ASMT-Mxx4
Moonstone® 1W Power LED Light Source
Data Sheet
Description
The Moonstone® 1W Power LED Light Source is a high per-
formance energy ecient device which can handle high
thermal and high driving current. The exposed pad design
has excellent heat transfer from the package to the moth-
erboard.
The low prole package design is suitable for a wide variety
of applications especially where height is a constraint.
The package is compatible with reow soldering. This
will give more freedom and exibility to the light source
designer.
The 1W Power LED light source can be mounted onto
metal core PCB enabling optimum heat dissipation and
ease of installation.
Applications
x Sign backlight, billboard illumination or backlight
x Exit sign or emergency sign lightings
x Commercial lightings
x Accent and marker lightings
x Pathway lighting
x Task lighting
x Reading lights
x Decorative lighting
x Garden lighting
x Architectural lighting
x Portable (ash light, bicycle head light
Features
x Available in Cool White & Warm White color
x Energy ecient
x Exposed pad for excellent heat transfer
x Suitable for reow soldering process
x High current operation
x Long operation life
x Wide viewing angle
x Silicone encapsulation
x Non-ESD sensitive (threshold > 16KV)
x MSL 2a products
Specications
x InGaN Technology
x 3.5 V (max) at 350 mA
x 110° viewing angle
2
Package Dimension for Moonstone®
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1 mm unless otherwise specied.
3. Terminal nish: Ag plating.
Figure 1. Moonstone® package outline drawing.
Package Dimension for Moonstone® on MCPCB
Figure 2. MCPCB I package outline drawing. Figure 3. MCPCB II package outline drawing.
Notes:
1. All dimensions in millimeters.
2. Tolerance is ±0.1 mm unless otherwise specied.
Metal Slug
Cathode
Anode1
2
3
10.00
8.50
3
12
8.50
Ø 5.26
Ø 8.00
5.08 0.81
2.00 5.25
1.30
10.60
1.27
3.30
Heat Sink
LED
ZENER
+
−
Cathode
Anode1
2
3Heat Sink
∅ 3.00
∅ 5.00
24.00
2.30
1.30
4.60
19.00
4.00
16.00
20.00 14.00
2.50
1.40
R 1.60
∅ 19.00
60 °
19.90
3.00
3.30
4.90
1.60
3
Part Numbering System
Note:
1. Please refer to Page 9 for selection details.
Device Selection Guide (Tj = 25°C)
Part Number [3] Color
Luminous Flux, ΦV [1,2] (lm) Test
Current
(mA)
Dice
Technology
Electrically
Isolated
Metal Slug Min. Typ. Max.
ASMT-MWx24-NKL00 Cool White 56.0 75.0 95.0 350 InGaN Yes
ASMT-MWx24-NKM00 56.0 80.0 124.0 350 Yes
ASMT-MYx24-NKL00 Warm White 56.0 70.0 95.0 350 InGaN Yes
ASMT-MWx24-NKL00 Cool White
Diused
56.0 70.0 95.0 350 InGaN Yes
ASMT-MWx24-NKM00 56.0 75.0 124.0 350 Yes
ASMT-MYx24-NKL00 Warm White
Diused
56.0 65.0 95.0 350 InGaN Yes
Notes:
1. ΦV is the total luminous ux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is ±10 %.
3. Flux performance for respective part number is similar when device on MCPCB I or MCPCB II.
ASMT-M 3x4x5x6
Packaging Option
Color Bin Selection
Max Flux Bin Selection
Min Flux Bin Selection
Color
W – Cool White
Y – Warm White
Moonstone®Type
0 – Non-diffused
B – Diffused
A - Non-diffused on MCPCB I
C - Diffused on MCPCB I
K - Non-diffused on MCPCB II
L - Diffused on MCPCB II
- N xx1x24
4
Absolute Maximum Ratings (TA = 25°C)
Parameter ASMT-Mxx4 Units
DC Forward Current [1] 350 mA
Peak Pulsing Current [2] 1000 mA
Power Dissipation 1225 mW
LED Junction Temperature 125 °C
LED Junction Temperature for short term application 145 °C
Operating Ambient Temperature Range -40 to +110 °C
Storage Temperature Range -40 to +120 °C
Soldering Temperature Refer to Figure 13
Reverse Voltage [3] Not recommended
Notes:
1. Derate linearly based on Figure 11.
2. Pulse condition duty factor = 10%, Frequency = 1kHz.
3. Not recommended for reverse bias operation.
Optical Characteristics at 350 mA (TJ = 25°C)
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle,
2θ½ [2] (°)
Luminous Eciency
(lm/W)
Min. Max. Typ Typ
ASMT-MWx24-NKL00 Cool White 4000 10000 110 67
ASMT-MWx24-NKM00 4000 10000 110 71
ASMT-MYx24-NKL00 Warm White 2600 4000 110 63
ASMT-MWx24-NKL00 Cool White Diused 4000 10000 110 63
ASMT-MWx24-NKM00 4000 10000 110 67
ASMT-MYx24-NKL00 Warm White Diused 2600 4000 110 58
Notes:
1. T½ is the o-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (TJ = 25°C)
Dice type
Forward Voltage VF (Volts) at IF = 350mA Thermal Resistance Rθ j-ms ( °C/W) [1]
Min. Typ. Max. Typ.
InGaN 2.8 3.2 3.5 10
Note:
1. RTj-ms is the Thermal Resistance from LED junction to metal slug.
5
Figure 4. Relative Intensity vs. Wavelength. Figure 5. Relative Luminous Flux vs. Mono Pulse Current.
Figure 6. Forward Current vs. Forward Voltage. Figure 7. Radiation Pattern.
Figure 9. Maximum pulse current vs. ambient temperature. Derated based
on TA = 85°C, RTJ-A = 50°C/W.
Figure 8. Maximum pulse current vs. ambient temperature. Derated based
on TA = 25°C, RTJ-A = 50°C/W.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
WARM WHITE
COOL WHITE
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 50 100 150 200 250 300 350 400 450 500
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D =
0.05
0.10
0.25
0.50
1.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D =
0.05
0.10
0.25
0.50
1.00
D=tp
T
tp
IF
T
D=tp
T
tp
IF
T
0
50
100
150
200
250
300
350
400
450
500
0 0.5 1 1.5 2 2.5 3 3.5 4
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
6
Figure 12. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125°C, RTJ-MS = 10°C/W.
Figure 13. Recommended Reow Soldering. Figure 14. Recommended soldering land pattern.
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
10.70±0.10
8.40±0.10
3.1±0.10
5.08±0.10
1.00±0.10
17.00±0.20
Note:
For detail information on reow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
Figure 11. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RTJ-A = 30°C/W, 40°C/W and 50°C/W.
Figure 10. Relative Light Output vs. Junction Temperature.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-50 -25 0 25 50 75 100 125
JUNCTION TEMPERATURE, TJ - °C
RELATIVE LIGHT OUTPUT
(NORMALIZED AT 25°C)
WARM WHITE
COOL WHITE
0
50
100
150
200
250
300
350
400
0 20406080100 120 140
AMBIENT TEMPERATURE, TA - °C
MAX ALLOWABLE DC CURRENT - mA
RTJ-A = 30°C/W
RTJ-A = 40°C/W
RTJ-A = 50°C/W
0
50
100
150
200
250
300
350
400
020406080100 120 140
METAL SLUG TEMPERATURE, TMS - °C
MAX ALLOWABLE DC CURRENT - mA
RTJ-MS = 10°C/W
7
Color Bin Selections [x5]
Individual reel will contain parts from one full bin only.
Cool White
O Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
G G only
H H only
L A and G only
M B and H only
N A and C only
P B and D only
Q E and C only
R F and D only
S G and H only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
2 G, H, A and B only
4 C, D, E and F only
Warm White
O Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
N A and C only
P B and D only
Q E and C only
R F and D only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
4 C, D, E and F only
Flux Bin Limit [x3, x4]
Bin
Luminous Flux (lm) at IF = 350mA
Min. Max.
K 56.0 73.0
L 73.0 95.0
M 95.0 124.0
Tolerance for each bin limits is ±10%.
Option Selection Details
ASMT-Mx1 x2 4 - N x3 x4 x5 x6
x3 – Minimum Flux Bin
x4 – Maximum Flux Bin
x5 – Color Bin Selection
x6 – Packaging Option
8
Color Bin Limit
Cool Color Limits
White (Chromaticity Coordinates)
Bin A X 0.367 0.362 0.329 0.329
Y 0.400 0.372 0.345 0.369
Bin B X 0.362 0.356 0.329 0.329
Y 0.372 0.330 0.302 0.345
Bin C X 0.329 0.329 0.305 0.301
Y 0.369 0.345 0.322 0.342
Bin D X 0.329 0.329 0.311 0.305
Y 0.345 0.302 0.285 0.322
Bin E X 0.303 0.307 0.283 0.274
Y 0.333 0.311 0.284 0.301
Bin F X 0.307 0.311 0.290 0.283
Y 0.311 0.285 0.265 0.284
Bin G X 0.388 0.379 0.362 0.367
Y 0.417 0.383 0.372 0.400
Bin H X 0.379 0.369 0.356 0.362
Y 0.383 0.343 0.330 0.372
Tolerance: ± 0.01
Warm Color Limits
White (Chromaticity Coordinates)
Bin A X 0.452 0.488 0.470 0.438
Y 0.434 0.447 0.414 0.403
Bin B X 0.438 0.470 0.452 0.424
Y 0.403 0.414 0.384 0.376
Bin C X 0.407 0.418 0.452 0.438
Y 0.393 0.422 0.434 0.403
Bin D X 0.395 0.407 0.438 0.424
Y 0.362 0.393 0.403 0.376
Bin E X 0.381 0.387 0.418 0.407
Y 0.377 0.404 0.422 0.393
Bin F X 0.373 0.381 0.407 0.395
Y 0.349 0.377 0.393 0.362
Tolerance: ± 0.01
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
Y - COORDINATE
X - COORDINATE
B
C
ED
A
F
4.5k
7k
10k
4.0k
G
H
Black Body Curve
5.6k
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
Y - COORDINATE
B
C
E
D
A
F
3.5k
4.0k
2.6k
3.0k
Black Body Curve
Packaging Option [x6]
Selection Option
0 Tube (for Moonstone® only)
Tray (for Moonstone® on MCPCB only)
1 Tape and Reel
Example
ASMT-MW04-NKLZ1
ASMT-MW04-Nxxxx – Cool White, Non-diused
X3 = K – Minimum Flux Bin K
X4 = L – Maximum Flux Bin L
X5 = Z – Color Bin A and B only
X6 = 1 – Tape and Reel Option
Figure 16. Color bins (Warm White).Figure 15. Color bins (Cool White).
9
Dim Value
AO8.80 ±0.10
BO16.45 ±0.10
KO3.60 ±0.10
E 1.75 ±0.10
F 11.50 ±0.10
W 24.0 ±0.10
P 16.0 ±0.10
Quantity/
Reel
250 units
All dimensions in millimeters.
Tape and Reel – Option 1
Packing Tube – Option 0
535.00
1.00
5.45
5.80
4.65
5.50
10.10
37.00
8.30
TOP VIEW
SIDE VIEW
Figure 17. Tube dimensions.
Figure 18. Carrier tape dimensions.
A
A
B
Ao
B
P
SECTION B
SECTION A
Ko
W
F
E
Bo
2.5
END
MINIMUM OF 160 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
START
Figure 19. Carrier tape leader and trailer dimensions.
10
R10.00
60.0º
268.00
330.00 ± 1.00
99.50 ± 1.00
2.30 2.30
24.0+1.00
−0.00
13.50 ± 0.50
2.50 ± 0.50
R10.50 ± 0.50
120.0º
Figure 20. Reel dimensions.
Packing Tray – Option 0 (for Moonstone® on MCPCB only)
Figure 21. Tray dimensions.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1673EN - October 5, 2010
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly of
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
Moisture Sensitivity
This product is qualied as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reow the LEDs per the original MSL
rating.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unnished reel
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
oor life of 672 hours.
E. Baking is required if
– HIC “10%” indicator is not blue and “5%” indicator is
pink.
– The LEDs are exposed to condition of >30°C / 60%
RH at any time.
– The LED oor life exceeded 672hrs.
Recommended baking condition: 60±5°C for 20hrs.
DISCLAIMER: Avago’s products and software are not specically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make
claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.