PKF4910ASI - Ericsson Power Modules

PKF series

General information

The MacroDens™ PKF family of true component

level on-board DC/DC power modules are intended

as distributed power sources in decentralized power

systems. Utilization of thick film technology and a

high degree of silicon integration has made it possible

to achieve a MTTF of more than 10 million hours.

The high reliability and the very low heights of these

DC/DC power modules makes them particularly

suited for Information Technology and Telecom

(IT&T) applications, with board spacing down to

15 mm or 0.6 in. They are optimized for an

operational ambient temperature range in compliance

• SMD and through hole versions with

ultra-low component height 8.0 mm

(0.315 in.)

• Up to 87% efficiency at full load

• Safety requirements in accordance

with EN60950

• MTTF >10 million hours at +50°C case

temperature (+40°C ambient)

• Low EMI

PKF series

with present and future application needs, including

non temperature controlled environments. The

mechanical design offers surface mount and through-

hole versions, delivered in ready-to-use tubes, trays or

tape & reel packages, and compatibility with semi and

fully aqueous cleaning processes. The PKF series is

manufactured in highly automated production lines

using SMT, laser trimming, 100% burn-in and ATE

final inspection.

Ericsson Microelectronics AB has been an ISO 9001

certified supplier since 1991. For a complete product

program please reference the back cover.

Patents

US: D357901 DE: M94022763

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2EN/LZT 146 57 R1A ©Ericsson Microelectronics AB, March 2001

1) Applies to through-hole versions

2) For surfacemount versions please see soldering profile page 4.

Environmental Characteristics

Characteristics

Vibration

(Sinusoidal)

JESD 22-B103

(IEC 68-2-6 Fc)

Test procedure & conditions

MIL-STD-883

Method 2026

(IEC 68-2-34 Ed)

Random

vibration

Temperature

change

JESD 22-A104

(IEC 68-2-14 Na)

Frequency

Amplitude

Acceleration

Number of cycles

10…500 Hz

0.75 mm

10 g

10 in each axis

Frequency

Acceleration density

spectrum

Duration

Reproducability

10…500 Hz

0.5 g2/Hz

10 min in 3 directions

medium (IEC 62-36)

Peak acceleration

Shock duration

200 g

3 ms

Duration

Temperature

96 h

35°C

JESD 22-A-A107

(IEC 68-2-11 Ka)

Aggressive

environment

Resistance to

soldering temp1) 2)

JESD 22-B106

(IEC 68-2-20 Tb 1A)

Temperature, solder

Duration 260°C

10...13 s

High temp

Storage life JESD22-A10 Temperature

Duration 125°C

1000hrs

Lead Integrity

Solderability

JESD22-B105 Number of cycles 2

JESD22-B102

Operational

life test

Temperature

Maximum load

Input voltage on

Input voltage off

Duration

85°C

9min

3min

1000hrs

Moisture reflow

Senitive classification J-STD-020 Level 1

JESD 22-A101

(IEC 68-2-3 Ca

with bias)

Temperature

Humidity

Duration

85°C

85% RH

1000 hours

Shock

(Half sinus)

JESD 22-B104

(IEC 68-2-27 Ea)

Temperature

Number of cycles –40°C…+125°C

500

Accelerated

damp heat

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EN/LZT 146 57 R1A ©Ericsson Microelectronics AB, March 2001

3.6[0.142]

5.0[0.197]

24.0[0.945]

29.6[ 1.165]

2.8[0.110]

12 3456 789

1011

131415

40.0[1.575]

Case

The case consists of semiconductor grade

epoxy with embedded pins.

Coefficient of thermal expansion (CTE) is typ.

15 ppm/°C.

Weight

Maximum 20 g (0.71 oz).

Connection Pins

Base material is copper (Cu), first plating is

nickel (Ni) and second (outer) plating is

palladium (Pd).

Dimensions in mm (in)

Mechanical Data

Through-hole version

Foot print Component side

Dimensions in mm (in) Dimensions in mm (in)

Surface-mount version

Foot print Component side

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4EN/LZT 146 57 R1A ©Ericsson Microelectronics AB, March 2001

Thermal Data

Two-parameter model

This model provides a more precise description of the thermal char-

acteristics to be used for thermal calculations.

Thermally the power module can be considered as a component and

the case temperature can be used to characterize the properties. The

thermal data for a power module with the substrate in contact with

the case can be described with two thermal resistances. One from

case to ambient air and one from case to PB (Printed circuit Board).

The thermal characteristics temperature can be calculated from the

following formula:

Palladium plating is used on the terminal pins. A pin temperature (Tp)

in excess of the solder fusing temperature (+183°C for Sn/Pb 63/37)

for more than 25 seconds and a peak temperature above 195°C, is

required to guarantee a reliable solder joint.

Both pin 1 and pin 11 must be monitored.

No responsibility is assumed if these recommendations are not

strictly followed.

Reflow Soldering Information

The PKF series of DC/DC power modules are manufactured in sur-

face mount technology. Extra precautions must therefore be taken

when reflow soldering the surface mount version. Neglecting the

soldering information given below may result in permanent damage

or significant degradation of power module performance.

The PKF series can be reflow soldered using IR, Natural Convection,

Forced Convection or Combined IR/Convection Technologies. The

high thermal mass of the component and its effect on DT (°C) re-

quires that particular attention be paid to other temperature sensi-

tive components.

IR Reflow technology may require the overall profile time to be

extended to approximately 8–10 minutes to ensure an acceptable

DT. Higher activity flux may be more suitable to overcome the

increase in oxidation and to avoid flux burn-up.

The general profile parameters detailed in the diagram, with this ex-

tended time to reach peak temperatures, would then be suitable.

Note! These are maximum parameters. Depending on process varia-

tions, an appropriate margin must be added.

TPB = (TC–TA)×(Rth C–PB+Rth C–A)/Rth C–A–Pd×Rth C–PB+TA

Where:

Pd: dissipated power, calculated as PO ×(l/h–1)

TC: max average case temperature

TA: ambient air temperature at the lower side of the

power module

TPB: temperature in the PB between the PKF connection pins

Rth C-PB: thermal resistance from case to PB under the

power module

Rth C-A: thermal resistance from case to ambient air

v: velocity of ambient air

Rth C-PB is constant and Rth C-A is dependent on the air velocity.

Free convection is equal to an air velocity of aprox. 0.2 – 0.3 m/s.

See figure below.

Figure 4

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EN/LZT 146 57 R1A ©Ericsson Microelectronics AB, March 2001

Delivery Package Information

Tubes

The PKF-series is delivered in tubes (designated by /A) with a

length of 500 mm (19.69 in), see fig. 2.

Figure 2

Specification

Material: Antistatic coated PVC

Max surface resistance: 1011W/

Color: Transparent

Capacity: 10 power modules/tube

Weight: Typ. 60 g

End stops: Pins

Trays

SMD versions, SI, can be delivered in standard JEDEC trays (desig-

nated by /B) on request, see fig. 3. For more information, please

contact your local Ericsson sales office.

Figure 3

Specification

Material: Polypropylene (PP)

Max temperature: 125ºC

Max surface resistance: 105W/

Color: Black

Tape & Reel

SMD versions, SI, can be delivered in standard tape & reel package

(designated by /C) on request, see fig. 4. For more information, please

contact your local Ericsson sales office.

Figure 4

Capacity: 15 power modules/tray

Stacking pitch: 10.16 mm

Weight: Typ. 130 g

Min. order quantity: 150 pcs (one box contains 10 full trays)

Specification

Tape material: Conductive polystyrene (PS)

Tape width: 72 mm

Tape pitch: 36 mm

Max surface resistance: 105W/

Tape color: Black

Cover tape color: Transparent

Reel diameter: 13"

Reel hub diameter: 4"

Reel capacity: 150 power modules/reel

Full reel weight: Typ. 3.7 kg

Min. order quantity: 300 pcs (one box contains two reels)

9.5

(0.37)

1.1

(0.04)

(1.38)

(0.59)

(0.43)

14.5

(0.57)

(0.95)

All dimensions in mm (in)

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Quality

Reliability

Meantime to fail (MTTF) is calculated to >10 million hours at

full output power and a case temperature of +50°C

(TA = +40°C), using the Ericsson failure rate data system.

The Ericsson failure rate data system is based on field failure

rates and is continuously updated. The data corresponds to actual

failure rates of components used in Information Technology and

Telecom equipment in temperature controlled environments

(TA = –5… +65°C). The data is considered to have a confidence

level of 90%. For more information see Design Note 002.

Quality Statement

The products are designed and manufactured in an industrial

environment where quality systems and methods like ISO 9000,

6s and SPC, are intensively in use to boost the continuous

improvements strategy. Infant mortality or early failures in the

products are screened out by a burn-in procedure and an ATE-

based final test. Conservative design rules, design reviews and

product qualifications, plus the high competence of an engaged

work force, contribute to the high quality of our products.

Warranty

Ericsson Microelectronics warrants to the original purchaser or

end user that the products conform to this Data Sheet and are

free from material and workmanship defects for a period of five

(5) years from the date of manufacture, if the product is used

within specified conditions and not opened. In case the product

is discontinued, claims will be accepted up to three (3) years from

the date of the discontinuation. For additional details on this

limited warranty please refer to Ericsson Microelectronics AB’s

“General Terms and Conditions of Sales”, or individual contract

documents.

Limitation of liability

Ericsson Microelectronics does not make any other warranties,

expressed or implied including any warranty of merchantability

or fitness for a particular purpose (including, but not limited to,

use in life support applications, where malfunctions of product

can cause injury to a person’s health or life).

Information given in this data sheet is believed to be accurate and reliable. No

responsibility is assumed for the consequences of its use nor for any infringement

of patents or other rights of third parties which may result from its use.

No license is granted by implication or otherwise under any patent or patent rights of

Ericsson Microelectronics. These products are sold only according to Ericsson Micro-

electronics’ general conditions of sale, unless otherwise confirmed in writing.

Specifications subject to change without notice.

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Ericsson Microelectronics

SE-164 81 KISTA, Sweden

Phone: +46 8 757 5000

www.ericsson.com/microelectronics

For local sales contacts, please refer to our website

or call: Int. +46 8 757 4700, Fax: +46 8 757 4776 EN/LZT 146 57 R1A

Data Sheet

The latest and most complete infor-

mation can be found on our website!

Product Program

VO/IO max Part No.

SMD

PO max

O/P 1 O/P 2

3.3V/2.0A 6.6W PKF 2610A PI PKF 2610A SI

5V/1.2A 6W PKF 2611 PI PKF 2611 SI

5V/2.0A 10W PKF 2111A PI PKF 2111A SI

12V/1.0A 12W PKF 2113A PI PKF 2113A SI

1.8V/5A 9W PKF 4918B SI

2.1V/1.5A 3W PKF 4310 PI PKF 4310 SI

2.5V/4.4A 11W PKF 4919B SI

3.3V/1.5A 5W PKF 4510 PI PKF 4510 SI

3.3V/2.0A 6.6W PKF 4610A PI PKF 4610A SI

3.3V/3.0A 9.9W PKF 4910A PI *) PKF 4910A SI

3.3V/4.0A 13.2W PKF 4110B SI

5V/1.2A 6W PKF 4611 PI PKF 4611 SI

5V/2.0A 10W PKF 4111A PI **) PKF 4111A SI

5V/3.0A 15W PKF 4211A PI PKF 4211A SI

12V/0.6A 7W PKF 4713 PI PKF 4713 SI

3.3 V/2.1A +5V/ 0.5A 9.4W PKF 4928A SI

+5V/1.0A -5V/ 1.0A 6W PKF 4622 PI PKF 4622 SI

+5V/1.0A +3.3V/ 1.0A 6W PKF 4628 PI PKF 4628 SI

+12V/0.5A -12V/ 0.5A 6W PKF 4621 PI PKF 4621 SI

+12V/0.84A -12V/ 0.84A 10W PKF 4121A SI

3.3V/1.5A 5W PKF 5510 PI PKF 5510 SI

5V/1.2A 6W PKF 5611 PI PKF 5611 SI

7V/0.86A 6W PKF 5617 PI PKF 5617 SI

12V/0.67A 8W PKF 5713 PI PKF 5713 SI

Through Hole

*) PKF 4910A PI NS

**) PKF 4111A PI NS

NS = versions without synchronization function

18-75 Vdc

18-36 Vdc

36-75 Vdc

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