CREAT BY ART
- Ideal for automated placement
- Reliable low cost construction utilizing molded plastic technique
- High surge current capability
- UL Recognized File # E-326854
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
I
2
t A
2
s
Trr ns
T
JO
C
T
STG O
C
Document Number: DS_D1310040 Version: E13
HDBLS101G thru HDBLS107G
Taiwan Semiconductor
Glass Passivated Hi
g
h Efficient Brid
g
e Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
DBLS
MECHANICAL DATA
Case: Molded plastic body
Rating for fusing (t<8.3mS) 10.3
UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Polarity: Polarity as marked on the body
Weight: 0.36 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL HDBLS
101G
Maximum average forward rectified current 1
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
HDBLS
106G
HDBLS
107G
HDBLS
102G
HDBLS
103G
HDBLS
104G
HDBLS
105G
A
Maximum instantaneous forward voltage (Note 1)
I
F
= 1 A V
F
V
Maximum DC reverse current T
J
=25 ℃
at rated DC blocking voltage T
J
=125℃I
R
5
500 μA
50
1.0
Storage temperature range - 55 to +150
Note 1: Pulse Test with PW=300μs,1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Maximum reverse recovery time (Note 2)
Typical thermal resistance R
θjL
R
θjA
15
40
O
C/W
1.3 1.7
50 75
Operating junction temperature range - 55 to +150
PART NO.
Note 1: "x" defines voltage from 50V (HDBLS101G) to 1000V (HDBLS107G)
PART NO.
HDBLS107G
HDBLS107G
(TA=25℃ unless otherwise noted)
Document Number: DS_D1310040 Version: E13
RATINGS AND CHARACTERISTICS CURVES
PREFERRED P/N PACKING CODE GREEN COMPOUND
CODE
Suffix "G" DBLS
RD
HDBLS107G RDG RD G
HDBLS101G thru HDBLS107G
Taiwan Semiconductor
PACKING COD E GREEN COMPOUND
CODE
PACKAGE
HDBLS107G RD RD
PACKING
ORDERING INFORMATION
Green compound
DESCRIPTION
EXAMPLE
1,500 / 13" Paper reel
50 / TUBE
HDBLS10xG
(Note 1)
C1
0
0.5
1
1.5
0 20 40 60 80 100 120 140 160
AVERAGE FORWARD CURRENT (A)
AMBIENT TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
0
10
20
30
40
50
60
70
1 10 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
(JEDEC Method)
0.1
1
10
100
1000
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
0.1
1
10
0.4 0.6 0.8 1 1.2 1.4 1.6
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
HDBLS101G -
HDBLS104G HDBLS105G
HDBLS106G -
HDBLS107G
Min Max Min Max
A 5.00 5.20 0.197 0.205
B 1.02 1.20 0.040 0.047
C 8.13 8.51 0.320 0.335
D 2.40 2.60 0.094 0.102
E 9.80 10.30 0.386 0.406
F 6.20 6.50 0.244 0.256
G 0.22 0.33 0.009 0.013
H 1.02 1.53 0.040 0.060
I 0.076 0.33 0.003 0.013
J 3.90 4.10 0.154 0.161
Symbol
A
B
C
D
E
F
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1310040 Version: E13
HDBLS101G thru HDBLS107G
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
2.6
9.2
MARKING DIAGRAM
SUGG ESTED PAD LAYOUT
Unit (mm)
2.3
1.3
6.9
11.5
Unit (inch)
0.091
0.051
0.272
0.453
0.102
0.362
0
10
20
30
40
50
60
70
0.1 1 10 100 1000
CAPACITANCE (pF) A
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
HDBLS101G -
HDBLS105G
HDBLS106G -
HDBLS107G
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1310029 Version: J13
A
BS2 thru ABS10
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
