1/6
EMIF02-MIC03F1
®
January 2004 - Ed: 3A
IEC61000-4-2
Level 4 on input pins 15kV (air discharge)
8 kV (contact discharge)
Level 1 on output pins 2kV (air discharge)
2kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
COMPLIES WITH THE FOLLOWING STANDARDS:
Flip Chip package
B
132
C
A
I1
O1
GND
I2
O2
PIN CONFIGURATION (ball side)
■EMI symmetrical (I/O) low-pass filter
■High efficiency in EMI filtering
■Very low PCB space consuming: 1.07mm x 1.47mm
■Very thin package: 0.65 mm
■High efficiency in ESD suppression
■High reliability offered by monolithic integration
■High reducing of parasitic elements through integration
& wafer level packaging.
BENEFITS
2 LINES EMI FILTER
AND ESD PROTECTION
IPADTM
Where EMI filtering in ESD sensitive equipment is
required :
■Mobile phones and communication systems
■Computers, printers and MCU Boards
MAIN PRODUCT CHARACTERISTICS:
The EMIF02-MIC03 is a highly integrated device designed
to suppress EMI/RFI noise in all systems subjected to
electromagnetic interferences. The EMIF02 flip chip
packaging means the package size is equal to the die
size.
This filter includes an ESD protection circuitry which
prevents the device from destruction when subjected to
ESD surges up 15kV.
DESCRIPTION
TM : IPAD is a trademark of STMicroelectronics.
Input Output
GND GND GND
Low-pass Filter
Ri/o = 68
Cline = 100pF
Ω
BASIC CELL CONFIGURATION