SN74LVT244BDBRE4 - Texas Instruments

SN74LVT244B

3.3-V ABT OCTAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCAS354J − FEBRUARY 1994 − REVISED SEPTEMBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DSupports Mixed-Mode Signal Operation

(5-V Input and Output Voltages With

3.3-V VCC)

DSupports Unregulated Battery Operation

Down to 2.7 V

DTypical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA = 25°C

DIoff and Power-Up 3-State Support Hot

Insertion

DLatch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

DESD Protection Exceeds JESD 22

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

VCC

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

DB, DW, NS, OR PW PACKAGE

(TOP VIEW)

RGY PACKAGE

(TOP VIEW)

120

10 11

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

2A1 V

GND

1OE

description/ordering information

This octal buffer and line driver is designed specifically for low-voltage (3.3-V) VCC operation, but with the

capability to provide a TTL interface to a 5-V system environment.

The SN74LVT244B is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE

is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the

high-impedance state.

ORDERING INFORMATION

TAPACKAGE†ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

QFN − RGY Tape and reel SN74LVT244BRGYR LX244B

SOIC DW

Tube SN74LVT244BDW

LVT244B

SOIC − DW Tape and reel SN74LVT244BDWR LVT244B

SOP − NS Tape and reel SN74LVT244BNSR LVT244B

−40°C to 85°CSSOP − DB Tape and reel SN74LVT244BDBR LX244B

40 C

85 C

TSSOP PW

Tube SN74LVT244BPW

LX244B

TSSOP − PW Tape and reel SN74LVT244BPWR LX244B

VFBGA − GQN

Tape and reel

SN74LVT244BGQNR

LX244B

VFBGA − ZQN (Pb-free) Tape and reel SN74LVT244BZQNR LX244B

†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

SN74LVT244B

3.3-V ABT OCTAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCAS354J − FEBRUARY 1994 − REVISED SEPTEMBER 2003

2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description/ordering information (continued)

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry

disables the outputs, preventing damaging current backflow through the device when it is powered down. The

power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,

which prevents driver conflict.

terminal assignments

1234

A1A1 1OE VCC 2OE

B1A2 2A4 2Y4 1Y1

C1A3 2Y3 2A3 1Y2

D1A4 2A2 2Y2 1Y3

EGND 2Y1 2A1 1Y4

FUNCTION TABLE

(each 4-bit buffer)

INPUTS OUTPUT

OE A

OUTPUT

L H H

LLL

H X Z

logic diagram (positive logic)

218

1Y1

1OE

1A1

416

1Y2

1A2

614

1Y3

1A3

812

1Y4

1A4

11 9 2Y1

2OE

2A1

13 7 2Y2

2A2

15 5 2Y3

2A3

17 3 2Y4

2A4

Pin numbers shown are for the DB, DW, NS, PW, and RGY packages.

GQN OR ZQN PACKAGE

(TOP VIEW)

1234

SN74LVT244B

3.3-V ABT OCTAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCAS354J − FEBRUARY 1994 − REVISED SEPTEMBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage range, VCC −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage range applied to any output in the high-impedance

or power-off state, VO (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage range applied to any output in the high state, VO (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . .

Current into any output in the low state, IO 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current into any output in the high state, IO (see Note 2) 64 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, IOK (VO < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance, θJA (see Note 3): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): GQN/ZQN package 78°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 4): RGY package 37°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. This current flows only when the output is in the high state and VO > VCC.

3. The package thermal impedance is calculated in accordance with JESD 51-7.

4. The package thermal impedance is calculated in accordance with JESD 51-5.

recommended operating conditions (see Note 5)

MIN MAX UNIT

VCC Supply voltage 2.7 3.6 V

VIH High-level input voltage 2 V

VIL Low-level input voltage 0.8 V

VIInput voltage 5.5 V

IOH High-level output current −32 mA

IOL Low-level output current 64 mA

Δt/ΔvInput transition rise or fall rate Outputs enabled 10 ns/V

Δt/ΔVCC Power-up ramp rate 200 μs/V

TAOperating free-air temperature −40 85 °C

NOTE 5: All unused inputs of the device must at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications

of Slow or Floating CMOS Inputs, literature number SCBA004.

SN74LVT244B

3.3-V ABT OCTAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCAS354J − FEBRUARY 1994 − REVISED SEPTEMBER 2003

4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT

VIK VCC = 2.7 V, II = −18 mA −1.2 V

VCC = 2.7 V to 3.6 V, IOH = −100 μA VCC−0.2

VOH VCC = 2.7 V, IOH = −8 mA 2.4 V

VOH

VCC = 3 V, IOH = −32 mA 2

V27V

IOL = 100 μA 0.2

VCC = 2.7 V IOL = 24 mA 0.5

VOL IOL = 16 mA 0.4 V

VOL

VCC = 3 V IOL = 32 mA 0.5

VCC

IOL = 64 mA 0.55

Control inputs

VCC = 0 or 3.6 V, VI = 5.5 V 10

Control inputs VCC = 3.6 V, VI = VCC or GND ±1

Data inputs

V36V

VI = VCC 1μA

Data inputs VCC = 3.6 V VI = 0 −5

Ioff VCC = 0, VI or VO = 0 to 4.5 V ±100 μA

IOZH VCC = 3.6 V, VO = 3 V 5μA

IOZL VCC = 3.6 V, VO = 0.5 V −5 μA

IOZPU VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care ±100 μA

IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care ±100 μA

VCC

3.6 V,

Outputs high 0.19

ICC

CC =

IO = 0, Outputs low 5mA

ICC

VI = VCC or GND Outputs disabled 0.19

ΔICC‡VCC = 3 V to 3.6 V, One input at VCC − 0.6 V,

Other inputs at VCC or GND 0.2 mA

CiVI = 3 V or 0 4 pF

CoVO = 3 V or 0 7 pF

†All typical values are at VCC = 3.3 V, TA = 25°C.

‡This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.

switching characteristics over recommended operating free-air temperature range, CL = 50 pF

(unless otherwise noted) (see Figure 1)

PARAMETER FROM

(INPUT)

(OUTPUT)

VCC = 3.3 V

± 0.3 V VCC = 2.7 V UNIT

PARAMETER

(INPUT) (OUTPUT) MIN TYP†MAX MIN MAX

UNIT

tPLH

1.1 2.3 3.5 3.8

tPHL

A Y 1.3 2.1 3.3 3.6 ns

tPZH

1.1 2.5 4.5 5.3

tPZL

OE Y1.4 2.7 4.4 4.9 ns

tPHZ

1.9 2.8 4.4 4.5

tPLZ

OE Y1.8 2.9 4.4 4.4 ns

†All typical values are at VCC = 3.3 V, TA = 25°C.

SN74LVT244B

3.3-V ABT OCTAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCAS354J − FEBRUARY 1994 − REVISED SEPTEMBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION

1.5 V

tsu

From Output

Under Test

CL = 50 pF

(see Note A)

LOAD CIRCUIT

6 V

Open

GND

500 Ω

Data Input

Timing Input 1.5 V

2.7 V

0 V

1.5 V 1.5 V

2.7 V

0 V

2.7 V

0 V

1.5 V

Input

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

VOLTAGE WAVEFORMS

PULSE DURATION

tPLH

tPHL

tPLH

VOH

VOL

1.5 V 1.5 V

2.7 V

0 V

1.5 V1.5 V

Input

1.5 V

Output

Control

Output

Waveform 1

S1 at 6 V

(see Note B)

Output

Waveform 2

S1 at GND

(see Note B)

VOL

VOH

tPZL

tPZH

tPLZ

tPHZ

1.5 V1.5 V

3 V

0 V

1.5 V VOL + 0.3 V

1.5 V VOH − 0.3 V

≈0 V

2.7 V

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

Output

tPLH/tPHL

tPLZ/tPZL

tPHZ/tPZH

Open

6 V

GND

TEST S1

NOTES: A. CL includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.

D. The outputs are measured one at a time with one transition per measurement.

E. All parameters and waveforms are not applicable to all devices.

1.5 V

Figure 1. Load Circuit and Voltage Waveforms

PACKAGE OPTION ADDENDUM

www.ti.com 4-May-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LVT244BDB OBSOLETE SSOP DB 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI

SN74LVT244BDBR ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BGQNR LIFEBUY BGA

MICROSTAR

JUNIOR

GQN 20 1000 TBD SNPB Level-1-240C-UNLIM

SN74LVT244BNSR ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BNSRG4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BPW ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 4-May-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LVT244BPWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI

SN74LVT244BPWR ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVT244BRGYR ACTIVE VQFN RGY 20 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

SN74LVT244BRGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

SN74LVT244BZQNR ACTIVE BGA

MICROSTAR

JUNIOR

ZQN 20 1000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com 4-May-2012

Addendum-Page 3

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LVT244BDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1

SN74LVT244BDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

SN74LVT244BGQNR BGA MI

CROSTA

R JUNI

GQN 20 1000 330.0 12.4 3.3 4.3 1.5 8.0 12.0 Q1

SN74LVT244BNSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1

SN74LVT244BPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

SN74LVT244BRGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1

SN74LVT244BZQNR BGA MI

CROSTA

R JUNI

ZQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LVT244BDBR SSOP DB 20 2000 367.0 367.0 38.0

SN74LVT244BDWR SOIC DW 20 2000 367.0 367.0 45.0

SN74LVT244BGQNR BGA MICROSTAR

JUNIOR GQN 20 1000 340.5 338.1 20.6

SN74LVT244BNSR SO NS 20 2000 367.0 367.0 45.0

SN74LVT244BPWR TSSOP PW 20 2000 367.0 367.0 38.0

SN74LVT244BRGYR VQFN RGY 20 3000 367.0 367.0 35.0

SN74LVT244BZQNR BGA MICROSTAR

JUNIOR ZQN 20 1000 340.5 338.1 20.6

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

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regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265