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FEATURES
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1IN+
1IN−
FEEDBACK
DTC
CT
RT
GND
C1
2IN+
2IN−
REF
OUTPUT CTRL
VCC
C2
E2
E1
D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
DESCRIPTION
TL494PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E – JANUARY 1983 – REVISED FEBRUARY 2005
•Complete PWM Power-Control Circuitry•Uncommitted Outputs for 200-mA Sink orSource Current•Output Control Selects Single-Ended orPush-Pull Operation•Internal Circuitry Prohibits Double Pulse atEither Output•Variable Dead Time Provides Control OverTotal Range•Internal Regulator Provides a Stable 5-VReference Supply With 5% Tolerance•Circuit Architecture Allows EasySynchronization
The TL494 incorporates all the functions required in the construction of a pulse-width-modulation (PWM) controlcircuit on a single chip. Designed primarily for power-supply control, this device offers the flexibility to tailor thepower-supply control circuitry to a specific application.
The TL494 contains two error amplifiers, an on-chip adjustable oscillator, a dead-time control (DTC) comparator,a pulse-steering control flip-flop, a 5-V, 5%-precision regulator, and output-control circuits.
The error amplifiers exhibit a common-mode voltage range from –0.3 V to V
CC
– 2 V. The dead-time controlcomparator has a fixed offset that provides approximately 5% dead time. The on-chip oscillator can be bypassedby terminating RT to the reference output and providing a sawtooth input to CT, or it can drive the commoncircuits in synchronous multiple-rail power supplies.
The uncommitted output transistors provide either common-emitter or emitter-follower output capability. TheTL494 provides for push-pull or single-ended output operation, which can be selected through the output-controlfunction. The architecture of this device prohibits the possibility of either output being pulsed twice duringpush-pull operation.
The TL494C is characterized for operation from 0 °C to 70 °C. The TL494I is characterized for operation from–40 °C to 85 °C.
AVAILABLE OPTIONS
PACKAGED DEVICES
(1)
SHRINK SMALL THIN SHRINKT
A
SMALL OUTLINE PLASTIC DIP SMALL OUTLINE
OUTLINE SMALL OUTLINE(D) (N) (NS)
(DB) (PW)
0°C to 70 °C TL494CD TL494CN TL494CNS TL494CDB TL494CPW–40 °C to 85 °C TL494ID TL494IN — — —
(1) The D, DB, NS, and PW packages are available taped and reeled. Add the suffix R to device type (e.g., TL494CDR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1983–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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GND
VCC
Reference
Regulator
C1
Pulse-Steering
Flip-Flop
C1
1D
DTC
CT
RT
PWM
Comparator
+
−
Error Amplifier 1
≈ 0.1 V Dead-Time Control
Comparator
Oscillator
OUTPUT CTRL
(see Function Table)
0.7 mA
E1
C2
E2
+
−
Error Amplifier 2
1IN+
1IN−
2IN+
2IN−
FEEDBACK
REF
6
5
4
1
2
16
15
3
13
8
9
11
10
12
14
7
Q1
Q2
≈ 0.7 V
TL494
PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E – JANUARY 1983 – REVISED FEBRUARY 2005
FUNCTION TABLE
INPUT TO
OUTPUT FUNCTIONOUTPUT CTRL
V
I
= GND Single-ended or parallel outputV
I
= V
ref
Normal push-pull operation
FUNCTIONAL BLOCK DIAGRAM
2
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
TL494PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E – JANUARY 1983 – REVISED FEBRUARY 2005
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage
(2)
41 VV
I
Amplifier input voltage V
CC
+ 0.3 VV
O
Collector output voltage 41 VI
O
Collector output current 250 mAD package 73DB package 82θ
JA
Package thermal impedance
(3) (4)
N package 67 °C/WNS package 64PW package 108Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to the network ground terminal.(3) Maximum power disipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperatire is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN MAX UNIT
V
CC
Supply voltage 7 40 VV
I
Amplifier input voltage –0.3 V
CC
– 2 VV
O
Collector output voltage 40 VCollector output current (each transistor) 200 mACurrent into feedback terminal 0.3 mAf
OSC
Oscillator frequency 1 300 kHzC
T
Timing capacitor 0.47 10000 nFR
T
Timing resistor 1.8 500 k ΩTL494C 0 70T
A
Operating free-air temperature °CTL494I –40 85
3
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N
n1(xnX)2
N1
Electrical Characteristics
Reference Section
Oscillator Section
Error-Amplifier Section
TL494
PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E – JANUARY 1983 – REVISED FEBRUARY 2005
over recommended operating free-air temperature range, V
CC
= 15 V, f = 10 kHz (unless otherwise noted)
TL494C, TL494IPARAMETER TEST CONDITIONS
(1)
UNITMIN TYP
(2)
MAX
Output voltage (REF) I
O
= 1 mA 4.75 5 5.25 VInput regulation V
CC
= 7 V to 40 V 2 25 mVOutput regulation I
O
= 1 mA to 10 mA 1 15 mVOutput voltage change with temperature ∆T
A
= MIN to MAX 2 10 mV/VShort-circuit output current
(3)
REF = 0 V 25 mA
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.(2) All typical values, except for parameter changes with temperature, are at T
A
= 25 °C.(3) Duration of short circuit should not exceed one second.
C
T
= 0.01 µF, R
T
= 12 k Ω(see Figure 1 )
TL494C, TL494IPARAMETER TEST CONDITIONS
(1)
UNITMIN TYP
(2)
MAX
Frequency 10 kHzStandard deviation of frequency
(3)
All values of V
CC
, C
T
, R
T
, and T
A
constant 100 Hz/kHzFrequency change with voltage V
CC
= 7 V to 40 V, T
A
= 25 °C 1 Hz/kHzFrequency change with temperature
(4)
∆T
A
= MIN to MAX 10 Hz/kHz
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.(2) All typical values, except for parameter changes with temperature, are at T
A
= 25 °C.(3) Standard deviation is a measure of the statistical distribution about the mean as derived from the formula:
(4) Temperature coefficient of timing capacitor and timing resistor are not taken into account.
See Figure 2
TL494C, TL494IPARAMETER TEST CONDITIONS UNITMIN TYP
(1)
MAX
Input offset voltage V
O
(FEEDBACK) = 2.5 V 2 10 mVInput offset current V
O
(FEEDBACK) = 2.5 V 25 250 nAInput bias current V
O
(FEEDBACK) = 2.5 V 0.2 1 µA–0.3 toCommon-mode input voltage range V
CC
= 7 V to 40 V VV
CC
– 2Open-loop voltage amplification ∆V
O
= 3 V, V
O
= 0.5 V to 3.5 V, R
L
= 2 k Ω70 95 dBUnity-gain bandwidth V
O
= 0.5 V to 3.5 V, R
L
= 2 k Ω800 kHzCommon-mode rejection ratio ∆V
O
= 40 V, T
A
= 25 °C 65 80 dBOutput sink current (FEEDBACK) V
ID
= –15 mV to –5 V, V (FEEDBACK) = 0.7 V 0.3 0.7 mAOutput source current (FEEDBACK) V
ID
= 15 mV to 5 V, V (FEEDBACK) = 3.5 V –2 mA
(1) All typical values, except for parameter changes with temperature, are at T
A
= 25 °C.
4
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Electrical Characteristics
Output Section
Dead-Time Control Section
PWM Comparator Section
Total Device
Switching Characteristics
TL494PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E – JANUARY 1983 – REVISED FEBRUARY 2005
over recommended operating free-air temperature range, V
CC
= 15 V, f = 10 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Collector off-state current V
CE
= 40 V, V
CC
= 40 V 2 100 µAEmitter off-state current V
CC
= V
C
= 40 V, V
E
= 0 –100 µACommon emitter V
E
= 0, I
C
= 200 mA 1.1 1.3Collector-emitter saturation voltage VEmitter follower V
O(C1 or C2)
= 15 V, I
E
= –200 mA 1.5 2.5Output control input current V
I
= V
ref
3.5 mA
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
See Figure 1
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Input bias current (DEAD-TIME CTRL) V
I
= 0 to 5.25 V –2 –10 µAV
I
(DEAD-TIME CTRL) = 0, C
T
= 0.01 µF,Maximum duty cycle, each output 45 %R
T
= 12 k ΩZero duty cycle 3 3.3Input threshold voltage (DEAD-TIME CTRL) VMaximum duty cycle 0
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
See Figure 1
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Input threshold voltage (FEEDBACK) Zero duty cyle 4 4.5 VInput sink current (FEEDBACK) V (FEEDBACK) = 0.7 V 0.3 0.7 mA
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
V
CC
= 15 V 6 10R
T
= V
ref
,Standby supply current mAAll other inputs and outputs open
V
CC
= 40 V 9 15Average supply current V
I
(DEAD-TIME CTRL) = 2 V, See Figure 1 7.5 mA
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
T
A
= 25 °C
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Rise time 100 200 nsCommon-emitter configuration, See Figure 3Fall time 25 100 nsRise time 100 200 nsEmitter-follower configuration, See Figure 4Fall time 40 100 ns
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
5
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PARAMETER MEASUREMENT INFORMATION
Test
Inputs DTC
FEEDBACK
RT
CT
GND
50 kΩ
12 kΩ
0.01 µF
VCC
REF
OUTPUT
CTRL
E2
C2
E1
C1 Output 1
Output 2
150 Ω
2 W 150 Ω
2 W
VCC = 15 V
TEST CIRCUIT
1IN+
VCC
VCC
0 V
0 V
Voltage
at C1
Voltage
at C2
Voltage
at CT
DTC
FEEDBACK
0 V
0.7 V
0% MAX 0%
Threshold Voltage
Threshold Voltage
VOLTAGE WA VEFORMS
Duty Cycle
Error
Amplifiers
7
14
12
8
9
11
10
4
3
6
5
1
2
16
15
13
1IN−
2IN−
2IN+
TL494
PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E – JANUARY 1983 – REVISED FEBRUARY 2005
Figure 1. Operational Test Circuit and Waveforms
6
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PARAMETER MEASUREMENT INFORMATION
+
−
+
−
VI
Vref
FEEDBACK
Amplifier Under Test
Other Amplifier
Output
Each Output
Circuit
68 Ω
2 W
15 V
CL = 15 pF
(See Note A)
90%
10%
90%
10%
tftr
TEST CIRCUIT OUTPUT VOLTAGE WAVEFORM
NOTE A: CL includes probe and jig capacitance.
TL494PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E – JANUARY 1983 – REVISED FEBRUARY 2005
Figure 2. Amplifier Characteristics
Figure 3. Common-Emitter Configuration
Figure 4. Emitter-Follower Configuration
7
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TYPICAL CHARACTERISTICS
Df = 1%
†
40
10
100
1 k 4 k 10 k 40 k 100 k 400 k 1 M
f − Oscillator Frequency and Frequency Variation − Hz
OSCILLATOR FREQUENCY AND
FREQUENCY VARIATION†
vs
TIMING RESISTANCE
400
1 k
4 k
10 k
40 k
100 k
RT − T iming Resistance − Ω
0.1 µF
−2% −1%
0% 0.01 µF
0.001 µF
VCC = 15 V
TA = 25°C
CT = 1 µF
†Frequency variation (∆f) is the change in oscillator frequency that occurs over the full temperature range.
10
0
100
20
110 100 1 M
A − Amplifier Voltage Amplification − dB
30
f − Frequency − Hz
AMPLIFIER VOLTAGE AMPLIFICATION
vs
FREQUENCY
1 k
VCC = 15 V
∆VO = 3 V
TA = 25°C
10 k
40
50
60
70
80
90
100 k
TL494
PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E – JANUARY 1983 – REVISED FEBRUARY 2005
Figure 5.
Figure 6.
8
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TL494CD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDRG3 PREVIEW SOIC D 16 2500 TBD Call TI Call TI
TL494CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CJ OBSOLETE CDIP J 16 TBD Call TI Call TI
TL494CN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
TL494CNE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
TL494CNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI
TL494CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494ID ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 9-Apr-2010
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TL494IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
TL494INE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
TL494MJ OBSOLETE CDIP J 16 TBD Call TI Call TI
TL494MJB OBSOLETE CDIP J 16 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Apr-2010
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TL494CDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
TL494CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TL494CNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
TL494CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TL494IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Feb-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL494CDBR SSOP DB 16 2000 346.0 346.0 33.0
TL494CDR SOIC D 16 2500 346.0 346.0 33.0
TL494CNSR SO NS 16 2000 346.0 346.0 33.0
TL494CPWR TSSOP PW 16 2000 346.0 346.0 29.0
TL494IDR SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Feb-2011
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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