Description
These Precision Optical Perform ance AlInGaP LEDs pro-
vide superior light output for excellent readability in sun-
light and are extremely reliable. AlInGaP LED technology
provides extremely stable light output over long periods
of time. Precision Optical Per formance lamps utilize the
aluminum indium gallium phos phide (AlInGaP) technol-
ogy.
These LED lamps are untinted, nondiused, T-13/4 pack-
ages incorporating second generation optics producing
well dened spatial radiation patterns at specic viewing
cone angles.
These lamps are made with an advanced optical grade
epoxy, oering superior high tempera ture and high
moisture resistance performance in outdoor signal and
sign applications. The high maximum LED junction
tempera ture limit of +130°C enables high temperature
operation in bright sunlight conditions. The package ep-
oxy contains both uv-a and uv-b in hibitors to reduce the
eects of long term exposure to direct sunlight.
These lamps are available in two package options to give
the designer exibility with device mounting.
Benets
• Viewing angles match trac management sign require-
ments
• Colors meet automotive and pedestrian signal speci-
cations
• Superior performance in outdoor environments
• Suitable for autoinsertion onto PC boards
Features
• Well dened spatial radiation patterns
• Viewing angles: 8°, 15°, 23°, 30°
• High luminous output
• Colors:
590 nm amber
605 nm orange
615 nm reddish-orange
626 nm red
• High operating temperature: TJ led = +130°C
• Superior resistance to moisture
• Package options:
With or without lead stand-os
Applications
• Trac management:
Trac signals
Pedestrian signals
Work zone warning lights
Variable message signs
• Commercial outdoor advertising:
Signs
Marquees
• Automotive:
Exterior and interior lights
HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx
T-13/4 (5 mm) Precision Optical Performance
AlInGaP LED Lamps
Data Sheet
2
Device Selection Guide
Typical
Viewing Angle
2θ1
/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standos on Leads
(Outline Drawing A)
Lamps with Standos
on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min. Max.
8°
Amber 590 HLMP-EL08-T0000 2500 –
HLMP-EL08-VY000 HLMP-EL10-VY000 4200 12000
HLMP-EL08-VYK00 4200 12000
HLMP-EL08-WZ000 HLMP-EL10-WZ000 5500 16000
HLMP-EL08-X1K00 HLMP-EL10-X1K00 7200 21000
HLMP-EL08-X1000 HLMP-EL10-X1000 7200 21000
Orange 605 HLMP-EJ08-WZ000 5500 16000
HLMP-EJ08-X1000 HLMP-EJ10-X1000 7200 21000
HLMP-EJ08-Y2000 9300 27000
Red-Orange 615 HLMP-EH08-UX000 HLMP-EH10-UX000 3200 9300
HLMP-EH08-WZ000 HLMP-EH10-WZ000 5500 16000
HLMP-EH08-X1000 HLMP-EH10-X1000 7200 21000
HLMP-EH08-Y2000 HLMP-EH10-Y2000 9300 27000
Red 626 HLMP-EG08-T0000 HLMP-EG10-T0000 2500 –
HLMP-EG08-VY000 4200 12000
HLMP-EG08-WZ000 HLMP-EG10-WZ000 5500 16000
HLMP-EG08-X1000 HLMP-EG10-X1000 7200 21000
HLMP-EG08-YZ000 9300 16000
HLMP-EG08-Y2000 HLMP-EG10-Y2000 9300 27000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the o-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
3
Device Selection Guide
Typical
Viewing Angle
2θ1
/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standos on Leads
(Outline Drawing A)
Lamps with Standos
on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min. Max.
15° Amber 590 HLMP-EL15-PS000 880 2500
HLMP-EL15-QSK00 1150 2500
HLMP-EL15-QT000 1150 3200
HLMP-EL15-UX000 HLMP-EL17-UX000 3200 9300
HLMP-EL15-VY000 HLMP-EL17-VY000 4200 12000
HLMP-EL15-VYK00 4200 12000
HLMP-EL15-VW000 4200 7200
Orange 605 HLMP-EJ17-QT000 1150 3200
HLMP-EJ15-PS000 880 2500
HLMP-EJ15-RU000 1500 4200
HLMP-EJ15-SV000 HLMP-EJ17-SV000 1900 5500
Red-Orange 615 HLMP-EH15-QT000 1150 3200
HLMP-EH15-RU000 1500 4200
HLMP-EH15-TW000 2500 7200
Red 626 HLMP-EG15-PS000 880 2500
HLMP-EG15-QT000 1150 3200
HLMP-EG15-RU000 HLMP-EG17-RU000 1500 4200
HLMP-EG15-UX000 HLMP-EG17-UX000 3200 9300
HLMP-EG15-TW000 HLMP-EG17-TW000 2500 7200
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the o-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
4
Device Selection Guide
Typical
Viewing Angle
2θ1
/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standos on Leads
(Outline Drawing A)
Lamps with Standos
on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min. Max.
23° Amber 590 HLMP-EL24-NR000 680 1900
HLMP-EL24-PS000 HLMP-EL26-PS000 880 2500
HLMP-EL24-QR000 1150 1900
HLMP-EL24-QRK00 1150 1900
HLMP-EL24-QS400 1150 2500
HLMP-EL24-QT000 HLMP-EL26-QT000 1150 3200
HLMP-EL24-SU400 1900 4200
HLMP-EL24-TW000 2500 7200
Orange 605 HLMP-EJ24-QT000 1150 3200
Red-Orange 615 HLMP-EH24-PS000 HLMP-EH26-PS000 880 2500
HLMP-EH24-QT000 1150 3200
HLMP-EH24-RU000 1500 4200
Red 626 HLMP-EG24-M0000 520 –
HLMP-EG24-PS000 HLMP-EG26-PS000 880 2500
HLMP-EG24-QT000 1150 4200
HLMP-EG24-RU000 1500 4200
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the o-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
5
Device Selection Guide
Typical
Viewing Angle
2θ1
/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standos on Leads
(Outline Drawing A)
Lamps with Standos
on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min. Max.
30° Amber 590 HLMP-EL30-K0000 310 –
HLMP-EL30-MQ000 520 1500
HLMP-EL30-PQ000 880 1500
HLMP-EL30-PR400 880 1900
HLMP-EL30-PS000 HLMP-EL32-PS000 880 2500
HLMP-EL30-PSK00 880 2500
HLMP-EL30-QT000 1150 3200
HLMP-EL30-QTK00 1150 3200
HLMP-EL30-STK00 1900 3200
HLMP-EL30-SV000 HLMP-EL32-SV000 1900 5500
HLMP-EL30-SVK00 1900 5500
Orange 605 HLMP-EJ30-NR000 680 1900
HLMP-EJ30-PS000 HLMP-EJ32-PS000 880 2500
Red-Orange 615 HLMP-EH30-MQ000 520 1500
HLMP-EH30-NR000 680 1900
HLMP-EH30-PS000 880 2500
Red 626 HLMP-EG30-KN000 310 880
HLMP-EG30-MQ000 HLMP-EG32-MQ000 520 1500
HLMP-EG30-NQ000 680 1500
HLMP-EG30-NR000 HLMP-EG32-NR000 680 1900
HLMP-EG30-PQ000 880 1500
HLMP-EG30-PR000 880 1900
HLMP-EG30-PS000 880 2500
HLMP-EG30-QT000 HLMP-EG32-QT000 1150 3200
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the o-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
6
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin Selections
0: No color bin limitation
4: Amber color bin 4 only
K: Amber color bins 2 and 4 only
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Viewing Angle & Lead Stand Os
08: 8 deg without lead stand os
10: 8 deg with lead stand os
15: 15 deg without lead stand os
17: 15 deg with lead stand os
24: 23 deg without lead stand os
26: 23 deg with lead stand os
30: 30 deg without lead stand os
32: 30 deg with lead stand os
Color
G: 626 nm Red
H: 615 nm Red-Orange
J: 605 nm Orange
L: 590 nm Amber
Package
E: 5 mm Round
Part Numbering System
Note: Please refer to AB 5337 for complete information on part numbering system.
7
Package Dimensions
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.)
DOWN THE LEADS.
3. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
d
1.50 ± 0.15
(0.059 ± 0.006)
PART NO.
d
HLMP-XX10 HLMP-XX17 HLMP-XX26 HLMP-XX32
AB
12.37 ± 0.25
(0.487 ± 0.010)
12.42 ± 0.25
(0.489 ± 0.010)
12.52 ± 0.25
(0.493 ± 0.010)
11.96 ± 0.25
(0.471 ± 0.010)
8
Absolute Maximum Ratings at TA = 25°C
DC Forward Current [1,2,3] 50 mA
Peak Pulsed Forward Current [2,3] 100 mA
Average Forward Current [3] 30 mA
Reverse Voltage (IR = 100 µA) 5 V
LED Junction Temperature 130 °C
Operating Temperature -40 °C to +100 °C
Storage Temperature -40 °C to +100 °C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more
information on recommended drive conditions, please refer to Application Brief I-024.
3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.
Electrical/Optical Characteristics at T
A = 25 °C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Amber (λd = 590 nm)
Orange (λd = 605 nm)
Red-Orange (λd = 615 nm)
Red (λd = 626 nm)
VF
2.02
1.98
1.94
1.90
2.4
V IF = 20 mA
Reverse Voltage VR5 20 V IR = 100 µA
Dominant Wavelength
Red
Amber
Orange
Red Orange
λd
620.0
584.5
599.5
612.0
626.0
590.0
605.0
615.0
630.0
594.5
610.5
621.7
nm IF = 20 mA
Peak Wavelength:
Amber (λd = 590 nm)
Orange (λd = 605 nm)
Red-Orange (λd = 615 nm)
Red (λd = 626 nm)
λPEAK
592
609
621
635
nm Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Spectral Halfwidth ∆λ1/2 17 nm Wavelength Width at Spectral
Distribution 1/2 Power Point at
IF = 20 mA
Speed of Response ts20 ns Exponential Time Constant, e-t/ts
Capacitance C 40 pF VF = 0, f = 1 MHz
Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Cathode Lead
Luminous Ecacy[1]
Amber (λd = 590 nm)
Orange (λd = 605 nm)
Red-Orange (λd = 615 nm)
Red (λd = 626 nm)
hv
480
370
260
150
lm/W Emitted Luminous Power/
Emitted Radiant Power
Luminous Flux jv500 mlm IF = 20 mA
Luminous Eciency [2]
Amber
Orange
Red-Orange
Red
he
12
13
13
13
lm/W Emitted Luminous Flux/
Electrical Power
Note:
1. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv
is the luminous ecacy in lumens/watt.
2. he = jV / IF x VF, where jV is the emitted luminous ux, IF is electrical forward current and VF is the forward voltage.
9
WAVELENGTH – nm
RELATIVE INTENSITY
550 600 650 700
1.0
0.5
0
AMBER RED-ORANGE
ORANGE RED
CURRENT – mA
1.0
0
VF – FORWARD VOLTAGE – V
2.5
100
40
30
1.5 2.0
60
3.0
10
20
50 RED
AMBER
70
80
90
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
IF – DC FORWARD CURRENT – mA
40
3.0
2.0
1.5
1.0
0.5
20 60
2.5
IF – FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – C
40 80
50
45
35
25
15
5
55
40
30
20
10
20 60 100 120
Figure 1. Relative intensity vs. peak wavelength Figure 2. Forward current vs. forward voltage
Figure 3. Relative luminous intensity vs. forward current Figure 4. Maximum forward current vs. ambient temperature
10
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
0.1
0.3
0.4
0.9
-60 -30 0 30 60 90-90
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
0.1
0.3
0.4
0.9
30 60 90 120 150 1800
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
0.1
0.3
0.4
0.9
-50 0 50 100-100 0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
Figure 8. Representative spatial radiation pattern for 30° viewing angle
lamps
Figure 6. Representative spatial radiation pattern for 15° viewing angle
lamps
Figure 7. Representative spatial radiation pattern for 23° viewing angle
lamps
Figure 5. Representative spatial radiation pattern for 8° viewing angle
lamps
11
Figure 9. Relative light output vs. junction temperature
0.1
RELATIVE LOP
(NORMALIZED AT 25C)
JUNCTION TEMPERATURE – C
-50
10
1
-25 0 25 50 75 150100 125
ORANGE
RED
RED-ORANGE
AMBER
Intensity Bin Limits
(mcd at 20 mA)
Bin Name Min. Max.
K 310 400
L 400 520
M 520 680
N 680 880
P 880 1150
Q 1150 1500
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
1 16000 21000
2 21000 27000
Tolerance for each bin limit is ± 15%.
Amber Color Bin Limits
(nm at 20 mA)
Bin Name Min. Max.
1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
Tolerance for each bin limit is ± 0.5 nm.
Note:
1. Bin categories are established for classication of products.
Products may not be available in all bin categories.
12
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder opera-
tion, as the excess lead length also acts as small heat
sink.
Soldering and Handling:
• Care must be taken during PCB assembly and solder-
ing process to prevent damage to the LED component.
• LED component may be eectively hand soldered
to PCB. However, it is only recommended under un-
avoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
Note:
1. PCB with dierent size and design (component density) will have
dierent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
prole again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high eciency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED conguration
• ESD precaution must be properly applied on the sol-
dering station and personnel to prevent ESD damage
to the LED component that is ESD sensitive. Do refer
to Avago application note AN 1142 for details. The sol-
dering iron used should have grounded tip to ensure
electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and main-
tained according to the recommended tempera-
ture and dwell time. Customer is advised to perform
daily check on the soldering prole to ensure that
it is always conforming to recommended soldering
conditions.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal mate-
rial is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment xture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommend-
ed that surface mount components be soldered on
the top side of the PCB. If surface mount need to be
on the bottom side, these components should be sol-
dered using reow soldering prior to insertion the TH
LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause diculty inserting the TH LED.
CATHODE
1.59mm
13
Ammo Pack Drawing
Figure 10. Recommended wave soldering prole
Example of Wave Soldering Temperature Prole for TH LED
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
18.00 ± 0.50
(0.7087 ± 0.0197)
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
12.70 ± 0.30
(0.50 ± 0.0118)
CATHODE
0.70 ± 0.20
(0.0276 ± 0.0079)
20.50 ± 1.00
(0.807 ± 0.039)
A A
VIEW A–A
∅4.00 ± 0.20
(0.1575 ± 0.008) TYP.
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
0 100
250
200
150
100
50
TIME (SECONDS)
PREHEAT
TURBULENT WAVE LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin ux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be suciently
cooled to room temperature before
exerting mechanical force.
TEMPERATURE (°C)
10 20 30 40 50 60 70 80 90
14
Packaging Box for Ammo Packs
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
AVAGO
TECHNOLOGIES
ANODE
MOTHER LABEL
CATHODE
C
A
+
–
ANODE LEAD LEAVES
THE BOX FIRST.
NOTE:
THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
LABEL ON
THIS SIDE
OF BOX.
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4368EN
AV02-0373EN - July 22, 2014
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLE-
AR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO
MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
(ii) Avago Baby Label (Only available on bulk packaging)
Acronyms and Denition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Avago Technologies:
HLMP-EG08-T0000 HLMP-EG08-VY000 HLMP-EG08-WZ000 HLMP-EG08-WZ0DD HLMP-EG08-X1000 HLMP-
EG08-X10DD HLMP-EG08-Y2000 HLMP-EG08-Y20DD HLMP-EG08-YZ000 HLMP-EG08-YZ0DD HLMP-EG08-
Z2000 HLMP-EG10-T0000 HLMP-EG10-WZ000 HLMP-EG10-X1000 HLMP-EG10-X10DD HLMP-EG10-Y2000
HLMP-EG10-Y20DD HLMP-EG15-N0000 HLMP-EG15-PS000 HLMP-EG15-QT000 HLMP-EG15-QT0DD HLMP-
EG15-RU000 HLMP-EG15-SV000 HLMP-EG15-TW000 HLMP-EG15-TW0DD HLMP-EG15-UX000 HLMP-EG15-
UX0DD HLMP-EG17-N0000 HLMP-EG17-QT000 HLMP-EG17-RU0DD HLMP-EG17-SV000 HLMP-EG17-TW000
HLMP-EG17-UX000 HLMP-EG24-M0000 HLMP-EG24-PQ0DD HLMP-EG24-PS000 HLMP-EG24-PS002 HLMP-
EG24-PS0DD HLMP-EG24-PS0YY HLMP-EG24-QT000 HLMP-EG24-RS0DD HLMP-EG24-RU000 HLMP-EG24-
SV0DD HLMP-EG26-M0000 HLMP-EG26-PS000 HLMP-EG26-PS0DD HLMP-EG26-RU000 HLMP-EG26-RU0DD
HLMP-EG30-K0000 HLMP-EG30-KN000 HLMP-EG30-KN0DD HLMP-EG30-LP0DD HLMP-EG30-MQ000 HLMP-
EG30-MQ0DD HLMP-EG30-NQ000 HLMP-EG30-NQ0DD HLMP-EG30-NR000 HLMP-EG30-NR0DD HLMP-EG30-
PQ000 HLMP-EG30-PQ0DU HLMP-EG30-PR000 HLMP-EG30-PS000 HLMP-EG30-PS0DD HLMP-EG30-QT000
HLMP-EG30-QT0DD HLMP-EG30-RS0DD HLMP-EG32-K0000 HLMP-EG32-MQ000 HLMP-EG32-MQ0DD HLMP-
EG32-NR000 HLMP-EG32-NR0DD HLMP-EG32-PS000 HLMP-EG32-QT000 HLMP-EG32-QT0DD HLMP-EG32-
RU0DD HLMP-EH08-UX000 HLMP-EH08-WZ000 HLMP-EH08-X1000 HLMP-EH08-Y2000 HLMP-EH08-Y20DD
HLMP-EH10-UX000 HLMP-EH10-WZ000 HLMP-EH10-X10DD HLMP-EH10-Y2000 HLMP-EH10-Y20DD HLMP-
EH15-QT002 HLMP-EH15-RU000 HLMP-EH15-RU0DD HLMP-EH15-TW000 HLMP-EH15-UX000 HLMP-EH17-
SV0DD HLMP-EH17-TW000 HLMP-EH17-UX000 HLMP-EH24-PS000 HLMP-EH24-QT000 HLMP-EH24-RU000
HLMP-EH24-RU0DD HLMP-EH24-SV000 HLMP-EH24-SV0DD HLMP-EH26-PS000