HSMP-386D
PIN Diode Diversity Switch
Data Sheet
Description
The HSMP-386D is a low cost and high linearity diversity
switch designed to operate from 50MHz to 6GHz.
HSMP-386D is built with unique 4 PIN diode configuration,
and it is housed in a industrial standard low cost miniature
SOT-143 package, which will allow board space saving for
space constraint application.
HSMP-386D is equipped with -0.35dB IL and -25.40dB
ISO @ 900MHz. On the other hand, HSMP-386D is also
featuring with 56.83dBm IIP3 and 47.41dBm IP1dB per-
formance @ 900MHz. HSMP-386D is suitable for wireless
application that required low distortion diversity switch,
such as dect phone, wireless LAN and WiMAX.
Pin Connections and Package Marking, SOT-143
Notes:
L7 = Device Code
? = Month code indicates the month of manufacture
Features
• Unique configurations in Surface Mount SOT-143
– Increase Flexibility
– Save Board Space
– Reduce Cost
• Switching
– Low Distortion Switching
– Low Capacitance
• Low Failure In Time (FIT) Rate [1]
• Specifications at 900MHz; IF=10mA (Typ.)
– Low IL, 0.35dB
– High ISO, 25.40dB
– High power handling, IP1dB, 47.41dBm
– High Linearity, IIP3, 56.83dBm
L7?
1
3
2
4
2
Table 1. Absolute Maximum Rating [1] Tc = +25°C
Symbol Parameter Units Absolute Max.
IFForward Current (1µs Pulse) Amp 1
PIV Peak Inverse Voltage V 50
TJJunction temperature °C 150
TSTG Storage Temperature °C -65 to 150
θJC Thermal Resistance [2] °C/W 500
Notes:
1. Operation in excess of anyone of these conditions may result in permanent damage to the device.
2. TC = 25°C, TC where is defined to be the temperature at the package pins where contacts is made to the circuit board.
Table 2. Electrical Specifications, Tc = +25°C, each diode
Symbol Parameter and Test Condition Units Min. Typ Max.
VBR Breakdown Voltage @ IR = 10µA V – 55 –
VF Forward Voltage @ IF = 30mA V – 0.88 –
VF Forward Voltage @ IF =100mA V – 0.96 1.15
RS Typical Series Resistance @ Freq = 100MHz & IF =1mA Ohm – 17.0 –
RS Typical Series Resistance @ Freq = 100MHz & IF =10mA Ohm – 2.6 –
RS Typical Series Resistance @ Freq = 100MHz & IF =100mA Ohm – 1.2 –
CT Typical Total Capacitance @ Freq = 1MHz & VR = 0V pF – 0.35 0.55
T Carrier Lifetime @ IF = 50mA & IR =250mA ns – 500 –
Trr Reverse Recovery Time @ VR =10V, IF = 20mA & 90% Recovery ns – 75 –
Table 3. Performance Table at Nominal Operating Conditions, Tc = +25°C, IF = 10mA, each diode
IIP3 [1, 4] Input 3rd order Intercept Point @ freq = 0.9GHz dBm – 56.83 –
IIP3 [2, 4] Input 3rd order Intercept Point @ freq = 1.9GHz dBm – 57.93 –
IIP3 [3, 4] Input 3rd order Intercept Point @ freq = 2.4GHz dBm – 59.26 –
IP1dB [4] Input 1dB Compressed Power @ freq = 0.9GHz dBm – 47.41 –
IP1dB [4] Input 1dB Compressed Power @ freq = 1.9GHz dBm – 48.11 –
IP1dB [4] Input 1dB Compressed Power @ freq = 2.4GHz dBm – 48.45 –
Notes:
1. 0.9 GHz OIP3 Test Condition : F1 = 0.9 GHz & F2 = 0.905 GHz, Pin =30 dBm
2. 1.9 GHz OIP3 Test Condition : F1 = 1.9 GHz & F2 = 1.905 GHz, Pin =30 dBm
3. 2.4 GHz OIP3 Test Condition : F1 = 2.4 GHz & F2 = 2.405 GHz, Pin =30 dBm
4. Measurement obtained using the demoboard described in Figure 7 & 8.
3
HSMP-386D Typical Performance, Tc = +25°C, each diode
Figure 1. Forward Current vs. Forward Voltage Figure 2. Typical RF Resistance vs. Forward Bias Current
Figure 3. Total Capacitance vs. Reverse Voltage Figure 4. Return Loss vs. Frequency (Pin = 0dBm)
Figure 5. Insertion Loss vs. Frequency (Pin = 0dBm) Figure 6. Isolation vs. Frequency (Pin = 0dBm)
-60
-50
-40
-30
-20
-10
0
0.01
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1 1.2
VF - FORWARD VOLTAGE (mA)
25°C
125°C
-50°C
1
10
100
1000
0.01 0.1 1 10 100
BIAS CURRENT (mA)
0.15
0.20
0.25
0.30
0.35
0 2 4 6 8 10 12 14 16 18 20
VR - REVERSE VOLTAGE (V)
1MHz
1GHz
-60
-50
-40
-30
-20
-10
0
0123456
Frequency (GHz)
IF=5mA
IF=10mA
-5
-4
-3
-2
-1
0
0 1 2 3 4 5 6
Frequency (GHz)
0 1 2 3 4 5 6
Frequency (GHz)
IF - FORWARD CURRENT (mA)
RESISTANCE (OHMS)
RETURN LOSS (dB)
ISOLATION (dB)
TOTAL CAPACITANCE (pF)
INSERTION LOSS (dB)
85°C
25°C
-55°C
IF=5mA
IF=10mA
IF=5mA
IF=10mA
4
Figure 7. A diagram showing the application circuit for Diversity Switch
using HSMP-386D.
This set-up is applicable for measurement shown in Figure 4 – 6.
Truth Table
CTR1 (V) CTR2 (V) Low Loss paths
VF 0 RF4-RF3
RF1-RF2
0 VF RF3-RF1
RF2-RF4
Figure 8. Evaluation Board for Diversity Switch
APLAC Model Parameters for PIN Diode
Parameter Units PIN Diode
RMAX KΩ 5
IS A 1.42 E-9
N 1.99
TT ns 500
C pF 0.20
A 0.0276
K 0.9018
RMIN Ω 1.10
L nH 2
Bias TeeBias Tee
Bias Tee Bias Tee
CTR1
RF1
VF
VFVF
VF
RF2
RF4RF3
CTR2
CTR2
CTR1
Bias Tee
RF4
CTR2
Bias Tee
RF4
30.0
42.0
RF 3 RF 4
RF 1 RF 2
RO 4350
DK 3.48
H 10 mil
W 0.56mm
G 0.44mm
Avago Technologies
Diversity Switch
5
Package Outline, SOT-143
Part Number Ordering Information
Part Number No. of Devices Container
HSMP-386D-BLK 100 Bulk, per Antistatic bag
HSMP-386D-TR1 3000 Tape & Reel, per 7” Reel
HSMP-386D-TR2 10000 Tape & Reel, per 13” Reel
e
B
e1
E1
C
EXXX
L
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
DIMENSIONS (mm)
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.01
0.60
2.65
0.69
SYMBOL
A
A1
B
B1
C
D
E1
e
e1
e2
E
L
e2
Tape and Reeling conforms to Electronic Industries RS-481,
“Taping of Surface Mounted Components for Automated
Placement”.
For lead-free option, the part number will have the
character “G” at the end, eg. –TR2G for a 10K pc lead-free
reel.
6
Recommended PCB Pad Layout for AVAGO’s SOT-143 Products
Device Orientation
USER
FEED
DIRECTION
COVER TAPE
CARRIER
TAPE
REEL
Note: "AB" represents package marking code.
"C" represents date code.
END VIEW
8 mm
4 mm
TOP VIEW
ABC ABC ABC ABC
Dimensions in
0.112
2.85
0.079
2
0.075
1.9
0.108
2.75
0.071
1.8
inches
mm
0.033
0.85
0.041
1.05
0.033
0.85
0.033
0.85
0.047
0.12
0.03
0.8
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1689EN - January 13, 2009
Tape Dimensions and Product Orientation