Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 LM7321x Single and LM7322x Dual Rail-to-Rail Input and Output 15-V, High-Output Current and Unlimited Capacitive Load Operational Amplifier 1 Features 3 Description * The LM732xx devices are rail-to-rail input and output amplifiers with wide operating voltages and highoutput currents. The LM732xx family is efficient, achieving 18-V/s slew rate and 20-MHz unity gain bandwidth while requiring only 1 mA of supply current per op amp. The LM732xx device performance is fully specified for operation at 2.7 V, 5 V and 15 V. 1 * * * * * * * * * * * * * (VS = 15, TA = 25C, Typical Values Unless Specified.) Wide Supply Voltage Range 2.5 V to 32 V Output Current +65 mA/-100 mA Gain Bandwidth Product 20 MHz Slew Rate 18 V/s Capacitive Load Tolerance Unlimited Input Common-Mode Voltage 0.3-V Beyond Rails Input Voltage Noise 15 nV/Hz Input Current Noise 1.3 pA/Hz Supply Current/Channel 1.1 mA Distortion THD+Noise -86 dB Temperature Range -40C to 125C Tested at -40C, 25C and 125C at 2.7 V, 5 V, 15 V. LM732xx are Automotive Grade Products that are AEC-Q100 Grade 1 Qualified. 2 Applications * * * * * * * * * * Driving MOSFETs and Power Transistors Capacitive Proximity Sensors Driving Analog Optocouplers High-Side Sensing Below Ground Current Sensing Photodiode Biasing Driving Varactor Diodes in PLLs Wide Voltage Range Power supplies Automotive International Power Supplies The LM732xx devices are designed to drive unlimited capacitive loads without oscillations. All LM7321x and LM7322x parts are tested at -40C, 125C, and 25C, with modern automatic test equipment. High performance from -40C to 125C, detailed specifications, and extensive testing makes them suitable for industrial, automotive, and communications applications. Greater than rail-to-rail input common-mode voltage range with 50 dB of common-mode rejection across this wide voltage range, allows both high-side and low-side sensing. Most device parameters are insensitive to power supply voltage, and this makes the parts easier to use where supply voltage may vary, such as automotive electrical systems and battery powered equipment. These amplifiers have true rail-to-rail output and can supply a respectable amount of current (15 mA) with minimal head- room from either rail (300 mV) at low distortion (0.05% THD+Noise). Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM7321 LM7322 SOIC (8) 4.90 mm x 3.91 mm SOT (5) 2.90 mm x 1.60 mm LM7322 VSSOP (8) 3.00 mm x 3.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Output Swing vs. Sourcing Current Large Signal Step Response 10 12,200 pF VS = 15V 25V/DIV + VOUT from V (V) 8,600 pF 1 125C VS = 15V, AV = +1 85C 0.1 2,200 pF 10 pF 25C -40C INPUT 0.01 0.1 1 10 100 5 Ps/DIV ISOURCE (mA) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description continued ........................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 8 1 1 1 2 3 3 4 Absolute Maximum Ratings ..................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 4 2.7-V Electrical Characteristics ............................... 5 5-V Electrical Characteristics ................................. 7 15-V Electrical Characteristics ............................... 8 Typical Characteristics ............................................ 10 Detailed Description ............................................ 20 8.1 Overview ................................................................. 20 8.2 Functional Block Diagram ....................................... 20 8.3 Feature Description................................................. 20 8.4 Device Functional Modes........................................ 23 9 Application and Implementation ........................ 25 9.1 Application Information............................................ 25 9.2 Typical Application ................................................. 25 10 Power Supply Recommendations ..................... 27 11 Layout................................................................... 27 11.1 Layout Guidelines ................................................. 27 11.2 Layout Example .................................................... 27 12 Device and Documentation Support ................. 28 12.1 12.2 12.3 12.4 12.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 28 28 28 28 28 13 Mechanical, Packaging, and Orderable Information ........................................................... 28 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (March 2013) to Revision E * Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Changes from Revision C (May 2008) to Revision D * 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 25 Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 5 Description continued There are several package options for each part. Standard SOIC versions of both parts make upgrading existing designs easy. LM7322x are offered in a space-saving 8-Pin VSSOP package. The LM7321x are offered in small SOT-23 package, which makes it easy to place this part close to sensors for better circuit performance. 6 Pin Configuration and Functions DBV Package 5-Pin SOT-23 Top View OUT - V D Package 8-Pin SOIC Top View 5 1 + V N/C -IN 2 + +IN +IN 3 4 1 8 2 + 3 7 6 N/C V + OUT -IN V - 4 5 N/C DGK Package 8-Pin VSSOP or SOIC Top View +IN A V - 8 A 3 7 + 2 B + -IN A 1 6 - OUT A 4 5 + V OUT B -IN B +IN B Pin Functions PIN NAME SOT-23 NO. SOIC NO. VSSOP, SOIC NO. I/O DESCRIPTION OUT 1 6 -- O Output OUT A -- -- 1 O Output for Amplifier A OUT B -- -- 7 O Output for Amplifier B V+ 5 7 7 P Positive Supply V- 2 4 4 P Negative Supply +IN 3 3 -- I Noninverting Input -IN 4 2 -- I Inverting Input +IN A -- -- 3 I Noninverting Input for Amplifier A -IN A -- -- 2 I Inverting Input for Amplifier A +IN B -- -- 5 I Noninverting Input for Amplifier B -IN B -- -- 6 I Inverting Input for Amplifier B N/C -- 1, 5, 8 -- -- No connection Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 3 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN VIN Differential Output Short Circuit Current See Junction Temperature Soldering Information: V+ + 0.8 (2) (3) (4) V 35 V V- - 0.8 V (4) 150 C Infrared or Convection (20 sec.) 235 C Wave Soldering (10 sec.) 260 C 150 C -65 Storage Temperature (1) UNIT 10 (3) Supply Voltage (VS = V+ - V-) Voltage at Input/Output pins MAX Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Short circuit test is a momentary test. Output short circuit duration is infinite for VS 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5 ms. The maximum power dissipation is a function of TJ(MAX), RJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)) - TA)/ RJA. All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings VALUE V(ESD) Electrostatic discharge (1) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (2) 2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (3) 1000 Machine Model (1) (2) (3) UNIT V 200 Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Supply Voltage (VS = V+ - V-) Temperature Range (1) (1) MIN MAX 2.5 32 UNIT V -40 125 C The maximum power dissipation is a function of TJ(MAX), RJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)) - TA)/ RJA. All numbers apply for packages soldered directly onto a PCB. 7.4 Thermal Information LM7321 THERMAL METRIC (1) RJA (2) (1) (2) 4 Junction-to-ambient thermal resistance D (SOIC) DBV (SOT) DGK (VSSOP) 8 PINS 5 PINS 8 PINS 165 325 235 UNIT C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. The maximum power dissipation is a function of TJ(MAX), RJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)) - TA)/ RJA. All numbers apply for packages soldered directly onto a PCB. Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com 7.5 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 2.7-V Electrical Characteristics Unless otherwise specified, all limits ensured for TA = 25C, V+ = 2.7 V, V- = 0 V, VCM = 0.5 V, VOUT = 1.35 V, and RL > 1 M to 1.35 V. (1) PARAMETER TEST CONDITION VOS Input Offset Voltage VCM = 0.5 V and VCM = 2.2 V TC VOS Input Offset Voltage Temperature Drift VCM = 0.5 V and VCM = 2.2 V (4) VCM = 0.5 V (5) IB Input Bias Current VCM = 2.2 V IOS Input Offset Current VCM = 0.5 V and VCM = 2.2 V Common-Mode Rejection Ratio 0 V VCM 2.7 V PSRR Power Supply Rejection Ratio 2.7 V VS 30 V Common-Mode Voltage Range (Min) CMRR > 50 dB Common-Mode Voltage Range (Max) CMRR > 50 dB CMVR 0.5 V VO 2.2 V RL = 10 k to 1.35 V AVOL Open-Loop Voltage Gain 0.5 V VO 2.2 V RL = 2 k to 1.35V Output Voltage Swing High RL = 10 k to 1.35 V VID = 100 mV (1) (2) (3) (4) (5) (6) Output Current -5 0.7 +5 -6 -2 TA = -40C to +125C Sinking VID = -200 mV, VOUT = 2.7 V (6) 104 3 V 2.7 65 72 62 59 dB 66 55 50 TA = -40C to +125C 150 160 100 20 250 280 mV from 120 either rail 150 40 TA = -40C to +125C 120 150 30 48 20 40 TA = -40C to +125C -0.1 0 2.8 TA = -40C to +125C dB 74 -0.3 TA = -40C to +125C dB 70 TA = -40C to +125C TA = -40C to +125C nA 50 78 TA = -40C to +125C A 100 60 55 TA = -40C to +125C 200 300 70 TA = -40C to +125C 1 1.5 20 TA = -40C to +125C mV V/C -2.5 TA = -40C to +125C TA = -40C to +125C UNIT -1.2 TA = -40C to +125C RL = 10 k to 1.35 V VID = -100 mV RL = 2 k to 1.35 V VID = -100 mV +6 0.45 TA = -40C to +125C Sourcing VID = 200 mV, VOUT = 0 V (6) IOUT MAX (2) 2 RL = 2 k to 1.35 V VID = 100 mV VOUT Output Voltage Swing Low TYP (3) (5) 0 V VCM 1 V CMRR TA = -40C to +125C MIN (2) 65 mA 30 Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. All limits are ensured by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Offset voltage temperature drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Positive current corresponds to current flowing into the device. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Short circuit test is a momentary test. Output short circuit duration is infinite for VS 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5 ms. Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 5 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com 2.7-V Electrical Characteristics (continued) Unless otherwise specified, all limits ensured for TA = 25C, V+ = 2.7 V, V- = 0 V, VCM = 0.5 V, VOUT = 1.35 V, and RL > 1 M to 1.35 V.(1) PARAMETER LM7321 IS TYP (3) MAX (2) 0.95 1.3 TA = -40C to +125C Supply Current 1.9 2 LM7322 (7) MIN (2) TEST CONDITION TA = -40C to +125C 2.5 UNIT mA 3.8 SR Slew Rate AV = +1, VI = 2-V Step 8.5 V/s fu Unity Gain Frequency RL = 2 k, CL = 20 pF 7.5 MHz GBW Gain Bandwidth f = 50 kHz 16 MHz en Input Referred Voltage Noise Density f = 2 kHz 11.9 nV/H in Input Referred Current Noise Density f = 2 kHz 0.5 pA/H THD+N Total Harmonic Distortion + Noise V+ = 1.9 V, V- = -0.8 V f = 1 kHz, RL = 100 k, AV = +2 VOUT = 210 mVPP -77 dB CT Rej. Crosstalk Rejection f = 100 kHz, Driver RL = 10 k 60 dB (7) 6 Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower. Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com 7.6 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 5-V Electrical Characteristics Unless otherwise specified, all limited ensured for TA = 25C, V+ = 5 V, V- = -5V, VCM = 0 V, VOUT = 0 V, and RL > 1 M to 0 V. (1) PARAMETER TEST CONDITION VOS Input Offset Voltage VCM = -4.5 V and VCM = 4.5 V TC VOS Input Offset Voltage Temperature Drift VCM = -4.5 V and VCM = 4.5 V (4) TA = -40C to +125C VCM = -4.5 V (5) IB Input Bias Current MIN (2) TYP (3) MAX (2) -5 0.7 +5 -6 2 -2.0 TA = -40C to +125C +6 -1.2 0.45 TA = -40C to +125C IOS Input Offset Current VCM = -4.5 V and VCM = 4.5 V -5 V VCM 3 V CMRR Common Mode Rejection Ratio -5 V VCM 5 V PSRR Power Supply Rejection Ratio 2.7 V VS 30 V, VCM = -4.5 V Common-Mode Voltage Range (Min) CMRR > 50 dB Common-Mode Voltage Range (Max) CMRR > 50 dB CMVR AVOL Open-Loop Voltage Gain Output Voltage Swing High -4 V VO 4 V RL = 10 k to 0 V -4 V VO 4 V RL = 2 k to 0 V RL = 10 k to 0 V VID = 100 mV IOUT (1) (2) (3) (4) (5) (6) Output Current Sourcing VID = 200 mV, VOUT = -5 V (6) Sinking VID = -200 mV, VOUT = 5 V (6) 5.3 80 70 65 TA = -40C to +125C 250 280 160 350 450 35 200 250 80 TA = -40C to +125C mV from either rail 200 250 35 70 20 50 TA = -40C to +125C dB 74 100 TA = -40C to +125C V 5 68 TA = -40C to +125C -5.1 -5 74 RL = 10 k to 0 V VID = -100 mV dB 74 5.1 TA = -40C to +125C RL = 2 k to 0 V VID = -100 mV 104 -5.3 TA = -40C to +125C dB 80 TA = -40C to +125C TA = -40C to +125C nA 62 78 TA = -40C to +125C A 100 70 65 TA = -40C to +125C 200 300 80 RL = 2 k to 0 V VID = 100 mV VOUT Output Voltage Swing Low 20 TA = -40C to +125C 1 1.5 TA = -40C to +125C TA = -40C to +125C mV V/C -2.5 VCM = 4.5 V (5) UNIT 85 mA 30 Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. All limits are ensured by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Offset voltage temperature drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Positive current corresponds to current flowing into the device. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Short circuit test is a momentary test. Output short circuit duration is infinite for VS 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5 ms. Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 7 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com 5-V Electrical Characteristics (continued) Unless otherwise specified, all limited ensured for TA = 25C, V+ = 5 V, V- = -5V, VCM = 0 V, VOUT = 0 V, and RL > 1 M to 0 V.(1) PARAMETER LM7321 IS Supply Current VCM = -4.5 V TYP (3) MAX (2) 1.0 1.3 TA = -40C to +125C UNIT 2 2.3 LM7322 (7) MIN (2) TEST CONDITION TA = -40C to +125C 2.8 mA 3.8 SR Slew Rate AV = +1, VI = 8-V Step 12.3 V/s fu Unity Gain Frequency RL = 2 k, CL = 20 pF 9 MHz GBW Gain Bandwidth f = 50 kHz 16 MHz en Input Referred Voltage Noise Density f = 2 kHz in Input Referred Current Noise Density f = 2 kHz THD+N Total Harmonic Distortion + Noise CT Rej. Crosstalk Rejection (7) 14.3 nV/H 1.35 pA/H f = 1 kHz, RL = 100 k, AV = +2 VOUT = 8 VPP -79 dB f = 100 kHz, Driver RL = 10 k 60 dB Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower. 7.7 15-V Electrical Characteristics Unless otherwise specified, all limited ensured for TA = 25C, V+ = 15 V, V- = -15 V, VCM = 0 V, VOUT = 0 V, and RL > 1 M to 15 V. (1) PARAMETER TEST CONDITION VOS Input Offset Voltage VCM = -14.5 V and VCM = 14.5 V TC VOS Input Offset Voltage Temperature Drift VCM = -14.5 V and VCM = 14.5 V (4) VCM = -14.5 V (5) IB Input Bias Current VCM = 14.5 V (5) IOS Input Offset Current VCM = -14.5 V and VCM = 14.5 V -15 V VCM 12 V CMRR Common-Mode Rejection Ratio -15 V VCM 15 V PSRR (1) (2) (3) (4) (5) 8 Power Supply Rejection Ratio -40C to +125C MIN (2) TYP (3) MAX (2) -6 0.7 +6 -8 2 -2 -40C to +125C +8 mV V/C -1.1 -2.5 0.45 1 30 300 -40C to +125C A 1.5 -40C to +125C 500 80 -40C to +125C UNIT 100 75 72 -40C to +125C 70 2.7 V VS 30 V, VCM = -14.5 V -40C to +125C 78 74 nA 80 100 dB dB Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. All limits are ensured by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Offset voltage temperature drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Positive current corresponds to current flowing into the device. Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 15-V Electrical Characteristics (continued) Unless otherwise specified, all limited ensured for TA = 25C, V+ = 15 V, V- = -15 V, VCM = 0 V, VOUT = 0 V, and RL > 1 M to 15 V.(1) PARAMETER Common-Mode Voltage Range (Min) TEST CONDITION CMRR > 50 dB CMVR Common-Mode Voltage Range (Max) CMRR > 50 dB -13 V VO 13 V RL = 10 k to 0 V AVOL Open-Loop Voltage Gain Output Voltage Swing High Output Voltage Swing Low IOUT Output Current Supply Current -40C to +125C RL = 10 k to 0 V VID = 100 mV -40C to +125C 15.3 RL = 10 k to 0 V VID = -100 mV -40C to +125C RL = 2 k to 0 V VID = -100 mV -40C to +125C 65 130 Sinking VID = -200 mV, VOUT = 15 V (6) 60 100 Unity Gain Frequency RL = 2 k, CL = 20 pF Gain Bandwidth f = 50 kHz en Input Referred Voltage Noise Density f = 2 kHz in Input Referred Current Noise Density f = 2 kHz THD+N Total Harmonic Distortion +Noise f = 1 kHz, RL 100 k, AV = +2, VOUT = 23 VPP mV from either rail 300 400 65 GBW 200 250 40 fu 550 650 Sourcing VID = 200 mV, VOUT = -15 V (6) AV = +1, VI = 20-V Step 300 350 60 VCM = -14.5 V V dB 78 250 -40C to +125C UNIT 85 150 RL = 2 k to 0 V VID = 100 mV Slew Rate (7) (7) -15.1 70 70 -40C to +125C SR (6) -15.3 15 75 -40C to +125C LM7322 CT Rej. Crosstalk Rejection MAX (2) -15 15.1 LM7321 IS TYP (3) -40C to +125C -13 V VO 13 V RL = 2 k to 0 V VOUT MIN (2) mA 1.1 -40C to +125C 2.4 2.5 -40C to +125C f = 100 kHz, Driver RL = 10 k 1.7 4 mA 5.6 18 V/s 11.3 MHz 20 MHz 15 nV/H 1.3 pA/H -86 dB 60 dB Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Short circuit test is a momentary test. Output short circuit duration is infinite for VS 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5 ms. Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower. Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 9 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com 7.8 Typical Characteristics Unless otherwise specified: TA = 25C. 10 10 VOUT from V (V) 1 + VOUT from V (V) VS = 2.7V 125C 85C 0.1 VS = 2.7V 1 125C 85C 0.1 25C 25C -40C 0.01 0.1 1 -40C 10 0.01 0.1 100 1 ISOURCE (mA) Figure 1. Output Swing vs. Sourcing Current 10 VOUT from V (V) VS = 5V 1 + VOUT from V (V) 100 Figure 2. Output Swing vs. Sinking Current 10 125C 85C 0.1 10 ISINK (mA) VS = 5V 1 125C 0.1 85C 25C 25C -40C -40C 0.01 0.1 1 10 0.01 0.1 100 1 ISOURCE (mA) Figure 3. Output Swing vs. Sourcing Current 100 Figure 4. Output Swing vs. Sinking Current 10 10 VS = 15V VOUT from V (V) VS = 15V 1 + VOUT from V (V) 10 ISINK (mA) 125C 85C 0.1 25C 1 125C 0.1 85C -40C 25C -40C 0.01 0.1 1 10 100 0.01 0.1 ISOURCE (mA) 10 100 ISINK (mA) Figure 5. Output Swing vs. Sourcing Current 10 1 Figure 6. Output Swing vs. Sinking Current Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 Typical Characteristics (continued) Unless otherwise specified: TA = 25C. -0.5 12 VS = 5V 10 -0.9 -1.1 8 VOS (mV) PERCENTAGE (%) VS = 2.7V -0.7 6 4 -40C -1.3 -1.5 25C -1.7 85C -1.9 -2.1 2 125C -2.3 0 -2.5 -2 -3 -1 0 1 2 3 -1 0 1 VOS (mV) 2 3 4 VCM (V) Figure 7. VOS Distribution Figure 8. VOS vs. VCM (Unit 1) 0 -0.5 VS = 2.7V VS = 2.7V -0.7 -0.1 -40C -0.9 -0.2 VOS (mV) VOS (mV) -1.1 -0.3 85C -0.4 -40C -0.5 125C -0.6 -0.8 -1 -1.7 85C -2.1 125C 125C -2.3 -40C 0 25C -1.5 -1.9 25C -0.7 -1.3 1 2 3 -2.5 4 -1 0 1 VCM (V) 2 3 4 VCM (V) Figure 9. VOS vs. VCM (Unit 2) Figure 10. VOS vs. VCM (Unit 3) -1 -0.3 VS = 5V VS = 5V -1.25 -0.4 -40C 85C VOS (mV) VOS (mV) -1.5 25C -1.75 85C -0.5 -40C -0.6 125C -2 125C -0.7 -2.25 -2.5 -6 -4 25C -2 0 2 4 6 -0.8 -6 VCM (V) -4 -2 0 0 4 6 VCM (V) Figure 11. VOS vs. VCM (Unit 1) Figure 12. VOS vs. VCM (Unit 2) Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 11 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com Typical Characteristics (continued) Unless otherwise specified: TA = 25C. -0.5 -1 VS = 15V VS = 5V -0.75 -40C -1.25 VOS (mV) VOS (mV) -1.25 -40C -1 25C -1.5 -1.75 85C -1.5 25C -1.75 85C 125C -2 125C -2 -2.25 -2.5 -6 -4 -2 2 0 4 -2.25 -20 -15 -10 6 -5 0 -0.7 15 20 VS = 15V -0.9 -40C 125C 85C -0.3 -1.1 -0.4 VOS (mV) VOS (mV) 10 -0.5 VS = 15V -0.2 25C -0.5 -40C -0.6 -1.3 25C -1.5 -1.7 -0.7 -1.9 -0.8 -2.1 -0.9 85C 125C -2.3 -1 -20 -15 -10 -5 0 5 15 20 -10 -5 0 5 10 15 VCM (V) Figure 15. VOS vs. VCM (Unit 2) Figure 16. VOS vs. VCM (Unit 3) 20 0 VCM = V +0.5V -40C -1.3 10 -2.5 -20 -15 VCM (V) -1.1 VCM = V +0.5V -0.1 -1.5 -0.2 25C VOS (mV) VOS (mV) 5 Figure 14. VOS vs. VCM (Unit 1) Figure 13. VOS vs. VCM (Unit 2) -0.1 0 VCM (V) VCM (V) -1.7 -1.9 85C 125C -2.1 -0.3 -0.4 85C 25C -0.5 -2.3 -0.6 -2.5 -0.7 -40C 125C 0 10 20 30 40 0 10 15 20 25 30 35 40 VS (V) VS (V) Figure 17. VOS vs. VS (Unit 1) 12 5 Submit Documentation Feedback Figure 18. VOS vs. VS (Unit 2) Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 Typical Characteristics (continued) Unless otherwise specified: TA = 25C. -1 0 VCM = V +0.5V + VCM = V -0.5V -1.2 -0.5 VOS (mV) VOS (mV) -40C -1 25C -1.5 -40C -1.4 -1.6 25C 85C -2 85C -1.8 125C 125C -2.5 -2 0 5 10 15 20 25 30 35 40 5 0 10 15 20 0 35 40 -1 + VCM = V -0.5V VCM = V+ -0.5V -1.2 -0.2 -40C -0.3 -1.4 -0.4 VOS (mV) VOS (mV) 30 Figure 20. VOS vs. VS (Unit 1) Figure 19. VOS vs. VS (Unit 3) -0.1 25 VS (V) VS (V) 85C -0.5 125C -0.6 -1.6 25C -1.8 -0.7 25C -0.8 -1 0 5 10 15 20 25 30 85C -2 -40C -0.9 35 -2.2 40 125C 5 0 10 15 20 VS (V) 25 30 35 40 VS (V) Figure 21. VOS vs. VS (Unit 2) Figure 22. VOS vs. VS (Unit 3) 1 1 VS = 2.7V -40C VS = 5V 25C 0.5 0.5 IBAIS (PA) IBIAS (PA) 85C 125C 0 -0.5 0 -0.5 125C -1 85C 25C -1 -1.5 0 0.5 1 1.5 2 2.5 3 -1.5 -5 VCM (V) -40C -3 -1 1 3 5 VCM (V) Figure 23. IBIAS vs. VCM Figure 24. IBIAS vs. VCM Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 13 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com Typical Characteristics (continued) Unless otherwise specified: TA = 25C. -1 1 VCM = V +0.5V VS = 15V -1.1 0.5 85C 125C 0 IBIAS (PA) IBIAS (PA) -1.2 -0.5 -40C -1.4 85C 125C 25C -1.3 -1 -1.5 -1.5 -15 -40C 25C -10 -5 0 5 10 -1.6 15 0 5 10 15 VCM (V) -40C VS = 2.7V 40 125C 85C 0.55 0.5 25C 25C 1 0.8 -40C 85C 0.45 0.6 125C 0.4 0.4 0.35 0.2 0 -1 0.3 0 10 20 30 40 0 1 VS (V) 2 3 4 VCM (V) Figure 27. IBIAS vs. VS Figure 28. IS vs. VCM (LM7321) 3.5 2 125C 1.8 3 VS = 5V 1.6 85C 2.5 1.4 25C 2 IS (mA) IS (mA) 35 1.2 IS (mA) IBIAS (PA) 1.6 1.4 0.6 30 1.8 + VCM = V -0.5V 0.65 25 Figure 26. IBIAS vs. VS Figure 25. IBIAS vs. VCM 0.7 20 VS (V) -40C 1.5 1.2 125C 85C 1 25C 0.8 0.6 1 -40C 0.4 0.5 0.2 VS = 2.7V 0 -1 0 1 2 3 4 0 -6 VCM (V) -2 0 2 4 6 VCM (V) Figure 29. IS vs. VCM (LM7322) 14 -4 Submit Documentation Feedback Figure 30. IS vs. VCM (LM7321) Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 Typical Characteristics (continued) Unless otherwise specified: TA = 25C. 4 2.5 VS = 5V VS = 15V 3.5 2 3 125C IS (mA) IS (mA) 2.5 85C 2 25C 1.5 1.5 125C 85C 1 25C -40C 1 -40C 0.5 0.5 0 -6 -4 -2 2 0 4 0 -20 -15 -10 6 -5 VCM (V) Figure 31. IS vs. VCM (LM7322) 4.5 VS = 15V 3.5 15 20 - 125C 1.2 3 85C 1 25C IS (mA) IS (mA) 10 VCM = V +0.5V 1.4 85C 2 5 Figure 32. IS vs. VCM (LM7321) 1.6 4 2.5 0 VCM (V) 25C 25C 0.8 -40C 0.6 1.5 -40C 0.4 1 0.2 0.5 0 -20 -15 -10 -5 0 5 10 15 0 20 0 5 10 15 VCM (V) 25 20 30 30 40 VS (V) Figure 33. IS vs. VCM (LM7322) Figure 34. IS vs. VS (LM7321) 2.5 4.5 + VCM = V -0.5V 4 2 125C 3.5 85C 125C 85C 25C 2.5 IS (mA) IS (mA) 3 -40C 2 1.5 25C 1 -40C 1.5 1 0.5 0.5 0 + VCM = V -0.5V 0 5 10 15 20 25 30 35 40 0 0 VS (V) 5 10 15 20 25 30 35 40 VS (V) Figure 35. IS vs. VS (LM7322) Figure 36. IS vs. VS (LM7321) Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 15 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com Typical Characteristics (continued) Unless otherwise specified: TA = 25C. 3 0.3 85C RL = 2 k: 125C 2.5 125C 0.25 85C 25C 1.5 -40C 1 0.2 -40C 0.15 0.1 0.05 0.5 0 25C VOUT from RAIL (V) IS (mA) 2 VCM = V +0.5V 5 0 10 15 20 25 30 35 0 40 0 10 20 30 40 VS (V) VS (V) Figure 37. IS vs. VS (LM7322) Figure 38. Positive Output Swing vs. Supply Voltage 0.16 0.16 125C RL = 10 k: RL = 2 k: 125C 0.14 0.14 0.12 VOUT from RAIL (V) 85C 0.1 25C 0.08 -40C 0.06 0.04 0.12 25C 0.1 -40C 0.08 0.06 0.04 0.02 0.02 0 0 5 10 15 20 25 30 35 0 40 0 10 20 VS (V) 30 Figure 39. Positive Output Swing vs. Supply Voltage Figure 40. Negative Output Swing vs. Supply Voltage 0.07 140 158 VS = r15V RL = 10 M: 135 RL = 10 k: 120 125C 100 0.05 85C 0.04 GAIN (dB) VOUT from RAIL (V) 0.06 25C 0.03 -40C PHASE 80 60 40 68 45 0 30 90 20 pF 50 pF 100 pF 200 pF 23 0 500 pF 1000 pF 0 20 100 pF 50 pF 40 20 -20 1k VS (V) 113 200 pF GAIN 0.01 10 1000 pF 500 pF 0.02 0 40 VS (V) 10k 100k PHASE (q) VOUT from RAIL (V) 85C 1M 10M -23 100M FREQUENCY (Hz) Figure 41. Negative Output Swing vs. Supply Voltage 16 Figure 42. Open-Loop Frequency Response with Various Capacitive Load Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 Typical Characteristics (continued) Unless otherwise specified: TA = 25C. 120 PHASE 120 113 100 600: 100 140 158 VS = r15V CL = 20 pF 135 158 RL = 2 k: CL = 20 pF 135 PHASE 113 VS = 30V 90 10 k: 60 68 GAIN 40 100 k: 2 k: 600: 20 45 10 M: 0 -20 1k 10k 100k 1M 80 GAIN 40 20 0 0 68 VS = 30V 45 VS = 2.7V 23 0 VS = 10V -20 1k 10k 100k 1M 10M -23 100M FREQUENCY (Hz) FREQUENCY (Hz) Figure 43. Open-Loop Frequency Response with Various Resistive Load Figure 44. Open-Loop Frequency Response with Various Supply Voltage 100 70 VS = 15V 90 60 RL = 600: 80 50 70 RL = 2 k: CMRR (dB) PHASE MARGIN () 90 VS = 10V VS = 2.7V 60 23 -23 100M 10M GAIN (dB) 80 PHASE (q) GAIN (dB) 2 k: PHASE (q) 140 40 30 RL = 10 M:, 10 k:, 100 k: 60 50 40 30 20 20 10 10 VS = 15V 0 10 0 10 1000 100 10k 1k 100k CAPACITIVE LOAD (pF) FREQUENCY (Hz) Figure 45. Phase Margin vs. Capacitive Load Figure 46. CMRR vs. Frequency 120 100 VS = 2.7V VCM = 2V 80 VS = 10V VCM = 8V -PSRR (dB) 80 1M VS = 30V 90 VCM = 0.7V 100 +PSRR (dB) 100 VS = 30V 60 VCM = 28V 40 70 VS = 10V VCM = 2V 60 50 VS = 2.7V VCM = 2V 40 30 20 20 10 0 10 100 1k 10k 100k 1M 0 10 100 1k 10k 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 47. +PSRR vs. Frequency Figure 48. -PSRR vs. Frequency 1M Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 17 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com Typical Characteristics (continued) Unless otherwise specified: TA = 25C. 12,200 pF VS = 5V 1000 pF AV = +1 8,600 pF 100 mV/DIV 750 pF 25V/DIV 500 pF 330 pF VS = 15V, AV = +1 2,200 pF 100 pF 10 pF 10 pF INPUT INPUT 200 ns/DIV 5 Ps/DIV Figure 49. Small Signal Step Response 1000 Figure 50. Large Signal Step Response 1000 100 100 VOLTAGE 1 10 CURRENT 1 1 10 100 1k 10k VOLTAGE NOISE (nV Hz) 10 CURRENT NOISE (pA/ Hz) VOLTAGE NOISE (nV Hz) 100 100 10 CURRENT VOLTAGE 1 10 0.1 100k 1 1 10 FREQUENCY (Hz) 100 1k 10k CURRENT NOISE (pA/ Hz) VS = 5V VS = 2.7V 0.1 100k FREQUENCY (Hz) Figure 51. Input Referred Noise Density vs. Frequency 1000 Figure 52. Input Referred Noise Density vs. Frequency 100 0 AV = +2 VS = 15V 10 CURRENT VOLTAGE 1 10 RL = 100 k: -20 THD+N (dB) 100 CURRENT NOISE (pA/ Hz) VOLTAGE NOISE (nV Hz) -10 VIN = 520 mVPP -30 -40 -50 VS = 2.7V, VCM = 0.8V -60 -70 1 1 10 100 1k 10k 0.1 100k VS = 15V -80 10 FREQUENCY (Hz) 100 1k 10k 100k 1M FREQUENCY (Hz) Figure 53. Input Referred Noise Density vs. Frequency 18 VS = 5V Submit Documentation Feedback Figure 54. THD+N vs. Frequency Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 Typical Characteristics (continued) Unless otherwise specified: TA = 25C. 0 0 VS = 2.7V VS = 5V -10 f = 1 kHz -10 VCM = 0.8V -20 f = 1 kHz -20 -30 A = +2 V -40 -30 -50 -60 -40 -50 -60 -70 -70 -80 -80 -90 0.001 0.01 RL = 100 k: AV = +2 THD+N (dB) THD+N (dB) RL = 100 k: 0.1 1 -90 0.001 10 0.01 0.1 1 10 100 OUTPUT AMPLITUDE (VPP) OUTPUT AMPLITUDE (VPP) Figure 56. THD+N vs. Output Amplitude Figure 55. THD+N vs. Output Amplitude 0 VS = 15V -10 f = 1 kHz -20 RL = 100 k: AV = +2 THD+N (dB) -30 -40 -50 -60 -70 -80 -90 0.001 0.01 0.1 1 10 100 OUTPUT AMPLITUDE (VPP) Figure 57. THD+N vs. Output Amplitude Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 19 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com 8 Detailed Description 8.1 Overview The LM732xx devices are rail-to-rail input and output amplifiers with wide operating voltages and high-output currents. The LM732xx family is efficient, achieving 18-V/s slew rate and 20-MHz unity gain bandwidth while requiring only 1 mA of supply current per op amp. The LM732xx device performance is fully specified for operation at 2.7 V, 5 V and 15 V. The LM732xx devices are designed to drive unlimited capacitive loads without oscillations. All LM7321x and LM7322x parts are tested at -40C, 125C, and 25C, with modern automatic test equipment. High performance from -40C to 125C, detailed specifications, and extensive testing makes them suitable for industrial, automotive, and communications applications. Greater than rail-to-rail input common-mode voltage range with 50 dB of common-mode rejection across this wide voltage range, allows both high-side and low-side sensing. Most device parameters are insensitive to power supply voltage, and this makes the parts easier to use where supply voltage may vary, such as automotive electrical systems and battery-powered equipment. These amplifiers have true rail-to-rail output and can supply a respectable amount of current (15 mA) with minimal head room from either rail (300 mV) at low distortion (0.05% THD+Noise). 8.2 Functional Block Diagram V+ -IN OUT +IN + V- 8.3 Feature Description 8.3.1 Output Short Circuit Current and Dissipation Issues The LM732xx output stage is designed for maximum output current capability. Even though momentary output shorts to ground and either supply can be tolerated at all operating voltages, longer lasting short conditions can cause the junction temperature to rise beyond the absolute maximum rating of the device, especially at higher supply voltage conditions. Below supply voltage of 6 V, the output short circuit condition can be tolerated indefinitely. With the op amp tied to a load, the device power dissipation consists of the quiescent power due to the supply current flow into the device, in addition to power dissipation due to the load current. The load portion of the power itself could include an average value (due to a DC load current) and an AC component. DC load current would flow if there is an output voltage offset, or the output AC average current is non-zero, or if the op amp operates in a single supply application where the output is maintained somewhere in the range of linear operation. Therefore, PTOTAL = PQ + PDC + PAC 20 (1) Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 Feature Description (continued) The Op Amp Quiescent Power Dissipation is calculated as: PQ = IS x VS where * * IS: Supply Current VS: Total Supply Voltage (V+ - V-) (2) The DC Load Power is calculated as: PDC = IO x (Vr - Vo) where * * VO: Average Output Voltage Vr: V+ for sourcing and V- for sinking current (3) The AC Load Power is calculated as PAC = See Table 1. Table 1 shows the maximum AC component of the load power dissipated by the op amp for standard Sinusoidal, Triangular, and Square Waveforms: Table 1. Normalized AC Power Dissipated in the Output Stage for Standard Waveforms PAC (W./V2) Sinusoidal Triangular Square 50.7 x 10-3 46.9 x 10-3 62.5 x 10-3 The table entries are normalized to VS2/RL. To figure out the AC load current component of power dissipation, simply multiply the table entry corresponding to the output waveform by the factor VS2/RL. For example, with 12V supplies, a 600- load, and triangular waveform power dissipation in the output stage is calculated as: PAC = (46.9 x 10-3) x (242/600) = 45.0 mW (4) The maximum power dissipation allowed at a certain temperature is a function of maximum die junction temperature (TJ(MAX)) allowed, ambient temperature TA, and package thermal resistance from junction to ambient, JA. TJ(MAX) - TA PD(MAX) = TJA (5) For the LM732xx, the maximum junction temperature allowed is 150C at which no power dissipation is allowed. The power capability at 25C is given by the following calculations: For VSSOP package: PD(MAX) = 150C 25C = 0.53 W 235C/W (6) For SOIC package: PD(MAX) = 150C 25C = 0.76 W 165C/W (7) Similarly, the power capability at 125C is given by: For VSSOP package: PD(MAX) = 150C 125C = 0.11 W 235C/W (8) For SOIC package: PD(MAX) = 150C 125C = 0.15 W 165C/W (9) Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 21 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com Figure 58 shows the power capability vs. temperature for VSSOP and SOIC packages. The area under the maximum thermal capability line is the operating area for the device. When the device works in the operating area where PTOTAL is less than PD(MAX), the device junction temperature will remain below 150C. If the intersection of ambient temperature and package power is above the maximum thermal capability line, the junction temperature will exceed 150C and this should be strictly prohibited. 1.4 POWER CAPABILITY (W) 1.2 M 1 ax im um 0.8 Ma 0.6 um 0.4 0.2 th e the rm al ca Operating area 0 -40 -20 0 rm al xi m pa bil ca p ity ab lin i li t y e( li n e (S O IC ) MS OP ) 20 40 60 80 100 120 140 160 TEMPERATURE (C) Figure 58. Power Capability vs. Temperature When high power is required and ambient temperature can't be reduced, providing air flow is an effective approach to reduce thermal resistance therefore to improve power capability. 8.3.2 Estimating the Output Voltage Swing It is important to keep in mind that the steady-state output current will be less than the current available when there is an input overdrive present. For steady-state conditions, the Output Voltage vs. Output Current plot (Typical Characteristics section) can be used to predict the output swing. Figure 59 and Figure 60 show this performance along with several load lines corresponding to loads tied between the output and ground. In each cases, the intersection of the device plot at the appropriate temperature with the load line would be the typical output swing possible for that load. For example, a 1-k load can accommodate an output swing to within 250 mV of V- and to 330 mV of V+ (VS = 15 V) corresponding to a typical 29.3 VPP unclipped swing. Figure 59. Output Sourcing Characteristics With Load Lines 22 Figure 60. Output Sinking Characteristics With Load Lines Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 8.4 Device Functional Modes 8.4.1 Driving Capacitive Loads The LM732xx are specifically designed to drive unlimited capacitive loads without oscillations as shown in Figure 61. Figure 61. 5% Settling Time vs. Capacitive Load In addition, the output current handling capability of the device allows for good slewing characteristics even with large capacitive loads as shown in Figure 62 and Figure 63. Figure 62. +SR vs. Capacitive Load Figure 63. -SR vs. Capacitive Load The combination of these features is ideal for applications such as TFT flat panel buffers, A/D converter input amplifiers, and so forth. However, as in most op amps, addition of a series isolation resistor between the op amp and the capacitive load improves the settling and overshoot performance. Output current drive is an important parameter when driving capacitive loads. This parameter will determine how fast the output voltage can change. Referring to the Slew Rate vs. Capacitive Load Plots (Typical Characteristics section), two distinct regions can be identified. Below about 10,000 pF, the output Slew Rate is solely determined by the compensation capacitor value of the op amp and available current into that capacitor. Beyond 10 nF, the Slew Rate is determined by the available output current of the op amp. Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 23 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com Device Functional Modes (continued) NOTE Because of the lower output sourcing current compared to the sinking one, the Slew Rate limit under heavy capacitive loading is determined by the positive transitions. An estimate of positive and negative slew rates for loads larger than 100 nF can be made by dividing the short circuit current value by the capacitor. For the LM732xx, the available output current increases with the input overdrive. Referring to Figure 64 and Figure 65, it can be seen that both sourcing and sinking short circuit current increase as input overdrive increases. In a closed-loop amplifier configuration, during transient conditions while the fed back output has not quite caught up with the input, there will be an overdrive imposed on the input allowing more output current than would normally be available under steady-state condition. Because of this feature, the output stage quiescent current of the op amp can be kept to a minimum, thereby reducing power consumption, while enabling the device to deliver large output current when the need arises (such as during transients). Figure 64. Output Short Circuit Sourcing Current vs. Input Overdrive Figure 65. Output Short Circuit Sinking Current vs. Input Overdrive Figure 66 shows the output voltage, output current, and the resulting input overdrive with the device set for AV = +1 and the input tied to a 1-VPP step function driving a 47-nF capacitor. As can be seen, during the output transition, the input overdrive reaches 1-V peak and is more than enough to cause the output current to increase to its maximum value (see Figure 64 and Figure 65 plots). NOTE Because of the larger output sinking current compared to the sourcing one, the output negative transition is faster than the positive one. Figure 66. Buffer Amplifier Scope Photo 24 Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information 9.1.1 Similar High-Output Devices The LM7332 is a dual rail-to-rail amplifier with a slightly lower GBW capable of sinking and sourcing 100 mA. It is available in SOIC and VSSOP packages. The LM4562 is dual op amp with very low noise and 0.7-mV voltage offset. The LME49870 and LME49860 are single and dual low-noise amplifiers that can work from 22-V supplies. 9.1.2 Other High Performance SOT-23 Ampliers The LM7341 is a 4-MHz rail-to-rail input and output part that requires only 0.6 mA to operate, and can drive unlimited capacitive load. It has a voltage gain of 97 dB, a CMRR of 93 dB, and a PSRR of 104 dB. The LM6211 is a 20-MHz part with CMOS input, which runs on 12-V or 24-V single supplies. It has rail-to-rail output and low noise. The LM7121 has a gain bandwidth of 235 MHz. Detailed information on these parts can be found at www.ti.com. 9.2 Typical Application Figure 67 shows a typical application where the LM732xx is used as a buffer amplifier for the VCOM signal employed in a TFT LCD flat panel: Figure 67. VCOM Driver Application Schematic 9.2.1 Design Requirements For this example application, the supply voltage is +5 V, and noninverting gain is necessary. Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 25 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com Typical Application (continued) 9.2.2 Detailed Design Procedure Figure 68 shows the time domain response of the amplifier when used as a VCOM buffer/driver with VREF at ground. In this application, the op amp loop will try and maintain its output voltage based on the voltage on its noninverting input (VREF) despite the current injected into the TFT simulated load. As long as this load current is within the range tolerable by the LM732xx (45-mA sourcing and 65-mA sinking for 5-V supplies), the output will settle to its final value within less than 2 s. Figure 68. VCOM Driver Performance Scope Photo 9.2.3 Application Curve CROSSTALK REJECTION (dB) 90 80 70 VS = 15V 60 50 VS = 5V 40 + V = 1.8V 30 VCM = 0.9V 20 10 0 1k 10k 100k 1M 10M 100M FREQUENCY (Hz) Figure 69. Crosstalk Rejection vs. Frequency 26 Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 LM7321, LM7322 www.ti.com SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 10 Power Supply Recommendations The use of supply decoupling is mandatory in most applications. As with most relatively high-speed or highoutput current op amps, best results are achieved when each supply line is decoupled with two capacitors; a small value ceramic capacitor ( about 0.01 F) placed very close to the supply lead in addition to a large value Tantalum or Aluminum (> 4.7 F). The large capacitor can be shared by more than one device if necessary. The small ceramic capacitor maintains low supply impedance at high frequencies while the large capacitor will act as the charge bucket for fast load current spikes at the op amp output. The combination of these capacitors will provide supply decoupling and will help keep the op amp oscillation free under any load. 11 Layout 11.1 Layout Guidelines Take care to minimize the loop area formed by the bypass capacitor connection between supply pins and ground. A ground plane underneath the device is recommended; any bypass components to ground should have a nearby via to the ground plane. The optimum bypass capacitor placement is closest to the corresponding supply pin. Use of thicker traces from the bypass capacitors to the corresponding supply pins will lower the power supply inductance and provide a more stable power supply. The feedback components should be placed as close to the device as possible to minimize stray parasitics. 11.2 Layout Example Figure 70. LM732xx Layout Example Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 27 LM7321, LM7322 SNOSAW8E - MAY 2008 - REVISED SEPTEMBER 2015 www.ti.com 12 Device and Documentation Support 12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM7321 Click here Click here Click here Click here Click here LM7322 Click here Click here Click here Click here Click here 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 28 Submit Documentation Feedback Copyright (c) 2008-2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM7321MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732 1MA LM7321MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732 1MA LM7321MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AU4A LM7321MFE/NOPB ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AU4A LM7321MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AU4A LM7321QMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AR8A LM7321QMFE/NOPB ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AR8A LM7321QMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AR8A LM7322MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732 2MA LM7322MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732 2MA LM7322MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AZ4A LM7322MME/NOPB ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AZ4A LM7322QMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732 2QMA LM7322QMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732 2QMA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2015 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM7321, LM7321-Q1, LM7322, LM7322-Q1 : * Catalog: LM7321, LM7322 * Automotive: LM7321-Q1, LM7322-Q1 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2015 * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM7321MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM7321MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM7321MFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM7321MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM7321QMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM7321QMFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM7321QMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM7322MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM7322MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM7322MME/NOPB VSSOP DGK 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM7322QMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM7321MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM7321MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM7321MFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0 LM7321MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM7321QMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM7321QMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0 LM7321QMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM7322MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM7322MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM7322MME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0 LM7322QMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM7322MA/NOPB LM7322MAX/NOPB LM7322MM/NOPB LM7322MME/NOPB LM7322MMX/NOPB