2002-2012 Microchip Technology Inc. DS21368C-page 1
TC1223/TC1224
Features
Extremel y Low Ground Current for Lon ger Battery
Life
Very Low Dropout Voltage
Choice of 50mA and 100mA Output (TC1223,
TC1224, Respectively)
High Output Voltage Accuracy
Standard or Custom Output Voltages
Pow er Saving Shutdown Mode
Over Current and Over Temperature Protection
Space-Saving 5-Pin SOT-23A Package
Pin Compatible Upgrades for Bipolar Regulators
Applications
Bat tery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
Device Selection Table
NOTE: xx indicates output voltages
Available Output Voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.6,
4.0, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
General Description
The TC1223 and TC1224 are high accuracy (typic ally
±0.5%) CMOS upgra des fo r older (bipola r) low dro pout
regulators such as the LP2980. Designed specifically
for battery-operated systems, the devices’ CMOS
construction eliminates wasted ground current,
signific antly extending battery life. Total supply current
is ty pi ca l ly 50A at full load (20 to 60 times lower than
in bipolar regulators).
The devices’ key features include ultra low noise
operation; very low dropout voltage (typically 85mV,
TC1223 and 180mV, TC1224 at full load) and fast
response to step changes in load. Supply current is
reduced to 0.5A (max) and VOUT falls to zero when
the shut down input is low . The devices incorporate both
over temperature and over current protection.
The TC1223 and TC1224 are stable with an output
capacitor of only 1F and have a maximum output
current of 50mA and 100mA respectively. For higher
output current versions, please see the TC1107,
TC1108 and TC1173 (IOUT = 300mA) data sheets.
Typical Applicat ion
Part Number Package Junction
Temp. Range
TC1223-xxVCT 5-Pin SOT-23A -40°C to +125°C
TC1224-xxVCT 5-Pin SOT-23A -40°C to +125°C
5-Pin SOT-23A
SHDN
5
TC1223
TC1224
13
4
2
VIN
VOUT
GND
NC
NOTE: 5-Pin SOT- 23A is equivalent to the EIAJ (SC-74A)
TC1223
TC1224
VOUT
SHDN
GND
NC
1μF
+
VIN VIN VOUT
15
2
4
3
Shutdown Control
(from Power Control Logic)
50mA and 100mA CMOS LDOs with Shutdown
TC1223/TC1224
DS21368C-page 2 2002-2012 Microchip Technology Inc.
1.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage......... ...... ..... ...... .(-0.3V) to (VIN + 0.3V)
Power Dissipation..............................Internally Limited
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range......-40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and funct ional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1223/TC1 224 EL E CTRICAL SPECIFICATIO NS
Electrical Characteristics: VIN = V OUT + 1V, IL = 100A, CL = 3.3F, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol Parameter Min Typ Max Units Test Conditions
VIN Input Operating Voltage 2.7 6.0 VNote 8
IOUTMAX Maximum Output Current 50
100
mA TC1223
TC1224
VOUT Output Voltage VR – 2.5% V
R ±0.5% VR + 2.5% VNote 1
TCVOUT VOUT Temperature Coef ficient
20
40
ppm/°C Note 2
VOUT/VIN Line Regulation 0.05 0.35 %(V
R + 1V) VIN6V
VOUT/VOUT Load Regulation 0.5 2%I
L = 0.1m A to IOUTMAX
(Note 3)
VIN-VOUT Dropout Voltage
TC1224
2
65
85
180
120
250
mV IL = 100A
IL = 20mA
IL = 50mA
IL = 100mA (Note 4)
IIN Supply Current 50 80 A SHDN = VIH, IL = 0 (Note 7)
IINSD Shutdown Supply Current 0.05 0.5 A SHDN = 0V
PSRR Power Supply Rejection Ratio 64 dB FRE 1kHz
IOUTSC Output Short Circuit Current 300 450 mA VOUT = 0V
VOUT/PDThermal Regulation 0.04 V/W Notes 5, 6
TSD The rmal Shutdown Die Temperature 160 °C
TSD Thermal Shutdown Hysteresis 10 °C
eN Output Noise 260 nV/Hz IL = IOUTMAX
SHDN Input
VIH SHDN Input High Threshold 45 ——%V
IN VIN = 2.5V to 6.5V
VIL SHDN Input Low Threshold 15 %VIN VIN = 2.5V to 6.5V
Note 1: VR is the regulator output voltage setting. For example: VR = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
2:
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Ther mal C ons id er atio ns for more details.
7: Apply for Junction Temperatures of -40°C to +85°C.
8: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x T
2002-2012 Microchip Technology Inc. DS21368C-page 3
TC1223/TC1224
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No .
(5-Pin SOT-23A) Symbol Description
1V
IN Unregulated supply input.
2 GND Ground terminal.
3 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.5A (m ax).
4 NC No connect.
5V
OUT Regulated voltage output.
TC1223/TC1224
DS21368C-page 4 2002-2012 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
The TC1223 and TC1224 are precision fixed output
voltage regulators. Unlike bipolar regulators, the
TC1223 and TC1224’s supply current does not
increase with load current. In addition, VOUT remains
stable and within regulation over the entire 0mA to
IOUTMAX operating load current range, (an important
consid eration in RTC and CM OS R AM batt ery back-u p
applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be
controll ed by a CMOS log ic gate, or I/O port of a mic ro-
controller. If the SHDN input is not required, it should be
connected directly to the input supply. While in
shut down, supp ly current dec reases to 0. 05A (typical)
and VOUT falls to zero volts .
FIGURE 3-1: TYPICAL APPLICATION
CIRCUIT
3.1 Output Capacitor
A 1F (min) capacitor from VOUT to ground is
recommended. The output capacitor should have an
effective series resistance greater than 0.1 and less
than 5.0, and a resonant frequency above 1MHz. A
1F capacitor should be connected from VIN to GND if
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approxi-
mately -30°C, solid tantalums are recommended for
applications operating below -25°C.) When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.
TC1223
TC1224
V
OUT
SHDN
GND
NC
1μF
+
V
IN
V
OUT
Shutdown Control
(to CMOS Logic or Tie
to V
IN
if unused)
1μF
+
Battery
+
2002-2012 Microchip Technology Inc. DS21368C-page 5
TC1223/TC1224
4.0 THERMAL CONSIDERATIONS
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approx imate ly 150°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUAT I ON 4- 1:
The maximum allowable power dissipation (Equation
4-2) is a functi on of the maximum ambient tem perature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(JA). The 5-Pin SOT-23A package has a JA of
approximately 220°C/Watt.
EQUAT I ON 4- 2:
Equation 4-1 can be us ed in con jun cti on with Equa tion
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
VINMAX = 3.0V ±10%
VOUTMIN = 2. 7V – 2.5%
ILOADMAX = 40mA
TJMAX = 125°C
TAMAX = 55°C
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD (VINMAX – V OUTMIN)ILOADMAX
= [(3.0 x 1. 1) – (2 .7 x .975)]40 x 10–3
= 26.7mW
Maxi mu m all ow ab le pow e r diss ip a tion:
In this exam ple, the TC1223 dissipates a maximum of
26.7mW; below the allowable limit of 318mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
volt a ge lim its.
4.3 Layout Considerations
The prima ry path o f heat conduction out of the p ackage
is via the package leads. Therefore, layouts having a
ground pla ne, wide tra ces at th e pad s, and wid e power
supply bus lines combine to lower JA and therefore
increase the maximum allowable power dissipation
limit.
Where:
PD (VINMAX – VOUTMIN)ILOADMAX
PD
VINMAX
VOUTMIN
ILOADMAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltag e on VIN
PDMAX = (TJMAXTAMAX)
JA
Where all terms are previously defined.
PDMAX = (TJMAX – TAMAX)
JA
= (125 – 55)
220
= 318mW
TC1223/TC1224
DS21368C-page 6 2002-2012 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational p urposes only . The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presen ted may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0.000
0.002
0.004
0.006
0.008
0.010
0.012
0.014
0.016
0.018
0.020
-40 -20 0 20 50 70 125
DROPOUT VOLTAGE (V)
ILOAD = 10mA
CIN
= 1μF
COUT
= 1μF
TEMPERATURE (°C)
Dropout Voltage vs. Temperature
(V
OUT
= 3.3V)
0.000
0.020
0.040
0.060
0.080
0.100
0.120
0.140
0.160
0.180
0.200
-40 -20 0 20 50 70 125
DROPOUT VOLTAGE (V)
I
LOAD
= 100mA
C
IN
= 1μF
C
OUT
= 1μF
TEMPERATURE (°C)
Dropout Voltage vs. Temperature (V
OUT
= 3.3V)
0
10
20
30
40
50
60
70
80
90
GND CURRENT (
μ
A)
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
ILOAD = 100mA
CIN = 1μF
COUT = 1μF
Ground Current vs. VIN (VOUT = 3.3V)
VIN (V)
0.000
0.010
0.020
0.030
0.040
0.050
0.060
0.070
0.080
0.090
0.100
-40 -20 0 20 50 70 125
DROPOUT VOLTAGE (V)
I
LOAD
= 50mA
C
IN
= 1μF
C
OUT
= 1μF
TEMPERATURE (°C)
Dropout Voltage vs. Temperature (V
OUT
= 3.3V)
0
10
20
30
40
50
60
70
80
90
GND CURRENT (
μ
A)
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
ILOAD = 10mA
CIN
= 1μF
COUT
= 1μF
Ground Current vs. VIN
(V
OUT
= 3.3V)
VIN
(V)
2002-2012 Microchip Technology Inc. DS21368C-page 7
TC1223/TC1224
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
I
LOAD
= 100mA
C
IN
= 1μF
C
OUT
= 1μF
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
V
IN
(V)
V
OUT
(V)
V
OUT
vs.
V
IN
(V
OUT
= 3.3V)
4.985
4.990
4.995
5.000
5.005
5.010
5.015
5.020
5.025
-40 -20 -10 0 20 40 85 125
I
LOAD
= 10mA
V
IN
= 6V
C
IN
= 1μF
C
OUT
= 1μF
TEMPERATURE (°C)
Output Voltage vs. Temperature (V
OUT
= 5V)
V
OUT
(V)
3.275
3.280
3.285
3.290
3.295
3.300
3.305
3.310
3.315
3.320
-40 -20 -10 0 20 40 85 125
I
LOAD
= 10mA
C
IN
= 1μF
C
OUT
= 1μF
V
IN
= 4.3V
TEMPERATURE (°C)
V
OUT
(V)
Output Voltage vs. Temperature (V
OUT
= 3.3V)
0
10
20
30
40
50
60
70
-40 -20 -10 0 20 40 85 125
GND CURRENT (
μ
A)
ILOAD = 10mA
VIN = 6V
CIN = 1μF
COUT = 1μF
TEMPERATURE (°C)
Temperature
vs. Quiescent Current
(VOUT = 5V)
10.0
1.0
0.1
0.0
0.01K 0.1K 1K 10K 100K 1000K
FREQUENCY (Hz)
Output Noise vs. Frequency
NOISE (μV/Hz)
R
LOAD
= 50Ω
C
OUT
= 1μF
C
IN
= 1μF
1000
100
10
1
0.1
0.01
010 20 30 40 50 60 70 80 90 100
LOAD CURRENT (mA)
Stability Region vs. Load Current
C
OUT
ESR
(Ω)
C
OUT
= 1μF
to 10μF
Stable Region
S
table Re
g
io
n
-30
-35
-40
-45
-50
-60
-55
-65
-70
-75
-80
0.01K 0.1K 1K 10K 100K 1000
K
FREQUENCY (Hz)
Power Supply Rejection Ratio
PSRR (dB)
I
OUT
=
10mA
V
INDC
=
4V
V
INAC
=
100mVp-p
V
OUT
=
3V
C
IN
=
0
C
OUT
=
1μF
TC1223/TC1224
DS21368C-page 8 2002-2012 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
V
OUT
V
SHDN
Measure Rise Time of 3.3V LDO
Conditions: C
IN
= 1μF, C
OUT
= 1μF, I
LOAD
= 100mA, V
IN
= 4.3V,
Temp = 25
°
C, Fall Time = 184μS
V
SHDN
Measure Rise Time of 5.0V LDO
Conditions: C
IN
= 1μF, C
OUT
= 1μF, I
LOAD
= 100mA, V
IN
= 6V,
Temp = 25°C, Fall Time = 192μS
V
OUT
Thermal Shutdown Response of 5.0V LDO
Conditions: V
IN
= 6V, C
IN
= 0μF, C
OUT
= 1μF
I
LOAD
was increased until temperature of die reached about 160°C, at
which time integrated thermal protection circuitry shuts the regulator
off when die temperature exceeds approximately 160°C. The regulator
remains off until die temperature drops to approximately 150°C.
V
OUT
Measure Fall Time of 3.3V LDO
Conditions: C
IN
= 1μF, C
OUT
= 1μF, I
LOAD
= 100mA, V
IN
= 4.3V,
Temp = 25°C, Fall Time = 52μS
V
OUT
V
SHDN
Measure Fall Time of 5.0V LDO
Conditions: C
IN
= 1μF, C
OUT
= 1μF, I
LOAD
= 100mA, V
IN
= 6V,
Temp = 25°C, Fall Time = 88μS
V
OUT
V
SHDN
2002-2012 Microchip Technology Inc. DS21368C-page 9
TC1223/TC1224
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
“1” & “2” = part number code + temperature range and
voltage
“3” represents year and quarter code
“4” represents lot ID number
6.2 Taping Form
(V) TC1223
Code TC1224
Code
2.5 L1 M1
2.7 L2 M2
2.8 LZ MZ
2.85 L8 M8
3.0 L3 M3
3.3 L5 M5
3.6 L9 M9
4.0 L0 M0
5.0 L7 M7
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
5-Pin SOT-23A 8 mm 4 mm 3000 7 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)
W
P
TC1223/TC1224
DS21368C-page 10 2002-2012 Microchip Technology Inc.
6.3 Package Dimensions
.071 (1.80)
.059 (1.50)
.122 (3.10)
.098 (2.50)
.075 (1.90)
REF.
.020 (0.50)
.012 (0.30)
PIN 1
.037 (0.95)
REF.
.122 (3.10)
.106 (2.70)
.057 (1.45)
.035 (0.90)
.006 (0.15)
.000 (0.00)
.024 (0.60)
.004 (0.10)
10° MAX. .010 (0.25)
.004 (0.09)
SOT-23A-5
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21368C-page 11
TC1223/TC1224
7.0 REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
TC1223/TC1224
DS21368C-page 12 2002-2012 Microchip Technology Inc.
NOTES:
2002-2012 Microchip Technology Inc. DS21368C-page11
TC1223/TC1224
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www. micr ochip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1223/TC1224
DS21368C-page12 2002-2012 Microchip Technology Inc.
NOTES:
2002-2012 Microchip Technology Inc. DS21368C-page 13
Information contained in this publication regarding device
applications and the like is provided only for your con ve nience
and may be superseded by u pdates. It is y our respo ns ibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTA RT, PI C32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip T echnology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor ,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSens e , HI-TIDE, In-Circuit Serial
Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PI CC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767382
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in t heir particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in t he
intended manner and under normal conditions.
There are dishonest and possibly illegal m et hods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contai ned in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21368C-page 14 2002-2012 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasc a , IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los A n ge les
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Ma drid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921- 5869
Fax: 44-118-921-5820
Worldwide Sales and Service
10/26/12