MAX2209AEBS+TG45 - Maxim Integrated

_______________________________________________________________ Maxim Integrated Products 1

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,

or visit Maxim’s website at www.maxim-ic.com.

RF Power Detector

with Shutdown Control

MAX2209A

19-5493; Rev 0; 9/10

Ordering Information

Functional Diagram/Typical Operating Circuit

+Denotes a lead(Pb)-free/RoHS-compliant package.

UCSP is a trademark of Maxim Integrated Products, Inc.

General Description

The MAX2209A is a wideband (800MHz to 2GHz) RF

power detector. It takes an RF signal from the directional

coupler at the input, and outputs a DC voltage propor-

tional to the RF peak voltage. The change in output

voltage versus temperature is very repeatable from part

to part and enables a lookup table based on nominal

behavior, minimizing the effective detection error to less

than Q0.5dB relative to room temperature.

The MAX2209A comes in a space-saving 2 x 2, 0.5mm

pitch UCSP™.

Applications

Dual-Band WCDMA Handsets

High-Speed Downlink Packet Access (HSDPA)

High-Speed Uplink Packet Access (HSUPA)

Features

S -25dBm to -5dBm Power Detection Range

S ±0.5dB Detection Error Due to Temperature

S +2.7V to +5V Single-Supply Operation

S Space-Saving 4-Bump, 1mm2 UCSP Package

S Shutdown Control

S 140ns Step-Response Time

EVALUATION KIT

AVAILABLE

RF INPUT

ADC

VCC

OUT

VCC

GND

RFIN/

SHDN

MAX2209A

SHDN

2kI

PART TEMP RANGE PIN-

PACKAGE

TOP

MARK

MAX2209AEBS+ -40NC to +85NC 4 UCSP AGJ

RF Power Detector

with Shutdown Control

MAX2209A

2 ______________________________________________________________________________________

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

VCC to GND .............................................................-0.3V to +6V

RFIN to GND ......................................... -0.3V to + (VCC + 0.3V)

OUT to GND .......................................... -0.3V to + (VCC + 0.3V)

RFIN Input Power .......................................................... +10dBm

Continuous Power Dissipation (TA = +70NC)

4-Bump WLP (derate 3mW/NC above +70NC) .............238mW

Junction-to-Ambient Thermal

Resistance (BJA) (Note 1) ..........................................335NC/W

Operating Temperature Range .......................... -40NC to +85NC

Storage Temperature Range ............................ -65NC to +160NC

Junction Temperature ....................................................+150NC

Bump Temperature (soldering, Note 2)

Infrared (15s) ...............................................................+260NC

Soldering Temperature (reflow) ......................................+240NC

DC ELECTRICAL CHARACTERISTICS

(VCC = 2.7V to 5.0V, no RF signal applied, TA = -40NC to +85NC. Typical values are at VCC = 2.8V, TA = +25NC, unless otherwise

noted.) (Note 3)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 2: For detailed information on soldering, refer to Application Note 1891: Wafer-Level Packaging (WLP) and Its Applications.

CAUTION! ESD SENSITIVE DEVICE

PARAMETER CONDITIONS MIN TYP MAX UNITS

Supply Voltage 2.7 5.0 V

Supply Current 3.9 6 mA

Idle Output Voltage 35 mV

Output Current Source Capability PIN = -5dBm, VOUT forced 100mV lower than open-

circuit output voltage 1000 2300 FA

Output Current Sink Capability PIN = -25dBm, VOUT forced 10mV higher than open-

circuit output voltage 75 150 FA

Shutdown Current VSHDN = 0V 25 50 FA

SHDN Logic-High VIH, including 2kI resistor 1.2 V

SHDN Logic-Low VIL, including 2kI resistor 0.45 V

Turn-On Time SHDN transitions to VIH, VOUT is within 90% of final

value (Note 4) 1.5 2 Fs

RF Step-Response Time RF transitions from < -25dBm to -5dBm, VOUT is

within 90% of final value, 1kW + 10pF load (Note 4) 140 200 ns

RF Power Detector

with Shutdown Control

MAX2209A

_______________________________________________________________________________________ 3

Typical Operating Characteristics

(VCC = 2.8V. Typical values are at TA = +25NC, unless otherwise noted.)

AC ELECTRICAL CHARACTERISTICS

(50I system, VCC = 2.8V, TA = -40NC to +85NC. Typical values are at TA = +25NC, unless otherwise noted.) (Note 3)

Note 3: Guaranteed by production test at TA = +25NC. Guaranteed by design and characterization at TA = -40NC and TA = +85NC.

Note 4: Guaranteed by design and characterization. See the Typical Operating Characteristics.

INPUT POWER (dBm)

OUT (V)

-5-10-15-20

0.1

0.01

-25 0

OUTPUT VOLTAGE vs. INPUT POWER

(RF = 836MHz)

MAX2209A toc01

INPUT POWER (dBm)

OUT (V)

-5-10-15-20

0.1

0.01

-25 0

OUTPUT VOLTAGE vs. INPUT POWER

(RF = 1950MHz)

MAX2209A toc02

OUTPUT VOLTAGE vs. FREQUENCY

MAX2209A toc03

INPUT FREQUENCY (MHz)

OUT (V)

30002500200015001000500

0.1

0.01

0 3500

PIN = -25dBm

PIN = -10dBm

PIN = -5dBm

INPUT POWER (dBm)

ERROR (dB)

-5-10-15-20

-1.0

-0.5

0.5

1.0

1.5

-1.5

-25 0

ERROR DUE TO TEMPERATURE

(RF = 836MHz, 58 UNITS)

MAX2209A toc04

-40°C

+85°C

INPUT POWER (dBm)

ERROR (dB)

-5-10-15-20

-1.0

-0.5

0.5

1.0

1.5

-1.5

-25 0

MAX2209A toc05

-40°C

+85°C

ERROR DUE TO TEMPERATURE

(RF = 1950MHz, 58 UNITS) SIGMA OF -40°C ERROR

INPUT POWER (dBm)

SIGMA (dB)

0.02

0.04

0.06

0.08

0.12

0.10

0.14

0.16

MAX2209A toc06

-5-10-15-20-25 0

RF = 1950MHz

RF = 836MHz

PARAMETER CONDITIONS MIN TYP MAX UNITS

RF Input Frequency 800 2000 MHz

RF Input Return Loss 800MHz 16 dB

2000MHz 9

Output Voltage, 836MHz -5dBm input 0.88 V

-25dBm input 0.06

Output Voltage, 1950MHz -5dBm input 0.72 V

-25dBm input 0.06

Residual Error after Room

Temperature Calibration

(TA = -40NC to +85NC) (Note 4)

-5dBm input Q0.5

-25dBm input Q1.5

RF Power Detector

with Shutdown Control

MAX2209A

4 ______________________________________________________________________________________

Typical Operating Characteristics (continued)

(VCC = 2.8V. Typical values are at TA = +25NC, unless otherwise noted.)

RESIDUAL ERROR AFTER ROOM

TEMPERATURE CALIBRATION

MAX2209A toc10

INPUT POWER (dBm)

ERROR (dB)

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

-0.5

-5-10-15-20-25 0

RF = 1950MHz, 58 UNITS, -40°C

RESIDUAL ERROR AFTER ROOM

TEMPERATURE CALIBRATION

MAX2209A toc11

INPUT POWER (dBm)

ERROR (dB)

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

-0.5

-5-10-15-20-25 0

RF = 1950MHz, 58 UNITS, +85°C

TIME (µs)

OUT (V)

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

0.8

0.6

0.4

0.2

1.0

SETTLING TIME FROM RF POWER

(ON/OFF RF = 836MHz)

MAX2209A toc12

PIN = -5dBm

PIN = -7dBm

PIN = -10dBm

PIN = -15dBm

SIGMA OF +85°C ERROR

INPUT POWER (dBm)

SIGMA (dB)

-5-10-15-20

0.02

0.04

0.06

0.08

0.10

0.12

-25 0

MAX2209A toc07

RF = 1950MHz

RF = 836MHz

RESIDUAL ERROR AFTER ROOM

TEMPERATURE CALIBRATION

MAX2209A toc08

INPUT POWER (dBm)

ERROR (dB)

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

-0.5

-5-10-15-20-25 0

RF = 836MHz, 58 UNITS, -40°C

RESIDUAL ERROR AFTER ROOM

TEMPERATURE CALIBRATION

MAX2209A toc09

INPUT POWER (dBm)

ERROR (dB)

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

-0.5

-5-10-15-20-25 0

RF = 836MHz, 58 UNITS, +85°C

FREQUENCY (MHz)

RETURN LOSS (dB)

500 1000 1500 2000 2500 3000 3500

RF RETURN LOSS

vs. FREQUENCY

MAX2209A toc13

RF Power Detector

with Shutdown Control

MAX2209A

_______________________________________________________________________________________ 5

Bump Description

Bump Configuration

MAX2209A

UCSP

GND REFIN/SHDN

OUT VCC

B1 B2

A1 A2

TOP VIEW

BUMP SIDE DOWN

BUMP NAME FUNCTION

A1 OUT Detector Output

A2 VCC Power Supply. Bypass to GND with a capacitor as close as possible to the bump.

B1 GND Ground Connection. Connect to PCB ground plane with as low inductance as possible.

B2 RFIN/SHDN RF Input and Shutdown Control. AC-couple the RF input and DC couple the shutdown control

through a 2kI resistor to this pin.

RF Power Detector

with Shutdown Control

MAX2209A

6 ______________________________________________________________________________________

Detailed Description

The MAX2209A power detector is designed to oper-

ate from 800MHz to 2.0GHz. The device is ideal for

wideband code-division multiple access (WCDMA),

cdma2000M, and high-speed downlink/uplink packet

access. The MAX2209A accepts an RF signal at the

input, and outputs a temperature-independent voltage

related to the input signal power. The output voltage

expressed in dBV is proportional to the input power

expressed in dBm. The device has a detection range

from -25dBm to 0dBm.

Applications Information

The typical application circuit, as taken from the

MAX2209A EV Kit, is shown in Figure 1. The IC can be

shut down by forcing the RFIN/SHDN DC voltage low

through a 2kω resistor. The output of the detector goes

to an ADC for further processing by the baseband sys-

tem. Connect a series resistor and shunt capacitor to the

MAX2209A output to reduce residual amplitude ripple.

The series resistor should not be less than 1kI.

EV kit gerber files, schematic, BOM, and updates are

available on the MAX2209A product page at Maxim’s

website (www.maxim-ic.com).

Layout

There are two areas that require attention: the GND pin

and the supply bypassing. Connect the GND pin to the

PCB ground with a GND via as close as possible, and

bypass VCC to ground with a capacitor as close as pos-

sible to the part.

Figure 1. Typical Application Circuit from MAX2209A EV Kit

cdma2000 is a registered trademark of the Telecommunications

Industry Association.

Package Information

For the latest package outline information and land patterns,

go to www.maxim-ic.com/packages. Note that a “+”, “#”, or

“-” in the package code indicates RoHS status only. Package

drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Chip Information

PROCESS: BIPOLAR

INPUT

ADC

VCC

OUT

VCC

GND

RFIN/

SHDN

MAX2209A

SHDN

2kI

7.5kI

15pF 27pF

47pF

TEST POINT

SMA

50I

PA DIRECTIONAL

COUPLER

ANTENNA

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

4 UCSP B4+4 21-0007 —

MAX2209A

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.

Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 7

RF Power Detector

with Shutdown Control

Revision History

REVISION

NUMBER

REVISION

DATE DESCRIPTION PAGES

CHANGED

0 9/10 Initial release —