2003 Microchip Technology Inc. DS21434E-page 1
MTC54
Features
• Precise Detection Thresholds: Standard ±2.0%,
Custom ±1.0%
• Small Packages: 3-Pin SOT-23A, 3-Pin SOT-89,
TO-92 and 5-Pin SOT-23A (7.7V only)
• Low Current Drain: Typ. 1 µA
• Wide Detection Range: 1.1V to 6.0V and 7.7V
• Wide Operating Voltage Range: 0.7V to 10V
Applications
• Battery Voltage Monitoring
• Microprocessor Reset
• System Brown-Out Protection
• Switching Circuit in Battery Backup
• Level Discriminator
Functional Block Diagram
General Description
The TC54 Series are CMOS voltage detectors that are
especially well suited for battery-powered applications
because of their extremely low 1 µA operating current
and small surface-mount packaging. Each part is
laser-trimmed to the desired threshold voltage, which
can be specified from 1.4V to 7.7V for a 2% tolerance,
and 1.5V to 6.0V for a 1% tolerance.
The device includes a comparator, low-current high-
precision reference, laser-trimmed divider, hysteresis
circuit and output driver. The TC54 is available with
either an open-drain or complementary output stage.
In operation, the TC54's output (VOUT) remains in the
logic-high state as long as VIN is greater than the spec-
ified threshold voltage (VDET -). When VIN falls below
VDET-, the output is driven to a logic-low. VOUT remains
low until VIN rises above VDET - by an amount VHYST
,
whereupon it resets to a logic-high.
Package Types
VOUT
TC54VC only
VSS
1
3
+
–
VIN
2
TC54VN has open-drain output.
TC54VC has complementary output.
VREF
1 32
VIN VSS
VOUT
TC54
3-Pin SOT-89
5
5-Pin SOT-23A
TC54
13
4
2
NC NC
Note: 3-Pin SOT-23A is equivalent to the
EIAJ SC-59
5-Pin SOT-23A is equivalent to the
EIAJ SC-74A. (7.7V ONLY)
3-Pin TO-92
123
VSS
VIN
VOUT
VIN
VOUT VSS
3
12
TC54
3-Pin SOT-23A
VIN
VIN VSS
VOUT
VOUT VSS
Voltage Detector
TC54
DS21434E-page 2 2003 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage ...................................................................+12V
Output Current ..............................................................50 mA
Output Voltage: CMOS................(VSS – 0.3V) to (VIN + 0.3V)
Open-Drain.....................(VSS – 0.3V) to 12V
Power Dissipation (TA ≤ 70°C):
3-Pin SOT-23A .......................................................240 mW
3-Pin SOT-89..........................................................500 mW
5-Pin SOT-23A .......................................................240 mW
3-Pin TO-92 ............................................................300 mW
Operating Temperature Range........................-40°C to +85°C
Storage Temperature Range.........................-65°C to +150°C
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
PIN FUNCTION TABLE
DC CHARACTERISTICS
Symbol Description
VOUT Digital Output
VIN Analog Input
VSS Ground Terminal
NC No Connect
NC No Connect
Electrical Specifications: Unless otherwise noted, TA = +25°C.
Parameter Sym Min Typ Max Units Test Conditions
Operating Voltage VIN 0.7 — 10.0 V (VDET -) = 0.8 to 6.0V
Quiescent Current ISS —0.82.7µAV
IN = 2.0V
—0.93.0 V
IN = 3.0V
—1.03.2 V
IN = 4.0V
—1.13.6 V
IN = 5.0V
Threshold Voltage
Note 1
VDET - 1.37 1.4 1.43 V TC54VX14
2.06 2.1 2.14 TC54VX21
2.65 2.7 2.75 TC54VX27
2.84 2.9 2.96 TC54VX29
2.94 3.0 3.06 TC54VX30
4.12 4.2 4.28 TC54VX42
4.21 4.3 4.39 TC54VX43
7.54 7.7 7.86 TC54VX77 (5-pin SOT-23A only)
Hysteresis Voltage VHYST 28 70 112 mV VDET = 1.4V (typ)
42 105 168 VDET = 2.1V (typ)
54 135 216 VDET = 2.7V (typ)
58 145 232 VDET = 2.9V (typ)
60 150 240 VDET = 3.0V (typ)
84 210 336 VDET = 4.2V (typ)
86 215 344 VDET = 4.3V (typ)
154 385 616 VDET = 7.7V (typ)
Output Current IOUT —7.7—mAV
OL = 0.5V, VIN = 2.1V
—10.1— V
IN = 3.0V
—11.5— V
IN = 4.0V
—13.0— V
IN = 5.0V
—-10.0— TC54VC Only:
VOH = VIN – 2.1V, VIN = 8.0V
Te m p c o o f ( VDET -) TC (VDET -) — ±100 — ppm/°C -40°C ≤ TA ≤ 85°C
Delay Time tDLY ——0.2msV
DET- → VOUT inversion
Note 1: For other voltage options, please contact your regional Microchip sales office.
2003 Microchip Technology Inc. DS21434E-page 3
TC54
FIGURE 1-1: Timing Diagram.
VDD
OUTPUT
VOH
tDLY
VDET-
OUTPUT
TC54
DS21434E-page 4 2003 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
2.1 Digital Output (VOUT)
VOUT goes low when VIN drops below VDET - and
returns high when VIN rises above VDET - + VHYST
. (See
Figure 3-1, “Timing Diagram”.)
2.2 Analog Input (VIN)
VIN can be used for power supply monitoring or a
voltage level that requires monitoring.
2.3 Ground Terminal (VSS)
VSS provides the negative reference for the analog
input voltage. Typically, the circuit ground is used.
2.4 No Connect (NC)
No internal connection.
Pin No.
(3-Pin SOT-23A)
Pin No.
(3-Pin SOT-89)
(3-Pin TO-92)
Pin No.
(5-Pin SOT-23A) Symbol Description
111V
OUT Digital Output
322V
IN Analog Input
233V
SS Ground Terminal
— — 4 NC No Connect
— — 5 NC No Connect
2003 Microchip Technology Inc. DS21434E-page 5
TC54
3.0 DETAILED DESCRIPTION
In normal steady-state operation when VIN > VDET-,
the output will be at a logic-high (see Figure 3-1). In
the case of the TC54VN, this is an open-drain condi-
tion. If and when the input falls below VDET -, the output
will pull down (Logic 0) to VSS. Generally, VOUT can
pull down to within 0.5V of VSS at rated output current
and input voltage. (See Section 1.0, “Electrical
Characteristics”).
The output (VOUT) will stay valid until the input voltage
falls below the minimum operating voltage (VINMIN) of
0.7V. Below this minimum operating voltage, the output
is undefined. During power-up (or anytime VIN has
fallen below VINMIN), VOUT will remain undefined until
VIN rises above VINMIN. Once this occurs, the output
will become valid. VOUT will be in its active-low state,
while VINMIN < VIN < VDET+ (therefore, VDET+ = VDET-
+ VHYST). If and when the input rises above VDET +, the
output will assume its inactive state (high for TC54VC,
open-drain for TC54VN).
FIGURE 3-1: Timing Diagram.
VIN
Detect Voltage VDET -
Minimum Operating
Voltage
VHYST
VDET+
Output Voltage
Release Voltage
or RESET Voltage
Ground Level
Ground Level
VOUT
TC54
DS21434E-page 6 2003 Microchip Technology Inc.
4.0 APPLICATIONS INFORMATION
4.1 Modifying The Trip Point, VDET-
Although the TC54 has a pre-programmed VDET-, it is
sometimes necessary to make adjustments during pro-
totyping. This can be accomplished by connecting an
external resistor divider to a TC54, which has a VDET-
lower than that of VSOURCE (Figure 4-1).
To maintain detector accuracy, the bleeder current
through the divider should be significantly higher than
the 1 µA operating current required by the TC54. A rea-
sonable value for this bleeder current is 100 µA (100
times the 1 µA required by the TC54). For example, if
VDET- = 2V and the desired trip point is 2.5V, the value
of R1 + R2 is 25 kΩ (2.5V/100 µA). The value of R1 +
R2 can be rounded to the nearest standard value and
plugged into the equation of Figure 4-1 to calculate val-
ues for R1 and R2. 1% tolerance resistors are
recommended.
FIGURE 4-1: Modify trip-point of the TC54
using external resistor divider.
4.2 Other Applications
Low operating power and small physical size make the
TC54 Series ideal for many voltage detector applica-
tions, such as those shown in Figures 4-2, 4-3 and 4-4.
Figure 4-2 shows a low-voltage gate drive protection
circuit that prevents overheating of the logic-level
MOSFET due to insufficient gate voltage. When the
input signal is below the threshold of the TC54VN, its
output grounds the gate of the MOSFET. Figure 4-3
and Figure 4-4 show the TC54 in conventional voltage
monitoring applications.
FIGURE 4-2: MOSFET Low Drive
Protection.
FIGURE 4-3: Battery Voltage Monitor.
FIGURE 4-4: Power Good Monitor.
Where:
VSOURCE = Voltage to be monitored
(VDET-) = Threshold Voltage Setting of TC54
Note: In this example, VSOURCE must be
greater than (VDET-)
VSOURCE
R1
R1R2
+
--------------------VDET-==
TC54
VIN VOUT
VSS
R1
VSOURCE
R2
VIN
VOUT
VSS
TC54VX
270Ω
MTP3055EL
VCC
RL
4.3V
VIN
VOUT
VSS
BATLOW
TC54VX
+
––
VIN
VOUT
VSS
Power Good
TC54VX
+
–
Pwr
Sply
2003 Microchip Technology Inc. DS21434E-page 7
TC54
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Symbol Output Voltage
BCMOS1.
CCMOS2.
DCMOS3.
ECMOS4.
FCMOS5.
HCMOS6.
ICMOS7.
Symbol Output Voltage
LNch1.
MNch2.
NNch3.
PNch4.
RNch5.
SNch6.
TNch7.
Symbol Voltage Symbol Voltage
0.06.6
1.17.7
2.28.8
3.39.9
4.4
5.5
3-Pin SOT-23A 3-Pin SOT-89
1
1
2
2
43
4
3
1represents output configuration (CMOS or Nch)
and first integer of voltage
Ex: CMOS 3.x = D
2represents first decimal of output voltage (0-9)
Ex: CMOS 3.x = D 4
43 represents assembly lot code
&
Symbol Output Voltage
TNch7.
Symbol Voltage
0.0
1.1
2.2
3.3
4.4
5.5
6.6
7.7
8.8
9.9
5-Pin SOT-23A
1 2 43
1represents output configuration and first integer
of voltage
2represents first decimal of output voltage
4
3represents assembly lot code
&
TC54
DS21434E-page 8 2003 Microchip Technology Inc.
Package Marking Information (Continued)
Symbol Output
CCMOS
N N-Channel
Symbol Voltage
22.
33.
44.
55.
66.
Symbol Voltage Symbol Voltage
0.05.5
1.16.6
2.27.7
3.38.8
4.49.9
Symbol Delay Time
0No Delay
Symbol Accuracy
1 ±1.0% (custom)
2 ±2.0% (standard)
3-Pin TO-92
8
4
7
3
6
2
5
1
= 54X (fixed)
1 , 2 , & 3
4represents output configuration (CMOS or Nch)
Ex: CMOS 3.x = C
5represents first integer of detect voltage
6represents first decimal of detect voltage
7represents the output Delay Time
respresents the device accuracy
8
2003 Microchip Technology Inc. DS21434E-page 9
TC54
3-Lead Plastic Small Outline Transistor (CB) (SOT23)
10501050
β
Mold Draft Angle Bottom
10501050
α
Mold Draft Angle Top
0.510.440.37.020.017.015BLead Width
0.180.140.09.007.006.004
c
Lead Thickness
10501050
φ
Foot Angle
0.550.450.35.022.018.014LFoot Length
3.042.922.80.120.115.110DOverall Length
1.401.301.20.055.051.047E1Molded Package Width
2.642.372.10.104.093.083EOverall Width
0.100.060.01.004.002.000A1Standoff §
1.020.950.88.040.037.035
A2
Molded Package Thickness
1.121.010.89.044.040.035AOverall Height
1.92.076
p1
Outside lead pitch (basic)
0.96.038
p
Pitch
33
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
p
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
§ Significant Characteristic
TC54
DS21434E-page 10 2003 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (MB) (SOT89)
0.560.44.022.017BLead 2 Width
0.440.35.017.014
c
Lead Thickness
1.831.62.072.064
D1
Tab Length
4.604.40.181.173DOverall Length
2.292.13.090.084
E1
Molded Package Width at Top
4.253.94.167.155HOverall Width
1.601.40.063.055AOverall Height
3.00 BSC
.118 BSC
p1
Outside lead pitch (basic)
1.50 BSC.059 BSC
p
Pitch
MAXMINMAXMINDimension Limits
MILLIMETERS*INCHESUnits
exceed .005" (0.127mm) per side.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
Notes:
JEDEC Equivalent: TO-243
Drawing No. C04-29
*Controlling Parameter
Foot Length L .035 .047 0.89 1.20
Leads 1 & 3 Width B1 .014 .019 0.36 0.48
Molded Package Width at Base E .090 .102 2.29 2.60
D1
H
L
B1
B
B1
p
p1
E
C
A
D
1
2
3
E1
2003 Microchip Technology Inc. DS21434E-page 11
TC54
5-Lead Plastic Small Outline Transistor (CT) (SOT23)
10501050
β
Mold Draft Angle Bottom
10501050
α
Mold Draft Angle Top
0.500.430.35.020.017.014BLead Width
0.200.150.09.008.006.004
c
Lead Thickness
10501050
φ
Foot Angle
0.550.450.35.022.018.014LFoot Length
3.102.952.80.122.116.110DOverall Length
1.751.631.50.069.064.059E1Molded Package Width
3.002.802.60.118.110.102EOverall Width
0.150.080.00.006.003.000A1Standoff §
1.301.100.90.051.043.035A2Molded Package Thickness
1.451.180.90.057.046.035AOverall Height
1.90.075
p1
Outside lead pitch (basic)
0.95.038
p
Pitch
55
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
p
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
§ Significant Characteristic
TC54
DS21434E-page 12 2003 Microchip Technology Inc.
3-Lead Plastic Transistor Outline (ZB) (TO-92)
432432
β
Mold Draft Angle Bottom
654654
α
0.560.480.41.022.019.016BLead Width
0.510.430.36.020.017.014
c
Lead Thickness
2.412.292.16.095.090.085RMolded Package Radius
4.954.644.32.195.183.170DOverall Length
4.954.714.45.195.186.175E1Overall Width
3.943.623.30.155.143.130ABottom to Package Flat
1.27.050
p
Pitch
33
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
R
n
1
3
α
p
L
B
A
c
β
1
D
2
E1
Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49
*Controlling Parameter
Mold Draft Angle Top
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
2003 Microchip Technology Inc. DS21434E-page 13
TC54
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Device: TC54V: Voltage Detector
Output Configuration: N = Nch Open-Drain
C = CMOS Output
Detected Voltage: 14 = 1.4V
21 = 2.1V
27 = 2.7V
29 = 2.9V
30 = 3.0V
42 = 4.2V
43 = 4.3V
Extra Feature Code: 0 = Fixed
Tolerance: 1 = 1% (custom)
2 = 2% (standard)
Temperature: E = -40°C to +85°C
Package: CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59)
MB = 3-Pin SOT-89
CT = 5-Pin SOT-23A (equivalent to EIAJ SC-74A)
(7.7V ONLY)
ZB = Transistor Outline (TO-92), 3-lead
Taping Direction: 713 = Standard Taping
PART NO. XXX
PkgOutput
Config.
Device
XX
Detected
Voltage
X
Extra
Feature
Code
X
Tolerance
X
Temp.
XX
Taping
Direction
Examples:
a) TC54VC1402ECB713: 1.4V Voltage
Detector, 2% Tol., SOT-23A-3-TR.
b) TC54VC1402EMB713: 1.4V Voltage
Detector, 2% Tol., SOT-89-3-TR.
c) TC54VC1402EZB: 1.4V Voltage Detec-
tor, 2% Tol., TO-92.
d) TC54VC2102ECB713: 2.1V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
e) TC54VC2102EMB713: 2.1V Voltage
Detector, 2% Tolerance, SOT-89-3-TR.
f) TC54VC2102EZB: 2.1V Voltage Detec-
tor, 2% Tolerance, TO-92.
g) TC54VC2702ECB713: 2.7V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
h) TC54VC3002ECB713: 3.0V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
i) TC54VN4202ECB713: 4.2V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
j) TC54VN7702ECT713: 7.7V Voltage
Detector, 2% Tolerance, SOT-23A-3-TR.
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC54
DS21434E-page 14 2003 Microchip Technology Inc.
NOTES:
DS21434E-page 15 2003 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Accuron, Application Maestro, dsPIC, dsPICDEM,
dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select
Mode, SmartSensor, SmartShunt, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21434E-page 16 2003 Microchip Technology Inc.
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China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Hong Kong SAR
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380 Fax: 86-755-82966626
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Microchip Technology Inc.
India Liaison Office
Marketing Support Division
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611 Fax: 39-0331-466781
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/25/03
WORLDWIDE SALES AND SERVICE
