TPS853
2005-07-21 1
TOSHIBA Photo IC Silicon Epitaxial Planar
TPS853
Mobile Phones, PHS
Notebook PCs, PDAs
Video cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS853 is an ultra-compact surface-mount photo-IC for
illuminance sensors which incorporates a photodiode and current amp
circuit in a single chip.
The sensitivity is superior to that of a phototransistor, and exhibits
little variation.
It has spectral sensitivity closer to luminous efficiency and excellent
output linearity.
With its ultra-compact surface-mount package, this photo-IC can be
used as the power-saving control for domestic appliances or for
backlighting for displays in cellular phones, this device enables low
power consumption to be achieved.
• Ultra-compact and light surface-mount package suitable for lead-free
soldering and reflow soldering: 2.0 × 2.1 × 0.7 mm
• Excellent output linearity of illuminance
• Little fluctuation in light current and high level of sensitivity
: IL = 37 µA to 74 µA @EV = 100 lx using fluorescent light
: Light current variation width: ×1.67 (when light current classification is specified.)
: Little temperature fluctuation
• Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources
: IL (using incandescent light)/IL (using fluorescent light) = 1.2 (typ.)
• Low supply voltage, making device suitable for battery-powered equipment: VCC = 2.2 V to 5.5 V
Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Supply voltage VCC −0.5 to 7 V
Output voltage VOUT
<
=
VCC V
Stand-by voltage Vstb
<
=
VCC V
Light current IL 5 mA
Permissible power dissipation P 35 mW
Operating temperature range Topr −30 to 85 °C
Storage temperature range Tstg −40 to 100 °C
Soldering temperature range (Note 1)
Tsol 260 °C
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
TOSHIBA
?
Weight: 0.0054 g (typ.)
TPS853
2005-07-21 2
Recommendation operation conditions
Characteristics Symbol Min Typ.
Max
Unit
Supply voltage VCC 2.2 5.5 V
Stand-by voltage Vstb 2.2 VCC
V
Electrical and Optical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ.
Max
Unit
Supply voltage VCC 2.2 5.5 Ｖ
Supply current ICC+Istb VCC = 3 V, Vstb = 3 V,EV = 1000 lx
RL = 1 kΩ (Note 2)
624
µA
Supply current ICC+Istb VCC = 3 V, Vstb = 0.3 V,EV = 1000 lx
RL = 1 kΩ (Note 2)
4.2 µA
Light current (1) IL (1) VCC = 3 V, Vstb = 3 V,EV = 100 lx
(Note 2), (Note 4)
62 µA
Light current (2) IL (2) VCC = 3 V, Vstb = 3 V,EV = 10 lx
(Note 3), (Note 4)
3.7 5.2 7.4 µA
Light current (3) IL (3) VCC = 3 V, Vstb = 3 V,EV = 100 lx
(Note 3), (Note 4)
37 52 74 µA
Light current ratio (3)
L
I(1)
L
I 1.2 1.7
Dark current ILEAK VCC = 3.3 V, Vstb = 3 .3V,EV = 0 0.1 µA
Saturation output voltage VO VCC = 3 V, Vstb = 3 V,RL = 150 kΩ,
EV = 100 lx (Note 3)
2.2 2.35
V
Peak sensitivity wavelength λp 600
nm
Rise time tr 0.07
1
Switching time Fall time tf
VCC = 3 V, RL = 5 kΩ
(Note 5)
0.4 2 ms
Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light).
Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process.
IL classification IL (3) → A: 39 µA to 65 µA
Note 4: Light current measurement circuit
Note 5: Rise time/fall time time measurement method
Light
source
OUT
VCC
IL
TPS853
A
Vstb
White LED
Pulse drive
tf
tr
IF
1.5 V
VOUT
GND
90%
10%
OUT
VCC
IL
TPS853
Vstb
RL
TPS853
2005-07-21 3
Package Dimensions
Weight: 0.0054 g (typ.)
Block Diagram
: Light-receiving area
Size of light-receiving area:
(0.51x0.13 mm)
Unit: mm
Tolerance: ±0.1
( ): Reference value
Pin connection
1. VCC
2. GND
3. NC
4. Vstb
5. OUT
Center of receiving area
1. VCC
5. OUT
2. GND
3. NC
4. Vstb
TPS853
2005-07-21 4
Moisture-Proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
(2) Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Temperature: 5°C to 30°C, Relative humidity: 70% (max), Time: 168 h (max)
(3) Baking is required if the devices have been store unopened for more than six months or if the
aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Recommended baking conditions: 60°C for 12 h or longer
Mounting Precautions
(1) Do not apply stress to the resin at high temperature.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
Mounting Methods
(1) Reflow soldering
• Package surface temperature: 260°C (max)
• Please perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
• Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
• Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 70% RH or lower
• Do not perform flow soldering.
• Make any necessary soldering correction manually.
(do not do this more than once for any given pin.)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
30 s to 50 s Heating part
Time (s) →
60 s to 120 s
Temperature (°C) →
260°C max
230°C
190°C
180°C
Preheating part
TPS853
2005-07-21 5
(2) Recommended soldering pattern
(3) Cleaning conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or 30°C × 3 minutes
Ultrasonic cleaning: 300 W or less
Packing Specification
(1) Packing quantity
Reel (minimum packing quantity) 3,000 devices
Carton 5 reels (15,000 devices)
(2) Packing format
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
• Carton specification
Carton dimensions
(W) 81 mm × (L) 280 mm × (H) 280 mm
Label
0.65
1.9
0.65
0.4
0.8
Unit: mm
TPS853
2005-07-21 6
Tape Packing Specifications
(1) Reel dimensions
Reel material: Plastic
φ180
φ60
11.4
9.0
Unit: mm
5.0
Enlarged view of reel center
5.0
120°
φ13 ± 0.2
2 ± 0.5
φ21 ± 0.8
TPS853
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(2) Tape dimensions
Tape material: Plastic (anti-electrostatic)
Unit: mm
Tolerance: ±0.2
φ1.5
+ 0.1
− 0 0.18
4.0
3.5 ± 0.1
0.85 ± 0.05
2.3 ± 0.05
2.2 ± 0.05
A’
A
B’
2.0 ± 0.1
B
4.0 ± 0.1
(feed hole)
8.0
1.75
φ1.1
(pocket hole)
Cross-section between A and A’
Cross-section between B and B’
TPS853
2005-07-21 8
Reel Label
The label markings may include product number, tape type and quantity.
P/N
TYPE TPS853
ADDC Q’TY 3,000 pcs.
NOTE
Leader and Trailer Sections of Tape
Position of label
Sensor hole
Empty trailer section:
at least 10 empty device slots
Empty leader section:
at least 100 mm of carrier tape
Cover tape: 300 mm (min)
TPS853
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Ambient temperature Ta (°C)
P – Ta
Power dissipation P (mW)
Luminance EV (lx)
IL – EV (typ.)
Light current IL (µA)
Relative IL – VCC (typ.)
0
0
40
20
40
60
80
100
30
20
10
5
35
25
15
Relative light current
Supply voltage V
CC (V)
0
1.6
1.2
0.8
0.4
Ta = 25°C
2
3
4
5
6
Ambient temperature Ta (°C)
ILEAK – Ta (typ.)
Dark current ILEAK (µA)
1
0.0001
20
VCC =
3 V
Vstb=3 V
0.1
0.01
0.001
40 60
0
80 100
Ta = 25°C
VCC = 3 V
Vstb=3 V
A light source
Fluorescent light
1
10000
1000
100
10
0.1
1
10
100
1000
10000
Relative light current
Ambient temperature Ta (°C)
Relative IL – Ta (typ.)
VCC = 3 V
Vstb = 3 V
EV = 100 lx
using fluorescent light
1.40
0.60
−40
1.20
1.00
0.80
−20
0
20
40
60
80
100
Luminance EV (lx)
VO – EV (typ.)
Output voltage VO (V)
Ta = 25°C, VCC = 3 V , Vstb=3 V
Fluorescent light RL = 5.1 kΩ
Fluorescent light RL = 30 kΩ
Fluorescent light RL = 100 kΩ
A light source RL = 5.1 kΩ
A light source RL = 30 kΩ
A light source RL = 100 kΩ
0.001
10
1
0.1
0.01
1
10
100
1000
10000
TPS853
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Luminance EV (lx)
ICC – EV
(typ.)
Consumption current I
CC
(µA)
Ta
=
25
°
C
VCC = 3 V
Vstb =3V
Using the A light source
RL = 5.1 kΩ
RL = 30 kΩ
RL = 100 kΩ
0.01
100
10
1
0.1
1
10
100
1000
10000
Luminance EV (lx)
(ICC+ISTB) – EV
(typ.)
Consumption current I
CC
(µA)
Ta
=
25
°
C
VCC = 3 V
Vstb =3V
Using the A light
source
RL = 5.1 kΩ
RL = 30 kΩ
RL = 100 kΩ
1000
100
10
1
1
10
100
1000
10000
Luminance EV (lx)
Istb – EV
(typ.)
Consumption current I
CC
(µA)
Ta
=
25
°
C
VCC = 3 V
Vstb =3V
Using the A light
source RL = 5.1 kΩ
RL = 30 kΩ
RL = 100 kΩ
1000
100
10
1
1
10
100
1000
10000
Ambient temperature Ta (°C)
Relative ICC – Ta (typ.)
Relative consumption current
VCC = 3 V
Vstb = 3 V
EV = 100 lx
using fluorescent light
RL = 1 kΩ
1.40
0.60
−40
1.20
1.00
0.80
−20 0 20 40 60 80 100
Luminance EV (lx)
Istb – EV
(typ.)
Consumption current Istb (µA)
Ta
=
25
°
C
VCC = 3 V
Vstb =0.3V
Using the A Light source
1
0.1
0.01
0.001
1
10
100
1000
10000
Luminance EV (lx)
（ICC + Istb ） – EV
(typ.)
Consumption current I
CC
+ I
stb
(µA)
Ta
=
25
°
C
VCC = 3 V
Vstb =0.3V
A 光源照射
0.01
100
10
1
0.1
1
10
100
1000
10000
TPS853
2005-07-21 11
Radiation Pattern (typ.)
Luminosity
angle 30°
0°
60°
90°
90°
30°
60°
1.0
0.8
0.6
0.4
0.2
0
80°
70°
50°
40°
20°
10°
70°
80°
50°
40°
20°
10°
Ta
=
25°C
Load resistance R
L (k
Ω
)
Switching Characteristics
(non
-
saturating operation)
Switching time
(
µ
s)
t
f
t
d
t
r
t
s
1 0.1
10
10000
1000
100
1
10
100
Ta = 25°C
VCC = 3 V
Vstb = 3 V
VOUT
= 1.5 V
Using white LED
Load resistance R
L (k
Ω
)
Switching Characteristics
(saturating operation)
Switching time
(
µ
s)
10000
t
f
t
d
t
r
t
s
1 0.1
10
1000
100
1
10
100
Ta = 25°C
VCC = 3 V
Vstb = 3 V
VOUT
> 2 V
Using white LED
0.1
0.01
0
20
40
60
80
100
200
400
600
800
1000
1200
Ta = 25°C
Spectral Response (typ.)
Wavelength λ (nm)
Relative sensitivity
TPS853
2005-07-21 12
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
030619EBA
RESTRICTIONS ON PRODUCT USE
