AMMC-3041-W10 - Agilent / Hewlett-Packard

Note: These devices are ESD sensitive. The following precautions are strongly recommended:

Ensure that an ESD approved carrier is used when dice are transported from one destination to another.

Personal grounding is to be worn at all times when handling these devices.

Agilent AMMC-3041

18 - 42 GHz Double Balanced Mixer

Data Sheet

Description

The AMMC- 3041 is a monolithic

double balanced mixer designed

for commercial communication

systems. The AMMC- 3041 mixer

is fabricated using a suspended

metal system to create a unique,

broadside- coupled balun

structure (patent pending) to

achieve exceptional bandwidth.

The broadband performance of

the AMMC- 3041 can be used to

advantage by replacing

conventional, narrow band

mixers with a single device.

Chip Size: 1050 x 750 µm (41.5 x 29.5 mils)

Chip Size Tolerance:± 10 µm (± 0.4 mils)

Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)

Pad Dimensions: 75 x 75 µm (3 ± 0.4 mils)

Features

• Wide Frequency Range:

•RF, LO: 18 − 42 GHz

•IF: DC − 5 GHz

• Conversion Loss: 9.5 dB

• High IIP3: +22 dBm

• High Input P-1dB : +16 dBm

• Up or Down Conversion

Applications

• Point-to-Point Radio

• LMDS

•SATCOM

AMMC-3041 Absolute Maximum Ratings[1]

Symbol Parameters/Conditions Units Min. Max.

TbOperating Backside Temp. °C−55 +140

Tstg Storage Temp. °C−65 +165

Tmax Maximum Assembly Temp (60 sec max) °C +300

Note:

1. Operation in excess of any one of these conditions may result in permanent damage to this device.

AMMC-3041 RF Specifications [1]

(Zo=50 Ω, Tb = 25°C, IF = 2 GHz, LO Input Power = +14 dBm, RF Input Power = -20 dBm, except as noted.)

Spurious Mixing Products

fRF = 31 GHz, RF Input Power = -10 dBm,

fLO = 32 GHz, LO Input Power = +14 dBm.

Symbol Parameters and Test Conditions Units Minimum Typical Maximum

Lc Conversion Loss [1] Down Conversion

Up Conversion

dB 9.5

9.0

IIP3 Input 3rd Order Intercept Point,

Down Conversion [2]

fRF = 26 GHz

fRF = 38 GHz

dBm 23

P−1 dB Input Power at 1 dB Conversion

Loss Compression

Down Conversion

Up Conversion

dBm

ISOLL-R LO - RF Isolation fLO = 26 GHz

fLO = 38 GHz

dB 44

Notes:

1. 100% on-wafer RF test is done at RF frequency = 18, 22, 32, and 42 GHz.

2. ∆f = 2 MHz, RF Input Power = -10 dBm.

m x RF

n x LO

01234

0 - 17.9 - - -

143069- -

2 - 88 49 95 -

3 - - 115 88 115

4---115115

All values are dBc relative to the IF output power level.

AMMC-3041 Typical Performance

Zo=50 Ω, Tb = 25°C, IF = 2 GHz, LO Input Power = +14 dBm, RF Input Power = −20 dBm, except as noted.

Figure 1. Conversion Loss, Down Conversion,

LO freq = RF - IF.

Figure 2. Conversion Loss, Up Conversion, LO

freq = RF - IF.

Figure 3. Output Power at 1 dB Conversion

Loss Compression, Down Conversion, LO freq

= RF + IF.

Figure 4. Output Power at 1 dB Conversion

Loss Compression, Up Conversion, LO freq =

RF + IF.

Figure 5. Input 3rd Order Intercept Point, Down

Conversion, LO freq = RF + IF.

Figure 6. Isolation, Down Conversion, LO freq

= RF + IF.

RF FREQUENCY (GHz)

CONVERSION LOSS (dB)

20 4222 24 26 28 30 32 34 36 38 40

LO = 1 4 dBm

LO = 1 5 dBm

LO = 1 6 dBm

RF FREQUENCY (GHz)

CONVERSION LOSS (dB)

20 4222 24 26 28 30 32 34 36 38 40

LO = 1 4 dBm

LO = 1 5 dBm

LO = 1 6 dBm

RF FREQUENCY (GHz)

P1dB (dBm)

18 4020 22 24 26 28 30 32 34 36 38

LO = 1 4 dBm

LO = 1 5 dBm

LO = 1 6 dBm

RF FREQUENCY (GHz)

P1dB (dBm)

18 4020 22 24 26 28 30 32 34 36 38

LO = 1 4 dBm

LO = 1 5 dBm

LO = 1 6 dBm

RF FREQUENCY (GHz)

IIP3 (dBm)

18 4020 22 24 26 28 30 32 34 36 38

RF FREQUENCY (GHz)

ISOLATION (dB)

18 4020 22 24 26 28 30 32 34 36 38

L-R Isolation

L-I Isolation

R-I Isolation

Applications Information

Operation of the AMMC- 3041 is

very straightforward. The RF,

LO, and IF ports can be

connected directly to 50- ohm

circuits. None of the three ports

should have a DC voltage

applied to them. If DC voltages

are present, a blocking capacitor

should be used.

Some enhancement in

Conversion Loss may be

obtained by reflectively

terminating the LO and RF

signals at the IF port. This is

easily done by connecting a 20-

mil long bond wire from the IF

output pad on the MMIC to a

shunt, off- chip 0.5 pF chip

capacitor as indicated in Figure

For up conversion applications,

the input signal is normally

applied to the IF port, the local

oscillator connected to the LO

port, and the up-converted

output signal taken from the RF

port.

Assembly Techniques

The backside of the AMMC- 3041

chip is RF ground. For

microstripline applications, the

chip should be attached directly

to the ground plane (e.g., circuit

carrier) using electrically

conductive epoxy[1].

For best performance, the

topside of the MMIC should be

brought up to the same height

as the circuit surrounding it.

This can be accomplished by

mounting a gold plated metal

shim (same length and width as

the MMIC) under the chip,

which is of the correct

thickness to make the chip and

adjacent circuit coplanar.

The amount of epoxy used for

chip and or shim attachment

should be just enough to

provide a thin fillet around the

bottom perimeter of the chip or

shim. The ground plane should

be free of any residue that may

jeopardize electrical or

mechanical attachment.

For use on coplanar circuits,

the chip can be mounted

directly on the topside ground

plane of the circuit.

The location of the RF, LO, and

IF bond pads is shown in

Figure 8. Note that all I/O ports

are in a Ground- Signal- Ground

configuration. The IF port is

located near the middle of the

die, which allows this

connection to be made from

either side of the chip for

maximum layout flexibility.

RF connections should be kept

as short as reasonable to

minimize performance

degradation due to series

inductance. A single bond wire

is sufficient for all signal

connections. However, double-

bonding with 0.7 mil gold wire

or the use of gold mesh[2] is

recommended for best

performance, especially near the

high end of the frequency range.

Thermosonic wedge bonding is

the preferred method for wire

attachment to the bond pads.

Gold mesh can be attached

using a 2 mil round tracking

tool and a tool force of

approximately 22 grams with an

ultrasonic power of roughly 55

dB for a duration of 76 ± 8 mS.

A guided wedge at an ultrasonic

power level of 64 dB can be

used for the 0.7 mil wire. The

recommended wire bond stage

temperature is 150 ± 2° C.

Caution should be taken to not

exceed the Absolute Maximum

Rating for assembly temperature

and time.

The chip is 100 µm thick and

should be handled with care.

This MMIC has exposed air

bridges on the top surface and

should be handled by the edges

or with a custom collet (do not

pick up die with vacuum on die

center.)

This MMIC is also static

sensitive and ESD handling

precautions should be taken.

Notes:

1. Ablebond 84-1 LM1 silver epoxy is

recommended.

2. Buckbee-Mears Corporation, St. Paul, MN,

800-262-3824

Figure 7. AMMC-3041 Schematic Diagram.

Figure 8. AMMC-3041 Bonding Pad Locations. Dimensions are in microns.

Ordering Information:

AMMC- 3041- W10 = waffle pack, 10 devices per tray

AMMC- 3041- W50 = waffle pack, 50 devices per tray

0.5 pF

20 mil

bondwire

440

750

518

045 540 960

10505400

www.agilent.com/

semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

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(916) 788-6763

Europe: +49 (0) 6441 92460

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India, Australia, New Zealand: (+65) 6755 1939

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or 0120-61-1280 (Domestic Only)

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Philippines, Indonesia: (+65) 6755 2044

Taiwan: (+65) 6755 1843

Data subject to change.

February 13, 2004

5989-0529EN