1
HV300/HV310
08/26/02
Supertex Inc. does not recommend the use of its products in life support applications and will not knowingly sell its products for use in such applications unless it receives an adequate "products liability
indemnification insurance agreement." Supertex does not assume responsibility for use of devices described and limits its liability to the replacement of devices determined to be defective due to
workmanship. No responsibility is assumed for possible omissions or inaccuracies. Circuitry and specifications are subject to change without notice. For the latest product specifications, refer to the
Supertex website: http://www.supertex.com. For complete liability information on all Supertex products, refer to the most current databook or to the Legal/Disclaimer page on the Supertex website.
HV300
HV310
Applications
Central Office Switching
Servers
POTS Line Cards
ISDN Line Cards
xDSL Line Cards
PBX Systems
Powered Ethernet for VoIP
Distributed Power Systems
Negative Power Supply Control
Antenna and Fixed Wireless Systems
General Description
The Supertex HV300 (and HV310),
Hotswap Controller, Negative
Supply
control power supply connection during insertion of
cards or modules into live backplanes. They may be used in
traditional ‘negative 48V’ powered systems or for higher voltage
busses up to negative 90V.
Operation during the initial power up prevents turn-on glitches,
and after complete charging of load capacitors (typically found
in filters at the input of DC-DC converters) the HV300 (and
HV310) issues a power good signal. This signal is typically
used to enable the DC-DC converter.
The only difference between the HV300 and the HV310 is the
polarity of the PWRGD signal line to accommodate different
DC-DC converter models. Once PWRGD signal has been
established the device sleeps in a low power state, important
for large systems with many individual hotswap cards or
modules.
An external power MOSFET is required as the pass element,
plus a ramp capacitor, and resistors to establish current limiting
and over and under voltage lockouts. There is no need for
additional external snubber components.
Features are programmable over voltage and under voltage
detection of the input voltage which locks out the load connection
if the bus (input) voltage is out of range. An internal voltage
regulator creates a stable reference, and maintains accurate
gate drive voltage. The unique control loop scheme provides
full current control and limiting during start up.
Theory of Operation
Initially the external N-channel MOSFET is held off by the gate
signal, preventing an input glitch. After a delay (while internal
circuits are activated) the inrush current to the load is limited by
the gate control output. The current may ramp up and limit at
a maximum value programmed by an external resistor. Initial
time delay, to allow for contact bounce, and charging operation
is determined by the single external ramp capacitor connected
to the RAMP pin. When the load capacitor is fully charged, the
controller emerges from current limit mode, an additional time
delay occurs before the external N-channel MOSFET pass
transistor is switched to full conduction, and the PWRGD
output signal is activated. The controller will then transition to
a low power standby mode.
The HV300LG PWRGD is active high (open drain), while the
HV310LG PWRGD is active low (VEE).
Ordering Information
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Features
HV300, PWRGD=Active HIGH
HV310, PWRGD=Active LOW
-10V to -90V Input Voltage Range
Few External Components
0.33mA Typical Standby Supply Current
Programmable Over/Under Voltage Limits with
Hysteresis
Programmable Current Limit
Active control during all phases of start-up
Programmable timing
8 Lead SOIC
Hotswap, Inrush Current Limiter Controllers
(Negative Supply Rail)
Not RecommendedNot Recommended
For New Designs! For New Designs!
HV300/HV310
2
Electrical Characteristics (VIN=-10V to -90V, -40°C TA +85°C unless otherwise noted)
Symbol Parameters Min Typ Max Unit Conditions
Supply (Referenced to VDD pin)
VEE Supply Voltage -90 -10 V
IEE Supply Current 550 650 µAV
EE = -48V, Mode = Limiting
IEE Standby Mode Supply Current 330 400 µAV
EE = -48V, Mode = Standby
OV and UV Control (Referenced to VEE pin)
VUVH UV High Threshold 1.26 V Low to High Transition
VUVL UV Low Threshold 1.16 V High to Low Transition
VUVHY UV Hysteresis 100 mV
IUV UV Input Current 1.0 nA VUV = VEE + 1.9V
VOVH OV High Threshold 1.26 V Low to High Transition
VOVL OV Low Threshold 1.16 V High to Low Transition
VOVHY OV Hysteresis 100 mV
IOV OV Input Current 1.0 nA VOV = VEE + 0.5V
Current Limit (Referenced to VEE pin)
VSENSE Current Limit Threshold Voltage 40 50 60 mV VUV = VEE + 1.9V,
VOV = VEE + 0.5V
Gate Drive Output (Referenced to VEE pin)
VGATE Maximum Gate Drive Voltage 9.0 10 11 V VUV = VEE + 1.9V,
VOV = VEE + 0.5V
IGATEUP Gate Drive Pull-Up Current 500 µAV
UV = VEE + 1.9V,
VOV = VEE + 0.5V,
IGATEDOWN Gate Drive Pull-Down Current 40 mA VUV = VEE, VOV = VEE + 0.5V
Power Good Output (Referenced to VEE pin)
VPWRGD Power Good Pin Breakdown Voltage 90 V
VPWRGD Power Good Pin Output Low Voltage 0.5 0.8 V IPWRGD = 1mA
Dynamic Characterstics
tGATEHLOV OV Delay 500 ns
tGATEHLUV UV Delay 500 ns
Note 1: This timing depends on the threshold voltage of the external N-Channel MOSFET. The higher its threshold is, the longer this timing.
Note 2: This voltage depends on the characteristics of the external N-Channel MOSFET. VGS(th) = 3V for an IRF530.
*IRF530 is a registered trademark of International Rectifier.
Timing Control – Test Conditions: C =100µF, CRAMP=10nF, VUV = VEE+1.9V, VOV= VEE+0.5V, External MOSFET is IRF530*
IRAMP Ramp Pin Output Current 10 µAV
SENSE = 0V
tPOR Time from UV to Gate Turn On 2.0 ms (Note 1)
tRISE Time from Gate Turn On to VSENSE Limit 400 µs
tLIMIT Duration of Current Limit Mode 5.0 ms
tPWRGD Time from Current Limit to PWRGD 5.0 ms
VRAMP Voltage on Ramp Pin in Current Limit Mode 3.6 V (Note 2)
3
HV300/HV310
Timing Diagrams
Absolute Maximum Ratings
VEE reference to VDD pin +0.3V to -100V
VPWRGD referenced to VEE Voltage -0.3V to +100V
Operating Ambient Temperature Range -40°C to +85°C
Operating Junction Temperature
Range -40°C to +125°C
Storage Temperature Range -65°C to +150°C
UV & OV ref to VEE -0.3V to +12V
VINT is the internally regulated supply voltage and can
range from 9V to 11V.
VGS(th) is the gate threshold voltage of the external pass
transistor and may be obtained from its datasheet.
VGS(lim) is the pass transistor gate-source voltage required
to obtain the limit curent. It is dependent on the pass
transistor ’s characteristics and may be obtained from the
transfer characteristics curves on the transistor datasheet.
gfs is the transconductance of the pass transistor and may
be obtained from its datasheet.
RFB is the internal feedback resistor and is 5k nominal.
IV
R
tV
C
I
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C
I
LIM SENSE
SENSE
START RAMP
RAMP
TH GS th RAMP
RAMP
POR START TH
RISE RAMP
fs RAMP
LIM
SENSE
FB
LIM IN LOAD
LIM RISE
PWRGD INT GS RAMP
RAMP
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12
09
1
2
12
.
.
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(lim)
GND
-48V
V
IN
I
IN
tSTART
contact
bounce
ILIM
PWRGD
VUVL
tRISE tPWRGD
V
GATE
Initialization Limiting Full On
VGATE
V
OUT
tLIM
tTH
V
RAMP V
RAMP
V
GATE
inactive
active
V
OUT
V
IN
VGS(th)
VGS(lim)
VEE
tPOR
90%
HV300/HV310
4
Pinout
Pin Description
PWRGD – The Power Good Output Pin is held inactive on initial
power application and will go active when the external MOSFET
is fully turned on. This pin may be used as an enable control
when connected directly to a PWM power module.
OV – This Over Voltage sense pin, when raised above its high
threshold will immediately cause the GATE pin to be pulled low .
The GATE pin will remain low until the voltage on this pin falls
below the low threshold limit, initiating a new start-up cycle.
UV – This Under V oltage sense pin, when below its low threshold
limit will ensure that the GATE pin is low. The GATE pin will
remain low until the voltage on this pin rises above the high
threshold, initializing a new start-up cycle.
VEE This pin is the negative voltage power supply input to the
circuit.
VDDThis pin is the positive voltage power supply input to the
circuit.
RAMP – This pin provides a current output so that a timing
ramp voltage is generated when a capacitor is connected. The
initial portion of the ramp provides a time delay, which in
conjunction with the Under Voltage detection circuit eliminates
circuit card insertion contact bounce. The RAMP pin also controls
the delay between the current limit mode disengaging and the
PWRGD signal activating; as well as the current rise profile
after the initial turn on delay.
GATE – This is the Gate Driver Output for the external N-
Channel MOSFET.
SENSE – The current sense resistor connected from this pin to
VEE pin programs the current limit. Constant current output
mode is established when the voltage drop across this resistor
reaches 50mV.
Functional Block Diagram
1
2
3
4
8
7
6
5
PWRGD VDD
OV RAMP
UV GATE
VEE SENSE
PWRGD Logic
Model Condition PWRGD
HV300 NOT READY 0 VEE
READY 1 HI Z
HV310 NOT READY 1 HI Z
READY 0 VEE
Buffer
LOGIC
VINT
V
DD
UV
OV
V
EE
SENSE GATERAMP
Vref
UVLO
and
POR
Band Gap
Reference
Internal
Supply
Regulator
VINT
V
INT –1.2V
Vref
HV300:PWRG
HV310: PWRGD
+
10µA
Trans-
conductor
VREF
5kΩ
5
HV300/HV310
Functional Description
Insertion Into Hot Backplanes
Telecom, Data Network and some Computer applications require
the ability to insert and remove circuit cards from systems
without powering down the entire system. All circuit cards have
some filter capacitance on the power rails, which is especially
true in circuit cards or network terminal equipment utilizing
distributed power systems. The insertion can result in high
inrush currents that can cause damage to connector and circuit
cards and may result in unacceptable disturbances on the
system backplane power rails.
The HV300/HV310 was designed to allow the insertion of these
circuit cards or connection of terminal equipment by eliminating
these inrush currents and powering up these circuits in a
controlled manner after full connector insertion has been
achieved. The HV300/HV310 is intended to provide this function
on a negative supply rail in the range of -10 to -90 Volts.
Operation
On initial power application an internal regulator seeks to provide
10 Volts for the internal IC circuitry. Until the proper internal
voltage is achieved all circuits are held reset, the open drain
PWRGD signal is inactive to inhibit the start of any load circuitry
and the gate to source voltage of the external N-channel
MOSFET is held low. Once the internal under voltage lock out
(UVLO) has been satisfied, the circuit checks the input supply
voltage under voltage (UV) and over voltage (OV) sense circuits
to ensure that the input voltage is within acceptable programmed
limits. These limits are determined by the selected values of
resistors R1, R2 and R3, which form a voltage divider.
Waveforms
Drain
50V/div
VIN
50V/div
Gate
5.00V/div
Iinrush
500mA/div
5.00ms/div
Assuming the above conditions are satisfied and while continuing
to hold the PWRGD output inactive and the external MOSFET
GATE voltage low, the current source feeding the RAMP pin is
turned on. The external capacitor connected to it begins to
charge, thus starting an initial time delay determined by the
value of the capacitor. If an interruption of the input power
occurs during this time (i.e. caused by contact bounce) or the
OV or UV limits are exceeded, an immediate reset occurs and
the external capacitor connected to the RAMP pin is discharged.
When the voltage on the RAMP pin reaches an internally set
voltage limit, the gate drive circuitry begins to turn on the
external MOSFET; allowing the current to softly rise over a
period of a few hundred micro-seconds to the current limit set
point. While the circuit is limiting current, the voltage on the
RAMP pin will be fixed.
Depending on the value of the load capacitance and the
programmed current limit, charging may continue for some
time. The magnitude of the current limit is programmed by
comparing a voltage developed by a sense resistor connected
between the VEE and SENSE pins to 50mV (Typical). Once the
load capacitor has been charged, the current will drop which
will cause the ramp voltage to continue rising; providing yet
another programmed delay.
When the ramp voltage is within 1.2V of the internally regulated
voltage, the controller will force the GATE full on and will
activate the PWRGD pin and the circuit will transition to a low
power standby mode. The PWRGD pin is often used as an
enable for downstream DC/DC converter loads.
At any time during the start up cycle or thereafter, crossing the
UV and OV limits (including hysteresis) will cause an immediate
reset of all internal circuitry. Thereafter the start up process will
begin again.
HV300/HV310
6
1235 Bordeaux Drive, Sunnyvale, CA 94089
TEL: (408) 744-0100 • FAX: (408) 222-4895
www.supertex.com
08/26/02rev.10b
©2002 Supertex Inc. All rights reserved. Unauthorized use or reproduction prohibited.
Typical Application Circuit
Application Information
Under Voltage and Over Voltage Detection
The UV and OV pins are connected to comparators with nominal
1.21V thresholds and 100mV of hysteresis (1.21V ± 50mV).
They are used to detect under voltage and over voltage
conditions at the input to the circuit. Whenever the OV pin rises
above its threshold or the UV pin falls below its threshold the
GATE voltage is immediately pulled low, the PWRGD signal is
deactivated and the external capacitor connected to the RAMP
pin is discharged.
The under voltage and over voltage trip points can be
programmed by means of the three resistor divider formed by
R1, R2 and R3. Since the input currents on the UV and OV pins
are negligible the resistor values may be calculated as follows:
UVoff = VUVH = 1.16 = |VEEUV| * (R2+R3) / (R1+R2+R3)
OVoff = VOVL = 1.26 = |VEEOV| * R3 / (R1+R2+R3)
Where |VEEUV| and |VEEOV| are Under & Over Voltage Set
points.
If we select a divider current of 100µA at a nominal operating
input voltage of 50 Volts then
(R1+R2+R3) = 50V / 100µA = 500k
From the second equation for an Over voltage set point of 65
Volts the value of R3 may be calculated.
OVoff = 1.26 = 65 * R3 / 500k
R3 = (1.26 * 500K) / 65 = 9.69 k
The closest 1% value is 9.76k.
From the first equation for an Under Voltage set point of 35
Volts the value R2 can be calculated.
UVoff = 1.16 = 35 * (R2 + R3) / 500K
R2 = (1.16 * 500K) / 35 – 9.76k = 6.81k.
The closest 1% value is 6.81k.
Then R1 = 500K – (R2 +R3) = 483k
The closest 1% value is 487k.
Current Limit
The current limit magnitude above which the current will not be
allowed to rise during startup is programmed using a sense
resistor connected from the SENSE pin to VEE pin. For example
to program a current limit of 1A, one would choose a resistor as
follows:
Rsense = 50mV / Isense
Rsense = 50mV / 1A
Rsense = 50m
Undervoltage/Overvoltage Operation
V
DD
UV
OV
V
EE
SENSE GATERAMP
GND
-48V
R4
50mΩ
R1
487kΩ
R2
6.81kΩ
R3
9.76kΩ
Q1
IRF530
Cload
+5V
HV300LG or
HV310LG
8
3
2
COM
DC/DC
PWM
CONVERTER
1
GND
Jumper
Long
Pin
Long
Pin
Short
Pin
ENABLE
C1
10nF
PWRGD
NOTES: 1. Undervoltage Lockout (UV) set to 35
V
2. Overvoltage Lockout (OV) set to 65V
3. Remove Jumper if Short Pin is used
74 5 6
GND
V
IN
Pass
Transistor OFF
ON
UV
OFF
UV
ON
OV
OFF
OV
ON