BAS40 thru BAS40-06
Vishay Semiconductors
for mer ly General Semiconductor
Document Number 88129 www.vishay.com
8-May-02 1
Schottky Diodes
Maximum Ratings and Thermal Characteristics (TA= 25°C unless otherwise noted)
Parameter Symbol Value Unit
Repetitive Peak Reverse Voltage VRRM 40 V
Forward Continuous Current at Tamb = 25°CI
F200(1) mA
Surge Forward Current at tp < 1 s, Tamb = 25°CI
FSM 600(1) mA
Power Dissipation(1) at Tamb = 25°CP
tot 200(1) mW
Thermal Resistance Junction to Ambiant Air RthJA 430(1) °C/W
Junction Temperature Tj150 °C
Storage Temperature Range TS–55 to +150 °C
Note:
(1) Device on fiberglass substrate, see layout on next page.
.016 (0.4)
.056 (1.43
)
.037(0.95).037(0.95)
max. .004 (0.1)
.122 (3.1)
.016 (0.4) .016 (0.4)
12
3
Top Vi ew
.102 (2.6)
.007 (0.175)
.045 (1.15)
.110 (2.8)
.052 (1.33
)
.005 (0.125)
.094 (2.4)
.037 (0.95)
Features
• These diodes feature ver y low turn-on voltage and fast
switching.
• These devices are protected by a PN junction guard
ring against excessive voltage, such as electrostatic dis-
charges.
Mechanical Data
Case: SOT-23 Plastic Package
Weight: approx. 0.008g
Packaging Codes/Options:
E8/10K per 13”reel (8mm tape), 30K/box
E9/3K per 7”reel (8mm tape), 30K/box
TO-236AB (SOT-23)
Dimensions in inches and (millimeters) Mounting Pad Layout
0.079 (2.0)
0.037 (0.95
0.035 (0.9)
0.031 (0.8)
0.037 (0.95)
Top View
Top View
BAS40
Marking: 43
BAS40-05
Marking: 45
BAS40-04
Marking: 44
BAS40-06
Marking: 46
BAS40 thru BAS40-06
Vishay Semiconductors
for mer ly General Semiconductor
www.vishay.com Document Number 88129
28-May-02
Electrical Characteristics (TJ= 25°C unless otherwise noted)
Parameter Symbol Test Condition Min Typ Max Unit
Reverse Breakdown Voltage V(BR)R IR=10µA (pulsed) 40 ——V
Leakage Current IRPulse Test tp < 300µs —20 100 nA
VR = 30V
Pulse Test tp < 300µs
F orward Voltage VFIF = 1mA ——380 mV
IF= 40mA ——1000 mV
Capacitance Ctot VR= 0V —4.0 5 pF
f = 1MHz
Reverse Recover y Time trr IF= 10mA, IR = 10mA —— 5ns
Irr = 1mA, RL= 100Ω
Note:
(1) Device on fiberglass substrate, see layout.
0.59 (15)
0.2 (5)
0.03 (0.8)
0.30 (7.5)
0.12 (3)
.04 (1)
0.06 (1.5)
0.20 (5.1)
.08 (2)
.08 (2)
.04 (1)
0.47 (12)
Dimensions in inches (millimeters)
Layout for RthJA test
Thickness: Fiberglass 0.059 in. (1.5 mm)
Copper leads 0.012 in. (0.3 mm)
