ES1A-ES1D 1.0 A Ultra Fast Recovery Rectifier Features * * * * * * * For Surface Mount Applications Glass Passivated Junction Low Profile Package Easy Pick and Place Built-in Strain Relief Superfast Recovery Times for High Efficiency This Device is Pb-Free and is RoHS Compliant www.onsemi.com Applications * This Product is General Usage and Suitable for Many Different Applications SMA CASE 403AE (COLOR BAND DENOTES CATHODE) MARKING DIAGRAM $Y&Z&3 ES1X $Y &Z &3 ES1X X = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Specific Device Code = A/B/C/D ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. (c) Semiconductor Components Industries, LLC, 2010 July, 2019 - Rev. 4 1 Publication Order Number: ES1D/D ES1A-ES1D ABSOLUTE MAXIMUM RATINGS TA = 25C Unless Otherwise Noted Value Parameter Symbol 1A 1B 1C 1D Units 50 100 150 200 V VRRM Maximum Repetitive Reverse Voltage IF(AV) Average Rectified Forward Current, @ TA = 120C 1.0 A IFSM Non-repetitive Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave 30 A Tstg Storage Temperature Range -50 to +150 C TJm Operating Junction Temperature -50 to +150 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Symbol PD Parameter Power Dissipation Value Units 1.47 W RJA Thermal Resistance, Junction to Ambient* 85 C/W RqJL Thermal Resistance, Junction to Lead* 35 C/W *Device mounted on FR-4 PCB 0.013 mm. ELECTRICAL CHARACTERISTICS TJ = 25C Unless Otherwise Noted Device Symbol 1A Parameter VF Forward Voltage @ 1.0 A trr Reverse Recovery Time IF = 0.5 A, IR = 1.0 A, IRR = 0.25 A IR Reverse Current TA = 25_C TA = 100_C CT Total Capacitance VR = 4.0 V, f = 1.0 MHz @ rated VR 1B 1C 1D Units 0.92 V 15 ns mA 5.0 100 7.0 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. PACKAGE MARKING AND ORDERING INFORMATION TBD Device Marking Device Package Quantity ESD1 ESD1 SMA 7500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 2 ES1A-ES1D 10 1.5 1.25 Forward Current, IF [A] Average Rectified Forward Current, IF [A] TYPICAL CHARACTERISTICS 1 0.75 RESISTIVE OR INDUCTIVE LOAD P.C.B. MOUNTED ON 0.2 x 0.2" (5.0 x 5.0 mm) COPPER PAD AREAS 0.5 0.2 5 0 0 25 50 75 100 125 150 1 0.1 0.01 0.001 175 TA = 25C Pulse Width = 300 ms 2% Duty Cycle 0.6 0.4 Ambient Temperature [5C] 1.4 1.2 1000 30 Reverse Current, IR [mA] 25 20 15 10 100 TA = 125C 10 TA = 75C 1 5 TA = 25C 1 2 5 10 20 50 0.1 100 0 20 Figure 3. Non-Repetitive Surge Current 60 80 100 120 140 Figure 4. Reverse Current vs Reverse Voltage 14 12 10 8 6 4 2 0 0.1 40 Percent of Rated Peak Reverse Voltage [%] Number of Cycles at 60 Hz Total Capacitance, CT [pF] 0 1 Figure 2. Forward Voltage Characteristics Figure 1. Forward Current Derating Curve Peak Forward Surge Current, IFSM [A] 0.8 Forward Voltage, VF [V] 1 10 Reverse Voltage, VR [V] Figure 5. Total Capacitance www.onsemi.com 3 100 ES1A-ES1D TYPICAL CHARACTERISTICS (continued) 50 W NONINDUCTIVE 50 W NONINDUCTIVE +0.5 A (-) DUT 0 Pulse Generator (Note 2) 50 V (approx) 50 W NONINDUCTIVE trr OSCILLOSCOPE (Note 1) -0.25 A (+) NOTES: 1. Rise time = 7.0 ns max; Input impedance = 1.0 MW 22 pf. 2. Rise time = 10 ns max; Source impedance = 50 W. -1.0 A 1.0 cm SET TIME BASE FOR 5/ 10 ns/ cm Figure 6. Reverse Recovery Time Characterstic and Test Circuit Diagram www.onsemi.com 4 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMA CASE 403AE ISSUE O B B 5.60 4.80 0.13 M C B DATE 31 AUG 2016 A 2.65 2.95 2.50 1.65 1.20 B 1.75 4.30 B A 4.75 4.00 LAND PATTERN RECOMMENDATION TOP VIEW 2.50 MAX A 2.20 1.90 B C 0.203 0.050 2.05 1.95 NOTES: 0.30 0.05 0.13 M C SIDE VIEW 8 0 B A A. EXCEPT WHERE NOTED, CONFORMS TO JEDEC DO214 VARIATION AC. B DOES NOT COMPLY JEDEC STANDARD VALUE. C. ALL DIMENSIONS ARE IN MILLIMETERS. D. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. E. DIMENSIONS AND TOLERANCE AS PER ASME Y14.5-2009. E. LAND PATTERN STD. DIOM5025X231M R0.15 4X GAGE PLANE 0.45 8 0 0.41 0.15 1.52 0.75 DETAIL A SCALE 20 : 1 DOCUMENT NUMBER: DESCRIPTION: 98AON13440G SMA Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800-282-9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 www.onsemi.com 1 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative