LANGUAGE PRODUCT SPECIFICATION 1. JAPANESE ENGLISH SCOPE 0.5 mm FPC This specification covers the 0.5mm PITCH FPC CONNECTOR series. 2. PRODUCT NAME AND PART NUMBER Product Name Part Number Housing Assembly (Upper Contact Type) LEAD FREE 54550-**29 54550-**29 Embossed Tape Package for 54550-**29 LEAD FREE 54550-**71 *: 3. Refer to the drawing. RATINGS Item Standard Rated Voltage (MAX.) 50 V [AC ( rms) / DC ] Rated Current (MAX.) 0.5 A Ambient Temperature Range -40C ~ + 85C *1 *2 *1: Including terminal temperature rise. *2: FPC FPC must be met temperature range specified in this standard. REV. SHEET J G H J 1~10 1~10 1-15 REVISE ON PC ONLY REVISED J2016-0602 '15/12/01 T.MORISHITA REV. DESCRIPTION STATUS DESIGN CONTROL J DOCUMENT NUMBER PS-54550-012 TITLE: 0.5 FPC Conn ZIF Upr Cont -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION WRITTEN BY: N.AIDA CHECKED BY: K.TOJO APPROVED BY: N.UKITA DATE: YR/MO/DAY 2004/02/18 FILE NAME PS54550012.docx SHEET 1 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 4. PERFORMANCE 4 - 1. Electrical Performance Test Condition Item 4-1-1 4-1-2 4-1-3 Contact Resistance Insulation Resistance Dielectric Strength 4 - 2. FPC 20mV 10mA (JIS C5402 5.4) FPC DC 500V (JIS C5402 5.2/MIL-STD-202 302) 50 Megohm MIN. Mate applicable FPC and apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 Method 302 FPC AC 250V () 1 (JIS C5402 5.1/MIL-STD-202 301) No Breakdown Mate applicable FPC and apply 250V AC(rms) for 1 minute between adjacent terminal or ground. (JIS C5402 5.1/MIL-STD-202 Method 301 Mechanical Performance Test Condition Actuator Insertion/ Withdrawal Force FPC 253mm FPC FPC Retention Force 4-2-2 40 milliohm MAX. Mate applicable FPC and measure by dry circuit, 20mV MAX., 10mA. (JIS C5402 5.4) Item 4-2-1 Requirement Mate applicable FPC and insert and withdrawal actuator at the speed rate of 253mm/minute. 253mm FPC Insert the actuator, pull the FPC at the speed rate of 25+/-3mm/minute. REVISE ON PC ONLY Requirement 6 Refer to paragraph 6 7 Refer to paragraph 7 TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 2 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION 4 - 3. Environmental Performance and Others Test Condition Repeated Actuator Insertion/ Withdrawal 1 10 20 Item 4-3-1 Temperature Rise 4-3-2 JAPANESE ENGLISH Insert and withdraw actuator up to 20 cycles at the speed rate of less than 10 cycles/minute. Requirement Contact Resistance 60 milliohm MAX. FPC (UL 498) Temperature Rise Carrying rated current load. 30C MAX. (UL 498) 4-3-3 4-3-4 Vibration Shock DC 1mA 3 10~55~10/ 1.5mm 2 (MIL-STD-202 201) Amplitude : 1.5mm P-P Sweep time : 10-55-10 Hz in 1 minute Duration : 2 hours in each X.Y.Z. axes (MIL-STD-202 Method 201) DC 1mA 2 6 490m/s {50G} 3 (JIS C60068-2-27/MIL-STD-202 213) 2 490m/s {50G}, 3 strokes in each X.Y.Z. axes. (JIS C60068-2-27/MIL-STD-202 Method 213) Heat Resistance 4-3-5 FPC852C 96 12 (JIS C60068-2-2/MIL-STD-202 108) 85+/-2 degree C, 96 hours (JIS C60068-2-2/MIL-STD-202 Method108) REVISE ON PC ONLY Appearance No Damage Contact Resistance 60 milliohm MAX. Discontinuity 1 microsecond MAX. Appearance No Damage Contact Resistance 60 milliohm MAX. Discontinuity 1 microsecond MAX. Appearance No Damage Contact Resistance 60 milliohm MAX. TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 3 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION Test Condition Item Cold Resistance 4-3-6 FPC-402C 96 12 (JIS C60068-2-1) -40+/-2 degree C, 96 hours (JIS C60068-2-1) 4-3-7 Humidity Temperature Cycling 4-3-8 FPC602C 90 95% 96 12 (JIS C60068-2-3/MIL-SDT-202 103) Temperature : 60+/-2 degree C Relative Humidity : 90-95% Duration : 96 hours (JIS C60068-2-3/MIL-SDT-202 Method 103) FPC-55C 30+85C 30 1 5 5 12 (JIS C0025) 5 cycles of : a) -55 degree C : 30 minutes b) +85 degree C : 30 minutes (JIS C0025) Salt Spray 4-3-9 FPC352C 51% 484 (JIS C60068-2-11/MIL-STD-202 101) 484 hours exposure to a salt spray from the 51% solution at 35+/-2 degree C. (JIS C60068-2-11/MIL-STD-202 Method 101) REVISE ON PC ONLY JAPANESE ENGLISH Requirement Appearance No Damage Contact Resistance 60 milliohm MAX. Appearance No Damage Contact Resistance Dielectric Strength Insulation Resistance 4-1-3 Must meet 4-1-3 Appearance No Damage Contact Resistance 60 milliohm MAX. Appearance No Damage Contact Resistance 60 milliohm MAX. 60 milliohm MAX. 20 Megohm MIN. TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 4 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION Test Condition Item 24 hours exposure to 50+/-5ppm SO2 gas at 40+/-2 degree C. FPC28% 40 (1L25mL) NH3 Gas 4-3-11 Requirement FPC402 505ppm 24 SO2 Gas 4-3-10 JAPANESE ENGLISH 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. 0.2mm 0.2mm 2453 30.5 Solderability 4-3-12 Soldering time : 3+/-0.5 seconds Solder temperature : 245+/-3 degree C 0.2mm from terminal tip and fitting nail tip. Contact Resistance 60 milliohm MAX. Contact Resistance 60 milliohm MAX. Solder Wetting 90% 90% of immersed area must show no voids, pin holes. Appearance No Damage () 82 (When reflowing) Repeat paragraph 8, condition two times. Resistance to Soldering Heat 4-3-13 () 0.2mm 0.2mm 35010 5 (Soldering iron method) Soldering time : 5 seconds MAX. Solder temperature : 350+/-10 degree C 0.2mm from terminal tip and fitting nail tip. ( { 5. ) } : : Reference Standard Reference Unit PRODUCT SHAPE, DIMENSIONS AND MATERIALS Refer to the drawing REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 5 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION 6. No. of CIRCUIT UNIT 4 JAPANESE ENGLISH ACTUATOR INSERTION/WITHDRAWAL FORCE () Insertion Force (MAX.) () Withdrawal Force (MAX.) 1st 6 6th 20 20th 1st 6 6th 20 20th N {kgf} 28.4 {2.9} 26.4 {2.7} 26.4 {2.7} 37.2 {3.8} 33.3 {3.4} 33.3 {3.4} 5 N {kgf} 29.4 {3.0} 27.4 {2.8} 27.4 {2.8} 38.2 {3.9} 34.3 {3.5} 34.3 {3.5} 6 N {kgf} 30.3 {3.1} 28.4 {2.9} 28.4 {2.9} 39.2 {4.0} 35.2 {3.6} 35.2 {3.6} 7 N {kgf} 31.3 {3.2} 29.4 {3.0} 29.4 {3.0} 40.1 {4.1} 36.2 {3.7} 36.2 {3.7} 8 N {kgf} 32.3 {3.3} 30.3 {3.1} 30.3 {3.1} 41.1 {4.2} 37.2 {3.8} 37.2 {3.8} 9 N {kgf} 33.3 {3.4} 31.3 {3.2} 31.3 {3.2} 42.1 {4.3} 38.2 {3.9} 38.2 {3.9} 10 N {kgf} 34.3 {3.5} 32.3 {3.3} 32.3 {3.3} 43.1 {4.4} 39.2 {4.0} 39.2 {4.0} 11 N {kgf} 35.2 {3.6} 33.3 {3.4} 33.3 {3.4} 44.1 {4.5} 40.1 {4.1} 40.1 {4.1} 12 N {kgf} 36.2 {3.7} 34.3 {3.5} 34.3 {3.5} 45.0 {4.6} 41.1 {4.2} 41.1 {4.2} 13 N {kgf} 37.2 {3.8} 35.3 {3.6} 35.3 {3.6} 46.0 {4.7} 42.1 {4.3} 42.1 {4.3} 14 N {kgf} 38.2 {3.9} 36.2 {3.7} 36.2 {3.7} 47.0 {4.8} 43.1 {4.4} 43.1 {4.4} 15 N {kgf} 39.2 {4.0} 37.2 {3.8} 37.2 {3.8} 48.0 {4.9} 44.1 {4.5} 44.1 {4.5} 16 N {kgf} 40.1 {4.1} 38.2 {3.9} 38.2 {3.9} 49.0 {5.0} 45.0 {4.6} 45.0 {4.6} 17 N {kgf} 41.1 {4.2} 39.2 {4.0} 39.2 {4.0} 49.9 {5.1} 46.0 {4.7} 46.0 {4.7} 18 N {kgf} 42.1 {4.3} 40.1 {4.1} 40.1 {4.1} 50.9 {5.2} 47.0 {4.8} 47.0 {4.8} REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 6 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION No. of UNIT CIRCUIT () Insertion Force (MAX.) JAPANESE ENGLISH () Withdrawal Force (MAX.) 1st 6 6th 20 20th 1st 6 6th 20 20th 20 N {kgf} 44.1 {4.5} 42.1 {4.3} 42.1 {4.3} 52.9 {5.4} 49.0 {5.0} 49.0 {5.0} 21 N {kgf} 45.0 {4.6} 43.1 {4.4} 43.1 {4.4} 53.9 {5.5} 49.9 {5.1} 49.9 {5.1} 22 N {kgf} 46.0 {4.7} 44.1 {4.5} 44.1 {4.5} 54.8 {5.6} 50.9 {5.2} 50.9 {5.2} 24 N {kgf} 48.0 {4.9} 46.0 {4.7} 46.0 {4.7} 56.8 {5.8} 52.9 {5.4} 52.9 {5.4} 26 N {kgf} 50.0 {5.1} 48.0 {4.9} 48.0 {4.9} 58.8 {6.0} 54.8 {5.6} 54.8 {5.6} REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 7 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION 7. FPC JAPANESE ENGLISH FPC RETENTION FORCE No. of CIRCUIT UNIT () Retention Force (MIN.) 1st 10 10th No. of CIRCUIT UNIT () Retention Force (MIN.) 1st 10 10th 4 N {kgf} 0.3 {0.03} 0.2 {0.02} 15 N {kgf} 3.6 {0.36} 3.1 {0.31} 5 N {kgf} 0.5 {0.05} 0.3 {0.03} 16 N {kgf} 3.8 {0.38} 3.3 {0.33} 6 N {kgf} 0.7 {0.07} 0.4 {0.04} 17 N {kgf} 4.0 {0.40} 3.5 {0.35} 7 N {kgf} 1.1 {0.11} 0.8 {0.08} 18 N {kgf} 4.3 {0.43} 3.8 {0.38} 8 N {kgf} 1.5 {0.15} 1.2 {0.12} 19 N {kgf} 4.5 {0.45} 4.0 {0.40} 9 N {kgf} 1.6 {0.16} 1.3 {0.13} 20 N {kgf} 4.7 {0.48} 4.3 {0.43} 10 N {kgf} 1.8 {0.18} 1.5 {0.15} 21 N {kgf} 4.9 {0.50} 4.5 {0.45} 11 N {kgf} 2.3 {0.23} 1.9 {0.19} 22 N {kgf} 5.2 {0.53} 4.7 {0.48} 12 N {kgf} 2.8 {0.28} 2.3 {0.23} 24 N {kgf} 5.7 {0.58} 5.2 {0.53} 13 N {kgf} 3.1 {0.31} 2.6 {0.26} 26 N {kgf} 6.2 {0.63} 5.7 {0.58} 14 N {kgf} 3.4 {0.34} 2.9 {0.29} REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 8 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 8 REFLOW CONDITION 250+5/-10 () 250+5/-10 degree C (PEAK TEMP.) 230 200 230 degree C MINIMUM 200 degree C 150 150 degree C 90120 90120 sec. (150200) (Pre-heat150-200 degree C) 3060 30~60 seconds TEMPERATURE CONDITION GRAPH (Temperature is measured at the soldering area on the surface of the print writing board) N2 () NOTE: Please investigate the mounting condition (reflow soldering condition) on your own devices beforehand. The mounting conditions may change due to the soldering temperature, soldering paste, air reflow machine, Nitrogen reflow machine, and the type of printed writing board. The different mounting conditions may have an influence on the product's performance. REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 9 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 1. LCP Although this product may have a small black dot, a weld line or a scratch on the housing, it doesn't impact the product's performance. Also, although weld line may stand out due to LCP used to mold material of this product, it doesn't impact the product's performance. 2. Although there may be slight differences in the housing color tone, it doesn't impact the product's performance. 3. Although the housing color tone could be changed by ultraviolet light, it doesn't impact the product's performance. 4. Although white marks due to drying of lubricant might be seen on the actuator, there is no influence on the product's performance. 5. N2 () Please make sure to do test run under the mounting condition (reflow soldering condition) on your own devices before use because reflow condition may change due to the local condition (Air / N2 reflow / temperature profile / solder paste, metal mask thickness / aperture rate / pattern layout of PWB / types of PWB / and other factors ). Depending on the mounting condition, product's performance might be influenced by occurrence of solder-wicking or flux wicking at contact area. 6. The product performance was tested using rigid PWB. In case the product needs to be mounted onto FPC, please conduct a reflow test on the FPC before use. 7. In case of mounting the connector onto FPC, add a stiffener on the FPC in order to prevent the deformation. 8. (PWB/FPC) Please design appropriate pattern on boards (PWB / FPC) for this connector to avoid excess temperature rise. REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 10 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 9. In case of designing with changing our recommended board pattern size, please consult the contact person in advance because it may cause a fatal defect. 10. Max0.02mm The mounting specification for coplanarity does not include the influence of warpage of the PWB. Warpage of the PWB should be 0.02mm at maximum at center of the connector based on the both sides of connector. 11. N2 N2 This product is designed to be mounted by air reflow. So, if this product is mounted by N2 reflow, solder wicking may caused after reflow. Therefore if it is plan to adopt N2 reflow for this connector, an evaluation is needed separately. 12. Our evaluation is conducted based on Molex-recommended condition specified in this product specification. 13. Only coplanarity before reflow is guaranteed. Coplanarity in and after reflow is not guaranteed. 14. If you leave any soldering area on this product open, it could occur terminal disengagement, short circuit between pins, terminal buckling or connector disengagement from the PWB. Therefore, please solder all of the soldering tails and fitting nails on the PWB. 15. Since this product is low profile product, flux wicking could be occurred on the areas except for the terminal contacts. However it does not impact on the product's performance. 16. If accidental contact is added onto connectors in the reflow machine, connectors could be deformed or damaged. Therefore review the reflow machine before use of the connectors. 17. Although color tone of housing could be varied depending on reflow conditions, it does not impact on the product's performance. 18. Although some discoloration could be seen on the soldering tail after reflow, it does not impact on the product's performance. REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 11 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 19. PIN When using this product, ensure that the specification for rated current per a circuit is followed. Do not allow the sum of the current used on several circuits to exceed the maximum allowable current. 20. Do not use the connector in a condition where the mating area (contact area) are constantly moved due to sympathetic vibration of wires and PWB or constant movement of devices. It may cause contact failure due to the worn out. Therefore fix wires and PWB on the chassis to reduces sympathetic vibration. 21. FPC FPC FPC FPC Pay special attention not to apply any pulling force/tension on the FPC while it is inserted into the connector. Avoid placing the connector where load is applied on the connector on the customer's board. The load could cause the actuator unlocked, the actuator disengagement, breaking of FPC wire, and/or damage of FPC. If the location is where constant load is applied on the FPC, fix the FPC directly on the chassis. Also, avoid applying loads to the connector by pulling FPC vertically or twisting FPC back and force horizontally while it is inserted in the connector. 22. Do not mate and un-mate connectors while those are energized since this connector is not designed to allow it. It may cause danger due to sparks and functional failure of the product. 23. FPC Use the appropriate FPC with the contact area with Gold plating (Nickel under plating). 24. FPC Check the compatibility between the connector and the FPC prior to the use in the mass production. 25. At packaging, transportation and storing, avoid applying loads to connectors by handling, interference of connectors or piling-up packages. It could cause functional defect such as connector deformation or breakage. 26. Do not stack PWB directly after mounting the connector on it. 27. Do not wash connector because it may impact the product's function. REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 12 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 28. FFC When using a flexible cable (especially FFC), ensure to comply with the temperature specification of the cable (especially FFC) Also, it is recommended to evaluate the compatibility between connector and your flexible cable. 29. Do not touch the terminals and fitting nails of connectors before or after mounting onto the PWB. 30. Avoid move or assembly of connector which could apply loads to the direction of the connector pitch, span or rotation. It may damage the connector and crack the soldering. 31. FPC FPC FPC FPC When inserting the FPC into the connector, ensure the actuator fully opened and to insert FPC completely until the end of the FPC touches the housing. Diagonal insertion of the FPC into the connector could cause short circuit due to the misaligned pitch, terminal deformation and damage on FPC contact area due to interference of the FPC edge to the terminal contact. (Noted: This connector has a tentative cable-hold feature which holds the FPC in place prior to actuation. Therefore small insertion resistance occurred at FPC insertion.) 32. FPC FPC Open/close the actuator only while the FPC is fully inserted into the connector on board. Open/close operation without FPC inserted in it could cause disengagement of actuator. 33. Do not use a tool with a sharp tip such as tweezers to operate an actuator. Also Do not insert the finger or finger nail deeply. It may cause terminal deformation, connector breakage and damage on the soldered area. 34. When opening and closing the actuator, gently push the both side of the actuator so that even force is applied across the actuator carefully. Do not apply a force only to one side of actuator. It may damage the connector. 35. After closing the actuator, apply soft pressure on the top of actuator to ensure that the actuator is completely locked. REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 13 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 36. FPC FPC When withdrawing the FPC, ensure that the actuator is completely open. If the FPC is withdrawn without the actuator fully opened, ensure that there is no debris on the contact area before inserting the FPC again. 37. When conducting manual repairs using a soldering iron, follow the soldering conditions shown in the product specification. If the conditions in the product specification are not followed, it may cause the terminal disengagement, contact gap change, housing deformation, housing melting, and connector damage. 38. When conducting manual repairs using a soldering iron, do not use excess solder and flux than needed. It may cause solder wicking and flux wicking issues, and also eventually cause a contact defect and functional issues. REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 14 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH REV. REV. RECORD DATE ECN NO. WRITTEN BY : CHECKED BY : A RELEASED `04/02/18 J2004-2495 N.AIDA K.TOJO B REVISED `04/05/19 J2004-4322 N.AIDA K.TOJO C REVISED `04/07/12 J2005-0143 M.NABEI K.TOJO D REVISED `05/07/28 J2006-0318 N.AIDA K.TOYODA E REVISED `05/11/01 J2006-1461 N.AIDA K.TOYODA F REVISED `07/05/14 J2007-3119 Y.AOYAGI K.TOYODA G REVISED `09/01/21 J2009-1769 M.TAKASAKI M.HAYASHI H REVISED `15/08/11 J2015-1471 M.TAKAHASHI04 K.TAKAHASHI J REVISED `15/12/01 J2016-0602 T.MORISHITA K.TAKAHASHI REVISE ON PC ONLY TITLE: 0.5 FPC Conn ZIF Upr Cont J SEE SHEET 1 OF 15 REV. DESCRIPTION -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-54550-012 PS54550012.docx 15 OF 15 EN-037(2015-11 rev.1)