YAMAICHI ELECTRONICS - Munich 089 / 45109-0
SPECIFICA TIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
QuadFlatPackage(QFP)IC200toIC248 -Open Top
IC Dimensions
E
F
(max) (max)
C
D
A
B
1)Insulation Resistance: 1,000M min. at 100V DC
Ω
13.2 13.210.0 10.0 12.1 12.1
12.0 12.010.0 10.0 11.5 11.5
12.0 12.010.0 10.0 11.5 11.5
17.9 23.914.0 20.0 17.4 23.4
18.8 23.613.2 18.0 18.3 23.1
13.6 13.612.0 12.0 13.15 13.15
14.0 14.012.0 12.0 13.5 13.5
17.9 23.914.0 20.0 17.4 23.4
17.2 17.214.0 14.0 16.7 16.7
17.2 23.214.0 20.0 16.7 22.7
19.2 25.214.0 20.0 18.7 24.7
16.0 16.014.0 14.0 15.5 15.5
17.9 23.914.0 20.0 17.4 23.4
17.2 23.214.0 20.0 16.7 22.7
16.0 22.014.0 20.0 15.55 21.55
16.0 16.014.0 14.0 15.5 15.5
Part Number
Body
Width
Pitch
(mm)
Pin
Count
44 10 x 100.8
64 10 x 100.5
64 10 x 100.5
64 14 x 201.0
72 13.2 x 180.8
80 12 x 120.5
80 12 x 120.5
80 14 x 200.8
80 14 x 14
0.65
80 14 x 200.8
80 14 x 200.8
100 14 x 14
0.5
100 14 x 200.65
100 14 x 200.65
100 14 x 200.65
100 14 x 14
0.5
IC201-0644-003 *
IC201-0644-019 *-*
IC218-0724-001 *-*
IC201-0804-014 *-*
IC201-0804-005 *-*
IC201-0804-012 *-*
IC201-0804-032 *
IC218-0804-002 *-*
IC201-1004-008 *-*
IC201-1004-016 *-*
IC201-1004-028 *
IC201-1004-050 *
IC216-1004-001 *-*
IC248-0444-001 *
1)
1)
1)
IC201-0644-040 *
IC201-0804-020 *-*
DWV = Dielectric Withstanding Voltage
Socket Dimensions
DWV
(Volt A C )
G
H
J
27.0 27.0 14.9 700
30.0 36.0 17.5 500
28.7 28.7 17.5 100
32.9 38.9 16.5 700
31.8 36.6 15.5 700
29.0 29.0 16.5 100
29.0 29.0 16.5 500
32.9 38.9 16.5 700
32.2 32.2 16.5 700
32.2 38.2 16.5 700
32.2 38.2 15.5 700
31.0 31.0 16.5 500
32.9 38.9 16.5 700
32.2 38.2 16.5 700
31.0 37.0 16.0 500
34.2 34.2 15.8 500
**ProtectionKey:PreventsICfromreleasingduringtransportation
Housing:
Contacts:
Plating:
➭
➭
➭
Open top type sockets for QFP packages
Lever operation ensu res low actuation force and high durability
Uniq u e c o n ta ct d e s ig n e n su re s o u tsta n d in g c o n tac t re lia b ility a n d in c re a se d d e n s ity o n b u r n -in b o ard s
Polyeth e rimide (PEI), glass -fille d o r
Polyp h e n y le n e s u lfid e (P P S), glass-filled
Beryllium Copper (B eCu)
Gold o v e r Nickel
PartNumber(Details)Specifications
Features
SeriesNo.
Numberof Sides
withContacts
No.ofContactPins
DesignNumber
PositioningPin
N=WithoutPositioningPin
P =WithPositioningPin
Protection Key**
K= WithProtection Key
Unmarked= Without ProtectionKey
IC200 064 0194**
---
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Contact Force:
100V AC for 1 minute or
500V AC for 1 minute or
700V AC for 1 minute*
20g min. per pin at minimum
displacement of 0.3mm
80g max. per pin at maximum
displacement of 0.7mm
1,000M min. at 500V DC or
1,000M min. at 100V DC*
Ω
Ω
Materials and Finish
30m max. at 10mA/20mV max.
–40°C to +170°C
Ω
*belowseetable
Outline IC Dim e n s io n s Outline Socke t Dimensions
D
B
F (max.)
E (max.)
AC
H
G
J
Ap p lic a b le S o c k e t a n d IC Dimensions (Reference Only)