0.8mm F-S1494(H=3.0mm) Gi -h + > ea - SMT BY) AMP hike AS 0.8mm F-S Connector(H=3.0mm) (Board to Board SMT TYPE) Handling and Operation Instruction Sheet 411-5654 Released Rev. FJO0-1035-98 B 1. AAT PAROS 1. Ll oRZFRSRABITI, BOTA COR, 11. Fayh-D7PU-S Se, RMeELIAER WIS RLET, AAIFABMEELIALL, Aveo HIRE at ROR AICRVET, flERLCOmRI Ss Oe RS HET CPS, 1.2 VES FS r7 RON YYTAINORA WRVEF, 2. BR ~OMOMTER 2. 2RAGIORAPEA FAY REBECA RL. SRM EK ICO SE BS ERORBADRY LET, RX. GAR SU yo eR REL CBRE BOSAPAH MOELLER aD CeOBa Ic, Poe Mca rs Aa DICEBLT FAY, (FILA ORF 350 +5C, 3EDEIA) LATER SY BBO ZEISS EAA BRO RE CTRL ACRE, (D 1-2. ANDLING OF CONNECTOR BODY Tools such as a serew driver or probing pin etc. should not be inserted in to the contact area of connector. INSERTION OF THE FOREIGN MATTERS INTO CONNECTORS WILL CAUSE SERIOUS PLATE-PEELING AND/OR TERMINAL DEFORMATION. Only one (1) connector should be used per one (1) PCB. li MAY CAUSE CRACKING OF SOLDER JOINTS AND BREAKAGE OF HOUSING. MOUNTING OPERATION ONTO PCB Adjust of mounting device automatic placement machine accordingly, so as to get the connectors held horizontally with the surface of PCB care should be taken such that the soldering tines are not deformed during this operation. This connector is designed for flow soldering. However, when the use of soldering iron is required for rework, care must be taken not to let the tip end of the iron touch on the tines of connector as this will deform the tines. The solder iron tip should touch on the PCB solder pads only. (Manual soldering conditions:350c4 5C. 3 Seconds Maximum) DEFORMATION OF SOLDERING TINES IS411-5654 OFTEN THE CAUSE OF BAD SOLDER JOINTS AND SUBSEQUENTLY,AFFECTS THE PERFORMANCE OF CONNECTORS. 21 EyF HACER TSE, SRYFORIRMY 2-1. The soldering tine deformed in the pitch AS RHCASRIAE A ER eb shh, direction will fail to be aligned with the FERRE MTIB CRRCIMET, corresponding PCB solder pad This condition is not good for soldering Ye-F SIIB Receptacle: Tab (TYP) RE RH Gireuit plane of PC board er FA Pitch direction fa A PETTY & ef YEE / i ; Soldering tine BAGO & | No deformation 2.2 RIFE RNCBIET SL, ARIFEE 2-2. Deformation of the soldering tine in the ROP CERABeLOZUAlL direction of connector height lead to no MEDMTARRORBROVIET, adhesion of pasie solder between the PCB solder pad and solder tines, and also cause the Manhattan phenomenon at reflow soldering. U4z-4 PHB Receptacle: Tab (TYP) FBI AP Solder cream BAZ OEY = Mo deformation ta A Petter & PL BE Solderring tine 278 El Solder pad of PC board ar ! [Ee ELAR a PG board RSS (2) Rev.B411-5654 3. RREMESE 3. MATING OPERATION IRTP REERB IL, VEY VV LET yy The mating operation should be carried PREG DE, Ham7tAV SEAS ~ out without excessive misalignment tilt. LEREEOERELT FSU, It is advisable to align the housings lightly before exerting the full mating force. fREIL10 LIAICL TC FAY TILT MUST BE WITHIN 10 DEGREES Zee ETT RT! Parallel mount type to PC board AATHOR, LEAS, Hold the top of connector. FRLIAFRKEG TS, Push strongly and mate it. { . RX, ARYF EA OIOIRTECKS LIKE TC. LE In the mating process, NEVER move the YFARICP OAR IOI BRU RLET, connector in the longitudinal direction. AVF ORE RUMY VY7 OMMCLOER MOVING THE CONNECTORS IN HRT MAICRVET, LONGITUDINAL DIRECTION DURING A HALF-MATED CONDITION, WILL OFTEN CAUSE DEFECTIVE EFFECTS TO THE FUNCTION OF THE CONNECTOR. (3) Rev.B_RER (TEL) ORR ROBIE RMICAR (ALY) Pout AVL BRORLET, SICA Pol Bbn OI, HRD DSC LSRRORRTRE WRLET, RR, FABRE RY SIDR ET SRI, RPA ASA orev FSC EL Ze CF by Ra BOI OLIATE ZF 7 ANT ROET. BREATH! a7) (Af yF SOBEL LDS) 411-5654 4, TREATMENT OF MATED CONNECTORS (IN PROCESS) No load (Kojiri) should be apphed to PC board after completion of the connector mating. Support the PC board using supplementary parts, when it is considered some load may be applied to the PC board . Fixing holes should be properly aligned before the PC board is fixed to the chassis. KOJIRI (LOAD) EXERTED AFTER THE CONNECTOR MATING WILL CAUSE SOLDER CRACK. Parallel] mount type to PC board. Kojiri PC board may sometimes be depressed by a switch etc.) at Fy Gonn aft Z ZL feeb lc KOSBRORE - Support of PC board with supplementary parts (4) Rev.BIATTRE ROBES ACMA, BENARIFIL-BLGOLIC GA ORRE BELTS, fi, BREE ORM, ROTI Le tab, RB SOR MAMORU LITE Be ELE, XM, SRE CARB RLIE OR, BeACE 411-5654 When mounting mated PCBs onto a case / chassis ,fix the PCBs in a condition such that the Mated . PCBs are integrated with minimal relative movement. Reasonable care should be taken to elimmate undue twisting and distorting stress resuiting from mounting and securing printed circuit board . Use of proper adhesive may be recommendable to secure the PCB as an alternative, when the above mentioned method is not possible. BISES8 CBRAT7T) Fixing position (Fixing hole) SES CALLE IX) Fixing position Fixing hole) 4HEZKEVERLET. le ah Fixing position wee oe 5 Beas Pixing position 3RA4 Conn. l | % im Case t L | (5) Rev.B5. Bie fF RAEOBROREMIL, SSIF IIE Ae FEC OUSLIICLT (10 A) ale WYO REV, Fi, HLA ETT LIA FFIIOGRACRIET. IO DEORE CRILSRVCFAM, HET 411-5654 5. REMOVAL OPERATION For the withdrawal of the PC board which ~ has already mated, it is best to hold the PCB at a portion adjacent te the connector and extract in a straight manner. In the event that the extraction force is high, if may be easier to unmate the PCB by tilting it in one direction and then the other while extracting. However, this tilt must not be more than 10 . DO NOT GIVE A FORCED STRESS TO IT WITH THE ANGLES EXCEEDING 10 DEGREES. Parallel mount type to PC board (6) Rev.B