ASDL-3007
IrDA Data Compliant Low Power 115.2 Kbit/s
with Remote Control Infrared Transceiver
Data Sheet
Description
The ASDL-3007 is a new generation ultra-low prole
enhanced infrared (IR) transceiver module that provides
the capability of (1) interface between logic and IR signals
for through-air, serial, half-duplex IR data link, and (2) IR
remote control transmission for universal remote control
applications. The ASDL-3007 can be used for IrDA as well
as remote control application without the need of any
additional external components for multiplexing.
The ASDL-3007 is fully compliant to IrDA Physical Layer
specication version 1.4 low power from 9.6 kbit/s to
115.2 kbit/s (SIR) and IEC825 Class 1 eye safety standards.
ASDL-3007 can be shutdown completely to achieve very
low power consumption. In the shutdown mode, the PIN
diode will be inactive and thus producing very little pho-
tocurrent even under very bright ambient light. It is also
designed especially for battery operated mobile devices
such as PDAs and mobile phones that require low power
consumption.
Applications
• Mobile data communication and universal remote
control
- Mobile Phones
- PDAs
- Printers
- Industrial and Medical Instrument
Features
General Features
• Operating temperature from -25°C to +85°C
- Critical parameters are guaranteed over
temperature and supply voltage
• Vcc Supply 2.4 to 3.6V
• Miniature Package
- Height : 1.60 mm
- Width : 7.00 mm
- Depth : 2.80 mm
• Moisture Level 3
• Integrated remote control LED driver
• LED Stuck-High Protection
• High EMI performance without shield
• Designed to Accommodate Light Loss with Cosmetic
Windows
• IEC 825-Class 1 Eye Safe
• Lead Free and ROHS Compliant
IrDA Features
• Fully Compliant to IrDA 1.4 Physical Layer Low Power
Specications from 9.6 kbit/s to 115.2 kbit/s
• Link distance up to 50cm typically
• Complete shutdown
• Low Power Consumption
- Low shutdown current
- Low idle current
Remote Control Features
• Wide angle and high radiant intensity
• Spectrally suited to remote control transmission
function
• Typical link distance up to 8 meter
2
Figure 1. Functional Block Diagram of ASDL-3007
Figure 2. Pin out for ASDL-3007
8 6 47 5 23 1
3
Application Support Information
The Application Engineering Group is available to assist
you with the application design associated with ASDL-
3007 infrared transceiver module. You can contact them
through your local sales representatives for additional
details.
Order Information
Part Number Packaging Type Package Quantity
ASDL-3007-021 Tape and Reel Front Option 2500
I/O Pins Conguration Table
Pin Symbol Description I/O Type Notes
1 LEDA LED Anode Note 1
2 SD Shutdown Input. Active High Note 2
3 TxD_IR IrDA transmitter data input. Input. Active High Note 3
4 RxD IrDA receive data Output. Active Low Note 4
5 Vcc Supply Voltage Note 5
6 TxD_RC RC transmitter data input. Input. Active High Note 6
7 NC Note 7
8 GND Ground Note 8
Notes:
1. Tied through external resistor, R1, to Vled. Refer to the table below for recommended series resistor value.
2. Complete shutdown of IC and PIN diode. The pin is used for setting receiver bandwidth and RC drive
programming mode. Refer to section on “Bandwidth Selection Timing” and “Remote Control Drive Modes” for
more information. Do NOT oat this pin.
3. This pin is used to transmit serial data when SD pin is low. If held high for longer than 50 ms, the LED is turned
o. Do NOT oat this pin.
4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is
required. The pin is in tri-state when the transceiver is in shutdown mode.
5. Regulated, 2.4V to 3.6V
6. Logic high turns on the RC LED. If held high longer than 50 ms, the RC LED is turned o. Do NOT oat the pin.
7. NC.
8. Connect to system ground.
CAUTIONS: The CMOS inherent to the design of this component increases the component’s susceptibility
to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling
and assembly of this component to prevent damage and/or degradation which may be induced by ESD
Marking Information
The unit is marked with ‘PYWWLL’ on the back of the PCB
for front option without shield.
P = Product Code
Y = Year
WW = Work Week
LL = Lot Number
4
Recommended Application Circuit Components
Component Recommended Value Note
R1 2.7 ohm ±5%, 0.25W for 2.4V≤ Vled≤2.7V
3.9 ohm ±5%, 0.25W for 2.7V≤ Vled≤3.0V
5.6 ohm ±5%, 0.25W for 3.0V≤ Vled≤3.3V
9.1 ohm ±5%, 0.25W for 3.3V≤ Vled≤4.2V
R2 4.7 ohm ±5% 2
CX1 100 nF, ± 20%, X7R Ceramic 1
CX2,CX3 4.7mF, ± 20%, Tantalum 1
Notes :
1. CX1, CX2 must be placed within 0.7cm of ASDL-3007 to obtain optimum noise immunity
2. To reduce noise at VCC.
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤ 50°C/W.
Parameter Symbol Min. Max. Units
Conditions
Notes
Storage Temperature TS-40 +100 °C
Operating Temperature TA-25 +85 °C
LED Anode Voltage VLEDA 0 6.5 V VledA < Vcc + 4V
Supply Voltage VCC 0 6.5 V
Input Voltage : TXD VTXD 0 Vcc V
Input Voltage : SD/Mode VSD 0 Vcc V
Output Voltage : RXD VO0 Vcc V
DC LED Transmit Current ILED (DC) 32 mA
Peak Transmit Current (RC) ILED (PK)_RC 1 A ≤ 8% duty cycle, ≤ 90 ms pulse width 1
Peak Transmit Current (IrDA) ILED (PK)_IR 0.5 A ≤ 20% duty cycle, ≤ 90 ms pulse width 2
Notes:
1. This peak current is specied for RC mode
2. This peak current is specied for IrDA mode
5
Recommended Operating Conditions
Parameter Symbol Min. Typ. Max. Units Conditions
Operating Temperature TA-25 +85 °C
Supply Voltage VCC 2.4 3.6 V
LED Anode Voltage VLEDA 5.5 V VledA < Vcc + 4V
Logic Input Voltage for TXD IR Logic High VIH-IR Vcc-0.5 Vcc V
Logic Low VIL-IR 0 0.4 V
Logic Input Voltage for TXD RC Logic High VIH-RC Vcc-0.5 Vcc V
Logic Low VIL-RC 0 0.4 V
Logic Input Voltage for SD Logic High VIH-SD Vcc-0.5 Vcc V
Logic Low VIL-SD 0 0.4 V
Receiver Input Irradiance Logic High EIH0.0090 500 mW/cm2 For in-band signals ≤
115.2kbit/s [3]
Logic Low EIL0.3 mW/cm2 For in-band signals [3]
LED (Logic High) Current Pulse Amplitude (IR) ILEDA 40 mA
LED (Logic High) Current Pulse Amplitude (RC) ILEDA 150 mA
Receiver Data Rate 9.6 115.2 kbit/s
Ambient Light See IrDA Serial Infrared
Physical Layer Link
Specication, Appendix A
for ambient levels
Note :
[1] An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is dened as 850 ≤ lp ≤ 900 nm, and the pulse characteristics are
compliant with the IrDA Serial Infrared Physical Layer Link Specication v1.4.
6
Electrical and Optical Specications
Specications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecied test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to
3.0V unless otherwise noted.
Parameter Symbol Min. Typ. Max. Units Conditions
Receiver
Viewing Angle 2q1/2 30 °
Peak Sensitivity Wavelength lP875 nm
RxD_IrDA Output Voltage Logic High VOH Vcc-0.5 Vcc V IOH = -200 mA, EI ≤ 0.3 mW/cm2
Logic Low VOL 0 0.4 V
RxD_IrDA Pulse Width (SIR) [2] tRPW(SIR) 1 4 msq1/2 ≤ 15°, CL=9pF
RxD_IrDA Rise & Fall Times tr, tf60 ns CL=9pF
Receiver Latency Time [3] tL200 ms EI = 4.0 mW/cm2
Receiver Wake Up Time [4] tRW 200 ms EI = 10 mW/cm2
Transmitter (IrDA Mode)
IR Radiant Intensity IEH 4 19 mW/sr ILEDA =40mA, TxD_IR ≥ VIH,
TA = 25°C
IR Viewing Angle 2q1/2 30 60 °
IR Peak Wavelength lP885 nm
TxD_IrDA Logic Levels High VIH-IR Vcc-0.5 Vcc V
Low VIL-IR 0 0.5 V
TxD_IrDA Input Current High IH-IR 0.01 1 mA VI ≥ VIH
Low IL-IR 2 10 mA 0 ≤ VI ≤ VIL
LED Current Shutdown IVLED 0.01 10 mA VSD ≥ VH-SD,
Wake Up Time [5] tTW 0.2 10 ms
Maximum Optical Pulse Width [6] tPW(Max) 50 120 ms
TXD Pulse Width (SIR) tPW(SIR) 1.6 ms tPW(TXD_IR)=1.6ms at 115.2 kbit/s
TxD Rise & Fall Times (Optical) tr, tf600 ns tPW(TXD_IR)=1.6ms at 115.2 kbit/s
LED Anode On-State Voltage VON (LEDA) 2.8 V ILEDA=40mA,
VI(TxD) ≥ VIH
Transmitter (Remote Control Mode)
RC Radiant Intensity IEH 70 mW/sr ILEDA = 150mA, q1/2 ≤ 15°,
TxD_RC ≥ VIH, TA = 25 °C
RC Viewing Angle 2q1/2 30 60 °
RC Peak Wavelength lP885 nm
TxD_RC Logic Levels High VIH Vcc-0.5 VCC V
Low VIL 0 0.5 V
TxD_RC Input Current High IH0.01 1 mA VI ≥ VIH
Low IL2 10 mA 0 ≤ VI ≤ VIL
Maximum Optical Pulse Width [8] tPW(Max) 60 ms
LED Anode On-State Voltage VON (LEDA) 1.9 V ILEDA=150mA, VI(TxD) ≥ VIH
7
Transceiver
Parameters Symbol Min. Typ. Max. Units Conditions
Logic Input Voltage for SD Logic High VIH-SD
Vcc-0.5 Vcc V
Logic Low VIL-SD
0 0.4 V
Supply Current Shutdown ICC1 0.03 1 mA Vsd ≥ 1.5V
Idle (Standby) ICC2 60 80 mA VI(TxD) ≤ VIL, EI=0
Active ICC3 350 mA VI(TxD) ≥ VIL, EI=10mW/cm2
Note:
[2] For in-band signals 9.6 kbit/s to 115.2 kbit/s where 3.6 μW/cm2 ≤ EI ≤ 500 mW/cm2.
[3] Latency is dened as the time from the last TxD_IrDA light output pulse until the receiver has recovered full sensitivity.
[4] Receiver Wake Up Time is measured from Vcc power ON to valid RxD_IrDA output.
[5] Transmitter Wake Up Time is measured from Vcc power ON to valid light output in response to a TxD_IrDA pulse.
[6] The Optical PW is dened as the maximum time which the LED will turn on. This is to prevent the long turn on time for the LED.
SIR Mode Typical ILED vs VLEDA at VCC=3.6V and Temp=25C
0.036288
0.038304
0.04032
0.042336
0.044352
2 2.2 2.4 2.6 2.8 3 3.2
VLEDA (V)
ILED (A)
SIR Mode Typical LOP vs ILED at VCC=3.6V and Temp=25C
8
10
12
14
16
18
20
22
0.02 0.025 0.03 0.035 0.04 0.045
ILED (A)
LOP (mW/Sr)
RC Mode Typical ILED vs VLEDA at VCC=3.6V and Temp=25C
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
1.2 1.7 2.2 2.7 3.2
VLEDA (V)
ILED (A)
RC Mode Typical LOP vs ILED at VCC=3.6V and Temp=25C
40
50
60
70
80
90
100
110
120
130
140
0.1 0.15 0.2 0.25 0.3
ILED (A)
LOP (mW/Sr)
8
Timing Diagram
TXD “Stuck ON” Protection LED Optical Waveform
RXD Output Waveform
Receiver wakeup time waveform TXD wakeup time waveform
9
Package Dimension
Tape and Reel Dimensions
10
Tape and Reel Dimensions (Cont.)
11
ASDL-3007 Moisture Proof Packaging
All ASDL-3007 options are shipped in moisture proof package. Once opened, moisture absorption begins.
This part is compliant to JEDEC Level 3.
NO
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
ENVIRONMENT
LESS THAN 30
o
C
AND LESS THAN
60% RH
PACKAGE IS OPENED
(UNSEALED)
PACKAGE IS
OPENED LESS
THAN 168
HOURS
NO BAKING IS
NECESSARY
YES
YES
NO
NO
PARTS ARE NOT
RECOMMENDED TO
BE USED
PERFORM RECOMMENDED
BAKING CONDITIONS
PACKAGE IS
OPENED LESS
THAN 15 DAYS
YES
12
Baking Conditions Chart
Recommended Storage Conditions
Storage Temperature 10 °C to 30 °C
Relative Humidity Below 60% RH
Time from unsealing to soldering
After removal from the bag, the parts should be soldered
within 7 days if stored at the recommended storage con-
ditions. When MBB (Moisture Barrier Bag) is opened and
the parts are exposed to the recommended storage con-
ditions more than 7 days but less than 15 days the parts
must be baked before reow to prevent damage to the
parts.
Note: To use the parts that exposed for more than 15 days is not
recommended.
Baking Conditions
If the parts are not stored per the recommended storage
conditions they must be baked before reow to prevent
damage to the parts.
Package Temp Time
In reels 60 °C≥ 48hours
In bulk 100 °C≥ 4hours
Note: Baking should only be done once.
13
Recommended Reow Prole
Process Zones Symbol DT Maximum DT/Dtime or Duration
Heat Up P1, R1 25°C to 150°C 3°C/s
Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s
Solder Reow P3, R3
P3, R4
200°C to 260°C
260°C to 200°C
3°C/s
-6°C/s
Cool Down P4, R5 200°C to 25°C -6°C/s
Time maintained above liquidus point , 217°C > 217°C 60s to 90s
Peak Temperature 260°C -
Time within 5°C of actual Peak Temperature - 20s to 40s
Time 25°C to Peak Temperature 25°C to 260°C 8mins
The reow prole is a straight-line representation of a nominal temperature prole for a convective reow solder
process. The temperature prole is divided into four process zones, each with dierent DT/Dtime temperature change
rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at
the component to printed circuit board connections.
In process zone P1, the PC board and ASDL-3007 pins are heated to a temperature of 150°C to activate the ux in the
solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC
board and ASDL-3007 pins.
Process zone P2 should be of sucient time duration (100 to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder.
Process zone P3 is the solder reow zone. In zone P3, the temperature is quickly raised above the liquidus point of
solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60
and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good
solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections
becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze
solid.
Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and ASDL-
3007 pins to change dimensions evenly, putting minimal stresses on the ASDL-3007.
It is recommended to perform reow soldering no more than twice.
50 100 150 200 250 300
t-TIME
(SECONDS)
25
80
120
150
180
200
230
255
0
T - TEMPERATURE (°C)
R1
R2
R3 R4
R5
217
MAX 260
°
C
60 sec to 90 sec
Above 217
°
C
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL DOWN
14
Appendix A: ASDL-3007 SMT Assembly Application Note
Solder Pad, Mask and Metal Stencil
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The minimum
solder resist strip width required to avoid solder bridging
adjacent pads is 0.25mm.It is recommended that two -
ducially crosses be placed at mid length of the pads for
unit alignment.
Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended
Dimension mm
h 0.25
l 1.5
k 3.0
j 8.0
Figure A1. Stencil and PCBA
Recommended land pattern
Figure A2. Recommended Land Pattern
Recommended Metal solder Stencil Aperture
It is recommended that a 0.127 mm (0.005 inch) thick
stencil be used for solder paste printing. This is to ensure
adequate printed solder paste volume and no shorting.
See the Table 1 below the drawing for combinations of
metal stencil aperture and metal stencil thickness that
should be used.
Figure A3. Solder stencil aperture
Table 1
Stencil thickness, t (mm)
Aperture size (mm)
Length, l Width, w
0.127mm 1.7+/-0.05 0.5+/-0.05
Figure A4. Adjacent Land Keepout and Solder Mask Area
Metal Stencil
For Solder
Paste Printing
Stencil
Aperture
Solder
Mask
Land
Pattern
PCBA
w
l
Apertures As Per
Land Dimensions t
l
k
h
j
SOLDER MASK UNITS: mm
15
Appendix B: PCB Layout Suggestion
The ASDL-3007 is a shieldless part and hence does not
contain a shield trace unlike the other transceivers. The
eects of EMI and power supply noise can potentially
reduce the sensitivity of the receiver, resulting in reduced
link distance. The following PCB layout guidelines should
be followed to obtain a good PSRR and EM immunity
resulting in good electrical performance. Things to note:
1. The ground plane should be continuous under the
part.
2. VLED and Vcc can be connected to either unltered
or unregulated power supply. If VLED and Vcc share
the same power supply, CX3 need not be used. The
connections for CX1 and CX2 should be connected
before the current limiting resistor R1.
Top Layer Bottom Layer
Top layer
Connect the module ground pin to
bottom ground layer
Layer 2
Critical ground plane zone. Do not connect
directly to the module ground pin
Layer 3
Keep data bus away from critical ground
plane zone
Bottom layer (GND)
3. CX1 is generally a ceramic capacitor of low inductance
providing a wide frequency response while CX2 and
CX3 are tantalum capacitor of big volume and fast
frequency response. The use of a tantalum capacitor
is more critical on the VLED line, which carries a high
current.
4. Preferably a multi-layered board should be used
to provide sucient ground plane. Use the layer
underneath and near the transceiver module as Vcc,
and sandwich that layer between ground connected
board layers. The diagrams below demonstrate an
example of a 4-layer board :
The area underneath the module at the second layer, and
3cm in all direction around the module is dened as the
critical ground plane zone. The ground plane should be
maximized in this zone. The layout below is based on a
2-layer PCB.
16
Appendix C: General Application Guide for the ASDL-3007 Infrared IrDA® Compliant 115.2kb/s Transceiver
Figure C1. Mobile Application Platform
Description
The ASDL-3007, a wide-voltage operating range infrared
transceiver, is a low-cost and ultra small form factor
device that is designed to address the mobile computing
market such as PDAs, as well as small embedded mobile
products such as digital cameras and cellular phones. It
is spectrally suited to universal remote control transmis-
sion function. It is fully compliant to IrDA 1.4 low power
specication from 9.6kb/s to 115.2kb/s, and support
most remote control codes. The design of ASDL-3007 also
includes the following unique features:
• Spectrally suited to universal remote control
transmission function;
• Low passive component count;
• Shutdown mode for low power consumption
requirement;
Figure C2. PDA Platform
Selection of Resistor R1
Resistor R1 should be selected to provide the appropri-
ate peak pulse LED current at dierent ranges of Vcc as
shown on page 4 under “Recommended Application
circuit components”.
Interface to the Recommended I/O chip
The ASDL-3007’s TXD data input is buered to allow
for CMOS drive levels. No peaking circuit or capacitor
is required. Data rate from 9.6kb/s up to 115.2kb/s is
available at RXD pin. The TXD_RC, pin6, is used to select
the remote control transmit mode. Alternatively, the
TXD_IR, pin3, is used for infrared transmit selection.
Figures C1 and C2 show how ASDL-3007 ts into a mobile
phone and PDA platform respectively.
ASIC Controller
DSP Core
Microcontroller
Audio Interface
RF Interface
Transceiver
Mod/De-modulator
User Interface
Speaker
Microphone
IR RC
RAM
ROM
PCMCIA
Controller
RS232C
Driver
COM
Port
LCD
Panel
Touch
Panel
CPU for embedded
application
RC IR
17
Figure C3. Reference design circuit for IrDA+RC transceiver
Remote Control Operation
The ASDL-3007 is spectrally suited to universal remote
control transmission function. Remote control applica-
tions are not governed by any standards, owing to which
there are numerous remote codes in market. Each of
those standards results in receiver modules with dierent
sensitivities, depending on the carries frequencies and
responsively to the incident light wavelength.
Figure C3 illustrate a reference interfacing circuit to
implement both IrDA and RC functionality using ASDL-
3007. The transceiver is directly interface with the micro-
processor provided it has support for infrared commu-
GND
GND
A
SDL -3007
GPIO
(
6
)
TXD_RC
(
4
)
RXD
(
2
)
SD
IR_RXD
GPIO
IR_TXD
100Kohm
(
3
)
TXD_IR
VLED
R1
CX3
(1) LEDA
100Kohm
GND
GND
CX1
CX2
(5) V
CC
(
8
)
GND
VCC
(
7
)
NC
nication commonly known as Infrared Communications
Port (ICP). The remote control commands can be sent
through one of the available General Purpose IO pins
(GPIO). It is not recommended to turn on both IrDA data
transmission and Remote control transmission simulta-
neously to prevent mixing and corruption of data. During
IrDA data transmission, TxD_RC pin should be pull-down
but not letting it oating. Same condition applied for
Remote control transmission, which TxD_IR pin should
not be left oating.
18
Appendix D: Window Design for ASDL-3007
Window Dimension
To ensure IrDA compliance, some constraints on the
height and width of the window exist. The minimum
dimensions ensure that the IrDA cones angles are met
without vignetting. The maximum dimensions minimize
the eects of stray light. The minimum size corresponds
to a cone angle of 300 and the maximum size corre-
sponds to a cone angle of 600.
Module
Depth
(z) mm
Aperture Width
(x, mm)
Aperture Height
(y, mm)
Max min Max Min
0 10.09 7.42 4.99 2.32
1 11.24 7.95 6.14 2.85
2 12.40 8.49 7.30 3.39
3 13.55 9.02 8.45 3.92
4 14.71 9.56 9.61 4.46
5 15.86 10.09 10.76 4.99
6 17.02 10.63 11.92 5.53
7 18.17 11.17 13.07 6.07
8 19.33 11.70 14.23 6.60
9 20.48 12.24 15.38 7.14
Figure D2. Aperture Height (x) vs. Module Depth (z)Figure D1. Window Design for ASDL-3007
In gure D1, X is the width of the window, Y is the height
of the window and Z is the distance from the ASDL-3007
to the back of the window. The distance from the center
of the LED lens to the center of the photodiode lens, K, is
5.1mm. The equations for computing the window dimen-
sions are as follows:
X = K + 2*(Z+D)*tanA
Y = 2*(Z+D)*tanA
The above equations assume that the thickness of the
window is negligible compared to the distance of the
module from the back of the window (Z). If they are com-
parable, Z’ replaces Z in the above equation. Z’ is dened
as
Z’=Z+t/n
where ‘t’ is the thickness of the window and ‘n’ is the re-
fractive index of the window material.
The depth of the LED image inside the ASDL-3007, D, is
4.32mm. ‘A’ is the required half angle for viewing. For IrDA
compliance, the minimum is 150 and the maximum is
300. Assuming the thickness of the window to be neg-
ligible, the equations result in the following table and
gures:
K
Z
X
Y
D
IR Transparent WindowOPAQUE MATERIAL
IR Transparent Window OPAQUE MATERIAL
A
0
5
10
15
20
25
0123456789
Module Depth (z) mm
Aperture Width (x) mm
Xmax
Xmin
Figure D3. Aperture Height (y) vs. Module Depth (z)
0
2
4
6
8
10
12
14
16
18
0 1 2 3 4 5 6 7 8 9
Module Depth (z) mm
Aperture Height (Y) mm
Ymax
Ymin
The recommended minimum aperture width and height
is based on the assumption that the center of the window
and the center of the module are the same. It is recom-
mended that the tolerance for assembly be considered
as well. The minimum window size which will take into
acount of the assembly tolerance is dened as:
X (min + assembly tolerance) = Xmin + 2*(assembly
tolerance) (Dimensions are in mm)
Y (min + assembly tolerance) = Ymin + 2*(assembly
tolerance) (Dimensions are in mm)
Window Material
Almost any plastic material will work as a window
material. Polycarbonate is recommended. The surface
nish of the plastic should be smooth, without any
texture. An IR lter dye may be used in the window to
make it look black to the eye, but the total optical loss
of the window should be 10% or less for best optical
performance. Light loss should be measured at 885 nm.
The recommended plastic materials for use as a cosmetic
window are available from General Electric Plastics.
Recommended Plastic Materials:
Material # Light Transmission Haze Refractive Index
Lexan 141 88% 1% 1.586
Lexan 920A 85% 1% 1.586
Lexan 940A 85% 1% 1.586
Note: 920A and 940A are more ame retardant than 141.
Recommended Dye: Violet #21051 (IR transmissant above 625mm)
Shape of the Window
From an optics standpoint, the window should be at.
This ensures that the window will not alter either the
radiation pattern of the LED, or the receive pattern of the
photodiode. If the window must be curved for mechani-
cal or industrial design reasons, place the same curve on
the backside of the window that has an identical radius as
the front side. While this will not completely eliminate the
lens eect of the front curved surface, it will signicantly
reduce the eects. The amount of change in the radiation
pattern is dependent upon the material chosen for the
window, the radius of the front and back curves, and the
distance from the back surface to the transceiver. Once
these items are known, a lens design can be made which
will eliminate the eect of the front surface curve. The
following drawings show the eects of a curved window
on the radiation pattern. In all cases, the center thickness
of the window is 1.5 mm, the window is made of polycar-
bonate plastic, and the distance from the transceiver to
the back surface of the window is 3 mm.
Flat Window
(First Choice)
Curved Front and Back
(Second Choice)
Curved Front, Flat Back
(Do not use)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0454EN - June 21, 2007