1) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
2) Tested with pulses tp = 300 :s, duty cycle # 2% – Gemessen mit Impulsen tp = 300 :s, Schaltverhältnis # 2%
24 01.11.2003
4
3
2
1
3
±0.1
6.5
±0.2
0.7
3.25 2.3
7
±0.3
1.65
3.5
±0.2
BCP 51, BCP 52, BCP 53 General Purpose Transistors
PNP Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage PNP
Power dissipation – Verlustleistung 1.3 W
Plastic case SOT-223
Kunststoffgehäuse
Weight approx. – Gewicht ca. 0.04 g
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Dimensions / Maße in mm
1 = B 2, 4 = C 3 = E
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
Maximum ratings (TA = 25/C) Grenzwerte (TA = 25/C)
BCP 51 BCP 52 BCP 53
Collector-Emitter-voltage B open - VCE0 45 V 60 V 80 V
Collector-Base-voltage E open - VCB0 45 V 60 V 100 V
Emitter-Base-voltage C open - VEB0 5 V
Power dissipation – Verlustleistung Ptot 1.3 W 1)
Collector current – Kollektorstrom (DC) - IC1 A
Peak Collector current – Koll.-Spitzenstrom - ICM 1.5 A
Peak Base current – Basis-Spitzenstrom - IBM 200 mA
Junction temperature – Sperrschichttemperatur Tj150/C
Storage temperature – Lagerungstemperatur TS- 65…+ 150/C
Characteristics (Tj = 25/C) Kennwerte (Tj = 25/C)
Min. Typ. Max.
Collector-Base cutoff current – Kollektorreststrom
IE = 0, - VCB = 30 V - ICB0 – – 100 nA
IE = 0, - VCB = 30 V, Tj = 125/C- I
CB0 – – 10 :A
Emitter-Base cutoff current – Emitterreststrom
IC = 0, - VEB = 5 V - IEB0 – – 100 nA
Collector saturation volt. – Kollektor-Sättigungsspg. 2)
- IC = 500 mA, - IB = 50 mA - VCEsat – – 500 mV