September 2009
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
NC7WZ16
TinyLogic® UHS Dual Buffer
Features
Ultra-High Speed: tPD 2.4ns (Typical) into 50pF at
5V VCC
High Output Drive: ±24mA at 3V VCC
Broad VCC Operating Range: 1.65V to 5.5V
Matches Performance of LCX when Operated at
3.3V VCC
Power Down High-Impedance Inputs/Outputs
Over-Voltage Tolerance Inputs Facilitate 5V to 3V
Translation
Proprietary Noise/EMI Reduction Circuitry
Ultra-Small MicroPak™ Packages
Space-Saving SC70 Package
Description
The NC7WZ16 is a dual buffer from Fairchild’s Ultra-
High Speed Series of TinyLogic®. The device is
fabricated with advanced CMOS technology to achieve
ultra-high speed with high output drive while maintaining
low static power dissipation over a very broad VCC
operating range. The device is specified to operate over
the 1.65V to 5.5V VCC range. The inputs and outputs are
high impedance when VCC is 0V. Inputs tolerate
voltages up to 7V independent of VCC operating voltage.
Ordering Information
Part Number Top Mark Eco Status Package Packing Method
NC7WZ16P6X Z16 RoHS 6-Lead SC70, EIAJ SC-88a, 1.25mm Wide 3000 Units on
Tape & Reel
NC7WZ16L6X C7 RoHS 6-Lead MicroPak™, 1.00mm Wi de 5000 Units on
Tape & Reel
NC7WZ16FHX
(Preliminary) C7 Green
6-Lead, MicroPak2, 1x1mm Body, .35mm
Pitch 5000 Units on
Tape & Reel
For Fairchild’s defini t i on of Eco St atus, pleas e visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3 2
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
Connection Diagrams IEEC/IEC
Figure 1. Logic Symbol
Pin Configurations
Figure 2. SC70 (Top View) Figure 3. MicroPak (Top Through View)
Notes:
1. AAA represents Product Code Top Mark (see ordering code).
2. Orientation of Top Mark determines Pin One location. Read the top product code mark left to right.
Pin One is the lower left pin. Figure 4. Pin 1 Orientation
Pin Definitions
Pin # SC70 Pin # MicroPak Name Description
1 1 A1 Input
2 2 GND Ground
3 3 A2 Input
4 4 Y2 Output
5 5 VCC Supply Voltage
6 6 Y1 Output
Function Table
Y= A
Inputs Output
A Y
L L
H H
H = HIGH Logic Level
L = LOW Logic Level
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3 3
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
VCC Supply Voltage -0.5 7.0 V
VIN DC Input Voltage -0.5 7.0 V
VOUT DC Output Voltage -0.5 7.0 V
IIK DC Input Diode Current VIN < 0V -50 mA
IOK DC Output Diode Current VOUT < 0V -50 mA
IOUT DC Output Source / Sink Current ±50 mA
ICC or IGND DC VCC or Ground Current ±100 mA
TSTG Storage Temperature Range -65 +150 °C
TJ Junction Temperature Under Bias +150 °C
TL Junction Lead Temperature (Soldering, 10 Seconds) +260 °C
SC70-6 180
MicroPak-6 130
PD Power Dissipation MicroPak2-6 120
mW
Human Body Model, JEDEC:JESD22-A114 4000
ESD Charge Device Model, JEDEC:JESD22-C101 2000 V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol Parameter Conditions Min. Max. Unit
Supply Voltage Operating 1.65 5.50
VCC Supply Voltage Data Retention 1.50 5.50 V
VIN Input Voltage 0 5.5 V
VOUT Output Voltage 0 VCC V
VCC=1.8V, 2.5V ±0.2V 0 20
VCC=3.3V ±0.3V 0 10
tr,tf Input Rise and Fall Times VCC=5.5V ±0.5V 0 5 ns/V
TA Operating Temperature -40 +125 °C
SC70-6 425
MicroPak-6 500
θJA Thermal Resistance MicroPak2-6 560
°C/W
Note:
3. Unused inputs must be held HIGH or LOW. They may not float.
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3 4
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
DC Electrical Characteristics
TA=25°C TA=-40 to +85°C
Symbol Parameter VCC (V) Conditions
Min. Typ. Max. Min. Max.
Units
1.65 to 1.95 0.75VCC 0.75VCC
VIH HIGH Level Cont rol
Input Vol tage 2.3 to 5.5 0.70VCC 0.70 VCC V
1.65 to 1.95 0.25VCC 0.25VCC
VIL LOW Level Control
Input Vol tage 2.3 to 5.5 0.30VCC 0.30VCC V
1.65 1.55 1.65 1.55
1.80 1.70 1.80 1.70
2.30 2.20 2.30 2.20
3.00 2.90 3.00 2.90
4.50
IOH=-100µA
4.40 4.50 4.40
1.65 IOH=-4mA 1.29 1.52 1.21
2.30 IOH=-8mA 1.90 2.14 1.90
3.00 IOH=-16mA 2.40 2.75 2.40
3.00 IOH=-24mA 2.30 2.62 2.30
VOH HIGH Level Output
Voltage
4.50
VIN=VIH
IOH=-32mA 3.80 4.13 3.80
V
1.65 0.00 0.10 0.10
1.80 0.00 0.10 0.10
2.30 0.00 0.10 0.10
3.00 0.00 0.10 0.10
4.50
IOL=100µA
0.00 0.10 0.10
1.65 IOL=4mA 0.08 0.24 0.24
2.30 IOL=8mA 0.10 0.30 0.30
3.00 IOL=16mA 0.16 0.40 0.40
3.00 IOL=24mA 0.24 0.55 0.55
VOL LOW Level Output
Voltage
4.50
VIN=VIL
IOL=32mA 0.25 0.55 0.55
V
IIN Input Leakage
Current 0 to 5.5 0 VIN 5.5V ±0.1 ±1.0 µA
IOFF Power Off Leakage
Current 0 VIN or VOUT=5.5V 1.0 10 µA
ICC Quiescent Supply
Current 1.65 to 5.50 VIN=5.5V, GND 1. 0 10 µA
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3 5
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
AC Electrical Characteristics
TA=25°C TA=-40 to +85°C
Symbol Parameter VCC (V) Conditions
Min. Typ. Max. Min. Max.
Units Figure
1.65 1.8 5.5 9.6 1.8 10.6
1.80 1.8 4.6 8.0 1.8 8.8
2.50 ± 0.20 1.0 3. 0 5.2 1.0 5.8
3.30 ± 0.30 0.8 2. 3 3.6 0.8 4.0
5.00 ± 0.50
CL=15pF,
RL=1MΩ
0.5 1.8 2.9 0.5 3.2
Figure 5
Figure 6
3.30 ± 0.30 1.2 3. 0 4.6 1.2 5.1
tPLH, tPHL Propagation Delay
5.00 ± 0.50 CL=50pF,
RL=500Ω 0.8 2.4 3.8 0.8 4.2
ns
Figure 5
Figure 6
CIN Input Capacitance 0.00 2.5 pF
3.30 10
CPD Power Dissipati on
Capacitance(4) 5.00 12 pF Figure 7
Note:
4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating
current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic
operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic).
Note:
5. CL includes load and stray capacitance;
Input PRR=1.0MHz; tW=500ns
Figure 5. AC Test Circuit Figure 6. AC Waveforms
Note:
6. Input=AC Waveform; tr=tf=1.8ns; PRR=10 MHz Duty Cycle=50%.
Figure 7. ICCD Test Circuit
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3 6
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
Physical Dimensions
DETAIL A
SCALE: 60X
B
1.90
2.00±0.20
0.50 MIN
1.00
0.80
1.10
0.80
0.10 C
0.25
0.10
0.46
0.26
0.20
GAGE
PLANE (R0.10)
30°
SEATING
PLANE
C0.10
0.00
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO EIAJ
SC-88, 1996.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE BURRS
OR MOLD FLASH.
D) DRAWING FILENAME: MKT-MAA06AREV6
2.10±0.30
0.10 AB
0.65
1.30
(0.25) 0.30
0.15
1
1.25±0.10
3
1.30 0.40 MIN
SEE DETAIL A
LAND PATTERN RECOMMENDATION
6
A
4
C
0.65 L
SYMM
PIN ONE
Figure 8. 6-Lead, SC70, EIAJ SC-88a, 1.25mm Wide
Pack age drawings are provided as a service to customers consideri ng Fai rchild components . Drawings may c hange i n any manner
without notice. P l ease note the revi sion and/or date on t he drawing and contac t a Fairchild S emiconductor represent ative to v er ify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’ s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/products/analog/pdf/sc70-6_tr.pdf.
Package Designator Tape Section Cavity Number Cavity Status Cover Type Status
Leader (Start End) 125 (Typical) Empty Sealed
Carrier 3000 Filled Sealed
P6X Trailer (Hub End) 75 (Typical) Empty Sealed
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3 7
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
Physical Dimensions
2. DIMENSIONS ARE IN MILLIMETERS
1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD
MAC06AREVC
Notes:
3. DRAWING CONFORMS TO ASME Y14.5M-1994
TOP VIEW
RECOMMENED
LAND PATTERN
BOTTOM VIEW
1.45
1.00
A
B0.05 C
0.05 C
2X
2X
0.55MAX
0.05 C
(0.49)
(1)
(0.75)
(0.52)
(0.30)
6X
1X
6X
PIN 1
DETAIL A
0.075 X 45
CHAMFER
0.25
0.15
0.35
0.25
0.40
0.30
0.5
(0.05)
1.0
5X
DETAIL A
PIN 1 TERMINAL
0.40
0.30
0.45
0.35
0.10
0.00
0.10 CBA
0.05 C
C0.05 C
0.05
0.00
5X
5X
6X (0.13)
4X
6X
Figure 9. 6-Lead, MicroPak™, 1.0mm Wide
Pack age drawings are provided as a service to customers consideri ng Fai rchild components . Drawings may c hange i n any manner
without notice. P l ease note the revi sion and/or date on t he drawing and contac t a Fairchild S emiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’ s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package Designator Tape Section Cavity Number Cavity Status Cover Type Status
Leader (Start End) 125 (Typical) Empty Sealed
Carrier 5000 Filled Sealed
L6X Trailer (Hub End) 75 (Typical) Empty Sealed
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3 8
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
Physical Dimensions
5X
DETAIL A
Figure 10. 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch
Pack age drawings are provided as a service to customers consideri ng Fai rchild components . Drawings may c hange i n any manner
without notice. P l ease note the revi sion and/or date on t he drawing and contac t a Fairchild S emiconductor represent ative to v er ify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’ s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf.
Package Designator Tape Section Cavity Number Cavity Status Cover Type Status
Leader (Start End) 125 (Typical) Empty Sealed
Carrier 5000 Filled Sealed
FHX Trailer (Hub End) 75 (Typical) Empty Sealed
© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.3 9
NC7WZ16 — TinyLogic
®
UHS Dual Buffer