TD62008APG/AFG
2007-10-16
1
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62008APG,TD62008AFG
7CH DARLINGTON SINK DRIVER
The TD62008APG and TD62008AFG are high−voltage,
high−current darlington drivers comprised of seven NPN
darlington pairs.
All units feature integral clamp diodes for switching inductive
loads and protective diodes against a negative input voltage.
The TD62008APG and TD62008AFG are suitable for interfaces
from plus and minus dual supply voltage systems to plus single
supply voltage systems.
Applications include relay, hammer, lamp and display (LED)
drivers.
Please observe the thermal conditions for use.
The suffix (G) appended to the part number represents a RoHS
product.
Features
z Output current (single output) 400 mA (Max)
z High sustaining voltage output 50 V (Min)
z Output clamp diodes
z Protective diodes against a negative input voltage
z Inputs base resistor RIN = 20 kΩ
z Inputs compatible with 9~15 V PMOS, CMOS.
z Package type−APG : DIP−16 pin
z Package type−AFG : SOP−16 pin
Pin Connection (top view) Schematics (each driver)
Note: The input and output parasitic diodes cannot
be used as clamp diodes.
Weight
DIP16−P−300−2.54A : 1.11 g (typ.)
SOP16−P−225−1.27 : 0.16 g (typ.)
TD62008APG
TD62008AFG
TD62008APG/AFG
2007-10-16
2
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTIC SYMBOL RATING UNIT
Output Sustaining
Voltage VCE (SUS) −0.5 ~ 50 V
Output Current IOUT 400 mA / ch
Input Voltage VIN −40 ~ 40 V
Clamp Diode Reverse
Voltage VR 50 V
Clamp Diode Forward Current IF 400 mA
APG 1.47
Power Dissipation
AFG
PD 0.625 (Note)
W
Operating Temperature Topr −40 ~ 85 °C
Storage Temperature Tstg −55 ~ 150 °C
Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
Operating Conditions (Ta = −40 ~ 85°C)
CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT
Output Sustaining
Voltage VCE (SUS) 0 ― 50 V
DC 1 Circuit, Tpw = 25%, Duty = 40% 0 ― 400
Output Current IOUT Tpw = 25 ms, Duty = 10%, 7 Circuits 0 ― 200
mA
Input Voltage VIN −35 ― 35 V
Clamp Diode Reverse
Voltage VR ― ― 50 V
Clamp Diode Forward Current IF ― ― 400 mA
APG ― ― 0.52
Power Dissipation
AFG
PD Ta = 85°C (Note) ― ― 0.325
W
Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
TD62008APG/AFG
2007-10-16
3
Electrical Characteristics (Ta = 25°C)
CHARACTERISTIC SYMBOL
TEST
CIR−
CUIT
TEST CONDITION MIN TYP. MAX UNIT
Output Leakage
Current ICEX 1 VOUT = 50 V ― ― 100 μA
IOUT = 400 mA ― 1.3 2.4
Collector−Emitter Saturation Voltage VCE (sat) 2
IOUT = 200 mA ― 1.0 1.6
V
VIN = 18 V ― 0.85 1.8
“H” Level IIN (ON) 4
VIN = 35 V ― ― 3.8
mA
Input Current
“L” Level IIN (OFF) 4 VIN = −35 V ― ― −20 μA
DC Current Transfer Ratio hFE 3 VCE = 4 V, IOUT = 350 mA 1000 3000 ―
Clamp Diode Reverse Current IR 5 VR = 50 V, VR = 35 V (Type−F) ― ― 100 μA
Clamp Diode Forward Voltage VF 6 IF = 400 mA ― 1.5 2.4 V
Turn−On Delay tON VOUT = 50 V, RL = 156 Ω ― 0.1 ― μs
Turn−Off Delay tOFF
7 CL =
15 pF
VOUT = 50 V, RL = 156 Ω ― 0.2 ― μs
TD62008APG/AFG
2007-10-16
4
Test Circuit
1. ICEX 2. VCE (sat) 3. hFE
4. IIN (ON), IIN (OFF) 5. IR 6. VF
7. tON, tOFF
Precautions for Use
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since the IC may be
destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
Note 1: Pulse Width 50 μs
Duty Cycle 10%
Output Impedance 50 Ω
tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance
TD62008APG/AFG
2007-10-16
5
① Type-APG Free Air
② Type-AFG Free Air
③ Type-APG On Glass Epoxy
PCB 30x30x16mm Cu 50%
TD62008APG/AFG
2007-10-16
6
Package Dimensions
DIP16−P−300−2.54A Unit : mm
Weight: 1.11 g (Typ.)
TD62008APG/AFG
2007-10-16
7
Package Dimensions
SOP16−P−225−1.27 Unit : mm
Weight: 0.16 gTyp.)
TD62008APG/AFG
2007-10-16
8
Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause breakdown, damage or deterioration of the device, and may result
in injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load. A breakdown could cause a large current to continuously
flow and lead to smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings are required, such as fuse capacity, fusing time and insertion circuit
location.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause breakdown, damage or deterioration of the device, and may result
injury by explosion or combustion.
In addition, do not use any device that has had current applied even once while inserted in the wrong
orientation or incorrectly .
(5) Carefully select external components such as power amps and regulators (including input and
negative feedback capacitors), and load components such as speakers.
If there is a large amount of leakage current, such as from input or negative feedback condensers, the
IC output DC voltage will increase. If this output voltage is connected to a speaker with a low input
voltage threshold, overcurrent or IC failure could cause smoke or ignition. (The overcurrent can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage directly to a speaker.
TD62008APG/AFG
2007-10-16
9
Points to Remember on Handling of ICs
(1) Heat Radiation Design
When using an IC with a large current flow, such as in a power amp, regulator or driver, please
design the device so that heat is appropriately radiated, so as not to exceed the specified junction
temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An
inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics
or IC breakdown. In addition, please design the device taking into consideration the effect of IC heat
radiation on peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, current flows back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
TD62008APG/AFG
2007-10-16
10
RESTRICTIONS ON PRODUCT USE
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also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
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