Chip Resistor Surface Mount
V1
9
SERIES
TEST METHOD PROCEDURE REQUIREMENTS
Short Time
Overload
IEC60115-1 4.13 2.5 times of rated voltage or maximum
overload voltage, the less of the above, for 5 sec
at room temperature
±(0.05%+0.05Ω)
High
Temperature
Exposure
AEC-Q200 Test 3
MIL-STD-202 Method 108
1,000 hours at Tamb = 125 °C, unpowered ±(0.1%+0.05Ω)
1,000 hours at Tamb = 155 °C, unpowered ±(0.3%+0.05Ω)
Moisture
Resistance
AEC-Q200 Test 6
MIL-STD-202 Method 106
Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d. with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
±(0.1%+0.05Ω)
Biased
Humidity
AEC-Q200 Test 7
MIL-STD-202 Method 103
1,000 hours; 85 °C / 85% RH
10% of operating power
Measurement at 24±4 hours after test
conclusion
±(0.1%+0.05Ω)
Operational
Life
AEC-Q200 Test 8
MIL-STD-202 Method 108
1,000 hours at 70±5 °C, RCWV applied for 1.5
hours on, 0.5 hour off, still air required
±(0.1%+0.05Ω)
1,000 hours at 125 °C, derated voltage applied
for 1.5 hours on, 0.5 hour off, still air required
±(0.3%+0.05Ω)
Resistance to
Soldering
Heat
AEC-Q200 Test 15
MIL-STD-202 Method 210
Condition B, no pre-heat of samples
Lead-free solder, 260±5 °C, 10±1
seconds immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±(0.05%+0.05Ω)
Shock
AEC-Q200 Test 16
MIL-STD-202 Method 107
-55/+125 °C
Number of cycles is 300. Devices
mounted Maximum transfer time is 20
seconds. Dwell time is 15 minutes. Air –
Air
±(0.1%+0.05Ω) No visible
damage
Solderability
- Wetting
AEC-Q200 Test 18
J-STD-002
Electrical Test not required Magnification
50X SMD conditions:
(a) Method B, aging 4 hours at 155 °C dry heat,
dipping at 235±3 °C for 5±0.5 seconds.
(b) Method B, steam aging 8 hours, dipping at
215±3 °C for 5±0.5 seconds.
(c) Method D, steam aging 8 hours, dipping at
260±3 °C for 7±0.5 seconds
Well tinned
(>95% covered)
No visible damage
Ta b le 4 Test condition, procedure and requirements
TS