"OH10/62,112" - NXP SEMICONDUCTORS

1. Product profile

1.1 General description

General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead

Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

1.3 Applications

General regulation functions

1.4 Quick reference data

[1] Pulse test: tp300 s; 0.02.

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for

cathode 16 mm2.

2. Pinning information

[1] The marking bar indicates the cathode.

TDZxJ series

Single Zener diodes

Rev. 2 — 29 July 2011 Product data sheet

SOD323F

Non-repetitive peak reverse power

dissipation: 180 W

Low differential resistance

Total power dissipation: 500 mW AEC-Q101 qualified

Very small plastic package suitable for

surface-mounted design

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF=100mA [1] --1.1V

Ptot total power dissipation Tamb 25 C[2] --500mW

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode

006aaa152

Product data sheet Rev. 2 — 29 July 2011 2 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

3. Ordering information

4. Marking

Tabl e 3. Ordering i nfo rmation

Type number Package

Name Description Version

TDZxJ series SC-90 plastic surface-mounted package; 2 leads SOD323F

Table 4. Marking codes

Type number Marking code Type number Marking code

TDZ2V4J 3A TDZ9V1J 3Q

TDZ2V7J 3B TDZ10J 3R

TDZ3V0J 3C TDZ11J 3S

TDZ3V3J 3D TDZ12J 3T

TDZ3V6J 3E TDZ13J 3U

TDZ3V9J 3F TDZ15J 3V

TDZ4V3J 3G TDZ16J 3W

TDZ4V7J 3H TDZ18J 3Y

TDZ5V1J 3J TDZ20J 3Z

TDZ5V6J JQ TDZ22J 4A

TDZ6V2J 3K TDZ24J 4B

TDZ6V8J 3L TDZ27J 4C

TDZ7V5J 3N TDZ30J 4D

TDZ8V2J 3P - -

Product data sheet Rev. 2 — 29 July 2011 3 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

5. Limiting values

[1] tp=100s; square wave; Tj=25C before surge.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 16 mm2.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 16 mm2.

[2] Soldering point of cathode tab.

7. Characteristics

[1] Pulse test: tp300 s; 0.02.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

IFforward current - 250 mA

IZSM non-repetitive peak

reverse current [1] -see

Table 8

and 10

PZSM non-repetitive peak

reverse power dissipation [1]

TDZ2V4J to TDZ5V6J - 180 W

TDZ6V2J to TDZ6V8J - 100 W

TDZ7V5J to TDZ30J - 40 W

Ptot total power dissipation Tamb 25 C[2] -500mW

Tjjunction temperature - 150 C

Tamb ambient temperature 55 +150 C

Tstg storage temperature 65 +150 C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] --250K/W

Rth(j-sp) thermal resistance from

junction to solder point [2] --25K/W

Table 7. Characteristics

Tj=25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage [1]

IF=10mA - - 0.9 V

IF=100mA - - 1.1 V

Product data sheet Rev. 2 — 29 July 2011 4 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

[1] f = 1 MHz; VR=0V

[2] tp= 100 s; square wave; Tj=25C before surge.

Table 8. Characteristics per type; Zener TDZ2V4 J to Zener T DZ24J

Tj=25



C unless otherwise specified.

TDZxxxJ Working voltage

VZ(V) Differential

resistance

rdif ()

Reverse current

IR(A) Temperature

coefficient

SZ(mV/K)

Diode

capacitance

Cd(pF)[1]

Non-repetitive

peak reverse

current

IZSM (A)[2]

IZ=5mA IZ=1mA IZ=5mA IZ=5mA

Min Max Max Max Max VR(V) Min Max Max Max

2V4 2.35 2.45 400 100 50 1.0 3.5 0 450 15

2V7 2.65 2.75 450 100 20 1.0 3.5 0 440 15

3V0 2.94 3.06 500 95 10 1.0 3.5 0 425 15

3V3 3.23 3.37 500 95 5 1.0 3.5 0 410 15

3V6 3.53 3.67 500 90 5 1.0 3.5 0 390 15

3V9 3.82 3.98 500 90 3 1.0 3.5 0 370 15

4V3 4.21 4.39 600 90 3 1.0 3.5 0 350 15

4V7 4.61 4.79 500 80 3 2.0 3.5 0.2 325 15

5V1 5.00 5.20 480 60 2 2.0 2.7 1.2 300 15

5V6 5.49 5.71 400 40 10 2.5 22.5275 15

6V2 6.08 6.32 150 10 3 4.0 0.4 3.7 250 12

6V8 6.66 6.94 80 15 2 4.0 1.2 4.5 215 12

7V5 7.5 7.65 80 10 1 5.0 2.5 5.3 170 4.0

8V2 8.04 8.36 80 10 0.70 5.0 3.2 6.2 150 4.0

9V1 8.92 9.28 100 10 0.50 6.0 3.8 7.0 120 3.0

10 9.80 10.20 150 10 0.20 7.0 4.5 8.0 110 3.0

11 10.80 11.20 150 10 0.10 8.0 5.4 9.0 108 2.5

12 11.80 12.20 150 10 0.10 8.0 6.0 10 105 2.5

13 12.70 13.30 170 10 0.10 8.0 7.0 11 103 2.5

15 14.70 15.30 200 15 0.05 10.5 9.2 13 99 2.0

16 15.70 16.30 200 20 0.05 11.2 10.4 14 97 1.5

18 17.6 18.4 225 20 0.05 12.6 12.4 16 93 1.5

20 19.6 20.4 225 20 0.05 14.0 14.4 18 88 1.5

22 21.6 22.4 250 25 0.05 15.4 16.4 20 84 1.25

24 23.5 24.5 250 30 0.05 16.8 18.4 22 80 1.25

Table 9. Characteristics per type; Zener TDZ5V6 J

Tj=25



C unless otherwise specified.

TDZxxxJ Working voltage

VZ(V) Differential resistance

rdif ()Temperature coefficient

SZ(mV/K)

IZ=10mA IZ=0.5mA IZ=10mA IZ=5mA

Min Max Max Max Min Max

5V6 5.20 6.00 500 7 1.7 2.8

Product data sheet Rev. 2 — 29 July 2011 5 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

[1] f = 1 MHz; VR=0V

[2] tp= 100 s; square wave; Tj=25C before surge.

Table 10 . Characteristics per type; Zener TD Z27J to Zener TDZ30J

Tj=25



C unless otherwise specified.

TDZxxxJ Working voltage

VZ(V) Differential resistance

rdif ()Reverse

current

IR(A)

Temperature

coefficient

SZ(mV/K)

Diode

capacitance

Cd(pF)[1]

Non-repetitive

peak reverse

current

IZSM (A)[2]

IZ=2mA IZ=0.5mA IZ=2mA IZ=2mA

Min Max Max Max Max VR(V) Min Max Max Max

27 26.5 27.5 250 40 0.05 18.9 21.4 25.3 73 1

30 29.4 30.6 250 40 0.05 21 24.4 29.4 66 1

(1) TDZ2V4J to TDZ5V6J

(2) TDZ6V2J to TDZ6V8J

(3) TDZ7V5J to TDZ30J; Tj=25C before surge

(4) TDZ7V5J to TDZ30J; Tj= 150 C before surge

Tj=25C

Fig 1. Non-repetitive peak rev erse power dissipation

as a function of pulse duration; maximum

values

Fig 2. Forward current as a function of forward

voltage; typical values

006aac671

102

103

PZSM

(W)

tp (s)

10–4 10–2

10–3

(1)

(2)

(4)

(3)

VF (V)

0.6 10.8

mbg781

100

200

300

(mA)

Product data sheet Rev. 2 — 29 July 2011 6 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

TDZ2V4J to TDZ4V7J

Tj=25C to 150 CTDZ5V1J to TDZ15J

Tj=25C to 150 C

Fig 3. Temperature coefficient as a function of

working current; typica l values Fig 4. Tempera ture coefficient as a function of

working current; typical va lues

TDZ2V7J to TDZ6V6J

Tj=25CTDZ10J to TDZ27J

Tj=25C

Fig 5. Working current as a function of working

voltage; typical values Fig 6. Working current as a function of working

voltage; typical values

IZ (mA)

10−1102

101

mld444

−1

−0.5

−1.5

0.5

(mV/K)

−2

2V4

4V7

4V3

3V9

3V6

3V3

3V0

2V7

mld445

(mV/K)

−4

IZ (mA)

10−1102

101

9V1

5V6

5V1

8V2

7V5

6V8

6V2

VZ (V)

0108462

006aaa996

(mA)

VZ(nom) (V) = 2.7

3.3

3.9

4.75.6 6.8 8.2

006aac672

VZ (V)

0302010

(mA)

2722

VZ(nom) (V) = 10

Product data sheet Rev. 2 — 29 July 2011 7 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

Fig 7. Package outline SOD323F (SC-90)

04-09-13Dimensions in mm

0.80

0.65

0.25

0.10

0.5

0.3

2.7

2.3 1.8

1.6

0.40

0.25

1.35

1.15

Table 11. Packing method s

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quan tity

3000 10000

TDZxJ series SOD323F 4 mm pitch, 8 mm tape and reel -115 -135

Product data sheet Rev. 2 — 29 July 2011 8 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

11. Soldering

Reflow soldering is the only recommended soldering method.

Fig 8. Reflow soldering footprint SOD323F (SC-90)

0.951.65

2.2

2.1

3.05

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

0.5

(2×)

0.6

(2×)

0.6 (2×)0.5 (2×)

sod323f_fr

Product data sheet Rev. 2 — 29 July 2011 9 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

12. Revision history

Table 12. Revision history

Document ID Release date Data sheet status Ch ange notice Supersedes

TDZXJ_SER v.2 20110729 Product data sheet - TDZ5V6J v.1

Modifications: •Added type numbers TDZ2V4 J, TDZ2 V7 J, TDZ3 V0 J, TDZ3 V3 J, TDZ 3V6J, TDZ3V 9J,

TDZ4V3J, TDZ4V7J, TDZ5V1J, TDZ6V2J, TDZ6V8J, TDZ7V5J, TDZ8V2J, TDZ9V1J,

TDZ10J, TDZ11J, TDZ12J, TDZ13J, TDZ15J, TDZ16J, TDZ18J, TDZ 20J, TDZ22J,

TDZ24J, TDZ27J and TDZ30J.

•Added Table 8 to 10.

•Updated Figure 1 to 4 and added Figure 5 and 6.

TDZ5V6J v.1 20100823 Product data sheet - -

Product data sheet Rev. 2 — 29 July 2011 10 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-crit ical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe propert y or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 29 July 2011 11 of 12

NXP Semiconductors TDZxJ series

Single Zen er di od e s

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors TDZxJ series

Single Zen er di od e s

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 29 July 2011

Document identifier: TDZXJ_SER

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning in formation. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Packing information . . . . . . . . . . . . . . . . . . . . . 7

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12