQFP L4 24 Plastic PLCC L5 44 Plastic PLCC L6 44 Plastic QFP L7 28 Ceramic CLCC M1 8 Plastic PDIP P1 14 Plastic PDIP P2 16 Plastic PDIP P3 24 Plastic PDIP P4 40 Plastic PDIP P5 24 Plastic PDIP P6 80 Plastic QFP S1 80 Plastic TQFP S2 CML microcircuit package working diagrams with dimensions are detailed on the following pages; basic form illustrations of the relevant packages are provided on the back page of each individual data sheet. 2 Package Styles ...... Legend Cerdip ceramic dual-in-line CLCC ceramic leaded chip carrier E J 28-pin TSSOP 14-pin cerdip DW 24-pin SOIC 24-pin TSSOP 16-pin cerdip SSOP shrunk small outline package DW 20-pin SOIC J TN 20-pin TSSOP 22-pin cerdip 16-pin TSSOP 24-pin cerdip LG 24-lead PLCC J LH LS 28-lead PLCC J LH 8 DW S 80-lead QFP P M1 14-pin PDIP 80-lead TQFP P 16-pin PDIP LH 48-lead TQFP P 24-pin PDIP 4 J DW 24-pin SSOP 28-pin cerdip P 24-lead PLCC 5 L J 28-pin SSOP 44-lead PLCC 22-pin PDIP 6 QFP quad flat pack TQFP thin quad flat pack P 8-pin PDIP 3 DS TSSOP thin shrunk small outline package M 28-lead CLCC 2 16-pin SOIC SOIC small outline integrated circuit L 24-lead PLCC 1 PDIP plastic dual-in-line PLCC plastic leaded chip carrier D 28-pin SOIC 44-lead QFP 7 Note: Package illustrations are not to scale Package Styles - Alternative Suffixes CML's IC package styles are recognised by the suffixes described on the axes of the table above: D1 to D6, E1 to E4, J1 to J5, L1 to L7, M1 P1 to P4 and P6 and S1 to S2. However, some previously published documents refer to these same package styles with other suffixes. Such publications would be pre-1995 CML datasheets and older published product data bulletins. These alternative (older) package suffixes are shown, where appropriate, in the relevant cell of the table. CML PACKAGING AND DESPATCH The table on the previous page illustrates the physical appearances of CML's integrated circuit packages (for clarity suffixes used in older documentation is shown within the relevant cell). For handling/loading ease and convenience, CML products are packed for despatch in industrystandard bulk or individual packaging as described below: o Trays and cardboard boxes with conductive foam. o Pocketed conductive trays for surface-mount microcircuits. o Antistatic coated tubes, of various sizes, with thumbplugs. o 13-inch reel Tape-and-Reel packaging which fully conforms to the latest IEC specification. The conductive embossed tape provides a secure cavity sealed with a peel-back cover tape. Relevant configurations are shown in the table below; no partial reel counts are available. Package Suffix Description Tube Tape Tape Also Available 1200 1200 1200 1200 D1 D2 D3 D4 D5 D6 28-Pin SOIC Package 24-pin SOIC Package 20-pin SOIC Package 16-pin SOIC Package 24-pin SSOP Package 28-pin SSOP Package 27 31 38 47 59 47 1000/1500 1000/1500 1000/1500 1000/1500 1000/1500 1000/1500 E1 E2 E3 E4 28-pin 24-pin 20-pin 16-pin TSSOP TSSOP TSSOP TSSOP 50 62 74 95 1000/2000/3000 1000/2000/3000 1000/2000/3000 1000/2000/3000 J1 J2 J3 J4 J5 14-pin 16-pin 22-pin 24-pin 28-pin Cerdip Cerdip Cerdip Cerdip Cerdip L1 (LG) L2 (LS) L3 (LH) L4 L5 L6 L7 24-lead PLCC Package (Gull) 24-lead PLCC Package (Hook) 28-lead PLCC Package (Hook) 48-lead TQFP Package (Gull) 24-lead PLCC Package 44-lead PLCC Package (Hook) 44-lead QFP Package (Gull) M1 28-lead CLCC Package (Hook) P1 P2 P3 P4 P6 8-pin Plastic DIL Package 14-pin Plastic DIL Package 16-pin Plastic DIL Package 24-pin Plastic DIL Package 22-pin Plastic DIL Package S1 80-lead QFP Package (Gull) Package Package Package Package DIL DIL DIL DIL DIL Package Package Package Package Package Tray 25 25 18 20 20 45 39 500 500 500 1000/2000 700 700 50 250 27 1000 160 500 50 25 25 15 18 500 Where your packaging requirement is not detailed above, please contact CML Microcircuits or your local distributor. `Tape and Reel' products are ordered by adding the suffix "T/R" to the part number. CML Microcircuit Package Information ...... 28-Pin Plastic S.O.I.C., DW (D1) DIM. A * * B ALTERNATIVE PIN LOCATION MARKING E W L PIN 1 X Y C K1 K P J H T A B C E F H J K K1 L P T W X Y MIN. TYP. MAX. 0.697 (17.70) 0.711 (18.06) 0.286 (7.26) 0.299 (7.59) 0.088 (2.24) 0.105 (2.67) 0.390 (9.90) 0.419 (10.64) 0.500 (16.51) 0.003 (0.08) 0.020 (0.51) 0.018 (0.46) 0.013 (0.33) 0.041 (1.04) 0.041 (1.04) 0.050 (1.27) 0.016 (0.41) 0.050 (1.27) 0.0125 (0.32) 0.009 (0.23) 45 0 10 7 NOTE : F * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 24-Pin Plastic S.O.I.C., DW (D2) DIM. A * * B ALTERNATIVE PIN LOCATION MARKING E W L T PIN 1 X Y C K K1 H P J F * 3 A B C E F H J K K1 L P T W X Y MIN. TYP. MAX. 0.613 (15.57) 0.597 (15.16) 0.286 (7.26) 0.299 (7.59) 0.093 (2.36) 0.105 (2.67) 0.390 (9.90) 0.419 (10.64) 0.550 (14.1) 0.003 (0.08) 0.020 (0.51) 0.020 (0.51) 0.013 (0.33) 0.041 (1.04) 0.041 (1.04) 0.050 (1.27) 0.016 (0.41) 0.050 (1.27) 0.0125 (0.32) 0.009 (0.23) 45 0 10 7 NOTE : A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees CML Microcircuit Package Information ...... 20-Pin Plastic S.O.I.C., DW (D3) DIM. A * * B ALTERNATIVE PIN LOCATION MARKING E W L PIN 1 X Y K C K1 J H T F P A B C E F H J K K1 L P T W X Y MIN. TYP. MAX. 0.495 (12.57) 0.510 (12.95) 0.286 (7.26) 0.299 (7.59) 0.088 (2.24) 0.105 (2.67) 0.390 (9.90) 0.419 (10.64) 0.450 (11.43) 0.003 (0.08) 0.020 (0.51) 0.020 (0.51) 0.013 (0.33) 0.041 (1.04) 0.041 (1.04) 0.050 (1.27) 0.016 (0.41) 0.050 (1.27) 0.0125 (0.32) 0.009 (0.23) 45 10 0 7 NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 16-Pin Plastic S.O.I.C., DW (D4) DIM. A * * B ALTERNATIVE PIN LOCATION MARKING E L T PIN 1 X Y C K1 H W K P J F A B C E F H J K K1 L P T W X Y MIN. TYP. MAX. 0.395 (10.03) 0.413 (10.49) 0.286 (7.26) 0.299 (7.59) 0.088 (2.24) 0.105 (2.67) 0.390 (9.90) 0.419 (10.64) 0.350 (8.89) 0.003 (0.08) 0.020 (0.51) 0.020 (0.51) 0.013 (0.33) 0.041 (1.04) 0.041 (1.04) 0.050 (1.27) 0.016 (0.41) 0.050 (1.27) 0.0125 (0.32) 0.009 (0.23) 45 10 0 7 NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 4 CML Microcircuit Package Information ...... 24-Pin Plastic S.S.O.P. (D5) A Z * * E B L PIN 1 T X Y H J F MIN. A B C E F H J L P T X Y Z 7.90 5.00 1.67 7.40 TYP. MAX. 8.50 5.60 2.00 8.20 7.15 0.05 0.22 0.55 0.65 0.21 0.38 0.95 0.25 8 0.09 0 7 9 4 12 NOTE : C P DIM. * A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees 28-Pin Plastic S.S.O.P. (D6) A Z E B ALTERNATIVE PIN LOCATION MARKING * * L PIN 1 T X Y H J F P DIM. MIN. A B C E F H J L P T X Y Z 9.90 5.00 1.67 7.40 0.05 0.22 0.55 TYP. 8.45 MAX. 10.50 5.60 2.00 8.20 0.21 0.38 0.65 0.09 0 0.95 0.25 8 7 9 4 12 NOTE : C * A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees 5 CML Microcircuit Package Information ...... 28-Pin Plastic T.S.S.O.P. (E1) A * * E B L PIN 1 T X Y C J H F * 9.60 4.30 -------6.30 0.05 0.17 0.45 8.45 0.65 0.08 0 MAX. 9.80 4.50 1.20 6.50 0.15 0.30 0.75 0.20 8 12 A & B are reference data and do not include mold deflash or protrusions. (E2) * * E B L PIN 1 T X Y C F A B C E F H J L P T X Y TYP. All dimensions in mm Angles are in degrees A J MIN. NOTE : P 24-Pin Plastic T.S.S.O.P. H DIM. DIM. MIN. A B C E F H J L P T X Y 7.70 4.30 -------6.30 0.05 0.17 0.45 TYP. MAX. 7.90 4.50 1.20 6.50 7.15 0.15 0.30 0.75 0.65 0.20 8 0.08 0 12 NOTE : * P A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees 6 20-Pin Plastic T.S.S.O.P. (E3) DIM. A * * E B L PIN 1 T X Y C J H F * 0.05 0.17 0.45 5.85 6.60 4.50 1.20 6.50 0.15 0.30 0.75 0.65 0.20 8 0.08 0 12 A & B are reference data and do not include mold deflash or protrusions. (E4) * * E B L PIN 1 T X Y C F 6.40 4.30 -------6.30 MAX. All dimensions in mm Angles are in degrees A J TYP. NOTE : P 16-Pin Plastic T.S.S.O.P. H A B C E F H J L P T X Y MIN. DIM. MIN. A B C E F H J L P T X Y 4.90 4.30 -------6.30 0.05 0.17 0.45 TYP. MAX. 5.10 4.50 1.20 6.50 4.55 0.65 0.08 0 0.15 0.30 0.75 0.20 8 12 NOTE : * P A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees 7 CML Microcircuit Package Information ...... 14-Pin Cerdip DIL; J (J1) A DIM. Z E1 B M T PIN 1 K E K1 C H L J J1 P A B C E E1 F H J J1 K K1 L M P T Z MIN. TYP. MAX. 0.766 (19.46) 0.754 (19.15) 0.245 (6.22) 0.251 (6.38) 0.165 (4.19) 0.230 (5.84) 0.360 (9.14) 0.400 (10.16) 0.305 (7.75) 0.315 (8.00) 0.600 (15.24) 0.015 (0.38) 0.018 (0.46) 0.060 (1.52) 0.075 (1.91) 0.080 (2.03) 0.075 (1.91) 0.080 (2.03) 0.115 (2.92) 0.200 (5.08) 0.080 (2.03) 0.100 (2.54) 0.010 (0.25) 8 NOTE : All dimensions in inches (mm.) F Angles in degrees 16-Pin Cerdip DIL; J (J2) A E1 B K K1 H L J J1 E T M PIN PIN 11 Z C P DIM. A B C E E1 F H J J1 K K1 L M P T Z MIN. TYP. MAX. 0.753 (19.13) 0.767 (19.48) 0.285 (7.24) 0.291 (7.39) 0.144 (3.66) 0.230 (5.84) 0.370 (9.40) 0.415 (10.54) 0.317 (8.05) 0.300 (7.62) 0.70 (17.78) 0.015 (0.38) 0.018 (0.46) 0.055 (1.40) 0.053 (1.35) 0.080 (2.03) 0.075 (1.91) 0.080 (2.03) 0.115 (2.92) 0.200 (5.08) 0.030 (0.76) 0.100 (2.54) 0.010 (0.25) 10 NOTE : F All dimensions in inches (mm.) Angles are in degrees 8 CML Microcircuit Package Information ...... 22-Pin Cerdip DIL; J (J3) A DIM. Z E1 B PIN1 E T M K K1 C H L J1 J P A B C E E1 F H J J1 K K1 L M P T Z TYP. MIN. MAX. 1.080 (27.43) 1.060 (26.92) 0.376 (9.55) 0.384 (9.75) 0.165 (4.19) 0.230 (5.84) 0.466 (11.84) 0.515 (13.08) 0.408 (10.36) 0.418 (10.62) 1.000 (25.40) 0.015 (0.38) 0.018 (0.46) 0.055 (1.40) 0.058 (1.47) 0.080 (2.03) 0.075 (1.91) 0.080 (2.03) 0.115 (2.92) 0.171 (4.34) 0.035 (0.89) 0.100 (2.54) 0.010 (0.25) 9 NOTE : All dimensions in inches (mm.) Angles are in degrees F 24-Pin Cerdip DIL; J (J4) A Z B E E1 T M PIN1 K K1 C H L J J1 P DIM. A B C E E1 F H J J1 K K1 L M P T Z TYP. MIN. MAX. 1.260 (32.00) 1.240 (31.50) 0.514 (13.06) 0.583 (14.81) 0.165 (4.19) 0.230 (5.84) 0.600 (15.24) 0.680 (17.27) 0.594 (15.09) 0.615 (15.62) 1.100 (27.94) 0.015 (0.38) 0.018 (0.46) 0.055 (1.40) 0.080 (2.03) 0.050 (1.27) 0.074 (1.88) 0.115 (2.92) 0.080 (2.03) 0.200 (5.08) 0.05 (1.27) 0.100 (2.54) 0.010 (0.25) 6 NOTE : F All dimensions in inches (mm.) Angles are in degrees 9 CML Microcircuit Package Information ...... 28-Pin Cerdip DIL; J (J5) A DIM. Z B T M PIN1 K K1 C H L J J1 E E1 P A B C E E1 F H J J1 K K1 L M P T Z TYP. MIN. MAX. 1.440 (36.58) 1.460 (37.08) 0.510 (12.95) 0.530 (13.46) 0.165 (4.19) 0.230 (5.84) 0.640 (16.26) 0.715 (18.16) 0.608 (15.44) 0.620 (15.75) 1.300 (33.02) 0.015 (0.38) 0.018 (0.46) 0.055 (1.40) 0.080 (2.03) 0.050 (1.27) 0.075 (1.91) 0.115 (2.92) 0.080 (2.03) 0.171 (4.34) 0.05 (1.27) 0.100 (2.54) 0.010 (0.25) 6 NOTE : F All dimensions in inches (mm.) Angles are in degrees 10 CML Microcircuit Package Information ...... 24-Pin PLCC; LG (L1) D A * * C P E1 G E B J K1 IDENT F (PIN 1) K (PIN 1) L T H X W * Z DIM. A B C D E E1 F G H J K K1 L P T W X Z TYP. MIN. MAX. 0.390 (9.91) 0.390 (9.91) 0.404 (10.26) 0.404 (10.26) 0.098 (2.49) 0.616 (15.65) 0.616 (15.65) 0.524 (13.31) 0.250 (6.35) 0.250 (6.35) 0.004 (0.10) 0.022 (0.56) 0.018 (0.46) 0.055 (1.40) 0.045 (1.14) 0.033 (0.84) 0.031 (0.80) 0.039 (1.00) 0.049 (1.24) 0.051 (1.30) 0.006 (0.15) 0.009 (0.23) 45 6 6 NOTE : A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 24-Lead PLCC; LS (L2) C E B Y K DA W H T PIN 1 P J E1 W PIN 1 K1 G F DIM. * BA * C D E E1 F G H J K K1 P T W Y * MIN. TYP. MAX. 0.409 (10.40) 0.382 (9.70) 0.409 (10.40) 0.382 (9.70) 0.128 (3.25) 0.146 (3.70) 0.435 (11.05) 0.417 (10.59) 0.417 (10.59) 0.435 (11.05) 0.366 (9.30) 0.250 (6.35) 0.250 (6.35) 0.023 (0.58) 0.018 (0.46) 0.022 (0.56) 0.048 (1.22) 0.059 (1.50) 0.049 (1.24) 0.051 (1.30) 0.006 (0.15) 0.009 (0.23) 60 30 6 NOTE : A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 11 CML Microcircuit Package Information ...... 28-Lead PLCC; LH (L3) C E B Y K J E1 J1 D A W * * W T PIN 1 H P G A B C D E E1 F G H J J1 K P T W Y TYP. MIN. DIM. MAX. 0.456 (11.58) 0.450 (11.43) 0.456 (11.58) 0.450 (11.43) 0.180 (4.57) 0.165 (4.19) 0.510 (12.95) 0.470 (11.94) 0.510 (12.95) 0.470 (11.94) 0.423 (10.74) 0.300 (7.62) 0.300 (7.62) 0.020 (0.51) 0.013 (0.33) 0.021 (0.53) 0.031 (0.79) 0.060 (1.52) 0.075 (1.91) 0.050 (1.27) 0.010 (0.25) 45 7 NOTE : * F All dimensions in inches (mm.) Angles are in degrees 48-Pin Thin Quad Flat Pack (L4) D IDENT C A (PIN 1) A & B are reference datum's and do not include mold deflash or protrusions. DIM. * * P B E J * MAX. 7.11 7.11 1.60 9.25 9.25 0.15 0.28 0.76 6.91 6.91 1.00 8.74 8.74 0.05 0.10 0.35 0.50 0.13 0 11 7 13 A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees T L TYP. NOTE : Y X A B C D E H J L P T X Y MIN. H 12 CML Microcircuit Package Information ...... 24-Lead Straight PLCC; L (L5) D A C P B J DIM. A B C D E F G J K K1 P T W * * G E IDENT (PIN 1) F K1 K (PIN 1) MIN. TYP. MAX. 0.390 (9.91) 0.404 (10.26) 0.404 (10.26) 0.390 (9.91) 0.087 (2.21) 0.094 (2.39) 0.846 (21.49) 0.846 (21.49) 0.250 (6.35) 0.250 (6.35) 0.022 (0.56) 0.018 (0.46) 0.055 (1.40) 0.045 (1.14) 0.033 (0.84) 0.049 (1.24) 0.051 (1.30) 0.006 (0.15) 0.009 (0.23) 45 NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees W T 44-Pin PLCC; LH (L6) C D K A N Y J IDENT B E J1 W PIN 1 H T M P DIM. * BA * C D E F G H J J1 K M N P T W Y G * TYP. MIN. 0.650 (16.51) 0.650 (16.51) 0.685 (17.40) 0.685 (17.40) MAX. 0.656 (16.66) 0.656 (16.66) 0.180 (4.57) 0.695 (17.65) 0.695 (17.65) 0.500 (12.7) 0.500 (12.7) 0.020 (0.51) 0.021 (0.53) 0.013 (0.33) 0.029 (0.74) 0.070 (1.78) 0.062 (1.57) 0.062 (1.57) 0.050 (1.27) 0.010 (0.25) 0.30 (7.62) x 45 7 NOTE : A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees F 13 CML Microcircuit Package Information ...... 44-Lead QFP; L7 D C A * * P E B J IDENT (PIN 1) Y MIN. A B C D E H J L P T X Y 9.90 9.90 1.40 11.80 11.80 TYP. MAX. 0.04 10.11 10.11 1.60 12.20 12.20 0.16 0.24 0.40 0.45 0.75 0.80 0.09 0 10 0.20 7 14 NOTE : * A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles in degrees T X DIM. H L 28-Lead Ceramic CLCC; M1 C D A K L N BE J E1 J1 PIN 1 W H T M P G F DIM. A B C D E E1 F G H J J1 K L M N P T W MIN. TYP. Angles in degrees 14 MAX. 0.457 (11.6) 0.447 (11.35) 0.447 (11.35) 0.457 (11.6) 0.160 (4.07) 0.170 (4.32) 0.474 (12.05) 0.490 (12.45) 0.474 (12.05) 0.490 (12.45) 0.395 (10.03) 0.426 (10.82) 0.300 (7.62) 0.300 (7.62) 0.044 (1.12) 0.037 (0.94) 0.019 (0.48) 0.028 (0.71) 0.065 (1.65) 0.065 (1.65) 0.060 (1.5) 0.065 (1.65) 0.060 (1.5) 0.065 (1.65) 0.05 (1.27) 0.023 (0.59) 45 NOTE : All dimensions in inches (mm.) CML Microcircuit Package Information ...... 8-Pin Plastic DIL; P (P1) A Z E1 B J1 PIN1 T M K H L K1 P E Y C J DIM. * AB *C E E1 F H J J1 K K1 L M P T Y Z F * TYP. MIN. MAX. 0.346 (8.790) 0.400 (10.16) 0.240 (6.10) 0.260 (6.60) 0.145 (3.68) 0.200 (5.08) 0.300 (7.62) 0.390 (9.91). 0.290 (7.37) 0.325 (8.25) 0.30 (7.62) 0.030 (0.76) 0.015 (0.38) 0.023 (0.58) 0.045 (1.14) 0.065 (1.65) 0.062 (1.58) 0.062 (1.58) 0.121 (3.07) 0.150 (3.81) 0.029 (0.74) 0.100 (2.54) 0.008 (0.20) 0.015 (0.38) 7 5 NOTE : A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 14-Pin Plastic DIL; P (P2) DIM. A Z B E1 E * AB *C J1 P F NOTE : PIN 1 PIN 1 T M K K1 C H L * TYP. MAX. 0.740 (18.80) 0.810 (20.57) 0.240 (6.10) 0.260 (6.60) 0.127 (3.23) 0.200 (5.08) 0.300 (7.62) 0.390 (9.91). 0.290 (7.37) 0.325 (8.26) 0.60 (15.24) 0.015 (0.38) 0.07 (1.78) 0.015 (0.38) 0.023 (0.58) E E1 F H J J1 K K1 L M P T Y Z Y J MIN. 0.045 (1.14) 0.065 (1.65) 0.056 (1.42) 0.064 (1.63) 0.056 (1.42) 0.064 (1.63) 0.121 (3.07) 0.150 (3.81) 0.072 (1.83) 0.100 (2.54) 0.008 (0.20) 0.015 (0.38) 7 5 A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 15 CML Microcircuit Package Information ...... 16-Pin Plastic DIL; P (P3) DIM. A * AB *C Z B E1 E Y T M PIN 1 K K1 H L J J1 E E1 F H J J1 K K1 L M P T Y Z C P F MIN. TYP. MAX. 0.740 (18.80) 0.810 (20.57) 0.240 (6.10) 0.262 (6.65) 0.127 (3.23) 0.200 (5.08) 0.300 (7.62) 0.390 (9.91). 0.290 (7.37) 0.325 (8.26) 0.70 (17.78) 0.015 (0.38) 0.015 (0.38) 0.040 (1.02) 0.040 (1.02) 0.023 (0.58) 0.065 (1.65) 0.056 (1.42) 0.064 (1.63) 0.056 (1.42) 0.064 (1.63) 0.121 (3.07) 0.150 (3.81) 0.028 (0.71) 0.100 (2.54) 0.008 (0.20) 0.015 (0.38) 7 5 NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 24-Pin Plastic DIL; P (P4) A DIM. Z B E E1 *A * BC E E1 F H J J1 K K1 L M P T Y Z Y PIN1 T M K H L K1 C J J1 P F MIN. TYP. MAX. 1.200 (30.48) 1.270 (32.26) 0.500 (12.70) 0.555 (14.10) 0.142(3.61) 0.220 (5.59) 0.600 (15.24) 0.670 (17.02) 0.590 (14.99) 0.625 (15.88) 1.10 (27.94) 0.015 (0.38) 0.045 (1.14) 0.015 (0.38) 0.023 (0.58) 0.040 (1.02) 0.065 (1.65) 0.066 (1.68) 0.074 (1.88) 0.060 (1.52) 0.074 (1.88) 0.121 (3.07) 0.160 (4.06) 0.180 (4.58) 0.100 (2.54) 0.008 (0.20) 0.015 (0.38) 7 4 NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 16 CML Microcircuit Package Information ...... 40-Pin Plastic DIL; P (P5) A Z E E1 B DIM. Y PIN 1 K K1 H L J1 P F * * T M C J A B C E E1 F H J J1 K K1 L M P T Y Z MIN. TYP. MAX. 2.040 (51.82) 2.060 (52.32) 0.530 (13.46) 0.555 (14.10) 0.146 (3.71) 0.195 (4.95) 0.600 (15.24) 0.670 (17.02) 0.595 (15.11) 0.625 (15.88) 1.90 (48.26) 0.015 (0.38) 0.045 (1.14) 0.018 (0.46) 0.050 (1.27) 0.066 (1.68) 0.074 (1.88) 0.060 (1.52) 0.074 (1.88) 0.121 (3.07) 0.150 (3.81) 0.070 (1.79) 0.100 (2.54) 0.008 (0.20) 0.015 (0.38) 7 3 NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 22-Pin Plastic DIL (P6) A DIM. Z B E E1 * * Y PIN1 T M K H L K1 C J1 J P F A B C E E1 F H J J1 K K1 L M P T Y Z MIN. TYP. MAX. 1.10 (27.94) 1.080 (27.43) 0.330 (8.38) 0.360 (9.14) 0.146 (3.71) 0.200 (5.08) 0.388 (9.85) 0.490 (12.44) 0.390 (9.90) 0.420 (10.67) 1.0 (25.40) 0.020 (0.51) 0.045 (1.14) 0.015 (0.38) 0.022 (0.56) 0.040 (1.02) 0.065 (1.65) 0.066 (1.68) 0.076 (1.93) 0.060 (1.52) 0.076 (1.93) 0.114 (2.89) 0.162 (4.11) 0.047 (1.14) 0.100 (2.54) 0.006 (0.15) 0.015 (0.38) 20 4 NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 17 80-Lead QFP (S1) D A 41 61 * * B E 80 1 21 IDENT (PIN 1) M J C P DIM. MIN. A B C D E H J L M P T X 13.8 13.8 TYP. MAX. 14.2 14.2 1.70 17.4 17.4 0.20 0.38 1.00 17.0 17.0 0.05 0.26 0.60 0.825 0.65 0.10 0.20 0 10 NOTES : All dimensions in mm Angles in degrees * Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition T X A & B are reference data and do not include mold deflash or protrusions. H L 80-Lead TQFP (S2) D A 61 41 60 * * 40 B E 80 1 20 21 IDENT (PIN 1) M J C P TYP. MAX. DIM. MIN. A B C D E H J L M P T X 11.8 11.8 12.2 12.2 1.27 13.8 13.8 0.05 0.18 0.30 14.2 14.2 0.15 0.27 0.70 1.25 0.50 0.10 0.20 0 10 NOTES : All dimensions in mm Angles in degrees * Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition T X L A & B are reference data and do not include mold deflash or protrusions. H 18 Integrated Circuits Packaging for Despatch For ease and convenience CML products are packaged for despatch in industry standard bulk or individual packaging as described below. * Trays (17cm x 10.5cm) and cardboard boxes with conductive foam. * 50-pocket conductive trays for surface-mount microcircuits. * Anti-static coated tubes, of various sizes, with thumbplugs. * 13-inch reel Tape-and-Reel packaging which fully conforms to the EIC 286-3: 1991 specification. The conductive embossed tape provides a secure cavity sealed with a peel-back cover tape. 500/1,000 units/reel (see Tape and Reel, Section 6.6) - no partial reel counts are available. 19 Tape and Reel Specification ...... D5/DW/LG/LH/LS 10 pitches cumulative tolerance on tape = +/-0.2mm K0 t P2 P0 D E Top Cover Tape A0 F W B0 B1 P1 D1 centre lines of cavity Embossment User Direction of Feed Fig.1 S1/S2 10 pitches cumulative tolerance +/- 0.2mm t D P0 P2 E Top Cover Tape F B1 S D1 K0 Fig.1a P1 USER DIRECTION OF FEED 20 r d W Tape and Reel Specification ...... Fig.2 Tape Top and Bottom Orientation Direction of unreeling Start End Trailer (75 [min.] empty compartments) Components 40 (min.) 230mm (min.) empty compartments Leader Fig.3 Layout of Tape Minimum Bending Radius R Fig.4 Reel Dimensions Fig.5 21 Tape Width (W) mm Bending Radius (R) Min mm 16 24 32 30 30 50 Figure 6a. USER DIRECTION OF FEED Figure 6b USER DIRECTION OF FEED Figure 6c USER DIRECTION OF FEED Figure 6d. USER DIRECTION OF FEED Figure 6. Component Orientation 22 CML Microcircuit Soldering Profile for Surface Mount Products 300 wave soldering I.R. reflow belt reflow vapour phase reflow 250 O Temperature ( C) 200 150 100 50 0 0 20 40 60 80 Time (seconds) 23 100 120 140