1
FEATURES
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
VS+
C1−
C2+
C2−
VS−
T2OUT
R2IN
VCC
GND
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
D, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
APPLICATIONS
DESCRIPTION/ORDERING INFORMATION
TRS232
www.ti.com
............................................................................................................................................ SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008
DUAL RS-232 DRIVER/RECEIVERWITH IEC61000-4-2 PROTECTION
2
•Meets or Exceeds TIA/RS-232-F and ITURecommendation V.28•Operates From a Single 5-V Power SupplyWith 1.0- µF Charge-Pump Capacitors•Operates up to 120 kbit/s•Two Drivers and Two Receivers•± 30-V Input Levels•Low Supply Current . . . 8 mA Typical•ESD Protection Exceeds JESD22– 2000-V Human-Body Model (HBM) (A114-A)•Upgrade With Improved ESD (15-kV HBM) and0.1- µF Charge-Pump Capacitors Is AvailableWith the TRS202
•TIA/RS-232-F
•Battery-Powered Systems•Terminals
•Modems
•Computers
The TRS232 is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/RS-232-F voltagelevels from a single 5-V supply. Each receiver converts TIA/RS-232-F inputs to 5-V TTL/CMOS levels. Thisreceiver has a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ± 30-V inputs. Each driverconverts TTL/CMOS input levels into TIA/RS-232-F levels. The driver, receiver, and voltage-generator functionsare available as cells in the Texas Instruments LinASIC™ library.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2LinASIC is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
TRS232
SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008 ............................................................................................................................................
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PDIP – N Tube of 25 TRS232CN TRS232CNTube of 40 TRS232CDSOIC – D TRS232CReel of 2500 TRS232CDRTube of 40 TRS232CDW0 ° C to 70 ° C SOIC – DW TRS232CReel of 2000 TRS232CDWRSOP – NS Reel of 2000 TRS232CNSR TRS232CTube of 25 TRS232CPWTSSOP – PW TRS232CReel of 2000 TRS232CPWRPDIP – N Tube of 25 TRS232IN TRS232INTube of 40 TRS232IDSOIC – D TRS232IReel of 2500 TRS232IDRTube of 40 TRS232IDW– 40 ° C to 85 ° C SOIC – DW TRS232IReel of 2000 TRS232IDWRSOP – NS Reel of 2000 TRS232INSR TRS232ITube of 25 TRS232IPWTSSOP – PW TRS232IReel of 2000 TRS232IPWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .
2Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TRS232
T1IN T1OUT
R1INR1OUT
T2IN T2OUT
R2INR2OUT
11
10
12
9
14
7
13
8
TRS232
www.ti.com
............................................................................................................................................ SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008
FUNCTION TABLES
ABC
Each Driver
(1)
INPUT OUTPUTTnIN TnOUT
L HH L
(1) H = high level, L = low level
Each Receiver
(1)
INPUT OUTPUTRnIN RnOUT
L HH L
(1) H = high level, L = low level
LOGIC DIAGRAM (POSITIVE LOGIC)
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TRS232
Absolute Maximum Ratings
(1)
Recommended Operating Conditions
Electrical Characteristics
(1)
TRS232
SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008 ............................................................................................................................................
www.ti.com
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Input supply voltage range
(2)
– 0.3 6 VV
S+
Positive-output supply voltage range V
CC
– 0.3 15 VV
S –
Negative-output supply voltage range – 0.3 – 15 VDriver – 0.3 V
CC
+ 0.3V
I
Input voltage range VReceiver ± 30T1OUT, T2OUT V
S –
– 0.3 V
S+
+ 0.3V
O
Output voltage range VR1OUT, R2OUT – 0.3 V
CC
+ 0.3Short-circuit duration T1OUT, T2OUT UnlimitedD package 73DW package 57θ
JA
Package thermal impedance
(3) (4)
N package 67 ° C/WNS package 64PW package 108T
J
Operating virtual junction temperature 150 ° CT
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to network GND.(3) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 ° C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN NOM MAX UNIT
V
CC
Supply voltage 4.5 5 5.5 VV
IH
High-level input voltage T1IN, T2IN 2 VV
IL
Low-level input voltage T1IN, T2IN 0.8 VReceiver input voltage R1IN, R2IN ± 30 VTRS232C 0 70T
A
Operating free-air temperature ° CTRS232I – 40 85
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
I
CC
Supply current V
CC
= 5.5 V, All outputs open, T
A
= 25 ° C 8 10 mA
(1) Test conditions are C1 – C4 = 1 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 5 V and T
A
= 25 ° C.
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Product Folder Link(s): TRS232
DRIVER SECTION
Switching Characteristics
(1)
TRS232
www.ti.com
............................................................................................................................................ SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008
abc
Electrical Characteristics
(1)
over recommended ranges of supply voltage and operating free-air temperature range
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
OH
High-level output voltage T1OUT, T2OUT R
L
= 3 k Ωto GND 5 7 VV
OL
Low-level output voltage
(3)
T1OUT, T2OUT R
L
= 3 k Ωto GND – 7 – 5 Vr
o
Output resistance T1OUT, T2OUT V
S+
= V
S –
= 0, V
O
= ± 2 V 300 Ω
I
OS
(4)
Short-circuit output current T1OUT, T2OUT V
CC
= 5.5 V, V
O
= 0 ± 10 mAI
IS
Short-circuit input current T1IN, T2IN V
I
= 0 200 µA
(1) Test conditions are C1 – C4 = 1 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 5 V and T
A
= 25 ° C.(3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logicvoltage levels only.(4) Not more than one output should be shorted at a time.
V
CC
= 5 V, T
A
= 25 ° C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SR Driver slew rate R
L
= 3 k Ωto 7 k Ω, See Figure 2 30 V/ µsSR(t) Driver transition region slew rate See Figure 3 3 V/ µsData rate One TnOUT switching 120 kbit/s
(1) Test conditions are C1 – C4 = 1 µF at V
CC
= 5 V ± 0.5 V.
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TRS232
RECEIVER SECTION
Switching Characteristics
(1)
TRS232
SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008 ............................................................................................................................................
www.ti.com
abc
Electrical Characteristics
(1)
over recommended ranges of supply voltage and operating free-air temperature range
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
OH
High-level output voltage R1OUT, R2OUT I
OH
= – 1 mA 3.5 VV
OL
Low-level output voltage
(3)
R1OUT, R2OUT I
OL
= 3.2 mA 0.4 VV
IT+
Receiver positive-going input threshold voltage R1IN, R2IN V
CC
= 5 V, T
A
= 25 ° C 1.7 2.4 VV
IT –
Receiver negative-going input threshold voltage R1IN, R2IN V
CC
= 5 V, T
A
= 25 ° C 0.8 1.2 VV
hys
Input hysteresis voltage R1IN, R2IN V
CC
= 5 V 0.2 0.5 1 Vr
i
Receiver input resistance R1IN, R2IN V
CC
= 5 V, T
A
= 25 ° C 3 5 7 k Ω
(1) Test conditions are C1 – C4 = 1 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 5 V and T
A
= 25 ° C.(3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logicvoltage levels only.
V
CC
= 5 V, T
A
= 25 ° C (see Figure 1 )
PARAMETER TYP UNIT
t
PLH(R)
Receiver propagation delay time, low- to high-level output 500 nst
PHL(R)
Receiver propagation delay time, high- to low-level output 500 ns
(1) Test conditions are C1 – C4 = 1 µF at V
CC
= 5 V ± 0.5 V.
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Product Folder Link(s): TRS232
PARAMETER MEASUREMENT INFORMATION
≤10 ns
VCC
R1IN or
R2IN
R1OUT or
R2OUT
RL = 1.3 kΩ
See Note C
CL = 50 pF
(see Note B)
TEST CIRCUIT
≤10 ns
Input
Output
tPHL tPLH
1.5 V VOL
VOH
0 V
3 V
10% 90%
50%
500 ns
WAVEFORMS
1.5 V
90%
50% 10%
Pulse
Generator
(see Note A)
TRS232
www.ti.com
............................................................................................................................................ SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008
A. The pulse generator has the following characteristics: Z
O
= 50 Ω, duty cycle ≤50%.B. C
L
includes probe and jig capacitance.C. All diodes are 1N3064 or equivalent.
Figure 1. Receiver Test Circuit and Waveforms for t
PHL
and t
PLH
Measurements
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TRS232
CL = 10 pF
(see Note B)
TEST CIRCUIT
≤10 ns≤10 ns
Input
Output
tPHL tPLH
VOL
VOH
0 V
3 V
10%
90%
50%
5 µs
WAVEFORMS
90%
50% 10%
RL
90%
10%
90%
10%
tTLH
tTHL
SR +0.8 (VOH – VOL)
tTLH or 0.8 (VOL – VOH)
tTHL
Pulse
Generator
(see Note A) RS-232 Output
T1IN or T2IN T1OUT or T2OUT
RS-232 Output
−3 V 3 V
−3 V
3 V
3 kΩ
10%
1.5 V
90%
WAVEFORMS
20 µs
1.5 V
90%
10%
VOH
VOL
tTLH
tTHL
≤10 ns ≤10 ns
TEST CIRCUIT
CL = 2.5 nF
Pulse
Generator
(see Note A)
Input
Output
SR +6 V
tTHL or tTLH
T1IN or T2IN T1OUT or T2OUT
TRS232
SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008 ............................................................................................................................................
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
A. The pulse generator has the following characteristics: Z
O
= 50 Ω, duty cycle ≤50%.B. C
L
includes probe and jig capacitance.
Figure 2. Driver Test Circuit and Waveforms for t
PHL
and t
PLH
Measurements (5- µs Input)
A. The pulse generator has the following characteristics: Z
O
= 50 Ω, duty cycle ≤50%.
Figure 3. Test Circuit and Waveforms for t
THL
and t
TLH
Measurements (20- µs Input)
8Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TRS232
APPLICATION INFORMATION
1 µF
1 µFVS+
VS−
2
6
14
7
13
8
C1+
C1−
C2+
C2−
1
3
4
5
11
10
12
9
GND
15
0 V
VCC
16
5 V
RS-232 Output
RS-232 Output
RS-232 Input
RS-232 Input
1 µF
8.5 V
−8.5 V
1 µF
From CMOS or TTL
To CMOS or TTL
CBYPASS = 1 µF
C1
C2
C3†
C4
†C3 can be connected to VCC or GND.
+
+
−
TRS232
www.ti.com
............................................................................................................................................ SLLS861A – AUGUST 2007 – REVISED SEPTEMBER 2008
A. Resistor values shown are nominal.B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they shouldbe connected as shown. In addition to the 1- µF capacitors shown, the TRS202 can operate with 0.1- µF capacitors.
Figure 4. Typical Operating Circuit
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TRS232
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TRS232D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232DG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232DRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232DWR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232ID ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232IDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232IDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232IDW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232IDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232IN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
TRS232INE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
TRS232N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
TRS232NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
TRS232NS ACTIVE SO NS 16 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232NSG4 ACTIVE SO NS 16 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TRS232NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 22-Sep-2008
Addendum-Page 1
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 22-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TRS232DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TRS232DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
TRS232IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TRS232IDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
TRS232NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TRS232DR SOIC D 16 2500 367.0 367.0 38.0
TRS232DWR SOIC DW 16 2000 367.0 367.0 38.0
TRS232IDR SOIC D 16 2500 333.2 345.9 28.6
TRS232IDWR SOIC DW 16 2000 367.0 367.0 38.0
TRS232NSR SO NS 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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