HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6275-A Issued Date : 1999.02.01 Revised Date : 2000.09.15 Page No. : 1/3 H2N5366 PNP EPITAXIAL PLANAR TRANSISTOR Description The H2N5366 is designed for general purpose applications requiring high breakdown voltages. Features * This device was designed for use as general purpose amplifier and switches. Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 400 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -40 V VCEO Collector to Emitter Voltage .................................................................................... -40 V VEBO Emitter to Base Voltage ............................................................................................ -4 V IC Collector Current ...................................................................................................... -500 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 fT Cob Min. -40 -40 -4 80 100 40 - Typ. - Max. -100 -100 -250 -1 -1.1 -2 10 Unit V V V nA nA mV V V V MHz PF Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-45V, IE=0 VEB=-3V. IC=0 IC=-50mA, IB=-5mA IC=-300mA, IB=-30mA IC=-50mA, IB=-5mA IC=-300mA, IB=-30mA VCE=-1V, IC=-2mA VCE=-1V, IC=-50mA VCE=-5V, IC=-300mA VCE=-10V, IC=-10mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% HSMC Product Specification HI-SINCERITY Spec. No. : HE6275-A Issued Date : 1999.02.01 Revised Date : 2000.09.15 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 10000 Saturation Voltage (mV) VCE=5V VCE=1V hFE 100 10 1000 100 VCE(sat) @ IC=10IB 1 10 1 10 100 1000 1 10 Collector Current (mA) Saturation Voltage & Collector Current Capacitance & Reverse-Biased Voltage Capacitance (Pf) Saturation Voltage (mV) 1000 100 10000 1000 VBE(sat) @ IC=10IB 10 Cob 1 100 1 10 100 1 1000 10 Collector Current (mA) 100 Reverse Biased Voltage (V) Safe Operating Area PD-Ta 10 450 400 Power Dissipation-PD(mW) PT=1ms Collector Current (mA) 100 Collector Current (mA) PT=100ms 1 PT=1s 0.1 350 300 250 200 150 100 50 0 0.01 1 10 Forward Voltage (V) 100 0 50 100 150 200 o Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY Spec. No. : HE6275-A Issued Date : 1999.02.01 Revised Date : 2000.09.15 Page No. : 3/3 MICROELECTRONICS CORP. TO-92 Dimension 2 A Marking : HSMC Logo B 1 2 Product Series Part Number 3 Date Code Rank 3 C Laser Mark HSMC Logo Product Series D Part Number H I G Ink Mark 1 Style : Pin 1.Emitter 2.Collector 3.Base E F 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification