1
®
FN6622.0
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) and XDCP are registered trademarks of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL22316WMUEP
Single Digitally Controlled Potentiometer (XDCP™)
Low Noise, Low Power I2C® Bus, 128 T aps
The ISL22316WMUEP integrates a single digitally controlled
potentiometer (DCP) and non-volatile memory on a
monolithic CMOS integrated circuit.
The digitally controlled potentiometer is imple mented with a
combination of resistor elements and CMOS switches. The
position of the wipers are controlled by the user through the
I2C bus interface. The potentiometer has an associated
volatile Wiper Register (WR) and a non-volatile Initial Value
Register (IVR) that can be directly written to and read by the
user. The contents of the WR controls the position of the
wiper. At power-up, the device recalls the contents of the
DCP’s IVR to the WR.
The DCP can be used as a three-terminal potentiometer or
as a two-terminal variable resistor in a wide vari ety of
applications including control , parameter adjustments and
signal processing.
Device Information
The specifications for an Enhanced Product (EP) device are
defined in a Vendor Item Drawing (VID), which is controlled
by the Defense Supply Center in Columbus (DSCC).
“Hot-links” to the applicable VID and other supporting
application information are provided on our website.
Features
Specifications per DSCC VID V62/08603-01XB
Full Mil-Temp Electrical Performance from -55°C to +125°C
Controlled Baseline with One Wafer Fabrication Site and
One Assembly/Test Site
Full Homogeneous Lot Processing in Wafer Fab
No Combination of Wafer Fabrication Lots in Assembly
Full Traceability Through Assembly and Test by
Date/Trace Code Assignment
Enhanced Process Change Notificatio n
Enhanced Obsolescence Management
Eliminates Need for Up-Screening a COTS Component
128 Resistor Taps
•I
2C Serial Interface
- Two Address Pins, Up To Four Devices/Bus
Non-volatile S torage of Wiper Position
Wiper Resistance: 70Ω Typical @ 3.3V
Shutdown Mode
Shutdown Current 5µA Max
Power Supply: 2.7V to 5.5V
•10kΩ Total Resistance
High Reliability
- Endurance: 1,000,00 0 Data Changes Per Bit Per
Register
- Register Data Retention:
- 10 years @ T +125°C
- 15 years @ T +90°C
- 50 years @ T +55°C
•10 Ld MSOP
Pinout ISL22316WMUEP
(10 LD MSOP)
TOP VIEW
1
2
3
4
56
10
9
8
7
SDA
SHDN
A0
A1
VCC
SCL
GND
RL
RW
RH
Ordering Information
VENDOR PART NUMBER
(Notes 1, 2) VENDOR ITEM DRAWING PART MARKING RESISTANCE OPTION
(kΩ)TEMP.
RANGE (°C) PACKAGE PKG.
DWG. #
ISL22316WMUEP V62/08603-01XB 2316M 10 -55 to +125 10 Ld MSOP M10.118
NOTES:
1. Add “-TK” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. Devices must be procured to the VENDOR PART NUMBER.
Data Sheet December 17, 2007
2FN6622.0
December 17, 2007
Block Diagram
I2C
INTERFACE
VCC
RH
GND
RL
RW
SCL
SDA
A0
A1
POWER-UP
INTERFACE,
CONTROL
AND
STATUS
LOGIC
NON-VOLATILE
REGISTERS
WR
SHDN
Pin Descriptions
MSOP PIN SYMBOL DESCRIPTION
1 SCL Open drain I2C interface clock input
2 SDA Open drain Serial data I/O for the I2C interface
3 A1 Device address input for the I2C interface
4 A0 Device address input for the I2C interface
5SHDNShutdown active low input
6 GND Device ground pin
7R
L“Low” terminal of DCP
8R
W“Wiper” terminal of DCP
9R
H“High” terminal of DCP
10 VCC Power supply pin
ISL22316WMUEP
3
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent right s of Int ersi l or it s sub sidi aries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6622.0
December 17, 2007
ISL22316WMUEP
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums and to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
L
0.25
(0.010)
L1
R1
R
4X θ
4X θ
GAUGE
PLANE
SEATING
PLANE
EE1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008) ABC
SEATING
PLANE
0.20 (0.008) C
0.10 (0.004) C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008) CD
E1
C
L
C
a
- H -
-A - - B -
- H -
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.037 0.043 0.94 1.10 -
A1 0.002 0.006 0.05 0.15 -
A2 0.030 0.037 0.75 0.95 -
b 0.007 0.011 0.18 0.27 9
c 0.004 0.008 0.09 0.20 -
D 0.116 0.120 2.95 3.05 3
E1 0.116 0.120 2.95 3.05 4
e 0.020 BSC 0.50 BSC -
E 0.187 0.199 4.75 5.05 -
L 0.016 0.028 0.40 0.70 6
L1 0.037 REF 0.95 REF -
N10 107
R 0.003 - 0.07 - -
R1 0.003 - 0.07 - -
5o15o5o15o-
α0o6o0o6o-
Rev. 0 12/02
θ