SCDS007U - NOVEMBER 1992 - REVISED JUNE 2005 D Members of the Texas Instruments D D D D SN54CBT16212A . . . WD PACKAGE SN74CBT16212A . . . DGG, DGV, OR DL PACKAGE (TOP VIEW) Widebus Family 5- Switch Connection Between Two Ports TTL-Compatible Input Levels Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 200-V Machine Model (A115-A) S0 1A1 1A2 2A1 2A2 3A1 3A2 GND 4A1 4A2 5A1 5A2 6A1 6A2 7A1 7A2 VCC 8A1 GND 8A2 9A1 9A2 10A1 10A2 11A1 11A2 12A1 12A2 description/ordering information The 'CBT16212A devices provide 24 bits of high-speed TTL-compatible bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. Each device operates as a 24-bit bus switch or a 12-bit bus exchanger that provides data exchanging between the four signal ports via the data-select (S0, S1, S2) terminals. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 S1 S2 1B1 1B2 2B1 2B2 3B1 GND 3B2 4B1 4B2 5B1 5B2 6B1 6B2 7B1 7B2 8B1 GND 8B2 9B1 9B2 10B1 10B2 11B1 11B2 12B1 12B2 ORDERING INFORMATION TOP-SIDE MARKING Tube SN74CBT16212ADL Tape and reel SN74CBT16212ADLR TSSOP - DGG Tape and reel SN74CBT16212ADGGR CBT16212A TVSOP - DGV Tape and reel SN74CBT16212ADGVR CY212A SSOP - DL -40C to 85C ORDERABLE PART NUMBER PACKAGE TA VFBGA - GQL CBT16212A SN74CBT16212AGQLR VFBGA - ZQL (Pb-free) Tape and reel SN74CBT16212AZQLR CY212A -55C to 125C CFP - WD Tube SNJ54CBT16212AWD SNJ54CBT16212AWD Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. Copyright 2005, Texas Instruments Incorporated !"# $ %&'# "$ (&)*%"# +"#', +&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$ $#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1 "** (""!'#'$, (+&%#$ %!(*"# # 23454 "** (""!'#'$ "' #'$#'+ &*'$$ #-'/$' #'+, "** #-' (+&%#$ (+&%# (%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1 "** (""!'#'$, POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCDS007U - NOVEMBER 1992 - REVISED JUNE 2005 GQL OR ZQL PACKAGE (TOP VIEW) 1 2 3 4 5 terminal assignments 6 1 2 3 4 5 6 A A 1A2 1A1 S0 S1 S2 1B1 B B 3A1 2A2 2A1 1B2 2B1 2B2 C C 4A1 GND 3A2 3B1 GND 3B2 D D 5A2 4A2 5A1 4B2 4B1 5B1 E 6A2 6A1 5B2 6B1 F 7A1 7A2 7B1 6B2 G GND GND 7B2 H VCC 8A2 9A1 9A2 9B2 9B1 8B2 J 10A1 10A2 11A1 11B1 10B2 10B1 K 11A2 12A1 12A2 12B2 12B1 11B2 E F G H J 8A1 8B1 K FUNCTION TABLE INPUTS 2 INPUTS/OUTPUTS FUNCTION S2 S1 S0 A1 A2 L L L Z Z Disconnect L L H B1 port Z A1 port = B1 port L H L B2 port Z A1 port = B2 port L H H Z B1 port A2 port = B1 port H L L Z B2 port A2 port = B2 port H L H Z Z Disconnect H H L B1 port B2 port A1 port = B1 port A2 port = B2 port H H H B2 port B1 port A1 port = B2 port A2 port = B1 port POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCDS007U - NOVEMBER 1992 - REVISED JUNE 2005 logic diagram (positive logic) 1A1 1A2 12A1 2 54 3 53 1B2 27 30 28 29 12B1 12B2 12A2 S0 1B1 1 56 S1 S2 55 Pin numbers shown are for the DGG, DGV, DL, and WD packages. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCDS007U - NOVEMBER 1992 - REVISED JUNE 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Package thermal impedance, JA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56C/W GQL/ZQL package . . . . . . . . . . . . . . . . . . . . . . . . . . . 42C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54CBT16212A SN74CBT16212A MIN MAX MIN MAX 5.5 4 5.5 VCC VIH Supply voltage 4 High-level control input voltage 2 VIL TA Low-level control input voltage 2 -55 125 V V 0.8 Operating free-air temperature UNIT -40 0.8 V 85 C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK II ICC ICC Control inputs Ci Control inputs Cio(off) SN54CBT16212A TYP MAX TEST CONDITIONS MIN VCC = 4.5 V, VCC = 0, II = -18 mA VI = 5.5 V VCC = 5.5 V, VCC = 5.5 V, VI = 5.5 V or GND IO = 0, VI = VCC or GND VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND VI = 3 V or 0 VO = 3 V or 0, VCC = 4 V, TYP at VCC = 4 V ron VCC = 4.5 V SN74CBT16212A TYP MAX MIN UNIT -1.2 -1.2 10 10 V 1 1 3.2 3 A 2.5 2.5 mA A A 2.5 2.5 pF S0, S1, and S2 = GND 7.5 7.5 pF VI = 2.4 V, II = 15 mA 14 20 14 20 II = 64 mA II = 30 mA 4 10 4 7 VI = 0 4 10 4 7 VI = 2.4 V, II = 15 mA 6 14 6 12 All typical values are at VCC = 5 V (unless otherwise noted), TA = 25C. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCDS007U - NOVEMBER 1992 - REVISED JUNE 2005 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54CBT16212A FROM (INPUT) PARAMETER TO (OUTPUT) SN74CBT16212A VCC = 4 V VCC = 5 V 0.5 V VCC = 4 V VCC = 5 V 0.5 V MIN MIN MIN MIN MAX MAX MAX tpd A or B B or A tpd S A or B 14 1.5 13 10 ten tdis S A or B 15 1.5 13.7 10.4 S A or B 14.2 1.5 13.5 9.2 0.8* UNIT MAX 0.35 0.25 ns 1.5 9.1 ns 1.5 9.7 ns 1.5 8.8 ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). PARAMETER MEASUREMENT INFORMATION 7V 500 From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V Output Control LOAD CIRCUIT 1.5 V 1.5 V 0V tPZL 3V Input 1.5 V 1.5 V 0V tPLH 1.5 V tPLZ 3.5 V 1.5 V tPZH tPHL VOH Output Output Waveform 1 S1 at 7 V (see Note B) 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPHZ 1.5 V VOH VOH - 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 5962-9852101QXA ACTIVE CFP WD 56 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9852101QX A SNJ54CBT16212A WD 74CBT16212ADGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16212A 74CBT16212ADGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16212A 74CBT16212ADGVRE4 ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CY212A 74CBT16212ADGVRG4 ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CY212A SN74CBT16212ADGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16212A SN74CBT16212ADGVR ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CY212A SN74CBT16212ADL ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16212A SN74CBT16212ADLG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16212A SN74CBT16212ADLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16212A SN74CBT16212ADLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16212A SN74CBT16212AZQLR ACTIVE BGA MICROSTAR JUNIOR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 CY212A SNJ54CBT16212AWD ACTIVE CFP WD 56 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9852101QX A SNJ54CBT16212A WD (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54CBT16212A, SN74CBT16212A : * Catalog: SN74CBT16212A * Military: SN54CBT16212A NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.6 1.8 12.0 24.0 Q1 SN74CBT16212ADGGR TSSOP DGG 56 2000 330.0 24.4 SN74CBT16212ADGVR TVSOP DGV 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 Q1 SN74CBT16212ADLR SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1 SN74CBT16212AZQLR BGA MI CROSTA R JUNI OR Pack Materials-Page 1 8.6 B0 (mm) PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CBT16212ADGGR TSSOP DGG 56 2000 367.0 367.0 45.0 SN74CBT16212ADGVR TVSOP DGV 56 2000 367.0 367.0 45.0 SN74CBT16212ADLR SSOP DL 56 1000 367.0 367.0 55.0 SN74CBT16212AZQLR BGA MICROSTAR JUNIOR ZQL 56 1000 336.6 336.6 28.6 Pack Materials-Page 2 MECHANICAL DATA MCFP010B - JANUARY 1995 - REVISED NOVEMBER 1997 WD (R-GDFP-F**) CERAMIC DUAL FLATPACK 48 LEADS SHOWN 0.120 (3,05) 0.075 (1,91) 0.009 (0,23) 0.004 (0,10) 1.130 (28,70) 0.870 (22,10) 0.370 (9,40) 0.250 (6,35) 0.390 (9,91) 0.370 (9,40) 0.370 (9,40) 0.250 (6,35) 48 1 0.025 (0,635) A 0.014 (0,36) 0.008 (0,20) 25 24 NO. OF LEADS** 48 56 A MAX 0.640 (16,26) 0.740 (18,80) A MIN 0.610 (15,49) 0.710 (18,03) 4040176 / D 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA GDFP1-F56 and JEDEC MO -146AB POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins - MO-153 14/16/20/56 Pins - MO-194 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated