2002 Microchip Technology Inc. DS21432B-page 1
MTC53
Features
• Highly Accurate: ±2%
• Low Power Consumption: 1.0µA, Typ.
• Detect Voltage Range: 1.6V to 6.0V and 7.7V
• Operating Voltage: 1.5V to 10.0V
• Output Confi guration: Open-Dr a in or CMOS
• Space-Saving 5-Pin SOT-23A Package
Typical Applications
• Micropr ocess or Rese t Circuit s
• Battery Life Monitors and Recharge Voltage
Monitors
• Memory Battery Backup Circuitry
• Power-On Reset Circuits
• Power Failure Detection
• Delay Circuitry
Device Selection Table
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
General Description
The TC53 is a low power voltage detector. Typical
supply current consumption is only 1µA at an input
volt age of 2V. The vo ltage detection thre shold settin g is
factor y-prog ramme d and gu arantee d to ± 2 % accu racy.
Threshold settings are available over a range of 1.6V
to 6.0V. The TC53 has both complementary (CMOS)
and open drain (NMOS) output configuration options.
TC53 is the ideal voltage detector for precision
applic ations in whic h small s ize, low inst alled c ost, hig h
accuracy and low supply current consumption are
critical.
Functional Block Diagram
Part Number Package Temp. Range
TC53-xxxxxxxxxx 5-Pin SOT-23A -40°C to +85 °C
5
5-Pin SOT-23A
TC53
13
4
2
NC
VOUT VIN VSS
NC
VREF
VSS
VOUT
VIN
VREF
VSS
VOUT
VIN
2) N-Channel
Open Drain Output
1) CMOS Output
Voltage Detector
TC53
DS21432B-page 2 2002 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage ........................................................+12V
Output Curren t ........ ...... ..... ................. ...... ..........50mA
Output Voltage............... ..... ...VIN + 0.3V to VSS – 0.3V
Power Dissipation
5-Pin SOT-23A...........................................240mW
Operati ng Tem pe ratu re Range.............-40°C to +85°C
Storage Temperature Range..............-40°C to +125°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and funct ional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC53 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 25°C, unless otherwise specified. Note 1, Note 2.
Symbol Paramete r Min Typ Max Units Test Conditions
VDF Detect Voltage VT x 0.98 VT ±0.5% VT x 1.02 V Note 3
VHYS Hysteresis Range VDF x 0.02 VDF x 0.05 VDF x 0.08 V
ISS Supply Current —
—
—
—
—
0.9
1.0
1.3
1.6
2.0
2.6
3.0
3.4
3.8
4.2
µAV
IN = 1.5V
VIN = 2.0V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
VIN Operating Voltage 1.5 —10.0 V VDF = 2.1 to 6.0V
IOUT Output Current —
—
—
—
—
2.2
7.7
10.1
11.5
13.0
—
—
—
—
—
mA N-ch; VDS = 0.5V, VIN = 1.0V
VIN = 2.0V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
—-10.0 —P-ch ; VDS = 2.1V, VIN = 8.0V
(CMOS Output)
∆VDF/
(∆TOPR VDF)Temperature Characteristics —±100 —ppm/°C
tDLY Delay Time
(VDR → VOUT Inversion) ——0.2 msec
Note 1: An additional resistor between the VIN pin and the supply voltage may alter the electrical characteristics due to the increasing values of
VDR.
2: The power consumption during power-start to output being stable (release operation) is 2µA greater than it is after that period
(completion of release operation) because of rush current in the delay circuit.
3: VT is the factory-programmed voltage detection threshold.
2002 Microchip Technology Inc. DS21432B-page 3
TC53
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
3.0 DETAILED DESCRIPTION
FIGURE 3-1: TIMING DIAGRAM
Pin No.
(5-Pin SOT-23A) Symbol Description
1V
OUT1 Output.
2V
IN Supply voltage input.
3V
SS Ground terminal.
4 NC Not connected.
5 NC Not connected.
Input Voltage (VIN)
Detect Release Voltage (VDR)
Detect Voltage (VDF)
Minimum Operating Voltage (VMIN)
Ground Voltage (VSS)
Output Voltage (VOUT)
Ground Voltage (VSS)
TC53
DS21432B-page 4 2002 Microchip Technology Inc.
4.0 P ACKAGING INFORMATION
4.1 Package Marking Information
Symbol Output Voltage
ACMOS0.
BCMOS1.
CCMOS2.
DCMOS3.
ECMOS4.
FCMOS5.
HCMOS6.
Symbol Output Voltage
KNch0.
LNch1.
MNch2.
NNch3.
PNch4.
RNch5.
SNch6.
3
1represents output configura tion and firs t integer
of voltage
Symbol Voltage
0.0
1.1
2.2
3.3
4.4
5.5
6.6
7.7
8.8
9.9
2represents first decimal of output voltage
4repr esents assembly lot code
3represents delay function and delay time
3 = no delay function
2002 Microchip Technology Inc. DS21432B-page 5
TC53
4.2 Taping Form
4.3 Package Dimensions
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
5-Pin SOT-23A 8 mm 4 mm 3000 7 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)
W
P
.071 (1.80)
.059 (1.50)
.122 (3.10)
.098 (2.50)
.075 (1.90)
REF.
.020 (0.50)
.012 (0.30)
PIN 1
.037 (0.95)
REF.
.122 (3.10)
.106 (2.70)
.057 (1.45)
.035 (0.90)
.006 (0.15)
.000 (0.00)
.024 (0.60)
.004 (0.10)
10° MAX. .010 (0.25)
.004 (0.09)
SOT-23A-5
Dimensions: inches (mm)
TC53
DS21432B-page 6 2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc. DS21432B-page7
TC53
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
PART CODE TC53 X XX 02 ECX XX
Output Configuration :
N = NMOS
C = CMOS
Detected Voltage:
Ex: 18 = 1.8V
Ex: 28 = 2.8V
Ex: 30 = 3.0V
Tolerance:
02 = ±2%
Temperature/Package:
E: -40°C to +85°C
CT: 5-Pin SOT23A Package
Taping Direction:
TR: Standard Taping
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com /cn) to receive the most current information on our products.
TC53
DS21432B-page8 2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc. DS21432B-page 9
TC53
Information contained in this publication regarding device
applications and the like is intended through sug gestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microc hip Technology Incorporated with respect
to the accuracy or use of such inf orm ation, or inf ringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexRO M, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPI C, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
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devices, Se rial EEP ROM s, micro pe ri ph era ls,
non-vol atil e me mor y and ana l og pro duc ts. In
addition, Microchip’s quality system for the
design and manufacture of development
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DS21432B-page 10 2002 Microchip Technology Inc.
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