IRF130SMD05N
IRFN130SMD05
Semelab plc. Telephone +44(0)1455) 556565. Fax +44(0)1455) 552612.
E-mail: sales@semelab.co.uk Website http://www.semelab.co.uk Prelim. 10/00
VGS Gate – Source Voltage
IDContinuous Drain Current @ Tcase = 25°C
IDContinuous Drain Current @ Tcase = 100°C
IDM Pulsed Drain Current
PDPower Dissipation @ Tcase = 25°C
Linear Derating Factor
TJ, Tstg Operating and Storage Temperature Range
R
q
JC Thermal Resistance Junction to Case
±20V
11A
7A
44A
45W
0.36W/°C
–55 to 150°C
2.8°C/W max.
MECHANICAL DATA
Dimensions in mm (inches)
!
0.127 (0.005)
2.41 (0.095)
(0 .0 3 0 )
min.
3 .0 5 (0 .1 2 0 )
5 .7 2 (.2 2 5 )
0.127 (0.005)
(0 .2 9 6 )
1 0 .1 6 (0 .4 0 0 )
0.76
(0.030)
min.
3.175 (0.125)
Max.
0.50 (0.020)
0.26 (0.010)
7.54
0.76
2.41 (0.095)
0.127 (0.005)
(0.286) 7.26
16 P LC S
0.50(0.020)
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
SMD 05
N–CHANNEL
POWER MOSFET
FOR HI–REL
APPLICATIONS
FEATURES
• HERMETICALLY SEALED
• SIMPLE DRIVE REQUIREMENTS
• LIGHTWEIGHT
• SCREENING OPTIONS AVAILABLE
• ALL LEADS ISOLATED FROM CASE
VDSS 100V
ID(cont) 11A
RDS(on) 0.19
WW
WW
IRF130SMD05
IRFN130SMD05
PAD1 = GATE PAD 2 DRAIN PAD3 = SOURCE
PAD1 = SOURCE PAD 2 = DRAIN PAD3 = GATE
IRF130SMD05N
IRFN130SMD05
Semelab plc. Telephone +44(0)1455) 556565. Fax +44(0)1455) 552612.
E-mail: sales@semelab.co.uk Website http://www.semelab.co.uk Prelim. 10/00
Parameter Test Conditions Min. Typ. Max. Unit
VGS = 0 ID= 1mA
Reference to 25°C
ID= 1mA
VGS = 10V ID= 7A
VGS = 10V ID= 11A
VDS = VGS ID= 250
m
A
VDS
³
15V IDS = 7A
VGS = 0 VDS = 0.8BVDSS
TJ= 125°C
VGS = 20V
VGS = –20V
VGS = 0
VDS = 25V
f = 1MHz
VGS = 10V ID= 11A
VDS = 0.5BVDSS
ID= 11A
VDS = 0.5BVDSS
VDD = 50V
ID= 11A
RG= 7.5
W
IS= 11A TJ= 25°C
VGS = 0
IS= 11A TJ= 25°C
di/ dt
£
100A/
m
sV
DD
£
50V
ELECTRICAL CHARACTERISTICS (TC= 25°C unless otherwise stated)
Drain – Source Breakdown Voltage
Temperature Coefficient of
Breakdown Voltage
Static Drain – Source On–State
Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
Forward Gate
– Source Leakage
Reverse Gate
– Source Leakage
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate – Source Charge
Gate – Drain (“Miller”) Charge
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Continuous Source Current
Pulse Source Current
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
100
0.1
0.19
0.22
24
325
250
100
-100
650
240
44
12.8 28.5
1.0 6.3
3.8 16.6
30
75
40
45
11
43
1.5
300
3
8.7
8.7
V
V/°C
W
V
S(
W
m
A
nA
pF
nC
nC
ns
A
V
ns
m
C
nH
BVDSS
D
BVDSS
D
TJ
RDS(on)
VGS(th)
gfs
IDSS
IGSS
IGSS
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
IS
ISM
VSD
trr
Qrr
LD
LS
STATIC ELECTRICAL RATINGS
DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
Internal Drain Inductance (from 6mm down drain lead pad to centre of die)
Internal Source Inductance (from 6mm down source lead to centre of source bond pad)
PACKAGE CHARACTERISTICS
(
W
)
HIGH
RELIABILITY
and
SCREENING
OPTIONS
DOC 2624 ISS 5
Contents
1. Introduction................................................................................................ 1
2. Quality Approvals...................................................................................... 2
3. Material Qualification................................................................................. 3
3.1 Header/Cap/Wire Approval Procedures..................................................................... 3
3.2 Die Approval Procedure .............................................................................................. 4
4. CECC (Discrete Products)......................................................................... 5
4.1 Inspection Levels for CECC Fully Assessed Devices.............................................. 5
4.2 CECC Screening Options............................................................................................ 7
5. BS (Linear Products)................................................................................. 8
5.1 Inspection Levels for BS Fully Assessed Devices ................................................... 8
5.2 BS Screening Options (Linear IC’s) ......................................................................... 10
6. DSCC / 883B (Linear Products)................................................................11
6.1 Inspection Levels for DSCC SMD listed Devices.................................................... 11
6.2 Screening Sequence for DSCC SMD listed devices............................................... 13
7. ESA - ESCC - Space Level Products...................................................... 14
7.1 Chart F2 - Production Control.................................................................................. 14
7.2 Chart F3 - Screening Tests....................................................................................... 15
7.3 Chart F4 - Qualification and Periodic Tests........................................................... 16
8. Semelab In-House Processing Options................................................. 17
8.1 CECC processed devices (QR208, QR209) ............................................................. 17
8.2 BS and CV processed devices (Bipolar).................................................................. 18
8.3 MIL-PRF-19500 Processed Discrete Semiconductors (QR205, QR204)............... 19
8.3.1 QR205 - Inspection levels: ‘Mil Processed’ Quality Conformance ....... 20
8.3.2 QR204 - Screening Sequences ‘Mil Processed’ Components............... 22
8.4 Space Level Processed Discrete Semiconductors (QR216, QR217).................... 23
8.4.1 QR217 - Inspection levels: ‘Space Level Processed’ Conf ormance..... 24
8.4.2 QR216 - Screening: Spa ce Level Processed’ Components................... 25
8.4.3 Comparison of space level die lot approval............................................ 27
8.5 MIL-883B Processed Integrated Circuits (QR214, QR215)..................................... 28
8.6 Customer Specifications ........................................................................................... 28
8.7 Data Sheets................................................................................................................. 28
9. Comparison of Screening Options........... .............................................. 29
9.1 Comparison Hi-Rel Screening options .................................................................... 30
9.2 Comparison of Space Level Screening Options..................................................... 30
Issue 10b (DMD) 04/06
1 DOC 2624 ISS 5
1. Introduction
Experience and Innovation In Semiconductor Technology
At SEMELAB, we research, design, manufacture and distribute an innovative range of
semiconductor products throughout the world.
Our R&D teams have an excellent track record for developing imaginative electronic
solutions. Our design engineers have created a wealth of high performance products. Our
manufacturing divisions have ensured supreme quality and reliability. And our sales teams
and distribution partners have opened international markets to some of the best electronics
solutions available.
We hold all the necessary Qualification Approvals needed to serve the Military and Hi-Rel
Industries now including QML Approval for a series of Linear Integrated Circuits and QML
Approval for our laboratory test house capabilities. The test facilities are available to qualify
and screen third party products, including Hybrid products not made by the Group. We have
the ability and considerable experience of most test methods currently demanded.
We specialise in the fabrication of very high quality products especially intended for use in
high reliability applications. We have supplied many millions of discrete and linear integrated
circuits into all forms of high reliability equipment such as:
• Space Satellite Vehicles
Launchers
Support & defence
• Aircraft Military
Civil
Air Traffic Control
• Communications Secure Communication Links
Military links
Naval Links
Broadcast Transmitters
Underwater Repeaters
• Defence Guided weapons
Electronic Counter Measures
Command & Control
Radar
• Transportation Railway Signalling Systems
Traction Systems
Automatic Signalling Systems
• Harsh Environment Oil Rig Installations
Drill Head Sensors
Atomic Event Detectors
--- everywhere when there is a need for cost effective ultra reliable products.
This is SEMELAB: design innovation, backed by numerous approvals and manufacturing
strength and led by a total commitment to quality.
2 DOC 2624 ISS 5
2. Quality Approvals
SCHEME Description SML Facilities
Approval (Y/N) SEMELAB
Approval
No
SML Devices Types
Approved Remarks
Current Schemes
BS9000 British Standards for Linear ICs
and Discrete Semiconductors
Y detailed
approval for many
products
1360/M Linear ICs and
Discrete
Semiconductors
Replaced in many areas by CECC or DSCC. Approved
suppliers and products listed in PD9002
BS EN ISO
9001:2000
International Standard for
Quality Assurance management
of all phases in the provision of
goods and services. Replaces
most of the old "national"
systems.
Y FM36235 refers to all product
types
The whole Semelab facility and all products conform with these
norms.
CECC 50000 European Military Quality
Approval system for Discrete
Semiconductors
Y
detailed approval
for many products
M/0103/CECC/
UK-1181M
Small signal
discretes, Power
discretes
European QPL. Generally in decline
CECC 90000 European Military Quality
Approval system for ICs.
Y
detailed approval
for many products
M/0103/CECC/
UK-1181M
Linear ICs. European QPL. Generally in decline
DSCC QPL approval US Manufacturing approval
accepted everywhere
Y
detailed approval
for large range of
linear ICs.
Cage NO.
U3158
Linear ICs Detailed product approval by DSCC - e.g. commonly called
MIL/883B for linear ICs
DSCC QML approval US Manufacturing approval
accepted everywhere
Y DSCC -VQ-03-
003050
&
DSCC-VQ-03-
003049
Linear ICs
(level Q certification)
Laboratory Suitability
Will generally replace many of the older approval systems on
International Military Systems.
ESA - ESCC 5000,
SCC 9000
European Space Agency Y QPL No 253 2N2880 - more to
follow
Product built & supplied in accordance
with generic ESCC specifications
STANAG 4093 General reciprocal listing
arrangement
Y All product types Reciprocal QPL listing between Europe and North America
Scheme s be in g
phased out
AQAP-1 Applies in UK and related areas.
Replaced Defence Standard
05/21
Y MOD
Registration
No.2M8S02
Being superseded by BS/EN/ISO 9001
GAMT1 French Military approved
products list
Y
detailed approval
for many products
A large number French Market - should be replaced by BS/EN/ISO9001
MUAHAG European - Military users and
Harmonisation Advisory Group
Y
detailed approval
for many products
Discrete products -
volume 9. Linears -
volume 7
Components generally for European Military equipment makers
- should be replaced by BS/EN/ISO9001
NATO NATO system applies to NATO
systems
Y
listed for many
products
Manufacturer
Code 3158
Several hundred
discrete products
Tending towards being a legacy system now
Legacy Schemes
CV Very early UK approvals system
for Military and GPO types
Y
some parts
replaced by BS
types, CECC or
CVxxxx-0 parts
Legacy system - generally replaced by BS or CECC types
DEF Specs Precursor of Defence Standard
Specifications
Many types - all
built to order.
Replaced by Defence Standard Specifications. Generally
already phased out.
Defence Standards
(many)
Relate to materials, components
and processes for UK Military
use
Y
for many products
but under AQAP1
and ISO9001
Discrete products Legacy system little used now. The most common DEF Stan
relating to Semiconductors is DEF STAN 05/21 - replaced by
AQAP1
RRE, RSRE P &
SRDE Specifications
Specifications drawn up in
support of MOD projects
Y
for many types
Discrete products Legacy system little used now.
3 DOC 2624 ISS 5
2. Material Screening
Piece Part – Qualification and pre-assembly approval process flow.
Before contemplating the assembly of any qualified semiconductor product, it is essential
that all the materials used in the construction of the parts be obtained from fully qualified and
trustworthy suppliers - those with a long continuous and successful supply history. Little used
or untried or suspect materials are thoroughly checked and qualified as being suitable for
their intended application before use.
In this case, mechanical piece parts are subject to an exhaustive series of tests culminating
in sample assemblies being built to establish lack of flaws and lack of unwanted difficulties
during assembly.
3.1 Header / Cap / Wire Approval Procedures
Incoming Mechanical Piece Parts
Visual inspection
Dimensional Check
Corrosion Resistance
Mechanical Strength
Visual Die Sort (before sample assembly)
Sample piece parts submitted to Assembly
Vibration test
Temperature Cycling
Acceleration
Sealing (Leak) Tests
Solderability Tests
Electrical Tests
Qualified (Approved) Mechanical Piece Parts
Available for Assembly of Hi-Rel Products.
Notes: Approval procedures are performed on samples to approve each single lot of
material.
Each batch of assembled piece parts carries its own unique “date” code. Traceability to each
incoming batch of materials (all mechanical batches and die lots) is guaranteed from this
unique number.
QA Inspection Tests
Operation
4 DOC 2624 ISS 5
3.2 Die Approval Procedure
Incoming Wafer
Wafer Saw
Wash & Dry
Headers*
(qualified) Break into individual die
Clean Visual Die sort and Tray
Die Acceptance
Die Attach
Die Attach Inspection
Aluminium Wire Bond
Bond Inspection
Caps*
(Qualified) 100% Optical Inspection
Clean Final Pre-Cap Inspection
Vacuum Bake
Final Seal
Seal Inspection
Final Acceptance
Electrical Yield Forecasting
QA Acceptance Tests
168 Hour Life and Electrical Tests
Final QA Acceptance of the Die Lot.
APPROVED DIE (available for production)
Each batch of assembled piece parts carries its own unique “date” code. Traceability to each
incoming batch of materials (all mechanical batches and die lots) is guaranteed from this
unique number.
The die qualification can include a 1000-hour electrical endurance test. One of the major
objectives is to ensure that the die lot’s performance stabilises rapidly during the initial
portion of this period and then remain unchanged throughout the remainder of the test
(and life).
Die and mechanical piece parts intended for use in Ultra-Reliable applications e.g. Space
Vehicles are subject to more rigorous evaluation.
QA Inspection Tests
Operation
5 DOC 2624 ISS 5
4. CECC (Discrete Devices)
Registration: M/0103/CECC/UK
SEMELAB offers one of the largest ranges of CECC approved products in Europe, including
small signal and power devices. These devices have undergone approval for use in new
applications as well as providing continuing support for existing applications.
All piece parts used in the manufacture of CECC released products undergo stringent
qualification procedures before they can be used. For further details contact our Quality
Manager (qa@semelab.co.uk).
Full forward and backward traceability is maintained on all CECC released devices
All CECC fully assessed devices are subject to groups A, B and C inspection carried out in
the Quality Assurance Department in Lutterworth. Assessment is available to levels E, F & L.
Ordering Information (example):-
BDS18CECC full assessment level (without additional screening)
BDS18CECC-B CECC full assessment level + sequence B screen
4.1 Inspection Levels for CECC Fully Assessed Devices
Group A - Lot by lot inspection IL = inspection levels
AQL = Acceptable Quality Level (%)
Levels of Quality Assessment
Examination or test Level E Level F & Level L
IL AQL Observations IL AQL Notes
SUB-GROUP A1
Visual Inspection
I
0.65
I
0.65
SUB-GROUP A2a
Non operatives
II
0.15
II
0.15
SUB-GROUP A 2b
Electrical Measurements
II
0.40 primary dc characteristics
II
0.65
1.0
if < 4 tests
if ≥ 4 tests
SUB-GROUP A 3
Electrical Measurements
II
0.65 other dc characteristics
I
I
2.5 4
if < 4 tests
if ≥ 4 tests
SUB-GROUP A 4
Electrical Measurements
S4
1 ac characteristics
S4
S4
4 6.5
if < 4 tests
if ≥ 4 tests
6 DOC 2624 ISS 5
CECC (Discrete Devices) (continued)
Group B - Lot by lot inspection IL = inspection level amb = ambient rated case = case rated
AQL in % c = acceptance criterion n = sample size
Levels of Quality Assess ment
Examination or test Level E Level F Level L
n/c IL AQL IL AQL Notes
SUB-GROUP B1
Dimensions
15/0 or 25/1
S2
2.5
S2
2.5
SUB-GROUP B2c
Verification of ratings
15/0 or 25/1
S4
4
na
na
see C2c
SUB-GROUP B3
Lead bending if applicable
15/0 or 25/1
S3
2.5
S2
4
SUB-GROUP B4
Solderability
22/0 or 38/1
S4
2.5
S4
2.5
SUB-GROUP B5
Change of temp followed by
acc. Damp heat or sealing
15/0 or 25/1
S4
2.5
na
na
see C5
SUB-GROUP B8
Electrical endurance
38/1 or 52/2
S4
1.5
na
na
see C8
SUB-GROUP CTR Unless otherwise stated in detail specification:
attributes information for B3, B4, B5, B8
Group C - Periodic Inspection
P = periodicity (months) na= not applied
Levels of Quality Assess ment
Examination or test E (p = 3 months) F (p = 3 months) L
n/c notes n/c notes P n/c Notes
SUB-GROUP C1
Dimensions
8/0 or 13/1
8/1
3
8/1
SUB-GROUP C2a
Electrical Measurements
15/0 or 25/1
13/1
3
13/1
SUB-GROUP C2b
Complementary characteristics
32/0 or 55/1
15/0 or 25/1
versus T
versus I,V
18/1
3
18/1
SUB-GROUP C2c
Verification of ratings
15/0 or 25/1
13/1
when not
in B2c
3
8/1
SUB-GROUP C3
Tensile / Torque (if applicable)
15/0 or 25/1
8/1
6
8/1
SUB-GROUP C4
Soldering heat
22/0 or 38/1
18/1
na
na
SUB-GROUP C5
Change of temp followed by
acc. Damp heat or sealing
na
see B5
na
see B5
3
13/1
SUB-GROUP C6
Shock acceleration vibration
15/0 or 25/1
8/1
6
8/1
SUB-GROUP C7
Damp heat (if applicable)
15/0 or 25/1
18/1
na
na
SUB-GROUP C8
Electrical endurance
38/1 or 52/1
43/3
34/2
amb
case
3
3
32/3 25/2 amb
case
SUB-GROUP C9
Storage at high temp
38/1 or 52/2
43/3
34/2
amb
case
na
na
SUB-GROUP CTR Unless otherwise stated in detail specification: attributes information
for C3, C5, C6, C9. Measurement information before and after C8
7 DOC 2624 ISS 5
CECC (Discrete Devices) (continued)
4.2 CECC Screening Options
All CECC approved devices can be supplied as a standard full assessment level part or with
additional 100% screening to any of the four levels (A, B, C, D) in accordance to CECC
50000 Appendix VI
In addition, SEMELAB can supply screening on products where the full device approval does
not exist or is not held. Screening is again carried out in accordance with any of the four
levels within CECC 50000 Appendix VI and is carried out at our factory in Lutterworth.
Screening sequences are as laid out below:-
SEQUENCE A SEQUENCE B SEQUENCE C SEQUENCE D
100% Internal
Visual Inspection
24 Hour High
Temperature
Storage
24 Hour High
Temperature
Storage
24 Hour High
Temperature
Storage
Rapid change of
Temperature
Rapid change of
Temperature
Rapid change of
Temperature
Acceleration
Test
Acceleration
Test
Acceleration
Test
Fine & Gross Leak
Test
Fine & Gross
Leak Test
Fine & Gross Leak
Test
Test & record
Electrical
Characteristics
Test
Electrical
Characteristics
Test
Electrical
Characteristics
168 Hour Burn-In
Electrical
Operation
(ambient rated) or
High Temperature
Reverse Bias
(case rated)
72 Hour Burn-In
Electrical
Operation
(ambient rated) or
High Temperature
Reverse Bias
(case rated)
48 Hour Burn-In
Electrical
Operation
(ambient rated) or
High Temperature
Reverse Bias
(case rated)
Test & record
Electrical
Characteristics
Test
Electrical
Characteristics
Test
Electrical
Characteristics
Test
Electrical
Characteristics
8 DOC 2624 ISS 5
5. BS (Linear IC’s)
Registration 1360/M.
SEMELAB offers a range of BS approved Linear IC’s including Voltage regulators, PWM’s
and Control IC’s. These families of devices have undergone approval for use in new
applications in addition to providing continuing support for existing applications.
Full forward and backward traceability is maintained on all BS released devices
All BS fully assessed devices are subject to groups A,B,C and D inspection carried out in the
Quality Assurance Department in Lutterworth. Screening is available to any of the four levels
defined in BS9400 (S1, S2, S3, S4)
The generic specifications for these devices are as follows:
BS9400 IC’s - Generic Data & Methods of Test
BS9430 Linear Voltage Regulators
BS9493 PWM and Control IC’s
Ordering Information (example):-
IP117K-BSS2 BS full assessment level + category S2 screening
5.1 Inspection Levels for BS Fully Assessed Devices
Group A - Lot by lot inspection IL = inspection levels
AQL = Acceptable Quality Level (%)
Levels of Quality Assessment
Examination or test IL AQL BS9400 Observations
SUB-GROUP A1
Visual Inspection
I
1.5
1.2.2
SUB-GROUP A2
Non operatives
II
0.15
SUB-GROUP A3a
Electrical Measurements
II
1.5
Static Characteristics Tamb=25°C
SUB-GROUP A3b
Electrical Measurements
II
1.5
Static Characteristics Tamb = Tmax
SUB-GROUP A3c
Electrical Measurements
II
1.5
Static Characteristics Tamb = Tmin
SUB-GROUP A4a
Electrical Measurements
S4
4%
Dynamic Characteristics Tamb = 25°C
9 DOC 2624 ISS 5
BS (Linear IC’s) (continued)
Group B - Lot by lot inspection IL = inspection levels
AQL = Acceptable Quality Level (%)
Levels of Quality Assessment
Examination or test IL AQL BS 9400 Observations
SUB-GROUP B1
Dimensions
S2
6.5
1.2.3
SUB-GROUP B2a
Solderbility
S4
4.0
1.2.6.15.1
SUB-GROUP B2b
Change of temp
followed by sealing
S4
4.0
1.2.6.13
1.2.6.14.1/2
SUB-GROUP B3
Lead bending
S3
6.5
1.2.6.16.2
SUB-GROUP B6
Acceleration steady state
S4
4.0
1.2.6.9
SUB-GROUP B7
Electrical Endurance
S4
1.5
1.2.7.2.2
SUB-GROUP B8
CTR Information Unless otherwise stated in detail specification:
attributes information for B2a, B2b, B6, B7
Group C - Periodic inspection IL = inspection levels
AQL = Acceptable Quality Level (%)
Levels of Quality Assessment
Examination or test IL AQL BS 9400 Observations
SUB-GROUP C1
Dimensions
S2
6.5
1.2.3
SUB-GROUP C3
Vibration followed by
Shock followed by
Damp Heat Cycle
S2
6.5
1.2.6.8.1
1.2.6.6
1.2.6.5
SUB-GROUP C5
Electrical Endurance
S3
4.0
1.2.7.2.2
Duration = 2000 hrs
SUB-GROUP C6
CTR Information
S3
6.5
1.1.11
Unless otherwise stated in detail spec:
attributes information for C3 & C5
10 DOC 2624 ISS 5
BS (Linear IC’s) (continued)
5.2 BS Screening Options (Linear IC’s)
CATEGORY S1 CATEGORY S2 CATEGORY S3 CATEG O RY S4
100% Internal
Visual Inspection
Level A
100% Internal
Visual Inspection
Level B
100% Internal
Visual Inspection
Level B
24 Hour High
Temperature
Storage
24 Hour High
Temperature
Storage
24 Hour High
Temperature
Storage
Rapid change of
Temperature
Rapid change of
Temperature
Rapid change of
Temperature
Shock
Acceleration Test
(Direction Y1, Y2)
Acceleration Test
(Direction Y1)
Acceleration Test
(Direction Y1)
Fine & Gross
Leak Test
Fine & Gross
Leak Test
Fine & Gross Leak
Test
Test
Electrical
Characteristics
Test
Electrical
Characteristics
Test
Electrical
Characteristics
240 Hour Duration
High Temperature
Burn-In
160 Hour Duration
High Temperature
Burn-In
160 Hour Duration
High Temperature
Burn-In
Test
Electrical
Characteristics
72 Hour Duration
High Temperature
Reverse Bias
Test
Electrical
Characteristics
Test
Electrical
Characteristics
Test
Electrical
Characteristics
Test
Electrical
Characteristics
Radiographic
Tests
(Accept / reject criteria at every stage strictly as defined by the BS Specifications).
11 DOC 2624 ISS 5
6. DSCC / 883B (Linear IC’s)
Built on Semelab’s QML Qualified Production Lines.
Cage Number U3158
SEMELAB offers a range of DSCC SMD listed and 883B processed voltage regulators,
PWM’s and Control IC’s. All manufacturing is carried out on our QML qualified lines in our
Lutterworth factory to the appropriate MIL-STD-883 specifications (5005 - Processing and
5004 - Screening).
6.1 Inspection Levels for DSCC SMD Listed Devices
Method 5005: Table I Group A electrical tests for class level B
Examination or test Quality/accept Observations
SUB-GROUP 1 Static Tests 116/0 Tamb = 25°C
SUB-GROUP 2 Static Tests 116/0 Tamb = Tmax
SUB-GROUP 3 Static Tests 116/0 Tamb = Tmin
SUB-GROUP 4 Dynamic Tests 116/0 Tamb = 25°C
SUB-GROUP 5 Dynamic Tests 116/0 Tamb = Tmax
SUB-GROUP 6 Dynamic Tests 116/0 Tamb = Tmin
SUB-GROUP 7 Functional Tests 116/0 Tamb = 25°C
SUB-GROUP 8a Functional Tests 116/0 Tamb = Tmax
SUB-GROUP 8b Functional Tests 116/0 Tamb = Tmin
SUB-GROUP9 Switching tests 116/0 Tamb = 25°C
SUB-GROUP10 Switching tests 116/0 Tamb = Tmax
SUB-GROUP11 Switching tests 116/0 Tamb = Tmin
1) The specific parameters to be included for tests in each subgroup shall be as specified in the applicable acquisition
document. Where no parameters have been identified in a particular subgroup or tests within a subgroup, no group A testing
is required for that subgroup or test to satisfy group A requirements.
2) When the (sub)lot size is less than the required sample size, each and every device in the (sub)lot shall be inspected and all
failed devices removed from the (sub)lot for final acceptance of that test, subgroup, or set of tests/subgroups.
Method 5005: Table I Ib Gr oup B t es t s f o r cl as s level B
Test note MIL-STD-883
method
Condition Quantity/accept or
sample size/accept
Subgroup 2
Resistant to solvents
(3)
2015
3/0
Subgroup 2
Solderability
(4)
20 03
soldering
temp 245°C ± 5°C
sample size
number = 22, c = 0
Subgroup 3
Bond strength
1) Thermo-compression
2) Ultrasonic / Wedge
3) Flip-chip
4) Beam lead
(5)
2011
1) Test Condition C or D
2) Test Condition C or D
3) Test Condition F
4) Test Condition H
sample size
number = 15, c = 0
3) Resistance to solvents testing required only on devices using inks or paints as the marking or contrast.
4) Devices submitted for solderability shall be in the same lead finish as shipped product and must have been through the
temp/time exposure of burn in except for devices which have been hot solder dipped or have lead-tin fusing after burn-in.
5) Unless otherwise specified the sample size number for condition C or D is the number of bond pulls selected from a
minimum number of 4 devices and for condition F or H is the number of dice (not bonds).
12 DOC 2624 ISS 5
DSCC / 883B (Linear IC’s) (continued)
Method 5005: Table I II Group C (Die related t est s) f o r cl as s level B
Test
MIL-STD-883
method
Condition Quantity/accept or
sample size/accept
Subgroup 1
a) Steady-state life test
1005
Test condition to be specified (1000
hours at 125°C or equivalent in
accordance with table 1)
sample size
number = 45, c = 0
b) End-point electrical
parameters
As specified in the applicable device
specification
Method 5005: Table IV Group D (package related tests) for class level B
Test (1)
MIL-STD-
883 method
Condition Quantity/accept or
sample size/accept
Subgroup 1 (2)
Physical Dimensions
2016
sample size
number = 15, c = 0
Subgroup 2
a) Lead Integrity (3)
b) Seal - Fine & Gross leak (5)
2004
1014
Test Condition B (lead fatigue)
As applicable
sample size
number = 45, c = 0
Subgroup 3 (4)
a) Thermal Shock
b) Temp Cycle
c) Moisture resistance
d) Visual Examination
e) Seal - Fine & Gross leak
f) End Point Electricals
1011
1010
1004
1014
Test cond B as a min. 15 cycles min
Test Condition C. 100 cycles min
In accordance with visual criteria
method 1004 and 1010
As applicable
As specified in the applicable device
specification
sample size
number = 15, c = 0
Subgroup 4 (4)
a) Mechanical Shock
b) Vibration, variable frequency
c) Constant Acceleration
d) Seal - Fine & Gross leak
e) Visual examination
f) End point Electricals (6)
2002
2007
2001
1014
Test condition B minimum
Test condition A minimum
Test condition E minimum (Y1 only)
In accordance with meth 1010 or 1101
As specified in applicable device
specification
sample size
number = 15, c = 0
Subgroup 5 (2)
a) Salt Atmosphere
b) Visual Examination
c) Seal - Fine & Gross leak
1009
1014
Test condition A minimum
In accordance with method 1009
sample size
number = 15, c = 0
Subgroup 6 (2)
a) Internal water-vapour content
1018
5000ppm max water content at 100°C
3/0 or 5/1
Subgroup 7 (2)
a) Adhesion of Lead finish (12)
2025
sample size
number = 15, c = 0
Subgroup 8 (2)
a) Lid Torque
2024
5/0
1) In line monitor data may be substituted for subgroups D1,D2,D6,D7 and D8 upon approval by the qualifying activity. The
monitors shall be performed by package type and to the specified subgroup test method.
2) Electrical reject devices from the same inspection lot may be used for samples.
3) The sample size number of 45, C=0 for lead integrity shall be based on the number of leads or terminals tested and shall be
taken from a minimum of 3 devices.
4) Seal tests need only be performed on packages having leads exiting through a glass seal.
5) Devices used in subgroup 3 can be used in subgroup 4.
6) End point electrical parameters may be performed after moisture resistance and prior to seal test.
7) Sample size based on number of leads.
13 DOC 2624 ISS 5
6.2 Screening Sequence for DSCC SMD listed devices
Method 5004: Table 1 Class lev el B sc ree ning
Screen MIL-STD-883
method
Condition Requirement
Internal Visual (1) 2010 Test Condition B 100%
Stabilisation Bake 1008 24hrs @ condition C minimum 100%
Temperature Cycling (2) 1010 Test Condition C 100%
Constant Acceleration 2001 Test condition E minimum
Y1 orientation only
100%
Visual Inspection 100%
Initial (pre-burn-in) (3)
electrical Parameters
In accordance with applicable
device specification
100%
Burn-In Test 1015 160 hours at 125°C minimum 100%
Interim (Post Burn-In)
Electrical Parameters
In accordance with applicable
device specification
100%
Percentage Defect Allowable 5% all lots
Final Electrical Test
a) Static tests
1) 25°C
subgroup 1 table 1 5005
2) Maximum and Minimum
rated operating temperature
subgroup 2,3 table 1 5005
b) Dynamic or functional tests
1) 25°C
subgroup 4,7 table 1 5005
2) Minimum and Maximum
rated operating temperature
subgroup 5,6,8 table 1 5005
c) Switching tests at 25°C
subgroup 9 table 1 5005
In accordance with applicable
device specification
100%
100%
100%
100%
100%
Seal (4)
a) Fine
b) Gross
1014 100%
Qualification or quality (5)
conformance inspection test
sample selection
5005 In accordance with applicable
device specification
sample
External Visual 2009 100%
1) Test samples for group B, bond strength may be selected prior to or following internal visual, prior to sealing provided all other
specification requirements are satisfied. Test method 2010 applies in full except when method 5004, alt 1 or 2 is in effect.
2) This may be replaced with thermal shock method 1111, test condition A, minimum.
3) When specified in the applicable device specification, 100% of devices shall be tested for parameters requiring deltas.
4) Fine & Gross leak tests shall be performed separately or together between constant acceleration and external visual. All
device lots having any physical processing steps performed following seal shall be retested for hermeticity and visual defects.
5) Samples shall be selected for testing in accordance with the specific device class and lot requirement of method 5005.
14 DOC 2624 ISS 5
7. ESA/ESCC - Space Level Product
Semelab’s Space Quality Level Products are based on the testing procedures specified in
the generic ESCC 5000 issue 3 and in the corresponding Detail Specifications.
7.1 Chart F2 - Production Control (ESCC 5000 issue 3)
Component Lot manufacturing
Wafer lot Acceptance
para 5.3.1 Process monitoring Review
para 5.3.2 SEM Inspection (1,3)
para 5.3.3 Total Dose Rad Testing (1,4)
Special In - Process controls
Para 5.2.1 Internal Visual inspection (Pre-cap Inspection)
Para 5.2.1 Bond Strength(Pre-cap Inspection) (1)
Para 5.2.1 Die Shear(Pre-cap Inspection) (1)
Para 5.2.1 Encapsulation (Pre-cap Inspection) (1)
Para 5.2.1 Dimension check (1)
Para 5.2.3 Weight (2)
To Chart F3 (Screening)
Notes: 1) Performed on a sample basis.
2) Guaranteed but not tested.
3) If specified in the detail specification.
4) If specified in the detail specification and required in the Purchase Order.
15 DOC 2624 ISS 5
7.2 ESA/ESCC - Chart F3 Screening (ESCC 5000 issue 3)
Components from Production Control
para 8.5 High Temperature Stabilisation Bake
Electrical Test (11)
para 8.6.1 Temperature Cycling
Acceleration (10)
para 8.7 Particle Impact Noise Detection (PIND)
para 8.22 Verification of Safe Operating Area (2,3)
para 8.9.1 Electrical Measurements, Serialisation and Parameter
Drift Values (Initial Measurements) (1)
para 8.20 High Temperature Reverse Bias Burn-In (2)
para 8.9.1 Parameter Drift Values
HTRB Final and Power Burn-In Initial Measurements (4)
para 8.21 Power Burn-In (2)
para 8.9.1 Parameter Drift Values (Final Measurements) (4)
para 8.9.2 High and Low Temperature Electrical Measurements (4,5)
Hot Solder Dip (if applicable) (6)
para 8.3 Radiographic Inspection (9)
para 8.8.1&2 Seal (Fine & Gross Leak)
para 8.9.3 Room Temp Electrical Measurements (including AC) (4,7)
para 6.4.1 Check for Lot Failure (8)
para 8.10 External Visual Inspection
para 8.16 Solderability (4,5)
To Chart F4 (Validation Testing)
Notes:
1) All components shall be serialised prior to Initial Electrical Measurement.
2) If specified in detail spec.
3) Can be performed at any time prior to initial measurements of Parametric Drift values.
4) The Lot Failure criteria of paragraph 6.4 applies to this test.
5) Performed on a sample basis.
6) Can be performed at any time prior to Room Temp Electrical Measurements during screening (prior to Seal test).
7) Measurements of parametric Drift Values need not be repeated in Room Temperature Electrical measurements.
8) Check for Lot Failure shall take into account all electrical parameter failures that may occur during screening.
tests in accordance with paragraph 8.9.1, 8.9.2, 8.9.3 subsequent to HTRB Burn-In.
9) Radiographic Inspection may be performed at any point during Screening Tests.
10) Not specified in ESCC 5000 iss 3, but performed by Semelab to MIL-STD-750 method 2006.
11) Not specified in ESCC 5000 iss 3, but performed by Semelab as a process monitor.
16 DOC 2624 ISS 5
ESA/ESCC (Space Level Flow) (continued)
7.3 Chart F4 - Validation Testing (ESCC Generic Specification 5000 issue 3)
Co mpo nen ts for Validati on
LVT 1
(Subgroup 1)
Mechanical & Environmental
LVT 2
(Subgroup 2)
Endurance
LVT 3
(Subgroup 3)
Assembly Capability
15 Components 15 Components 15 Components 5 Comp on ents
Mechanical Shock
para 8.11 Thermal Shock (2)
para 8.14 Operating Life (4)
2000 hours
data points:
0,1000, 2000 hrs
para 8.19
Vibration
para 8.12 Temp Cycling (3)
para 8.6.2
Terminal Strength
para 8.18
Constant
Acceleration
para 8.13
Moisture
Resistance
para 8.15
Immediate & End
Point electrical
Measurements
para 8.9.4
Internal Visual
Inspection
para 8.1
Seal
para 8.8.1 & 8.8.2 Seal
para 8.8.1 & 8.8.2 Seal
para 8.8.1 & 8.8.2 Bond Strength
para 8.2.1
Immediate & End
Point electrical
Measurements
para 8.9.4
Immediate & End
Point electrical
Measurements
para 8.9.4
External Visual
Inspection
para 8.10
Die Shear
para 8.2.2
External Visual
Inspection
para 8.10
External Visual
Inspection
para 8.10
Permanence
of Marking
para 8.17
LVT 1 (Subgroup 1)
Lot Validation LVT 2 (Subgroup 2)
Lot Validation LVT 3 (Subgroup 3)
Lot Validation
Notes:
1) ESCC 5000 iss 3 table F4 - Qualification & Periodic Testing becomes ‘Validation Testing’ for non qualified parts.
2) Only applicable to axial diodes.
3) Not applicable to axial lead glass diodes.
4) Variance in Test method based on product type.
Ordering Information:
1) Order for Subgroup 1 (includes subgroups 2 & 3) requires order for 50 (30+15+5) destructive samples.
2) Order for Subgroup 2 (includes subgroup 3) requires order for 20 (15+5) destructive samples.
3) Order for Subgroup 3 requires order for 5 destructive samples.
4) Other Ordering Options are available - please contact Semelab Sales.
17 DOC 2624 ISS 5
8. SEMELAB IN-HOUSE processing options
In addition to the numerous qualifications held by SEMELAB, there are also other processing
options available. These are based on SEMELAB’s own in house specifications that have
been written around a range of existing generic specifications.
These specifications enable SEMELAB to supply products processed to the requirements of
original manufacturers’ data sheets and military or space specifications (ie BS, CV, CECC,
MIL-PRF-19500 all levels, ESA, 883B)
Before assembly of any qualified semiconductor product is started, it is essential that all the
materials used in the construction of the parts be of known and proven high quality. They
may be obtained from fully qualified and trusted suppliers - those with a long continuous and
successful supply history. Little used or untried or suspect materials are thoroughly checked
and qualified as being suitable for their intended application before assembly is allowed to
start.
All products processed in this way are released in accordance with the company’s Defence
Standard Approvals.
8.1 CECC Processed Devices
QR208: Conformance to the requirements of CECC 50000
QR209: Screening to the requirements of CECC 50000 App VI
QR208 and QR209 are based entirely on CECC 50000 quality conformance inspection
requirements and screening options.
By working to these specifications SEMELAB are able to supply full CECC “look alike”
products, but released under the company’s ISO9001/AQAP1 approval. Standard processing
is done in accordance with Group A (electrical) and Group B (environmental) tests to full
assessment level F. Group C tests and level E assessment levels are optional and are
available on customer request.
Part numbers for products processed to QR208 and QR209 have -QR added (and a letter
corresponding to the screening level if required). The marking for the device has the suffix ‘-
O’ added (and a letter corresponding to the screening level if screened).
Semelab are also able to process devices to existing CECC specifications where we have
not undergone an approval exercise. This is particularly useful when Semelab want to supply
products in a smaller volume that does not justify the cost of the full approval exercise.
Part numbers for parts processed to detailed specifications will have the suffix ‘-O’ added to
the original part number (and a letter corresponding to the screening level if required). The
marking for the device has the suffix ‘-O’ added (and a letter corresponding to the screening
level if screened).
18 DOC 2624 ISS 5
Ordering Information (when no CECC specification exists):-
Part Number Description Marking (*)
2N5153-QR QR208 gps A, B level F
Processed to CECC full assessment level F, Groups A, B
2N5153-O
2N5153-QR-B QR208 gps A, B level F + QR209 sequence B
Processed to CECC full assessment level F, Groups A, B
with screening in accordance with CECC 50000 App VI seq B
2N5153-O/B
2N5153-QR-EB QR208 gps A, B level E + QR209 sequence B
Processed to CECC full assessment level E, Groups A, B
with screening in accordance with CECC 50000 App VI seq B
2N5153-O/B
2N5153-QR-EBC QR208 gps A, B, C level E + QR209 sequence B
Processed to CECC full assessment level E, Groups A, B, C
with screening in accordance with CECC 50000 App VI seq B
2N5153-O/B
* Where space permits
8.2 BS and CV Processed Devices (Bipolar)
Semelab can also provide look alike devices against BS specifications. This can be carried
out against any of the BS detail device specifications, including those where the original
manufacturer has ceased production. Semelab can also supply old type CV devices which
have been converted into the BS system.
Product is processed to the requirements of Group A (electrical) and Group B (mechanical
and environmental) tests of BS detail device specifications. Parts processed in accordance
with these specifications are marked with the suffix ‘-O’ added to the original part number.
Screening can also be carried out against the BS sequences A,B,C,D if required
Ordering Information (exa mple):
Part Number Description Marking (*)
BFT69-O Requirements of BS9365-F005 Groups A & B BFT69-O
BFT69-O-B Requirements of BS9365-F005 Groups A & B
with screening in accordance with BS sequence B
BFT69-0/B
CV7xxx-0 Requirements of BS 9300 Cxxx Groups A,B CVxxx-O
* Where space permits
19 DOC 2624 ISS 5
8.3 MIL-PRF-19500 Processed Discrete Semiconductors
QR205: ‘Mil Processed’ Full Quality Conformance Inspection (MIL-PRF-19500)
QR204: ‘Mi l Processed’ Di sc re t e Com ponent Scr ee ni ng (MIL-PRF-19500 )
SEMELAB’s QR205 and QR204 processing specifications, in conjunction with the company’s
AQAP1 / ISO 9001 approval present a viable alternative to the American MIL approved parts
from a European manufacturer.
Semelab QR205 (quality conformance) is based on the quality conformance inspection
requirements of MIL-PRF-19500 groups A (table V), B (table VIb), C (table VII).
Semelab QR204 (screening options) is based on the screening options and requirements of
MIL-PRF-19500 (table IV).
Full details of Semelab QR205 and QR204 are included in the following pages, showing
sample sizes and test methods used.
All manufacture and processing is carried out on our approved High-Rel assembly line in our
Lutterworth factory and product is released under the company’s AQAP1 defence standard
approval.
The table below shows part number examples and corresponding processing options and
marking. The device marking will also contain the SEMELAB identifier (SML) plus the date
code where space permits.
Ordering Information: (examples)
Part Number Description Marking (*)
2N2369-JQR QR205 groups A,B 2N2369-JQR
2N2369-JQRB QR205 groups A,B
Screening to QR204 level B
2N2369-JQRB
2N2369-JQRA QR205 groups A,B
Screening to QR204 level A
2N2369-JQRA
2N2369-JQRS Space Level – see section 8.4 (QR216 & QR217)
QR217 groups A,B Screening to QR216
2N2369-JQRS
* Where space permits
20 DOC 2624 ISS 5
MIL-PRF-19500 processed Discrete Semiconductors (continued)
8.3.1 ‘Mil Processed’ Full Quality Conformance Inspection (ref: MIL-PRF-19500)
QR205: Group A - Electrica l Tests * small lot conformance
Subgroup Description LTPD Sample* Reject
1 Visual + mechanical Inspection 5 45 0
2 DC electrical tests at 25°C 5 45 0
3 DC electrical tests at maximum and minimum rated
operating temperature
30 8 0
4 AC electrical tests at 25°C 30 8 0
5 Safe Operating Area (Power Transistors)
a) DC
b) Clamped Inductive
c) Unclamped Inductive
Endpoint electrical measurements
30 8 0
The specified parameters to be included in each subgroup shall be as per the detail specification. Where no parameters have
been specified in a particular subgroup or test within a subgroup, no Group A testing is required for that subgroup or test to
satisfy Group A requirements. A single sample may be used for all subgroup testing. These tests are considered non-
destructive.
QR205: Group B - Short term Environmen tal & Endurance Tests * small lo t conformance
Test Note MIL-STD-750
method
Condition Sample* Reject
Subgroup 1
Solderability
Resistant to solvents
(1)
(3)
2026
1022
Separate samples can be used
for each test
4 leads
3 devices
1
Subgroup 2
Thermal shock
(temperature cycling)
hermetic seal
(a) Fine Leak
(b) Gross leak
Electrical Measurements
1051
1071
No dwell is required at 25°C. Test
condition C1 (25 cycles), temp
extreme, ≥10 mins
Test condition G or H.
Max leak =5x10-8 atm cc/s,
(5x10-7 atm cc/s for <0.3cc)
6
0
Subgroup 3
Steady-state operation life
or
Intermittent operation life
or
Blocking life
Electrical Measurements
(4)
1027
1037
-
340hrs at specified bias
conditions
As specified
12
0
Subgroup 4
Internal visual design
verification
(5)
2075
Visual criteria in accordance with
qualified design.
1
0
Subgroup 5
Thermal resistance
QA1023
As specified ref SEMELAB SPEC
6
0
Subgroup 6
High temperature life (non
operating)
Electrical Measurements
1032
340hrs high temperature storage
As specified
12
0
21 DOC 2624 ISS 5
MIL-PRF-19500 processed Discrete Semiconductors (continued)
QR205: Group C - Periodic Inspection (chargeable option on request) * small lot conformance
Test note MIL-STD-750
method Condition Sample * Reject
Subgroup 1
Physical dimensions
2066
Dimensions per case outline specified
6
0
Subgroup 2
Thermal shock
(glass strain)
Terminal strength
Hermetic seal
(a) Fine Leak
(b) Gross leak
Moisture resistance
Electrical Measurements
1056
2036
1071
1071
1021
Test condition A, except for devices
> 10W at T=25which is condition B
As specified
a) Test condition H. Max leak rate
=5x10-8 atm cc/s, (5x10-7 atm cc/s for
internal cavity <0.3cc)
b) Test condition C
Omit initial conditioning
As specified
6
0
Subgroup 3
Shock
Vibration
(variable frequency)
Constant acceleration
Electrical Measurements
(4)
2016
2056
2006
Non-operating, 1500G, 0.5ms,
5 blows in each orientation, X1, Y1, Z1
I minute min. in each orientation, X1, Y1,
Z1 at 20000G min except at 10000G
min if device ≥15W at TC=25°C
As specified
6
0
Subgroup 4
Salt atmosphere
(corrosion)
(1)
1041
6
0
Subgroup 5
Thermal Resistance
3131
3161
3101,4081
As specified:
Bipolar transistors
MOSFETS
Diodes
6
0
Subgroup 6
Steady-state operation
life or
Intermittent operation life
or
Blocking life
Electrical Measurements
1026
1036
1000hrs at max operating junction temp
As specified
12
0
1) Electrical reject devices from the same inspection lot may be used for all subgroups when electrical end point
measurements are not required.
2) Post burn-in electrical rejects may be used.
3) The LTPD for solderability test applies to the number of leads inspected except in no case shall less than three devices be
used to provide the number of leads required.
4) If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the
340 hour life test may be continued to 1000 hours in order to satisfy the Group C life test requirements. In such cases, either
the 340 hour end point measurements must be made as a basis for Group B lot acceptance or the 1000 hour end point
measurement shall be used as the basis for both Group B and Group C acceptance.
5) Subgroup 4 may be omitted if the devices have been manufactured by Semelab as sample pre-cap visual inspection will
have been performed.
22 DOC 2624 ISS 5
MIL-PRF-19500 processed Discrete Semiconductors (continued)
8.3.2 ‘Mil Processed’ Discrete Component Screening (ref: MIL-PRF-19500)
QR204: Discrete Component Screening (with reference to MIL-STD-750)
Description MIL-STD-750
method Conditions JQR-A JQR-B
1 Internal Visual
(Precap) Inspection
2069 2070
2072 100% n/a
2 High temperature
stabilisation bake 1032 24 hrs min at rated maximum storage
temperature 100% 100%
3 Temperature Cycling 1051
20 cycles at -55°C to +175°C or max
storage temp (whichever is lower) with
minimum 10 minutes dwell time
100% 100%
4 Constant
acceleration 2006 20,000G force in Y1axis for 1 min
duration (see note 2) 100% 100%
5 Particle Impact Noise
Detection (PIND) 2052
6
Hermeticity
a) Fine
b) Gross
1071
1071
Test condition H. Max leak rate =5x10-
8 atm cc/s, (5x10-7 atm cc/s for internal
cavity <0.3cc)
Condition C
100%
100%
100%
100%
7 Device Serialisation
8 Interim electrical 100% 100%
10
High temperature
reverse bias
a) Bipolar
b) Power MOSFET
c) Diodes
1039
1042
1038
Test Condition A
Test Condition B
Test Condition A
100%
100%
11 Interim electrical Group A (read & record) 100% 100%
12
Power burn-in
a) Bipolar
b) Power MOSFET
c) Diodes
d) Case mounted
Rectifiers
1039
1042
1038
1038
Test Condition B - 160 hrs min
Test Condition A - 160 hrs min
Test Condition B - 96 hrs min
Test Condition A – 48 hrs min
100%
100%
13 Final electrical
Group A
Read & Record +Drift check (1)
100% 100%
14
Radiographic tests
(X-Ray)
2076
Notes:
1) Group A end point tests are DC functional / parametric at 25°C (subgroup 2) of QR205.
2) 10000G force for devices with power rating >10 watts at Tc=25°C.
3) PDA (percentage defects allowable) is 10% between steps 9 & 11 and 11& 13.
23 DOC 2624 ISS 5
8.4 ‘Space Level Processed’ Discrete Semiconductors.
QR217: ‘Space Level’ Full Quality Conformance Inspection.
QR216: ‘Space Level’ Discrete Component Screening
SEMELAB’s QR217 and QR216 processing specifications, in conjunction with the company’s
AQAP1 / ISO 9001 approval present a viable alternative to American MIL-PRF-19500 space
level parts supplied from a European manufacturer and ESA / ESCC 5000 space level parts.
QR217 (quality conformance) is based on the quality conformance inspection requirements
of MIL-PRF-19500 groups A (table V), B (table VIa), C (table VII) and ESA / ESCC 5000
(chart F4) lot validation tests.
QR216 (screening) is based on the screening requirements of MIL-PRF-19500 (table IV) and
ESA /ESCC 5000 (chart F3)
Details of QR217 and QR216 are included in the following pages.
All manufacture and processing is carried out on our approved High-Rel assembly line in our
Lutterworth factory and product is released under our AQAP1 defence standard approval.
The ‘standard’ JQRS part is processed to the Semelab data sheet, screened to QR216 and
has conformance testing to Q217 groups A and B. Additional options are available as shown
below. These are chargeable and must be specified at order stage. The extensions on the
Semelab part numbers used reflect these additional items.
Additional options available:
1) Customer Pre-Cap visual Inspection (suffix P)
2) Data Pack supplied (suffix D)
3) Group C tests (suffix C)
Ordering Info rm at ion: (examples)
Part Number Description Marking (*)
2N2369-JQRS QR217 groups A,B Screening to QR216 2N2369-JQRS
2N2369-JQRS-C QR217 groups A,B and group C. Screening to QR216 2N2369-JQRS
2N2369-JQRS-CD QR217 groups A,B and group C. Screening to QR216
with Data Pack
2N2369-JQRS
2N2369-JQRS-PCD QR217 groups A,B and group C. Screening to QR216
with Customer Pre-cap Visual Inspection & Data Pack
2N2369-JQRS
* Where space permits
Notes:
1) ‘Additional Options’ (Customer Pre-Cap Visual Inspection, Group C’s, Datapack) are chargeable
and must be specified at order stage.
2) ‘Additional Options’ are reflected in the Semelab Part Number, but do not affect device marking.
24 DOC 2624 ISS 5
‘Space Level Processed’ Discrete Semiconductors (continued)
8.4.1 QR217 ‘Space Level’ Full Quality Conformance Inspection.
QR217: Group A - Electrica l Tests * small lot conformance
Subgroup Description Sample* Reject
1 Visual + mechanical Inspection 20 0
2 DC electrical tests at 25°C 20 0
3 DC electrical tests at maximum and minimum rated
operating temperature
8 0
4 AC electrical tests at 25°C 8 0
5 Safe Operating Area (Power Transistors)
Endpoint electrical measurements
8 0
The specified parameters to be included in each subgroup shall be as per the Semelab Data Sheet. Where no parameters have
been specified in a particular subgroup or test within a subgroup, no Group A testing is required for that subgroup or test to
satisfy Group A requirements. A single sample may be used for all subgroup testing. These tests are considered non-
destructive.
QR217: Group B - Short term Environmen tal & Endurance Tests * small lo t conformance
Test note MIL-STD-750
method
Condition Sample* Reject
Subgroup 1
Physical Dimensions
2066
As per specification
8
0
Subgroup 2
Solderability
Resistant to solvents
(3)
(3)
2026
1022
Separate samples can be used for
each test
6 devices
0
Subgroup 3
Thermal shock
(temperature cycling)
hermetic seal
(a) Fine Leak
(b) Gross leak
Electrical Measurements
1051
1071
No dwell is required at 25°C. Test
condition C1 (25 cycles), temp
extreme, ≥10 mins
(100 cycles covered by MIL883
group D programme)
Test condition G or H. Max
leak =5x10-8 atm cc/s,
(5x10-7 atm cc/s for <0.3cc)
6
0
Subgroup 4
Steady-state operation life
or
Intermittent operation life
or
Blocking life
Electrical Measurements
(4)
1027
1037
-
340hrs at specified bias conditions
As specified
12
0
Internal visual design
verification
2075
Visual criteria in accordance with
qualified design.
5
0
bond strength 2037 11 wires 0
Subgroup 5
Thermal resistance
QA1023
As specified - SEMELAB SPEC
6
0
Subgroup 6
High temperature life (non
operating)
Electrical Measurements
1032
340hrs high temperature storage
As specified
12
0
See notes at bottom of group C table.
25 DOC 2624 ISS 5
‘Space Level Processed’ Discrete Semiconductors (continued)
QR217: Group C - Periodic Inspection (chargeable option on request ) * small lot conformance
Test note MIL-STD-750
method Condition Sample * Reject
Subgroup 1
Physical dimensions
2066
Dimensions per case outline specified
6
0
Subgroup 2 & 3
Thermal shock
(glass strain)
Shock
Vibration
(variable frequency)
Constant acceleration
Hermetic seal
(a) Fine Leak
(b) Gross leak
Moisture resistance
Terminal strength
Electrical Measurements
1056
2016
2056
2006
1071
1071
1021
Test condition A, except for devices
> 10W at T=25 which is condition B
Non-operating, 1500G, 0.5ms,
5 blows in each orientation, X1, Y1, Z1
1 minute min. in each orientation Y1 at
20000G min except at 10000G min if
device ≥15W at TC=25°C
a) Test condition H. Max leak rate
=5x10-8 atm cc/s, (5x10-7 atm cc/s for
internal cavity <0.3cc)
b) Test condition C
Omit initial conditioning
As specified
As specified
6
0
Subgroup 4
Salt atmosphere
(corrosion)
(2)
1041
Covered by MIL883 ongoing
group D programme
6
0
Subgroup 5
Thermal Resistance
3131
3161
3101,4081
As specified:
Bipolar transistors
MOSFETS
Diodes
6
0
Subgroup 6
Steady-state op lifen life
or
Intermittent operation life
or
Blocking life
Electrical Measurements
(4)
1026
1036
1000hrs at max operating junction temp
As specified
12
0
Subgroup 7
Internal Water Vapour
(2)
Covered by MIL883B ongoing
Group D programme
3
0
1) Individual subgroups may be performed on representative parts from the same package family.
2) Electrical reject devices from the same inspection lot may be used for all subgroups when electrical end point
measurements are not required.
3) Post burn-in electrical rejects may be used.
4) If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements,
the 340 hour life test may be continued to 1000 hours in order to satisfy the Group C life test requirements. In such
cases, either the 340 hour end point measurements must be made as a basis for Group B lot acceptance or the 1000
hour end point measurement shall be used as the basis for both Group B and Group C acceptance.
26 DOC 2624 ISS 5
‘Space Level Processed’ Discrete Semiconductors (continued)
8.4.2 QR216: ‘Space Level’ Discrete Component Screening
QR216: Discrete Component Screening (with reference to MIL-STD-750)
Description MIL-STD-750
method Conditions JQR-S
1 Internal Visual (Pre-cap)
Inspection
2069, 2070
2072 100%
2 Customer Pre Cap Visual
Inspection
2069, 2070
2072 Customer specified option (chargeable) 100%
3 High temperature
stabilisation bake 1032 24 hrs min at rated maximum storage temperature 100%
4 Temperature Cycling 1051
20 cycles at -55°C to +175°C or max storage temp
(whichever is lower) with minimum 10 minutes dwell
time
100%
5 Constant acceleration 2006 20,000G force in Y1axis for 1 min duration (see note
2) 100%
6 Particle Impact Noise
Detection (PIND) 2052 (full yielded quantity) 100%
7 Device Serialisation
8 Interim electrical Read & Record 100%
9
High temperature reverse
bias
a) Bipolar
b) Power MOSFET
c) Diodes
1039
1042
1038
Test Condition A
Test Condition B
Test Condition A
100%
10 Interim electrical (note 3) Read & Record, Drift Check 100%
11
Power burn-in
a) Bipolar
b) Power MOSFET
c) Diodes
1039
1042
1038
Test Condition B - 240 hrs min
Test Condition A - 240 hrs min
Test Condition B - 240 hrs min
100%
12 Final electricals (note 3) Read & Record, Drift check (1) 100%
13
a) Hermeticity - Fine
b) Hermeticity - Gross
1071
1071
Test condition H. Max leak rate =5x10-8 atm cc/s,
(5x10-7 atm cc/s for internal cavity <0.3cc)
Condition C
100%
100%
14 Radiographic tests (X-Ray) 2076 (May be performed at any time after serialization) 100%
15 External Visual Inspection 2071
Notes:
1) Group A end point tests are DC functional / parametric at 25°C (subgroup 2) of QR217.
2) 10000G force for devices with power rating >10 watts at Tc=25°C.
3) PDA (percentage defects allowable) is 10% between steps 8 & 10 and 10 & 12.
27 DOC 2624 ISS 5
‘Space Level Processed’ Discrete Semiconductors (continued)
8.4.3 Comparison of Space Level die lot approval procedures.
The table below shows a comparison of operations carried out for die approval within the
generic approval systems (MIL-PRF-19500 space level and ESA / ESCC 5000. It must be
noted that SEM and RHA total dose evaluation are options only available within MIL-PRF-
19500 and ESA / ESCC 5000. SEM and RHA total dose evaluation are not available within
the Semelab JQR-S processing options. If SEM and/or RHA total dose evaluation are
required then the ESE / ESCC 5000 procedures must be followed – see section 7 – ESA /
ESCC Space level products.
Space Level/ Die Lot Acceptance Table
GENERIC SML
Die Lot Acceptance ESCC JANS JQR-S
Selected Wafer • • •
Probe Test (100%) • • •
Glassivation / Metalisation Inspection • • •
Visual Inspection (100%) • • •
Sample Assembly (10 pcs) • • •
Stabilization • • •
Temperature Cycling • • •
Electrical Test (read/record) • • •
HTRB • • •
Electrical Test (read/record) • • •
Steady State Life (1000 hrs) • • •
Electrical Test (read/record) • • •
Wire Bond Evaluation • • •
Die Shear Evaluation • • •
SEM OPT OPT -
RHA Total Dose Evaluation OPT OPT -
Die Lot Acceptance Table
28 DOC 2624 ISS 5
8.5 ‘MIL883B Processed’ Integrated Circuits
QR215: ‘MIL Processed /883B’ Full Quality Conformance Inspection for
Linear Integrated Circuits A and B, C and D optional)
QR214: ‘MIL Processed /883B’ Linear Integrated Circuit Component Screening
Semelab’s QR214 and QR215 are based on MIL-STD-883E, METHOD 5005 quality
conformance, inspection requirements and METHOD 5004 screening methods.
Semelab QR215 (quality conformance) covers the control procedures for group A (electrical),
group B (environmental), group C (die related) and group D (package related) tests. It is
based on METHOD 5005 conformance procedures and MIL-STD-883E test methods
Semelab QR214 (screening) is based on METHOD 5004 screening procedures and
MIL-STD-883E test methods.
Ordering Information:
Devices screened in accordance with Semelab QR214 and QR215 are identified using the
standard product part number with the addition of the suffix “–8QRB”.
Example: LM117H built and screened to the MIL883B flows Method 5005 and Method 5004
in accordance with QR214 and QR215 is: LM117H-8QRB
Device Marking:-
xxx-8QRB for products equivalent to MIL883B parts - e.g. LM117H-8QRB + SML + DC
8.6 Customer Specifications
SEMELAB is also able to offer release on all parts manufactured in accordance with customers
own ‘in-house’ or national specifications. Both lot acceptance and screening options can be
met. Manufacturing is carried out to many customers’ special requirements for the UK, Europe,
USA and elsewhere.
Ordering Information:-
Customer part number and specification
8.7 Data Sheets
Many products can be processed in accordance with the original manufacturer’s data sheets
(JEDEC or PRO-ELETRON registered). Product can be supplied with fully traceable Certificate
of Conformity under SEMELAB’s company AQAP1 / ISO 9001 approval. This can be also be
done in cases where the original supplier has ceased production.
Ordering Information:-
2N5000 with AQAP1 / ISO 9001 release ordered as follows: 2N5000.MOD
29 DOC 2624 ISS 5
9. Comparison of Screening Options (Discrete Devices)
9.1 Comparison of High-Rel Screening Options (Discrete Devices)
The table below shows the comparison of screening options available within the CECC, BS
and MIL approvals. Comparison is also shown with Semelab’s in-house QR204 options.
• Test Performed
± Test Performed if required by device detail specification
{ 24 hours for PNP devices. 48 hours for NPN devices
∗ High Temp Reverse Bias for Case rated devices
Power Burn-in for Ambient rated Devices
CECC / QR209 : Screening carried out in accordance with CECC 50000 Appendix 6
BS : Screening carried out in accordance with BS9300 section 1.2.10
QR216 : Screening carried out in accordance with Semelab QR216
QR204 : Screening carried out in accordance with Semelab QR204
MIL : Screening carried out in accordance with MIL-PRF-19500 (Table 2)
* full JANTX, JANTXV not available from Semelab
CECC / QR209 BS 9300 QR204 MIL
A B C D A B C D
JQRA
JQRB
JAN*
TXV
JAN*
TX
Pre-cap Visual •
• • • •
High Temp Storage • • • • • • • • • •
Temperature Cycle 5
cycles
5
cycles
5
cycles 10
cycles
10
cycles
10
cycles 20
cycles
20
cycles
20
cycles
20
cycles
Constant Acceleration • • • • • • • • • •
Particle impact noise
detection (PIND)
Fine Leak test • • • • • • • • • •
Gross Leak Test • • • • • • • • • •
Device Serialisation
Variables Electrical test • •
± ± ± ±
Attributes Electrical tests • • • • • • • • •
Burn-In (HTRB) 168
hrs∗
72
hrs∗ 48
hrs∗
160
hrs∗
72
hrs∗
48
hrs∗
48
hrs∗ { { { {
Variables Electrical test
± ± ± ±
Attributes Electrical tests
• • • •
Burn-In (Power) 168
hrs∗
72
hrs∗
48
hrs∗
160
hrs∗
72
hrs∗
48
hrs∗
48
hrs∗
160
hrs
160
hrs
160
hrs
160
hrs
Variables Electrical test •
•
± ± ± ±
Attributes Electrical tests • • • • • • • • • •
Radiographic tests •
30 DOC 2624 ISS 5
Comparison of Screening Options (Discrete Devices) (continued)
9.2 Comparison of Space Level Screening Options
Space Level Flow Comparison Table GENERIC QR216
Screening ESCC JANS* JQRS
Pre-cap Visual • • •
Customer pre-cap Visual OPT OPT OPT
High Temp Storage (Stabilization Bake) 24 hrs 24 hrs 24hrs
Temperature cycling 20 cycles 20 cycles 20 cycles
Thermal impedance OPT { -
Constant Acceleration ■ • •
PIND • • •
Fine/Gross Leak • • •
Serialization • • •
Interim Electrical Measurements - - -
Interim Electrical Measurements (Read and Record / Drift) • • •
HTRB • • •
Electrical Measurements - - -
Parametric Drift measurements (Read and Record / Drift) • • •
Burn-In
min 168 hrs
max 264
hrs 240 hrs 240hrs
Electrical Measurements - - -
Parameter Drift Measurements (Read and Record) • • •
PDA Calculations • • •
Read and Record Test Data • • •
Other Electrical Parameters (Temp, Dynamic) • • •
Fine/Gross Leak • • •
Radiography • • •
External Visual Inspection • • •
*JANS part not available from Semelab.
Notes: { if specified in detail specification.
■ not specified in ESCC 5000 iss 3, but performed by Semelab.
Fet Devices
Homepage Divisions Technologies Search Tools Resources Corporate
Part number search for devices
beginning "IRF130SMD05DSG" Semelab Home Datasheets are downloaded
as Acrobat PDF files.
PRODUCT Status
Screening
options
available Polarity Package
VDSS
(V)
ID(cont)
(A)
PD
(W)
RDSS
(Ω)
CISS
(pF)
QG
(nC)
IRF130SMD05DSG N-Channel SMD0.5 (TO276AA) 100V 14A 75W 0.18Ω650pF 35nC
SCREENING OPTIONS AVAILABILITY
(including CECC, MIL-PRF-19500, BS)
symbol indicates that screening options are available for this device.
For device-specific screening options and order information, click the relevant symbol.
For more information on Screening options, visit the Screening Homepage.
Top of Page If you are unable to find a suitable part, please contact us.
Pa
g
e 1 of 1Part number search for devices be
g
innin
g
"IRF130SMD05DSG"
30-Oct-2006mhtml:file://\\
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aruda\AUTOMATION\AUTOMATION
_
CPR\10192006\SEME\IRF130...
Fet Devices
Homepage Divisions Technologies Search Tools Resources Corporate
Part number search for devices
beginning "IRF130SMD05" Semelab Home Datasheets are downloaded
as Acrobat PDF files.
PRODUCT Status
Screening
options
available Polarity Package
VDSS
(V)
ID(cont)
(A)
PD
(W)
RDSS
(Ω)
CISS
(pF)
QG
(nC)
IRF130SMD05 N-Channel SMD0.5 (TO276AA) 100V 14A 75W 0.18Ω650pF 35nC
IRF130SMD05DSG N-Channel SMD0.5 (TO276AA) 100V 14A 75W 0.18Ω650pF 35nC
SCREENING OPTIONS AVAILABILITY
(including CECC, MIL-PRF-19500, BS)
symbol indicates that screening options are available for this device.
For device-specific screening options and order information, click the relevant symbol.
For more information on Screening options, visit the Screening Homepage.
Top of Page If you are unable to find a suitable part, please contact us.
Pa
g
e 1 of 1Part number search for devices be
g
innin
g
"IRF130SMD05"
30-Oct-2006file://\\
g
aruda\AUTOMATION\AUTOMATION
_
CPR\10192006\SEME\IRF130SMD0...
