* All ABL's BGA heatsinks are supplied with thermal tape Width Length Height Pad C/W C/W Model [mm] [mm] [mm] Size Wire Form Natural Forced BGA-STD-010 13.5 13.0 10.0 12x12 - 27.00 14.50 BGA-STD-015 14.0 14.0 BGA-STD-020 21.0 21.0 10.0 18x18 - 26.50 14.00 9.0 20X20 - 24.50 BGA-STD-025 23.0 13.00 23.0 6.0 20x20 - 22.00 10.50 BGA-STD-030 27.0 27.0 6.0 20x20 WF700/WF300 20.00 10.00 BGA-STD-035 26.0 26.0 8.0 20x20 WF700/WF300 18.50 9.70 BGA-STD-040 27.0 27.0 6.0 20x20 WF700/WF300 16.00 10.20 BGA-STD-045 23.0 23.0 18.0 20x20 WF700/WF300 14.70 7.30 BGA-STD-050 20.0 20.0 19.1 18x18 - 14.00 5.80 BGA-STD-055 25.9 23.9 10.0 20x20 WF700/WF300/WF151 14.00 6.00 [mm] 2M/s BGA-STD-060 40.0 40.0 10.0 30x30 - 13.50 7.50 *BGA-STD-065 27.8 27.8 11.2 20x20 WF700/WF300 12.20 5.80 BGA-STD-070 40.0 40.0 25.0 30x30 WF700/WF300/WF151 11.50 6.00 BGA-STD-075 40.0 40.0 23.0 18x18 WF700/WF300/WF151 11.00 5.60 BGA-STD-080 27.0 27.0 25.0 20x20 WF700/WF300/WF151 10.50 4.50 BGA-STD-085 30.7 30.7 14.1 20x20 WF700/WF300 10.00 5.20 BGA-STD-090 40.0 23.9 10.0 20x20 - 10.00 5.20 BGA-STD-095 40.0 40.0 10.0 18x18 WF700/WF300 9.70 4.00 BGA-STD-100 38.1 38.1 16.0 30x30 - 9.20 4.10 BGA-STD-105 35.0 35.0 18.0 30x30 WF700/WF300/WF151 9.20 5.20 BGA-STD-110 35.0 35.0 25.0 30x30 WF700/WF300/WF151 8.50 5.00 BGA-STD-115 40.0 40.0 18.0 30x30 WF700/WF300/WF151 8.20 5.10 BGA-STD-120 40.6 38.8 30.5 30x30 - 7.00 3.70 Thermally Conductive Aluminium Foil Tape All ABL's BGA heatsinks are supplied with thermal tape. Colour - White Backing Type / Thickness Mm Aluminium Foil / 0.10 Adhesive Type / Thickness Mm Arylic 0.075 (on clear liner side) Total Thickness mm 0,27 Kg/25mm 1,5 W/m-K 0,95 C-in2/W 0,2 Hour Hour >72 >2 Adhesion Thermal Conductivity Thermal Resistance Holding Power@23C Holding Power @ 130C With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides, with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heatsink and to metal enclosure surfaces.