TPD6F003 www.ti.com ................................................................................................................................................................................................. SLLS907 - AUGUST 2008 SIX-CHANNEL EMI FILTER FOR LCD DISPLAY APPLICATION FEATURES APPLICATIONS * * * * * * 1 * * LCD Display Interfaces Cell Phones SVGA Video Connections Personal Digital Assistants (PDAs) DSV PACKAGE (TOP VIEW) 1 12 2 11 3 10 4 9 5 8 6 7 DESCRIPTION/ORDERING INFORMATION The TPD6F003 is a 6-channel EMI filter in a space-saving SON package. This low-pass filter array reduces EMI emissions and provide system level ESD protection. It is used on mobile-phone LCDs or memory interfaces. The pi-style (C-R-C) filter provides at least 30 dB attenuation in the carrier frequency range (800 to 2700 MHz). The TPD6F003 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up IEC 61000-4-2 (Level 4). The TPD6F003 is specified for -40C to 85C operation. ORDERING INFORMATION TA -40C to 85C (1) (2) PACKAGE (1) (2) PACKAGE DIMENSION 0.4-mm pitch SON - DSV Length = 2.5 mm, Width = 1.35 mm, Pitch = 0.4 mm, Height = 0.75 mm ORDERABLE PART NUMBER TPD6F003DSVR TOP-SIDE MARKING PREVIEW For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. EQUIVALENT SCHEMATIC REPRESENTATION 100 Ch_In 9.5 pF Ch_Out 9.5 pF GND 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright (c) 2008, Texas Instruments Incorporated PRODUCT PREVIEW * Six-Channel EMI Filtering for Data Ports ESD Protection Exceeds IEC61000-4-2 (Level 4) - 15-kV Human-Body Model (HBM) - 8-kV IEC 61000-4-2 Contact Discharge - 15-kV IEC 61000-4-2 Air-Gap Discharge Pi-Style (C-R-C) Filter Configuration (R = 100 , CTOTAL = 19 pF) Low 10-nA Leakage Current Space-Saving SON Package (2.5 mm x 1.35 mm) and Flow-Through Pin Mapping Provide Optimum Filter Performance TPD6F003 SLLS907 - AUGUST 2008 ................................................................................................................................................................................................. www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN VIO MAX IO to GND 6 Continuous power dissipation (TA = 70C) V TBD mW Tstg Storage temperature range 150 C TJ Junction temperature 150 C Lead temperature (soldering, 10 s) 300 C (1) -65 UNIT Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS TA = -40C to 85C (unless otherwise noted) PARAMETER TEST CONDITIONS IIO = 10 A PRODUCT PREVIEW VBR DC breakdown voltage R Resistance C Capacitance (C1 or C2) VIO = 2.5 V IIO Channel leakage current VIO = 3.3 V fC Cut-off frequency ZSOURCE = 50 , ZLOAD = 50 (1) MIN TYP (1) MAX 6 90 UNIT V 100 110 9.5 pF 10 nA 200 MHz Typical values are at TA = 25C. ESD PROTECTION Human-Body Model (HBM) TYP UNIT 15 kV IEC 61000-4-2 Contact Discharge 8 kV IEC 61000-4-2 Air-Gap Discharge 15 kV 2 Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): TPD6F003 TPD6F003 www.ti.com ................................................................................................................................................................................................. SLLS907 - AUGUST 2008 TYPICAL CHARACTERISTCS 0.0E+00 -5.0E+00 -1.0E+01 Gain (dB) -1.5E+01 -2.0E+01 -2.5E+01 -3.0E+01 -3.5E+01 -4.5E+01 1.0E+06 1.0E+07 1.0E+08 1.0E+09 PRODUCT PREVIEW --4.0E+01 1.0E+10 Frequency (Hz) Figure 1. Frequency Response Data 3 dB Freq = 220 MHz 3.0E-11 2.8E-11 2.6E-11 2.4E-11 Farads 2.2E-11 2.0E-11 1.8E-11 1.6E-11 1.4E-11 1.2E-11 1.0E-11 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Volts Figure 2. Capacitance (CTOTAL) vs Input Voltage Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): TPD6F003 3 TPD6F003 1.0E-03 9.0E-04 8.0E-04 7.0E-04 6.0E-04 5.0E-04 4.0E-04 3.0E-04 2.0E-04 1.0E-04 0.0E+00 -1.0E-04 -2.0E-04 -3.0E-04 -4.0E-04 -5.0E-04 -6.0E-04 -7.0E-04 -8.0E-04 -9.0E-04 -1.0E-03 PRODUCT PREVIEW -8 .0 -7 .5 -7 .0 -6 .5 -6 .0 -5 .5 -5 .0 -4 .5 -4 .0 -3 .5 -3 .0 -2 .5 -2 .0 -1 .5 -1 .0 -0 .5 0. 0 0. 5 1. 0 1. 5 2. 0 Amps SLLS907 - AUGUST 2008 ................................................................................................................................................................................................. www.ti.com Volts Figure 3. DC Breakdown Voltage 4 Submit Documentation Feedback Copyright (c) 2008, Texas Instruments Incorporated Product Folder Link(s): TPD6F003 PACKAGE OPTION ADDENDUM www.ti.com 21-Jul-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TPD6F003DSVR PREVIEW SON DSV Pins Package Eco Plan (2) Qty 12 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee(R) Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2008, Texas Instruments Incorporated