IS1870/71 Bluetooth(R) Low Energy (BLE) SoC Features Radio Frequency (RF)/Analog Features * Bluetooth smart 4.2 Bluetooth Low Energy (BLE) compliant * 256 Kbytes embedded Flash memory * UART/SPI/I2C interface supported * Integrated crystal oscillator operates with 32 MHz external crystal * Temperature sensor supported * 31 general purpose I/O (GPIO) pins for IS1870 SoC and 15 GPIO pins for IS1871 SoC * Supports 4-channel pulse-width modulation (PWM) for IS1870 SoC and 1-channel PWM for IS1871 SoC * Supports 12-bit ADC (ENOB=10 or 8 bits) for battery and voltage detection * 16-channel ADC for IS1870 SoC and 6-channel ADC for IS1871 SoC are provided * AES-CMAC hardware engine * Beacon support * Low power consumption * Compact size: - IS1871: 4 mm x 4 mm 32QFN package - IS1870: 6 mm x 6 mm 48QFN package * * * * * ISM band: 2.402 GHz to 2.480 GHz operation Channels: 0 to 39 Rx sensitivity: -90 dBm in BLE mode Tx power: 0 dBm (typical) Received Signal Strength Indicator (RSSI) monitor Operating Conditions * Operating voltage: 1.9V to 3.6V * Operating temperature: -40C to +85C Applications * * * * * * * * Internet of Things (IoT) Wearable, fitness, or healthcare Weighing scale Proximity/Find Me services Secure payment Digital beacons Consumer appliances or home automation Industrial Packages IS1870 IS1871 Pin count Type 48 32 I/O pins (up to) 31 15 Contact/lead pitch 0.4 0.4 Dimensions 6x6x0.9 4x4x0.9 Package QFN48 QFN32 Note: All dimensions are in millimeters (mm) unless specified. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 1 IS1870/71 NOTES: DS60001371E-Page 2 Advanced 2015-2018 Microchip Technology Inc. IS1870/71 Table of Contents 1.0 Device Overview .............................................................................................................................................................................. 5 2.0 System Block Details ..................................................................................................................................................................... 13 3.0 Electrical Characteristics................................................................................................................................................................ 17 4.0 Package Information ...................................................................................................................................................................... 21 5.0 Reflow Profile and Storage Condition ............................................................................................................................................ 27 6.0 Ordering Guide .............................................................................................................................................................................. 31 Appendix A: Reference Circuit ............................................................................................................................................................. 33 Appendix B: Layout Guidelines ............................................................................................................................................................ 37 Appendix C: Revision History .............................................................................................................................................................. 39 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 3 IS1870/71 NOTES: DS60001371E-Page 4 Advanced 2015-2018 Microchip Technology Inc. IS1870/71 1.0 DEVICE OVERVIEW The IS1870/71 SoC contains a 2.4 GHz transceiver, a Power Management Unit (PMU), Microchip's BLE software stack, and an RF power amplifier. The default factory configuration is designed to work with a host MCU to provide the user with an embedded BLE design setup for the IoT application domain. Note: Flexibility of the IS1870/71 SoC enables the user to work in a host-less implementation. In this configuration, the user can embed a full application into the IS1870/71 SoC. Contact your local Microchip representative for further guidance on obtaining this setup. The IS1870/71 SoC provides: * * * * Simple integration and programming Reduced development time Superior BLE solution with low-cost system Interoperability with Apple(R) iOS and AndroidTM OS * Wide range of application support With the default factory configuration, the IS1870/71 SoC supports Beacon technology, where the automation of BLE connection/control and cloud connectivity are common. The IS1870/71 SoC is optimized to maintain a low power wireless connection. The low power consumption and flexible power management maximize the IS1870/71 SoC lifetime in battery operated devices. A wide operating temperature range enables its applications in indoor and outdoor environments (industrial temperature range is -40C to +85C). The small form factor package size of the IS1870/71 SoC is designed for wearable applications. The solution providers can minimize the module size to meet the market requirements, which is commonly seen in the IoT application domain. To operate in the 2.4 GHz ISM band radio, the IS1870/71 SoC is certified for the Bluetooth v4.2 core specification, including support for the enhanced throughput and the Federal Information Processing Standard (FIPS) compliant encryption support for secure data connections. The IS1870/71 SoC integrates transceiver and baseband functions to decrease external components. Microchip provides free Bluetooth stack firmware to build an embedded BLE solution, using the IS1870/71 SoC. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 5 IS1870/71 Figure 1-1 illustrates a typical block diagram of the IS1870 SoC. FIGURE 1-1: BLOCK DIAGRAM OF THE IS1870 SOC Note 1: Users can enable other peripheral (SPI and I2C) functions of the IS1870/71 IC by changing the default factory firmware. For more details, contact local Microchip representatives. 2: An external host MCU is required when using the default factory firmware. DS60001371E-Page 6 Advanced 2015-2018 Microchip Technology Inc. IS1870/71 Figure 1-2 illustrates a typical block diagram of the IS1871 SoC-based system. FIGURE 1-2: IS1871 SOC-BASED SYSTEM BLOCK DIAGRAM Note 1: Users can enable other peripheral (SPI and I2C) functions of the IS1870/71 IC by changing the default factory firmware. For more details, contact your local Microchip representatives. 2: An external host MCU is required when using the default factory firmware. Table 1-1 provides the key features of the IS1870/71 SoC. TABLE 1-1: KEY FEATURES Features IS1870 IS1871 UART 1 1 GPIO 31 15 12-bit ADC channels 16 6 PWM 4 1 SPI (see Note 1) 2 1 I2C (see Note 1) 1 1 Pins 48 32 Size 6x6x0.9 mm 4x4x0.9 mm Event counter 2 0 AES-CMAC H/W engine Yes Yes Note 1: To make these peripherals available to a designer, contact your local Microchip representative. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 7 IS1870/71 Pin Description Figure 1-3 and Figure 1-4 illustrate the IS1870 and IS1871 pin assignment details. FIGURE 1-3: DS60001371E-Page 8 IS1870 SOC PIN ASSIGNMENT Advanced 2015-2018 Microchip Technology Inc. IS1870/71 FIGURE 1-4: IS1871 SOC PIN ASSIGNMENT 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 9 IS1870/71 Table 1-2 provides the functions of the various pins in the IS1870/71 SoC. TABLE 1-2: IS1870/71 SOC PIN DESCRIPTION IS1870 Pin No. IS1871 Pin No. Pin Name Type 1 32 P1_0 DIO AI GPIO: P1_0 ADC input: AD8 TX_CLS1: Class 1 RF Tx Control 2 -- P1_1 DIO AI DI GPIO: P1_1 ADC input: AD9 SPI bus: MISO2: second SPI bus (Master Mode) 3 1 P1_2 DIO AI I/O GPIO: P1_2 ADC input: AD10 I2C SCL 4 2 P1_3 DIO AI DIO GPIO: P1_3 ADC input: AD11 I2C SDA 5 -- P1_4 DIO AI DI GPIO: P1_4 ADC input: AD12 Event Counter 6 -- P1_5 DIO AI DI GPIO: P1_5 ADC input: AD13 Event Counter 7 3 P1_7 DIO AO GPIO: P1_7 External 32.768 kHz Crystal Output: XO32K 8 4 P1_6 DIO AI GPIO: P1_6 External 32.768 kHz Crystal Input: XI32K Description 9 5 HCI_TXD DO HCI UART TXD 10 6 HCI_RXD DI HCI UART RXD 11 -- P3_0 DIO GPIO: P3_0 12 7 P3_1 DIO DO GPIO: P3_1 SPI bus: NCS, SPI Flash: CSN 13 8 P3_2 DIO DI GPIO: P3_2 SPI bus: MISO, SPI Flash: SDO 14 9 P3_3 DIO DO GPIO: P3_3 SPI bus: MOSI, SPI Flash: SDI 15 10 P3_4 DIO DO GPIO: P3_4 SPI bus: SCLK, SPI Flash: SCK 16 -- P3_5 DIO AI GPIO: P3_5 LED1 17 11 P3_6 DIO DO DO GPIO: P3_6 UART flow-control RTS PWM0 18 12 RST_N DI DIO AI DI GPIO: P0_0 ADC input: AD0 UART flow-control CTS DIO AI GPIO: P0_1 ADC input: AD1 19 13 P0_0 20 -- P0_1 Legend: A = Analog DS60001371E-Page 10 D = Digital External Reset I = Input Advanced O = Output P = Power 2015-2018 Microchip Technology Inc. IS1870/71 TABLE 1-2: IS1870/71 SOC PIN DESCRIPTION (CONTINUED) IS1870 Pin No. IS1871 Pin No. Pin Name Type 21 14 P0_2 DIO AI AI GPIO: P0_2 ADC input: AD2 LED0 22 -- P0_3 DIO AI GPIO:P0_3 ADC input: AD3 23 -- P0_4 DIO AI GPIO:P0_4 ADC input: AD4 24 -- P0_5 DIO AI GPIO:P0_5 ADC input: AD5 25 -- P0_6 DIO AI GPIO:P0_6 ADC input: AD6 26 -- P0_7 DIO AI GPIO:P0_7 ADC input: AD7 27 15 BK_O P 1.55V buck regulator output. For internal use, do not connect to external devices) 28 16 BK_LX P 1.55V buck regulator output. For internal use, do not connect to external devices 29 17 BK_IN P Buck input. Voltage Range: 1.9V to 3.6V 30 18 VBAT P Battery input. Voltage Range: 1.9V to 3.6V. Connect to BK_IN and a 10 F decoupling capacitor, as illustrated in Figure A-1 and Figure A-3. 31 19 AVDD P Input of LDOs: CLDO, PALDO, and RFLDO 32 20 CLDO_O P 1.2V CLDO Output: Core-logic and memories supply, connect to 1 F (X5R/X7R) capacitor 33 21 ULPC_O P 1.2V Programmable ULPC Output: Always On logic and retention memory supply (for internal use, do not connect to external devices) 34 22 VREF P PMU band-gap reference voltage output for LDOs and buck (for internal use, do not connect to external devices) 35 23 XO_N A 32 MHz crystal input negative A 32 MHz crystal input positive Description 36 24 XO_P 37 25 VCC_RF P Power input for VCO and RF (1.28V). Connect to 1 F (X5R/X7R) capacitor 38 26 Rx AI RF receive path 39 27 Tx AO RF transmit path 40 28 VCC_PA P 41 29 P2_0 DIO Mode Configuration H: Application mode L: Test mode 42 -- P2_1 DIO DO GPIO: P2_1 PWM0 43 -- P2_2 DIO DO GPIO: P2_2 PWM1 44 -- P2_3 DIO DO GPIO: P2_3 PWM2 Legend: A = Analog D = Digital 2015-2018 Microchip Technology Inc. Power supply for power amplifier (1.55V). Connect to 0.22 F X5R/X7R I = Input Advanced O = Output P = Power DS60001371E-Page 11 IS1870/71 TABLE 1-2: IS1870/71 SOC PIN DESCRIPTION (CONTINUED) IS1870 Pin No. IS1871 Pin No. Pin Name Type 45 30 P2_4 DIO GPIO: P2_4 TX_CLS1: Class 1 RF RX Control 46 -- P2_5 DIO AI DO GPIO: P2_5 ADC input: AD15 PWM3 47 -- P2_6 DIO P26 P2_7 DIO AI DO GPIO: P27 ADC input: AD14 SPI bus: NCS2, second SPI bus (Master mode) 48 Legend: 31 A = Analog DS60001371E-Page 12 D = Digital Description I = Input Advanced O = Output P = Power 2015-2018 Microchip Technology Inc. IS1870/71 2.0 SYSTEM BLOCK DETAILS 2.1 System Block Descriptions This section provides a description of the blocks used in the IS1870/71 SoC. modes, controlling the amount of time the peak current is active, maximizing the battery life. The factory firmware enables the designer to perform the calibration for the internal LDOs to compensate for variations in the board design and other manufacturing-related artifacts. 2.1.1 Figure 2-1 illustrates the power tree diagram of the IS1870/71 SoC. PMU The IS1870/71 SoC includes a DC-DC converter and four LDOs. Microchip's BLE software stack is used for controlling and operating these LDOs in various FIGURE 2-1: 2.1.2 IS1870/71 SOC POWER TREE DIAGRAM 2.1.4 ALWAYS ON LOGIC Always On (AON) is the hardware-based state machine, which is controlled by Microchip's Bluetooth stack. Together, the software and hardware logic maintain the power-up, power-down, and low power sequences of the IS1870/71 SoC, by providing optimal device performance. It includes an RTC timer and I/O detector to wake-up the system from Power-Saving mode using time out or external general I/O transition. This allows the SoC to run in Power-Saving mode while maintaining an active connection with a peer device and minimizing power consumption. 2.1.3 MCU Microchip provides the BLE software stack, which runs on the IS1870/71 SoC's internal 8051 core. The stack resides in a combination of ROM, RAM, and embedded Flash. The software stack is responsible for scheduling the BLE tasks and for processing the BLE protocol and profiles. RF This SoC is controlled by Microchip's Bluetooth stack, which contains an on-chip RF circuit, a controller, and a modulator (Tx)/demodulator (Rx). The Tx is used to control the synthesizer's phase and output power, and modulate the data based on the BLE specifications. The Rx is used to decode the Bluetooth signal and optimize the performance, such as IQ-imbalance, suppress DC, and flick noise. It is also used to compensate the frequency drift and offset, and filter out interference to maximize receiver sensitivity. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 13 IS1870/71 2.2 System Block Specification 2.2.4 The following are the system block specifications. Note: 2.2.1 The system blocks which make up the IS1870/71 SoC are listed below. However, some of the blocks used in the IS1870/71 SoC are controlled by the default factory firmware and are not available to the designer. RF * Bluetooth BT4.2 LE compliant SoC * Frequency: 2.402 GHz to 2.480 GHz * Programmable transmit output power up to +3 dBm maximum * -25 dBm minimum Tx power to search nearby devices * -90 dBm typical receiver power sensitivity * Digital RSSI indicator (-50 dBm to -90 dBm) * -40C to +85C BLE RF certified 2.2.2 * * * * Note: MCU The Microchip provided BLE stack uses a portion of the available memory listed above. With the default factory firmware, the amount of memory used is fixed and the free memory is not available to the designer. As it is expected, the application will reside in the external host MCU. For details on altering the default factory setup, please contact your local Microchip representative. DS60001371E-Page 14 This peripheral is not available with the default factory firmware. For details on altering this default factory setup, contact your local Microchip representative. * Three wire serial interface (compatible to SPI) PMU 8051 core with scalable clock ROM: 32 KB Main SRAM: 24 KB Embedded Flash: 256 KB for Device Firmware Upgrade (DFU) and run-time data storage Note: * Flexible GPIO pin configuration * ADC: - 0V to 3.6V, 12-bit SDM-ADC with 16-channel (IS1870) or 6-Channel (IS1871) hybrid-I/O (Multi-Function). It can be configured as ADC or GPIO input * Internal 1.9V to 3.6V battery voltage monitor * Precision Temperature Sensor (PTS) for ambient temperature detection * 4 MHz clock-rate full duplex 4-wire master/slave SPI with 256 bytes buffer DMA * HCI over UART up to 921600 bps with flow-control * Two wire serial interface (compatible to I2C) Note: * Operating battery input voltage range: 1.9V to 3.6V * 1.28V RFLDO: RF IP power supply * 1.55V PALDO: RF Tx power amplify supply * 1.2V CLDO: Core-logic and memories supply * 1.55V DC-DC switching buck converter * 1.2V programmable ULPC to supply AON-logic and retention memory * AON-logic to control power-up, power-down and wake-up procedures * Internal 32 kHz (250 ppm) ultra-low power oscillator * Power-on Reset 2.2.3 PERIPHERALS This peripheral is not available with the default factory firmware. For details on altering this default factory setup, please contact your local Microchip representative. * GPIO pins with input internal pull up /Hi-Z selectable * 24-bit low-power Real Time Counter (RTC) for background timer in Standby mode * Watchdog timer * Event Counter option (P1_4 and P1_5) provides capture/counter function to external events for frequency calculation. It provides 1K/32K/1M/16M clock rate option to count the frequency range from 60 Hz to 1 MHz. The continuous/one shot count mode can be selected * Specific GPIO pins (P1_6 and P1_7) support external 32.768 kHz crystal option for RTC; however, the default from the factory is set to use the internal 32 kHz ultra low-power oscillator * PWM: - 16-bit PWM design - Four Individual frequency and individual duty cycle channel outputs multiplexed with GPIO pins (P2_1, P2_2, P2_3, and P2_5) - Three clock source (32K, 1M and 16M) selections to program frequency range from 0.488 Hz to 8 MHz - Double buffers output compare registers and top register to avoid glitch - Two pair output configurable as inverse channel Advanced 2015-2018 Microchip Technology Inc. IS1870/71 2.3 Host MCU Interface Over UART Figure 2-2 illustrates IS1870/71 SoC application block diagram. In the diagram the power supply (3.3V), UART interface, and GPIO control and indication are listed. FIGURE 2-2: IS1870/71 SOC APPLICATION BLOCK DIAGRAM WITH MCU Note 1: Ensure BAT_IN (I/O voltage) and MCU VDD voltage are compatible. 2: The control and indication ports are configurable in Microchip provided PC tool, referred to as the UI tool, see the product webpage for additional information. 3: Default factory firmware configuration enables the designer to control GPIO functions, ADC, PTS, and PWM peripherals. The I2C and SPI peripherals are not available with the default firmware. Contact your local Microchip representative for more details. 4: The GPIO applications of the IS1871 SoC have a reduced pin count, and some of the GPIO pins are not supported in the IS1871 SoC. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 15 IS1870/71 NOTES: DS60001371E-Page 16 Advanced 2015-2018 Microchip Technology Inc. IS1870/71 3.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the IS1870/71 SoC electrical characteristics. Additional information will be provided in future revisions of this document. Absolute maximum ratings for the IS1870/71 devices are listed below. Exposure to the maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings (See Note) Ambient temperature under bias with parts ending with 102 ................................................................... .-20C to +70C Ambient temperature under bias with parts ending with 202 ................................................................... .-40C to +85C Storage temperature .............................................................................................................................. -40C to +125C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V Voltage on any pin with respect to VSS .......................................................................................... -0.3V to (VDD + 0.3V) Maximum output current sunk by any I/O pin..........................................................................................................12 mA Maximum output current sourced by any I/O pin....................................................................................................12 mA ESD (according to machine model, JEDEC EIA/JESD22-A115-C) Maximum output for all pins, excluding RF Tx pin .......... .......................................................................................200V Maximum output for all pins ........... .........................................................................................................................150V Maximum output (human-body model)......................................................................................................................2 kV Maximum output (charge-device model).................................................................................................................150V Note: Stresses listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions, and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 17 IS1870/71 Table 3-1 provides the recommended operating conditions of the IS1870/71 SoC. TABLE 3-1: RECOMMENDED OPERATING CONDITIONS Symbol Min. Typ. Max. 1.9V 3.0V 3.6V RST_N 1.9V 3.0V 3.6V Other I/O 1.9V -- 3.6V 0.7 VDD -- VDD VSS -- 0.3 VDD 0.8 VDD -- VDD PMU VDD (VBAT, BK_IN, AVDD) GPIO VIH (Input High Voltage) VIL (Input Low Voltage) VOH (Output High Voltage) (High drive, 12 mA) VOL (Output Low Voltage) (High drive, 12 mA) Pull up Resistance Pull down Resistance VSS -- 0.2 VDD 34 kOhm 48 kOhm 74 kOhm 29 kOhm 47 kOhm 86 kOhm Supply Current (see Note 1) Tx mode peak current at VDD=3V, Tx=0 dBm, Buck mode -- 10 mA at +25C 13 mA at +70C/+85C Rx mode peak current at VDD=3V, Buck mode -- 10 mA at +25C 13 mA at +70C/+85C "Reduced current consumption" low power mode current (see Note 2) -- 60 A at +25C -- 1.0 A -- 2.9 A "Shutdown" low power mode current (see Note 2) Analog-to-Digital Converter (ADC) for IS1870/71-202 Full scale (BAT_IN) 0V 3.0V 3.6V Full scale (AD0 to AD15) 0V -- 3.6V Operating Temperature Range -40C 25C 85C Operating current -- -- 500 A DNL (ENOB 10-bit, ADC in 32 KHz Mode) (see Note 3 and 4) -1 -- +1.5 INL (ENOB 10-bit, ADC in 32 KHz Mode) (see Note 3 and 4) -2 LSB -- +2 LSB Precise Temperature Sensor (PTS) for IS1870/71-202 Detect range -40C -- +85C Digital Output 1387 -- 2448 -- 12-bit/C -- -3C -- +3C Resolution Accuracy Note 1: The current measurements are characterized across a sample of the BM70/71 module at room temperature (+25C), unless otherwise noted. 2: For more details on "Reduced current consumption" or "Shutdown" low power modes, refer to the "BM70/71 Bluetooth(R) Low Energy Module User's Guide" (DS50002542). This rating is part of the characterization of the default factory firmware. 3: ADC performance characterized with V1.06 production firmware across a set of IC's are not tested during production. 4: Calculated DNL/INL values are determined using "Best Fit" method. DS60001371E-Page 18 Advanced 2015-2018 Microchip Technology Inc. IS1870/71 Table 3-2 provides the RF specifications of the IS1870/71 SoC. TABLE 3-2: RF SPECIFICATIONS Parameter Min. Typ. Max. 2402 MHz -- 2480 MHz -- 0 dBm -- -25 dBm -- 3 dBm Transmitter Frequency Output Power RF Power Control Range In-band Spurious (N2) -- -38.5 dBm -- In-band Spurious (N3) -- -43.25 dBm -- Modulation Characteristic - Frequency Deviation (see Note 1) -- 247 kHz -- Receiver Frequency 2402 MHz -- 2480 MHz Sensitivity Level (Interference active) -- -90 dBm -- Interference Performance Co-channel -- 17 dB -- Adjacent 1 MHz -- 0 dB -- Adjacent 2 MHz -- -25 dB -- Adjacent >= 3 MHz -- -32 dB -- -- -37.5 dBm -- Intermodulation Characteristic (n=3,4,5) Maximum Usable Level 0 dBm Note 1: Tested with a known pattern of `00001111'b being transmitted. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 19 IS1870/71 3.1 3.1.1 Current Consumption Details The peak current of the VBAT input is 12 mA and the average current is around 230 A. In this example the advertising interval is 100 ms and current consumption is measured at 3.3V VBAT input. Tx/Rx CURRENT CONSUMPTION DETAILS Figure 3-1 illustrates the average current consumption of an advertising event during BLE operation of the IS1870/71 SoC. FIGURE 3-1: DS60001371E-Page 20 AVERAGE CURRENT CONSUMPTION DURING ADVERTISING Advanced 2015-2018 Microchip Technology Inc. IS1870/71 4.0 PACKAGE INFORMATION Figure 4-1 through Figure 4-5 illustrate the package marking information of the IS1870SF IC. 4.1 48QFN, 6x6 mm SoC Outline (IS1870SF) FIGURE 4-1: 48QFN, 6X6 MM PACKAGE INFORMATION (IS1870SF) 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 21 IS1870/71 48QFN, 6X6 MM FOOTPRINT INFORMATION (IS1870SF) DS60001371E-Page 22 FIGURE 4-2: Advanced 2015-2018 Microchip Technology Inc. IS1870/71 4.2 32QFN, 4x4 mm SoC Outline (IS1871SF) FIGURE 4-3: 32QFN, 4X4 MM PACKAGE SIZE INFORMATION (IS1871SF) 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 23 IS1870/71 32QFN FOOTPRINT INFORMATION (IS1871SF) DS60001371E-Page 24 FIGURE 4-4: Advanced 2015-2018 Microchip Technology Inc. IS1870/71 FIGURE 4-5: PACKAGE MARKING INFORMATION 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 25 IS1870/71 NOTES: DS60001371E-Page 26 Advanced 2015-2018 Microchip Technology Inc. IS1870/71 5.0 REFLOW PROFILE AND STORAGE CONDITION pad size on the PCB - Oval-shape opening is used to get the optimum paste release - Rounded corners to minimize the clogging - Positive taper walls (5 tapering) with the bottom opening larger than the top opening Figure 5-1 and Figure 5-2 illustrate the reflow profiles and stencil information of the IS1870/71 SoC. 5.1 5.1.1 Stencil of SMT Assembly Suggestion 5.1.3 STENCIL TYPE AND THICKNESS * Laser cutting * Stainless steel * Thickness: 0.5 mm pitch, thickness more than 0.15 mm 5.1.2 APERTURE SIZE AND SHAPE FOR TERMINAL PAD APERTURE DESIGN FOR THERMAL PAD * Small multiple openings are used instead of one big opening, see Figure 5-1 * 60 to 80% solder paste coverage * Rounded corners to minimize clogging * Positive taper walls (5 tapering) with the bottom opening larger than the top opening, see Figure 5-2 * Aspect ratio (width/thickness) more than 1.5 * Aperture shape - The stencil aperture is designed to match the FIGURE 5-1: REFLOW PROFILE Do not recommend Coverage 91% FIGURE 5-2: Recommend Coverage 77% Recommend Coverage 65% STENCIL TYPE 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 27 IS1870/71 5.2 Reflow Profile Figure 5-3 illustrates the reflow profile and the following are its specific features: * Standard Condition: IPC/JEDEC J-STD-020 * Preheat: +150 to +200 for 60 to 120 seconds * Average ramp-up rate (+217 to peak): +3/sec max FIGURE 5-3: DS60001371E-Page 28 * Temperature maintained above +217 : 60 to 150 seconds * Time within +5 of peak temperature: 30 to 40 seconds * Peak temperature: +260 with 5/-0 tolerance * Ramp-down rate (peak to +217): +6/sec. max * Time within +25 to peak temperature: 8 minutes max * Cycle interval: 5 minutes REFLOW PROFILE Advanced 2015-2018 Microchip Technology Inc. IS1870/71 5.3 Storage Condition Users are required to follow these specific storage conditions for the IS1870/71 SoC. * The calculated shelf life in the sealed bag is 24 months at <+40 and <90% Relative Humidity (RH) * After the bag is opened, devices that are subjected to reflow solder or other high temperature process must be mounted within 168 hours of factory conditions, i.e <+30 /60% RH 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 29 IS1870/71 NOTES: DS60001371E-Page 30 Advanced 2015-2018 Microchip Technology Inc. IS1870/71 6.0 ORDERING GUIDE Table 6-1 provides the ordering information for the IS1870/71 SoC. TABLE 6-1: ORDERING GUIDE Device Bluetooth Version IS1870SF-102 Bluetooth Low Energy SoC, BLE 4.2 compliant IS1871SF-102 Operating Temperature Range Package Part No. -20C to +70C 48-Lead QFN, 6x6x0.9 mm3, 0.4 mm pitch IS1870SF-102 Bluetooth Low Energy SoC, BLE 4.2 compliant -20C to +70C 32-Lead QFN, 4x4x0.9 mm3, 0.4 mm pitch IS1871SF-102 IS1870SF-202 Bluetooth Low Energy SoC, BLE 4.2 compliant -40C to +85C 48-Lead QFN, 6x6x0.9 mm3, 0.4 mm pitch IS1870SF-202 IS1871SF-202 Bluetooth Low Energy SoC, BLE 4.2 compliant -40C to +85C 32-Lead QFN, 4x4x0.9 mm3, 0.4 mm pitch IS1871SF-202 Note: The IS1870/71 SoC can be purchased through a Microchip representative. Visit http://www.microchip.com/ for ordering information. 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 31 IS1870/71 NOTES: DS60001371E-Page 32 Advanced 2015-2018 Microchip Technology Inc. 2015-2018 Microchip Technology Inc. APPENDIX A: REFERENCE CIRCUIT Figure A-1 through Figure A-4 illustrate a typical application circuit of the IS1870 and IS1871 SoC. FIGURE A-1: The application circuit lists the RF matching circuit, PMU power tree, LED option, test points, and configuration table. The GPIOs can be configured to general I/O functions or the function of ADC, PTS, PWM, and external 32.768 kHz crystal. IS1870 SOC APPLICATION CIRCUIT Advanced 2: The value of the antenna matching component depends on the user's antenna and PCB layout. IS1870/71 DS60001371E-Page 33 Note 1: The C13, C14, L4, C12, C11, C10, C3, and C4 must be as close to the chip as possible. IS1870/71 IS1870 SOC APPLICATION CIRCUIT (OPTIONAL) DS60001371E-Page 34 FIGURE A-2: Advanced 2015-2018 Microchip Technology Inc. 2015-2018 Microchip Technology Inc. FIGURE A-3: IS1871 SOC APPLICATION CIRCUIT Advanced 2: The value of the antenna matching component depends on the user's antenna and PCB layout. IS1870/71 DS60001371E-Page 35 Note 1: The C13, C14, L4, C12, C11, C10, C3, and C4 must be as close to the chip as possible. IS1870/71 IS1871 SOC APPLICATION CIRCUIT (OPTIONAL) DS60001371E-Page 36 FIGURE A-4: Advanced 2015-2018 Microchip Technology Inc. IS1870/71 APPENDIX B: B.1 LAYOUT GUIDELINES RF Matching The RF traces (Tx, Rx, and antenna path) on the PCB antenna must match the 50 Ohm impedance. In Figure A-1, value of L1, L3, C1, C2, and C5 are fixed. The antenna matching components, C6, C7, and L2, must be adjusted to match with the 50 Ohm 2.4 GHz antenna. B.2 PMU The PMU section components, such as VBAT, BK_IN, BK_O, BK_LX, AVDD, ULPC_O, CLDO_O, VREF must be kept close to the IS1870/71 SoC. The L4 and C14 of Buck section, illustrated in Figure A-1, must be selected carefully. The capacitor C14 is either 4.7 F/ 6.3V, X5R, or X7R type. The inductor L4 must be a high current (IDC>300 mA) and low DCR (<1 Ohm) type. For additional information on the PCB antenna design guidelines, contact your local Microchip sales office. A list of Microchip sales offices is given on the back page of this document. B.3 Crystal The XI 32 MHz crystal specification must be within the 10 ppm range, see Figure A-1. 2015-2017 Microchip Technology Inc. Advanced DS60001371E-Page 37 IS1870/71 NOTES: DS60001371E-Page 38 Advanced 2015-2017 Microchip Technology Inc. IS1870/71 APPENDIX C: REVISION HISTORY Revision A (October 2015) This is the initial released version of this document. Revision B (October 2015) This revision includes the following changes as well as minor updates to text and formatting, which were incorporated throughout the document. Status Description "Features" The section has been updated with new information. "Packages" The section is updated with the package information. 1.0 "Device Overview" Updated Figure 1-1 and Figure 1-2. Added Table 1-1 Revision C (March 2016) This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. Status Description "Features" The section is updated with new information. 1.0 "Device Overview" Updated Figure 1-1 and Figure 1-2. Updated Table 1-1 and Table 1-2. 2.0 "System Block Details" Updated 2.2 "System Block Specification" and 2.3 "Host MCU Interface Over UART" with new information. 3.0 "Electrical Characteristics" Updated 3.1.1 "Tx/Rx Current Consumption Details". Updated Figure 3-1 and Figure 3-1. Updated Table 3-1 and Table 3-2. 5.3 "Storage Condition" Deleted Figure 5-4. 6.0 "Ordering Guide" Updated Table 6-1 Appendix A: "Reference Circuit" Updated Figure A-1 and Figure A-3 Added Figure A-2 and Figure A-4 Appendix C: Bill of Material Deleted Revision D (February 2017) This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. Section Update Description "Features" Updated this section. "Packages" Updated the I/O pins details. "Operating Conditions" Updated the operating temperature details. 1.0 "Device Overview" Updated Figure 1-1 and Figure 1-2. 2.0 "System Block Details" Updated Figure 2-2. 3.0 "Electrical Characteristics" Updated ambient temperature, maximum output (human-body model) details and Table 3-1. Added Table 3-2. 6.0 "Ordering Guide" Updated Table 6-1 2015-2018 Microchip Technology Inc. Advanced DS60001371E-Page 39 IS1870/71 Revision E (February 2018) This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. Section Update Description 1.0 "Device Overview" Updated Table 1-2. 3.0 "Electrical Characteristics" Updated Table 3-1. DS60001371E-Page 40 Advanced 2015-2018 Microchip Technology Inc. IS1870/71 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. 2015-2017 Microchip Technology Inc. Advanced DS60001371E-Page 41 IS1870/71 NOTES: DS60001371E-Page 42 Advanced 2015-2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015-2017 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2015-2017, Microchip Technology Incorporated, All Rights Reserved. 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