To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. 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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. "Standard": 8. 9. 10. 11. 12. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT PB1510GV 3.0 GHz INPUT DIVIDE BY 4 PRESCALER IC FOR DBS TUNERS DESCRIPTION The PB1510GV is a 3.0 GHz input divide by 4 prescaler IC for DBS tuner applications. This IC is suitable for use of frequency divider for PLL synthesizer block. This IC is a shrink package version of the PB585G so that this small package contributes to reduce the mounting space. This IC is manufactured using our 20 GHz fT NESAT IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES * High operating frequency : fin = 0.5 to 3.0 GHz * High-density surface mounting : 8-pin plastic SSOP (4.45 mm (175) ) * Low current consumption : ICC = 14 mA TYP. @ VCC = 5 V * Fixed division :/4 APPLICATIONS * Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler * DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer ORDERING INFORMATION Part Number PB1510GV-E1 Package 8-pin plastic SSOP (4.45 mm (175) ) Marking 1510 Supplying Form * Embossed tape 8 mm wide * Pin 1 indicates pull-out direction of tape * Qty 1 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PB1510GV Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PU10311EJ01V0DS (1st edition) (Previous No. P12752EJ2V0DS00) Date Published January 2003 CP(K) Printed in Japan The mark * shows major revised points. NEC Compound Semiconductor Devices 1997, 2003 PB1510GV PIN CONNECTIONS (Top View) 1 8 2 7 3 6 4 5 Pin No. Pin Name 1 VCC 2 IN 3 IN 4 GND 5 GND 6 NC 7 OUT 8 NC INTERNAL BLOCK DIAGRAM IN D CLK IN CLK D Q Q CLK Q OUT Q Amp. SYSTEM APPLICATION EXAMPLE RF unit block of DBS tuners 1st IF Input (from DBS Converter) MIX. BPF Baseband Output SAW AGC Amp. FM Demod. PB1510GV OSC /4 Prescaler LPF 2 Data Sheet PU10311EJ01V0DS PLL Synthesizer for VHF/UHF Band PB1510GV PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage (V) 1 VCC 4.5 to 5.5 - Function and Application Supply voltage pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. 2 IN - 1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor (example: 1 000 pF) for DC cut. 3 IN - 1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. 4, 5 GND 0 - Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 6, 8 NC - - Non connection pins. These pins should be opened. 7 OUT - 1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can be connected to input of prescaler within PLL synthesizer through DC cut capacitor. Data Sheet PU10311EJ01V0DS 3 PB1510GV ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit 6.0 V 250 mW Supply Voltage VCC TA = +25C Power Dissipation PD TA = +85C Operating Ambient Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +150 C Note Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA -40 +25 +85 C ELECTRICAL CHARACTERISTICS (TA = -40 to +85C, VCC = 4.5 to 5.5 V, ZS = ZL = 50 ) Parameter Circuit Current Symbol ICC Test Conditions MIN. TYP. MAX. Unit No Signals 10.5 14 17 mA Upper Limit Operating Frequency 1 fin (U)1 Pin = -10 to +6 dBm 3.0 - - GHz Upper Limit Operating Frequency 2 fin (U)2 Pin = -15 to +6 dBm 2.7 - - GHz Lower Limit Operating Frequency fin (L) Pin = -15 to +6 dBm - - 0.5 GHz Input Power 1 Pin1 fin = 2.7 to 3.0 GHz -10 - +6 dBm Input Power 2 Pin2 fin = 0.5 to 2.7 GHz -15 - +6 dBm Output Power Pout Pin = 0 dBm, fin = 2.0 GHz -12 -7 - dBm 4 Data Sheet PU10311EJ01V0DS PB1510GV TYPICAL CHARACTERISTICS (TA = +25C, VCC = 5 V, unless otherwise specified) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 20 Circuit Current ICC (mA) No signal 15 10 TA = +85C +25C -40C 5 1 0 2 3 4 5 6 7 Supply Voltage VCC (V) INPUT POWER vs. INPUT FREQUENCY 20 20 10 10 0 Input Power Pin (dBm) Input Power Pin (dBm) INPUT POWER vs. INPUT FREQUENCY Guaranteed operating range -10 -20 -30 VCC = 4.5 to 5.5 V -40 0 +25C +85C -10 +85C Guaranteed operating range -20 -30 +25C -40C -40 VCC = 5.0 V -50 0.1 0.3 0.5 TA = +25C -50 0.1 0.3 0.5 1 3 5 10 1 3 5 10 Input Frequency fin (GHz) Input Frequency fin (GHz) OUTPUT POWER vs. INPUT FREQUENCY OUTPUT POWER vs. INPUT FREQUENCY 0 VCC = 5.0 V Pin = 0 dBm ZL = 50 Output Power Pout (dBm) 0 Output Power Pout (dBm) TA = -40C TA = +85C -5 +25C -40C -10 -15 0.1 0.3 0.5 1 3 5 10 TA = +25C Pin = 0 dBm ZL = 50 VCC = 5.5 V -5 5.0 V 4.5 V -10 -15 0.1 Input Frequency fin (GHz) 0.3 0.5 1 3 5 10 Input Frequency fin (GHz) Data Sheet PU10311EJ01V0DS 5 PB1510GV OUTPUT POWER vs. INPUT FREQUENCY 0 TA = -40C Pin = 0 dBm ZL = 50 Output Power Pout (dBm) Output Power Pout (dBm) 0 VCC = 5.5 V 5.0 V 4.5 V -5 -10 -15 0.1 OUTPUT POWER vs. INPUT FREQUENCY 0.3 0.5 1 3 5 10 TA = +85C Pin = 0 dBm ZL = 50 VCC = 5.5 V 5.0 V 4.5 V -5 -10 -15 0.1 Input Frequency fin (GHz) 0.3 0.5 1 3 5 Input Frequency fin (GHz) Remark The graphs indicate nominal characteristics. S11 vs. INPUT FREQUENCY VCC = 5.0 V, TA = +25C, ZO = 50 S11 Z REF 1.0 Units 4 200.0 mUnits/ 27.159 -27.582 hp MARKER 4 3 GHz 1 : 500 MHz 2 : 1 000 MHz 3 : 2 000 MHz 4 : 3 000 MHz 4 1 3 2 START 0.500000000 GHz STOP 3.000000000 GHz 6 Data Sheet PU10311EJ01V0DS Frequency (MHz) S11 () 500 37.1-j207.8 1 000 14.2-j105.1 2 000 7.9-j35.8 3 000 27.1-j27.5 10 PB1510GV S22 vs. OUTPUT FREQUENCY VCC = 5.0 V, fin = 500 MHz, TA = +25C, ZO = 50 S22 Z REF 1.0 Units 4 200.0 mUnits/ 60.925 104.77 hp MARKER 4 750 MHz 4 3 1 : 125 MHz 2 : 250 MHz 3 : 500 MHz 4 : 750 MHz 2 1 Frequency (MHz) S22 () 125 55.5+j6.7 250 53.7+j30.4 500 55.0+j60.3 750 60.9+j104.8 Frequency (MHz) S22 () 125 28.5+j11.5 250 27.6+j23.6 500 20.5+j50.7 750 15.6+j98.2 START 0.125000000 GHz STOP 0.750000000 GHz VCC = 5.0 V, fin = 3.0 GHz, TA = +25C, ZO = 50 S22 Z REF 1.0 Units 4 200.0 mUnits/ 15.613 98.168 hp 4 MARKER 4 750 MHz 3 2 1 1 : 125 MHz 2 : 250 MHz 3 : 500 MHz 4 : 750 MHz START 0.125000000 GHz STOP 0.750000000 GHz Data Sheet PU10311EJ01V0DS 7 PB1510GV TEST CIRCUIT Supply Voltage 50.5 V 1 000 pF 1 000 pF Signal Generator 50 1 8 2 7 C1 1 000 pF 1 000 pF Counter HP5350B (Spectrum Analyzer) 50 C4 C2 HP8665A 1 000 pF OPEN 3 6 4 5 OPEN C3 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 8 Data Sheet PU10311EJ01V0DS PB1510GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 1P VCC IN C4 C3 ,,,,,,, ,,,,,,,,,, ,, , , , C2 IN OUT C1 OUT PB1506/08/09GV COMPONENT LIST Notes (1) 35 m thick double-sided copper-clad 50 x 50 x 0.4 mm polyimide board. Value C1 to C4 1 000 pF (2) Back side : GND pattern (3) Solder plated on pattern : Through holes (5) of pin 3 : Pattern should be removed. (6) of pin 5 : Short chip must be attached to be grounded. ,,,,,, (4) Data Sheet PU10311EJ01V0DS 9 PB1510GV PACKAGE DIMENSIONS 8-PIN PLASTIC SSOP (4.45 mm (175) ) (UNIT: mm) 5 8 detail of lead end 3+7 -3 4 1 2.90.1 4.940.2 1.8 MAX. 3.20.1 1.50.1 0.870.2 0.575 MAX. 0.65 +0.10 -0.05 0.3 0.50.2 0.10 M 0.15 +0.10 -0.05 0.10.1 10 Data Sheet PU10311EJ01V0DS 0.15 PB1510GV NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 215C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 120C or below : 1 time : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10311EJ01V0DS 11 PB1510GV * The information in this document is current as of January, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 12 Data Sheet PU10311EJ01V0DS PB1510GV Business issue NEC Compound Semiconductor Devices, Ltd. 5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: salesinfo@csd-nec.com NEC Compound Semiconductor Devices Hong Kong Limited FAX: +852-3107-7309 Hong Kong Head Office TEL: +852-3107-7303 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 FAX: +82-2-528-0302 Korea Branch Office TEL: +82-2-528-0301 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-01 FAX: +49-211-6503-487 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Technical issue NEC Compound Semiconductor Devices, Ltd. http://www.csd-nec.com/ Sales Engineering Group, Sales Division E-mail: techinfo@csd-nec.com FAX: +81-44-435-1918 0209