ICS671-01
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER ZDB AND MULTIPLIER
IDT™ / ICS™
ZERO DELAY LOW SKEW BUFFER AND MULTIPLIER 4
ICS671-01 REV E 110409
AC Electrical Characteristics
VDD = 3.3V ±10%, Ambient Temperature 0 to +70°C, CLOAD at CLK = 15 pF, unless stated otherwise
Note 1: With CLKIN = 20 MHz, FBIN to CLK8, all outputs at 40 MHz.
Note 2:With CLKIN = 80 MHz, FBIN to CLK8, all outputs at 160 MHz.
Note 3: These specs do not apply to mode 01.
Thermal Characteristics (16 pin SOIC)
Ouput Low Voltage VOL IOL = 25mA 0.4 V
Output High Voltage,
CMOS level
VOH IOH = -8 mA VDD-0.4 V
Operating Supply Current IDD No Load, S1 = 1, S0 = 0,
Note 1
25 mA
No Load, S1 = 1, S0 =0
Note 2
Power Down Supply
Current
IDDPD CLKIN = 0, S0 = 0, S1 = 0 500 µA
Short Circuit Current IOS Each output ±50 mA
Input Capacitance CIN S0, S1, FBIN 7 pF
Parameter Symbol Conditions Min. Typ. Max. Units
Parameter Symbol Conditions Min. Typ. Max. Units
Input Clock Frequency fIN See table on page 2 5 80 MHz
Output Clock Frequency See table on page 2 5 160 MHz
Output Rise Time tOR 0.8 to 2.0V, CL=30 pF 1.5 ns
Output Fall Time tOF 2.0 to 0.8V, CL=30 pF 1.5 ns
Output Clock Duty Cycle tDC measured at VDD/2 40 50 60 %
Device to Device Skew rising edges at VDD/2, Note 3 700 ps
Output to Output Skew rising edges at VDD/2, Note 3 250 ps
Input to Output Skew rising edges at VDD/2, FBIN to
CLK8
±350 ps
Maximum Absolute JItter 15 pF 300 ps
Cycle to Cycle Jitter 30 pF loads 500 ps
PLL Lock Time Note 3 1.0 ms
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
θJA Still air 120 °C/W
θJA 1 m/s air flow 115 °C/W
θJA 3 m/s air flow 105 °C/W
Thermal Resistance Junction to Case θJC 58 °C/W