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IN
EN
6
2
34
BYPASS
1
10 nF
1 µF
1 µF
Input
Enable
GND
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CBP
COUT
(C3)
(A1)
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(A3)
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LP3995
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LP3995 Micropower 150-mA CMOS Voltage Regulator With Active Shutdown
1 Features 3 Description
The LP3995 linear regulator is designed to meet the
1• Input Range: 2.5 V to 6 V requirements of portable battery-powered
• Accurate Output Voltage: ±75 mV / 2% applications, providing an accurate output voltage
• Typical Dropout with 150 mA Load: 60 mV with low noise and low quiescent current. Ideally
suited for powering RF and analog devices, this
• Virtually Zero Quiescent Current When Disabled device can also be used to meet more general circuit
• Low Output Voltage Noise needs in which a fast turnoff is essential.
• Stable With a 1-µF Output Capacitor For battery-powered applications the low dropout and
• Output Current: 150 mA low ground current provided by the device allows the
• Fast Turnon: 30 µs (Typical) lifetime of the battery to be maximized. The
Enable(/Disable) control function allows the system to
• Fast Turnoff: 175 µs (Typical) further extend the battery lifetime by reducing the
• Stable With Ceramic Capacitor power consumption to virtually zero. This function
• Logic Controlled Enable also incorporates an active discharge circuit on the
• Fast Turnon output for faster device shutdown. Where the fast
turnoff is not required the LP3999 linear regulator is
• Active Disable for Fast Turnoff recommended. The LP3995 also features internal
• Thermal-Overload and Short-Circuit Protection protection against short-circuit currents and
•−40 to +125°C Junction Temperature Range for overtemperature conditions.
Operation The LP3995 is designed to be stable with small 1-µF
ceramic capacitors. The small outline of the LP3995
2 Applications DSBGA package with the required ceramic capacitors
can realize a system application within minimal board
• GSM Portable Phones area. Performance is specified for a −40°C to +125°C
• CDMA Cellular Handsets temperature range.
• Wideband CDMA Cellular Handsets The LP3995 is available in fixed output voltages from
• Bluetooth Devices 1.5 V to 3.3 V, in DSBGA or WSON packages. For
• Portable Information Appliances other package options or output-voltage options,
contact your local TI sales office.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE
DSBGA (5) 1.502 mm × 1.045 mm (MAX)
LP3995 WSON (6) 3.29 mm × 2.92 mm (NOM)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP3995
SNVS179F –FEBRUARY 2003–REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
8.3 Feature Description................................................. 11
1 Features.................................................................. 18.4 Device Functional Modes........................................ 12
2 Applications ........................................................... 19 Application and Implementation ........................ 13
3 Description............................................................. 19.1 Application Information............................................ 13
4 Revision History..................................................... 29.2 Typical Application ................................................. 13
5 Pin Configuration and Functions......................... 310 Power Supply Recommendations ..................... 17
6 Specifications......................................................... 411 Layout................................................................... 17
6.1 Absolute Maximum Ratings ...................................... 411.1 Layout Guidelines ................................................. 17
6.2 ESD Ratings.............................................................. 411.2 Layout Examples................................................... 17
6.3 Recommended Operating Conditions....................... 411.3 DSBGA Mounting.................................................. 18
6.4 Thermal Information.................................................. 511.4 DSBGA Light Sensitivity ....................................... 18
6.5 Electrical Characteristics........................................... 512 Device and Documentation Support................. 19
6.6 Timing Requirements................................................ 612.1 Documentation Support ........................................ 19
6.7 Typical Characteristics.............................................. 712.2 Community Resources.......................................... 19
7 Parameter Measurement Information ................ 10 12.3 Trademarks........................................................... 19
7.1 Input Test Signals ................................................... 10 12.4 Electrostatic Discharge Caution............................ 19
8 Detailed Description............................................ 11 12.5 Glossary................................................................ 19
8.1 Overview................................................................. 11 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram....................................... 11 Information........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (March 2013) to Revision F Page
• Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, Feature Description,
Device Functional Modes,Application and Implementation,Power Supply Recommendations,Layout,Device and
Documentation Support, and Mechanical, Packaging, and Orderable Information sections................................................. 1
• Changed Thermal Values, ..................................................................................................................................................... 1
• Deleted Lead Temp from Abs Max table (in POA); delete Heatsinking sections re: specific packages (outdated info) ....... 4
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 18
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1 IN
2 GND
3 EN
OUT 6
BYPASS 4
N/C 5
Device
Code
IN 1
GND 2
EN 3
6 OUT
4 BYPASS
5 N/C
PAD
GND PAD
GND
A3 C3
A1 B2 C1
BYPASS IN
EN GND OUT
A3C3
A1B2C1
BYPASSIN
ENGNDOUT
LP3995
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SNVS179F –FEBRUARY 2003–REVISED SEPTEMBER 2015
5 Pin Configuration and Functions
YZR Package
5-Pin DSBGA
Top View
NGD Package
6-Pin WSON
Top View
Pin Functions
PIN TYPE DESCRIPTION
NAME WSON DSBGA
Bypass capacitor connection.
BYPASS 4 A3 — Connect a 0.01-µF capacitor for noise reduction.
Enable input; Disables the regulator when ≤0.4 V.
EN 3 A1 Input Enables the regulator when ≥0.9 V.
GND 2 B2 Ground Common ground
The exposed thermal pad on the bottom of the WSON package should be
connected to a copper thermal pad on the PCB under the package. The use of
thermal vias to remove heat from the package into the PCB is recommended.
Thermal Connect the exposed thermal pad to ground potential or leave floating. Do not
GND — Ground
Pad connect the thermal pad to any potential other than the same ground potential
seen at device pin 2. For additional information on using TI's non pull-back WSON
package, see TI Application Note AN- 1187 Leadless Leadframe Package (LLP)
(SNOA401).
IN 1 C3 Input Voltage supply input
N/C 5 — — No internal connection. This pin can be connected to GND, or left open.
OUT 6 C1 Output Voltage output. Connect this output to the load circuit.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
Input voltage, VIN –0.3 6.5 V
Output voltage –0.3 (VIN + 0.3 V) to 6.5 V
Enable input voltage –0.3 6.5 V
Junction temperature 150 °C
Continuous power dissipation(4) Internally limited
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office / Distributors for availability and
specifications.
(4) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (TA(MAX)) is dependant on the maximum operating junction temperature (TJ(MAX-OP)), the
maximum power dissipation (PD(MAX)), and the junction-to-ambient thermal resistance in the application (RθJA). This relationship is given
by: TA(MAX) = TJ(MAX-OP) −(PD(MAX) × RθJA).
6.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Machine model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
Input voltage, VIN 2.5 6 V
Enable input voltage 0 6 V
Junction temperature −40 125 °C
Ambient temperature(1) −40 85 °C
(1) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (TA(MAX)) is dependant on the maximum operating junction temperature (TJ(MAX-OP)), the
maximum power dissipation (PD(MAX)), and the junction-to-ambient thermal resistance in the application (RθJA). This relationship is given
by: TA(MAX) = TJ(MAX-OP) −(PD(MAX) × RθJA).
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6.4 Thermal Information LP3995
THERMAL METRIC(1) YZR (DSBGA) NGD (WSON) UNIT
5 PINS 6 PINS
RθJA(2) Junction-to-ambient thermal resistance, High-K 181.2 68.5(3) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.8 71.8 °C/W
RθJB Junction-to-board thermal resistance 107.9 35.2 °C/W
ψJT Junction-to-top characterization parameter 0.5 1.4 °C/W
ψJB Junction-to-board characterization parameter 107.9 35.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 8.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal
Conductivity Test Board for Leaded Surface Mount Packages.
(3) The PCB for the NGD (WSON) package RθJA includes two (2) thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.
6.5 Electrical Characteristics
Unless otherwise noted, VEN = 1.5 V, VIN = VOUT + 1 V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, CBYPASS = 0.01 µF. Typical
(TYP) values and limits apply for TJ= 25°C; minimum (MIN) and maximum (MAX) apply over the full temperature range for
operation, −40 to +125°C, unless otherwise specified in the Test Conditions. (1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage 2.5 6 V
DEVICE OUTPUT: 1.5 ≤VOUT < 1.8V
IOUT = 1 mA, TJ= 25°C –50 50
Output voltage tolerance mV
IOUT = 1 mA –75 75
VIN = (VOUT(NOM)+1 V) to 6V,
ΔVOUT Line regulation error –3.5 3.5 µV/mA
IOUT = 1 mA
Load regulation error, DSBGA IOUT = 1 mA to 150 mA 10 75 µV/mA
Load regulation error, WSON IOUT = 1 mA to 150 mA 70 125 µV/mA
ƒ = 1 kHz, IOUT = 1 mA 55
PSRR Power supply rejection ratio(3) dB
ƒ = 10 kHz, IOUT = 1 mA 53
DEVICE OUTPUT: 1.8 V ≤VOUT < 2.5 V
IOUT = 1 mA, TJ= 25°C –50 50
Output voltage tolerance mV
IOUT = 1 mA –75 75
VIN = (VOUT(NOM)+1 V) to 6 V,
Line regulation error, DSBGA –2.5 2.5 mV/V
IOUT = 1 mA
ΔVOUT VIN = (VOUT(NOM)+1 V) to 6 V
Line regulation error, WSON –3.5 3.5 mV/V
IOUT = 1 mA
Load regulation error, DSBGA IOUT = 1 mA to 150 mA 10 75 µV/mA
Load regulation error, WSON IOUT = 1 mA to 150 mA 80 125 µV/mA
ƒ = 1 kHz, IOUT = 1 mA 55
PSRR Power supply rejection ratio(3) dB
ƒ = 10 kHz, IOUT = 1 mA 50
(1) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production at TJ= 25°C or correlated
using Statistical Quality Control methods. Operation over the temperature specification is specified by correlating the electrical
characteristics to process and temperature variations and applying statistical process control.
(2) VOUT(NOM) is the stated output voltage option for the device.
(3) This electrical specification is ensured by design.
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Electrical Characteristics (continued)
Unless otherwise noted, VEN = 1.5 V, VIN = VOUT + 1 V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, CBYPASS = 0.01 µF. Typical
(TYP) values and limits apply for TJ= 25°C; minimum (MIN) and maximum (MAX) apply over the full temperature range for
operation, −40 to +125°C, unless otherwise specified in the Test Conditions. (1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DEVICE OUTPUT: 2.5 V ≤VOUT ≤3.3 V
IOUT = 1 mA, TJ= 25°C –2 2
Output voltage tolerance % of VOUT(NOM)
IOUT = 1 mA –3 3
VIN = (VOUT(NOM)+1 V) to 6 V
Line regulation error –0.1 0.1 %/V
IOUT = 1 mA
ΔVOUT Load regulation error, DSBGA IOUT = 1 mA to 150 mA 0.0004 0.002 %/mA
Load regulation error, WSON IOUT = 1 mA to 150 mA 0.002 0.005 %/mA
IOUT = 1 mA 0.4 2
Dropout voltage mV
IOUT = 150 mA 60 100
ƒ = 1 kHz, IOUT = 1 mA 60
PSRR Power supply rejection ratio(3) dB
ƒ = 10 kHz, IOUT = 1 mA 50
FULL VOUT RANGE
ILOAD Load current See(3)(4) 0 µA
VEN = 1.5 V, IOUT = 0 mA 85 150
IQQuiescent current VEN = 1.5 V, IOUT = 150 mA 140 200 µA
VEN = 0.4 V 0.003 1.5
ISC Short-circuit current limit 450 mA
BW = 10 Hz to 100 kHz,
ENOutput noise voltage(3) 25 µVRMS
VIN = 4.2 V, IOUT = 1 mA
Temperature 160
TSHUTDOWN Thermal shutdown °C
Hysteresis 20
ENABLE CONTROL CHARACTERISTICS
Maximum input current at EN
IEN VEN = 0 V and VIN = 6 V 0.001 µA
input
VIL Low input threshold 0.4 V
VIH High input threshold 0.9 V
(4) The device maintains a stable, regulated output voltage without load.
6.6 Timing Requirements MIN NOM MAX UNIT
tON Turnon time to 95% level (1)(2) 30 µs
tOFF Turnoff time to 5% level (1)(3) 175 µs
(1) This electrical specification is ensured by design.
(2) Time from VEN = 0.9 V to VOUT = 95% (VOUT(NOM)).
(3) Time from VEN = 0.4 V to VOUT = 5% (VOUT(NOM)).
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6.7 Typical Characteristics
Unless otherwise specified, CIN = COUT = 1 µF ceramic, VIN = VOUT + 1 V, TA= 25°C, EN pin is tied to VIN.
VOUT = 1.8 V
Figure 1. Output Voltage Change vs Temperature Figure 2. Ground Current vs Load Current
VOUT = 2.8 V
Figure 3. Ground Current vs Load Current Figure 4. Ground Current vs VIN at 25°C
Figure 6. Dropout vs Load Current
Figure 5. Ground Current vs VIN at 125°C
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Typical Characteristics (continued)
Unless otherwise specified, CIN = COUT = 1 µF ceramic, VIN = VOUT + 1 V, TA= 25°C, EN pin is tied to VIN.
VOUT = 1.8 V
Figure 7. Short-Circuit Current Figure 8. Ripple Rejection
VOUT = 2.8 V
VOUT = 2.8 V
Figure 10. Enable Start-Up Time
Figure 9. Ripple Rejection
VOUT = 2.8 V VOUT = 1.8 V
Figure 11. Enable Start-Up Time Figure 12. Enable Start-Up Time
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Typical Characteristics (continued)
Unless otherwise specified, CIN = COUT = 1 µF ceramic, VIN = VOUT + 1 V, TA= 25°C, EN pin is tied to VIN.
VOUT = 1.8 V VOUT = 2.8 V
Figure 13. Enable Start-Up Time Figure 14. Turnoff Time
VOUT = 1.8 V
Figure 15. Turnoff Time
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VIN = VOUT(NOM) + 1V
50 mV
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7 Parameter Measurement Information
7.1 Input Test Signals
Figure 16. Line Transient Response Input Test Signal
Figure 17. PSRR Input Test Signal
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R1
R2
Fast
turnon and
turnoff
VREF
Overcurrent
Thermal Prot.
IN
EN
BYPASS
OUT
+
-
GND
LP3995
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SNVS179F –FEBRUARY 2003–REVISED SEPTEMBER 2015
8 Detailed Description
8.1 Overview
The LP3995 device is a CMOS voltage regulator with a low input operating voltage tolerance. Key protection
circuits, including thermal-overload and short-circuit protection, are integrated in the device. Using the EN pin,
the device may be controlled to provide a shutdown state, in which negligible supply current is drawn. The
LP3995 is designed to be stable with space-saving ceramic capacitors.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Enable (EN)
The EN pin is used to control the ON or OFF status of the LP3995. The EN pin voltage must be higher than the
VIH threshold to ensure that the device is fully enabled under all operating conditions.
8.3.2 Fast Turnoff
When the EN pin voltage is lower than the VIL threshold, the output is disabled, and the pull-down circuitry is
activated to discharge the output capacitance.
8.3.3 Low Output Noise
The BYPASS pin is an external connection into the LP3995 band-gap circuitry allows the addition of an external
capacitor to reduce output noise . A fast-charge circuit is controlled by the enable circuitry to reduce start-up
delays. The capacitor on the BYPASS pin also prevents overshoot on the output during startup.
8.3.4 Output Capacitor
The LP3995 requires at least a 1-µF low ESR ceramic capacitor at the OUT pin.
8.3.5 Thermal Overload Protection (TSD)
Thermal shutdown disables the output when the junction temperature rises to approximately 160°C which allows
the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry
automatically enables. Based on power dissipation, thermal resistance, and ambient temperature, the thermal
protection circuit may cycle on and off. This thermal cycling limits the dissipation of the regulator and protects it
from damage as a result of overheating. The thermal shutdown circuitry of the LP3995 has been designed to
protect against temporary thermal overload conditions. The thermal shutdown circuitry is not intended to replace
proper heat-sinking. Continuously running the LP3995 device into thermal shutdown may degrade device
reliability.
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8.4 Device Functional Modes
8.4.1 Enable Operation
The LP3995 may be switched ON or OFF by a logic input at the EN pin, VEN. A high voltage at this pin turns the
device on. When the EN pin is low, the regulator output is off and the device typically consumes 3 nA. If the
application does not require the shutdown feature, the EN pin should be tied to VIN to keep the regulator output
permanently on. To ensure proper operation, the signal source used to drive the EN input must be able to swing
above and below the specified turn-on/off voltage thresholds listed in Electrical Characteristics under VIL and VIH.
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OUT
IN
EN
6
2
34
BYPASS
1
10 nF
1 µF
1 µF
Input
Enable
GND
LP3995
Load
CIN
CBP
COUT
(C3)
(A1)
(B2)
(A3)
(C1)
LP3995
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LP3995 can provide 150-mA output current with 2.5-V to 6-V input. It is stable with a 1-μF ceramic output
capacitor. An optional external bypass capacitor reduces the output noise without slowing down the load
transient response. Typical output noise is 25 μVRMS at frequencies from 10 Hz to 100 kHz. Typical power supply
rejection is 60 dB at 1 kHz.
9.2 Typical Application
Figure 18. LP3995 Typical Application
9.2.1 Design Requirements
For typical CMOS voltage regulator applications, use the parameters listed in Table 1.
Table 1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Minimum input voltage 2.5 V
Minimum output voltage 1.8 V
Output current 150 mA
9.2.2 Detailed Design Procedure
9.2.2.1 External Capacitors
In common with most regulators, the LP3995 requires external capacitors to ensure stable operation. The
LP3995 is specifically designed for portable applications requiring minimum board space and smallest
components. These capacitors must be correctly selected for good performance.
9.2.2.2 Input Capacitor
An input capacitor is required for stability. It is recommended that a 1-µF capacitor be connected between the
LP3995 IN pin and ground (this capacitance value may be increased without limit).
This capacitor must be located a distance of not more than 1 cm from the IN pin and returned to a clean
analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
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NOTE
Tantalum capacitors can suffer catastrophic failures due to surge current when connected
to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum
capacitor is used at the input, it must be ensured by the manufacturer to have a surge
current rating sufficient for the application.
There are no requirements for the equivalent series resistance (ESR) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance remains ≅1
µF over the entire operating temperature range.
9.2.2.3 Output Capacitor
The LP3995 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor
(dielectric types Z5U, Y5V or X7R) in the 1-µF to 10-µF range, and with ESR between 5 mΩto 500 mΩ, is
suitable in the LP3995 application circuit.
For this device the output capacitor should be connected between the OUT pin and ground.
It may also be possible to use tantalum or film capacitors at the device output, VOUT, but these are not as
attractive for reasons of size and cost (see Capacitor Characteristics).
The output capacitor must meet the requirement for the minimum value of capacitance and also have an ESR
value that is within the range 5 mΩto 500 mΩfor stability.
Table 2. Recommended Output Capacitor
PARAMETER TEST CONDITIONS MIN TYP MAX Units
Capacitance(1) 0.7 1 µF
COUT Output Capacitor ESR 5 500 mΩ
(1) The capacitor tolerance should be ±30% or better over the temperature range. The recommended capacitor type is X7R however,
dependant on the application X5R, Y5V, and Z5U can also be used.
9.2.2.4 No-Load Stability
The LP3995 remains stable and in regulation with no external load. This is an important consideration in some
circuits, for example CMOS RAM keep-alive applications.
9.2.2.5 Capacitor Characteristics
The LP3995 is designed to work with ceramic capacitors on the output to take advantage of the benefits they
offer. For capacitance values in the range of 1 µF to 4.7 µF, ceramic capacitors are the smallest, least expensive
and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a
typical 1-µF ceramic capacitor is in the range of 20 mΩto 40 mΩ, which easily meets the ESR requirement for
stability for the LP3995.
The temperature performance of ceramic capacitors varies by type. Most large value ceramic capacitors (≥
2.2 µF) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance
dropping by more than 50% as the temperature goes from 25°C to +85°C.
A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable
and holds the capacitance within ±15% over the temperature range. Tantalum capacitors are less desirable than
ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance
and voltage ratings in the 1-µF to 4.7-µF range.
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum increases about
2:1 as the temperature goes from 25°C down to −40°C, so some guard band must be allowed.
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9.2.2.6 Noise Bypass Capacitor
A bypass capacitor should be connected between the BYPASS pin and ground to significantly reduce the noise
at the regulator output. This device pin connects directly to a high impedance node within the bandgap reference
circuitry. Any significant loading on this node causes a change on the regulated output voltage. For this reason,
DC leakage current through this pin must be kept as low as possible for best output voltage accuracy.
The use of a 0.01-µF bypass capacitor is strongly recommended to prevent overshoot on the output during start-
up.
The types of capacitors best suited for the noise bypass capacitor are ceramic and film. High quality ceramic
capacitors with NPO or COG dielectric typically have very low leakage. Polypropolene and polycarbonate film
capacitors are available in small surface-mount packages and typically have extremely low leakage current.
Unlike many other LDOs, the addition of a noise reduction capacitor does not effect the transient response of the
device.
9.2.2.7 Fast Turnoff and Turnon
The controlled switch-off feature of the device provides a fast turn off by discharging the output capacitor via an
internal FET device. This discharge is current limited by the RDSon of this switch. Fast turnon is ensured by
control circuitry within the reference block allowing a very fast ramp of the output voltage to reach the target
voltage.
9.2.2.8 Power Dissipation
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from
the power source, the junctions of the device, to the ultimate heat sink, the ambient environment. Thus the power
dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces
between the die and ambient air.
Equation 1 restates the equation given in note 5 of Absolute Maximum Ratings:
TA(MAX) = TJ(MAX-OP) −(PD(MAX) × RθJA) (1)
The allowable power dissipation for the device in a given package can be calculated:
PD= TJ(MAX) – TA/ RθJA (2)
With an RθJA = 255°C/W, the device in the DSBGA package returns a value of 392 mW with a maximum junction
temperature of 125°C.
With an RθJA = 88°C/W, the device in the WSON package returns a value of 1.136 mW with a maximum junction
temperature of 125°C.
The actual power dissipation across the device can be represented by Equation 3:
PD= (VIN −VOUT) × IOUT (3)
This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage
drop across the device, and the continuous current capability of the device. Equation 2 and Equation 3 should be
used to determine the optimum operating conditions for the device in the application.
This thermal resistance (RθJA) is highly dependent on the heat-spreading capability of the particular PCB design,
and therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA
recorded in Thermal Information is determined by the specific EIA/JEDEC JESD51-7 standard for PCB and
copper-spreading area and is to be used only as a relative measure of package thermal performance. For a well-
designed thermal layout, RθJA is actually the sum of the package junction-to-case (bottom) thermal resistance
(RθJCbot) plus the thermal resistance contribution by the PCB copper area acting as a heatsink.
9.2.2.9 Estimating Junction Temperature
The EIA/JEDEC standard recommends the use of psi (Ψ) thermal characteristics to estimate the junction
temperatures of surface mount devices on a typical PCB board application. These characteristics are not true
thermal resistance values, but rather package specific thermal characteristics that offer practical and relative
means of estimating junction temperatures. These psi metrics are determined to be significantly independent of
copper-spreading area. The key thermal characteristics (ΨJT and ΨJB) are given in Thermal Information and are
used in accordance with Equation 4 or Equation 5.
Copyright © 2003–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LP3995
LP3995
SNVS179F –FEBRUARY 2003–REVISED SEPTEMBER 2015
www.ti.com
TJ(MAX) = TTOP + (ΨJT × PD(MAX))
where
• PD(MAX) is explained in Equation 2
• TTOP is the temperature measured at the center-top of the device package. (4)
TJ(MAX) = TBOARD + (ΨJB × PD(MAX))
where
• PD(MAX) is explained in Equation 2.
• TBOARD is the PCB surface temperature measured 1-mm from the device package and centered on the
package edge. (5)
For more information about the thermal characteristics ΨJT and ΨJB, see TI Application Report Semiconductor
and IC Package Thermal Metrics (SPRA953); for more information about measuring TTOP and TBOARD, see the TI
Application Report Using New Thermal Metrics (SBVA025); and for more information about the EIA/JEDEC
JESD51 PCB used for validating RθJA, see the TI Application Report Thermal Characteristics of Linear and Logic
Packages Using JEDEC PCB Designs (SZZA017). Aforementioned application notes are available at
www.ti.com.
9.2.3 Application Curves
VOUT = 2.8 V VOUT = 2.8 V
Figure 19. Line Transient Response Figure 20. Load Transient Response
VOUT = 1.8 V
Figure 21. Load Transient Response
16 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated
Product Folder Links: LP3995
GND
EN
IN
GND
OUT
COUT
BYPASS
CIN
Thermal
Vias
1
2
3 4
5
6
EN
IN
CIN
GND
OUT
COUT
BYPASS
C3C1
B2
A3
A1
LP3995
www.ti.com
SNVS179F –FEBRUARY 2003–REVISED SEPTEMBER 2015
10 Power Supply Recommendations
The LP3995 is designed to operate from an input voltage supply range from 2.5 V to 6 V.
11 Layout
11.1 Layout Guidelines
The dynamic performance of the LP3995 is dependant on the layout of the PCB. PCB layout practices that are
adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LP3995. Best
performance is achieved by placing CIN and COUT on the same side of the PCB as the LP3995, and as close as
is practical to the package. The ground connections for CIN and COUT should be back to the LP3995 ground pin
using as wide, and as short, of a copper trace as is practical. Connections using long trace lengths, narrow trace
widths, and/or connections through vias should be avoided. These add parasitic inductances and resistance that
result in inferior performance especially during transient conditions.
11.2 Layout Examples
Figure 22. LP3995 DSBGA Layout
Figure 23. LP3995 WSON Layout
Copyright © 2003–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LP3995
LP3995
SNVS179F –FEBRUARY 2003–REVISED SEPTEMBER 2015
www.ti.com
11.3 DSBGA Mounting
The DSBGA package requires specific mounting techniques that are detailed in TI's AN-1112 Application Report
(SNVA009). Referring to the section Surface Mount Assembly Considerations, it should be noted that the pad
style which must be used with the 5-pin package is NSMD (non-solder mask defined) type.
For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the
DSBGA device.
11.4 DSBGA Light Sensitivity
Exposing the DSBGA device to direct sunlight may cause mis-operation of the device. Light sources such as
halogen lamps can affect electrical performance if they are situated in proximity to the device.
The wavelengths that have the most detrimental effect are reds and infra-reds, which means that the fluorescent
lighting used inside most buildings has little effect on performance. Tests carried out on a DSBGA test board
showed a negligible effect on the regulated output voltage when brought within 1 cm of a fluorescent lamp. A
deviation of less than 0.1% from nominal output voltage was observed.
18 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated
Product Folder Links: LP3995
LP3995
www.ti.com
SNVS179F –FEBRUARY 2003–REVISED SEPTEMBER 2015
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For additional information, see the following:
• TI Application Note DSBGA Wafer Level Chip Scale Package (SNVA009).
• TI Application Note Leadless Leadframe Package (LLP) (SNOA401).
• TI Application Report Semiconductor and IC Package Thermal Metrics (SPRA953).
• TI Application Report Using New Thermal Metrics (SBVA025).
• TI Application Report Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs
(SZZA017).
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2003–2015, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LP3995
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP3995ILD-1.5/NOPB ACTIVE WSON NGD 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L020B
LP3995ILD-1.8/NOPB ACTIVE WSON NGD 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L022B
LP3995ILD-2.8/NOPB ACTIVE WSON NGD 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L026B
LP3995ILD-3.0/NOPB ACTIVE WSON NGD 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L030B
LP3995ILDX-2.8/NOPB ACTIVE WSON NGD 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L026B
LP3995ITL-1.5/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITL-1.8/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITL-1.9/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITL-2.5/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITL-2.8/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITL-3.0/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITLX-1.5/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITLX-1.8/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITLX-1.9/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITLX-2.8/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
LP3995ITLX-3.0/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 2
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP3995ILD-1.5/NOPB WSON NGD 6 1000 178.0 12.4 3.6 3.2 1.0 8.0 12.0 Q1
LP3995ILD-1.8/NOPB WSON NGD 6 1000 178.0 12.4 3.6 3.2 1.0 8.0 12.0 Q1
LP3995ILD-2.8/NOPB WSON NGD 6 1000 178.0 12.4 3.6 3.2 1.0 8.0 12.0 Q1
LP3995ILD-3.0/NOPB WSON NGD 6 1000 178.0 12.4 3.6 3.2 1.0 8.0 12.0 Q1
LP3995ILDX-2.8/NOPB WSON NGD 6 4500 330.0 12.4 3.6 3.2 1.0 8.0 12.0 Q1
LP3995ITL-1.5/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITL-1.8/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITL-1.9/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITL-2.5/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITL-2.8/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITL-3.0/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITLX-1.5/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITLX-1.8/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITLX-1.9/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITLX-2.8/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
LP3995ITLX-3.0/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Aug-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP3995ILD-1.5/NOPB WSON NGD 6 1000 210.0 185.0 35.0
LP3995ILD-1.8/NOPB WSON NGD 6 1000 210.0 185.0 35.0
LP3995ILD-2.8/NOPB WSON NGD 6 1000 210.0 185.0 35.0
LP3995ILD-3.0/NOPB WSON NGD 6 1000 210.0 185.0 35.0
LP3995ILDX-2.8/NOPB WSON NGD 6 4500 367.0 367.0 35.0
LP3995ITL-1.5/NOPB DSBGA YZR 5 250 210.0 185.0 35.0
LP3995ITL-1.8/NOPB DSBGA YZR 5 250 210.0 185.0 35.0
LP3995ITL-1.9/NOPB DSBGA YZR 5 250 210.0 185.0 35.0
LP3995ITL-2.5/NOPB DSBGA YZR 5 250 210.0 185.0 35.0
LP3995ITL-2.8/NOPB DSBGA YZR 5 250 210.0 185.0 35.0
LP3995ITL-3.0/NOPB DSBGA YZR 5 250 210.0 185.0 35.0
LP3995ITLX-1.5/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0
LP3995ITLX-1.8/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0
LP3995ITLX-1.9/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0
LP3995ITLX-2.8/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0
LP3995ITLX-3.0/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Aug-2017
Pack Materials-Page 2
MECHANICAL DATA
NGD0006A
www.ti.com
MECHANICAL DATA
YZR0005xxx
www.ti.com
TLA05XXX (Rev C)
0.600±0.075
D
E
NOTES:
A
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
4215043/A 12/12
D: Max =
E: Max =
1.502 mm, Min =
1.045 mm, Min =
1.441 mm
0.984 mm
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Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LP3995ILD-1.5 LP3995ILD-1.5/NOPB LP3995ILD-1.8 LP3995ILD-1.8/NOPB LP3995ILD-2.8 LP3995ILD-2.8/NOPB
LP3995ILD-3.0 LP3995ILD-3.0/NOPB LP3995ILDX-2.8/NOPB LP3995ITL-1.5/NOPB LP3995ITL-1.6/NOPB
LP3995ITL-1.8/NOPB LP3995ITL-1.9/NOPB LP3995ITL-2.1/NOPB LP3995ITL-2.5/NOPB LP3995ITL-2.7/NOPB
LP3995ITL-2.8/NOPB LP3995ITL-2.85/NOPB LP3995ITL-3.0/NOPB LP3995ITLX-1.5/NOPB LP3995ITLX-1.6/NOPB
LP3995ITLX-1.8/NOPB LP3995ITLX-1.9/NOPB LP3995ITLX-2.1/NOPB LP3995ITLX-2.5/NOPB LP3995ITLX-
2.7/NOPB LP3995ITLX-2.8/NOPB LP3995ITLX-2.85/NOPB LP3995ITLX-3.0/NOPB